TWI490047B - 噴嘴單元 - Google Patents

噴嘴單元 Download PDF

Info

Publication number
TWI490047B
TWI490047B TW102129159A TW102129159A TWI490047B TW I490047 B TWI490047 B TW I490047B TW 102129159 A TW102129159 A TW 102129159A TW 102129159 A TW102129159 A TW 102129159A TW I490047 B TWI490047 B TW I490047B
Authority
TW
Taiwan
Prior art keywords
chamber
nozzle
wall
nozzle body
sealing member
Prior art date
Application number
TW102129159A
Other languages
English (en)
Chinese (zh)
Other versions
TW201408378A (zh
Inventor
Ki Taek Jung
Ho-Joong Choi
Myung Sung Kang
Wook Song
Original Assignee
Snu Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snu Precision Co Ltd filed Critical Snu Precision Co Ltd
Publication of TW201408378A publication Critical patent/TW201408378A/zh
Application granted granted Critical
Publication of TWI490047B publication Critical patent/TWI490047B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Nozzles (AREA)
TW102129159A 2012-08-22 2013-08-14 噴嘴單元 TWI490047B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120091912A KR101394265B1 (ko) 2012-08-22 2012-08-22 분사노즐 유닛

Publications (2)

Publication Number Publication Date
TW201408378A TW201408378A (zh) 2014-03-01
TWI490047B true TWI490047B (zh) 2015-07-01

Family

ID=50205621

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102129159A TWI490047B (zh) 2012-08-22 2013-08-14 噴嘴單元

Country Status (4)

Country Link
JP (1) JP5594503B2 (ja)
KR (1) KR101394265B1 (ja)
CN (1) CN103623962B (ja)
TW (1) TWI490047B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101974418B1 (ko) * 2018-10-10 2019-05-02 권오남 공정액 공급용 노즐튜브 및 이를 포함하는 노즐장치
CN110586380A (zh) * 2019-09-18 2019-12-20 大禹节水（天津）有限公司 一种水利灌溉用便于拆卸的洒水喷头
CN115522167B (zh) * 2022-09-22 2024-07-26 京东方科技集团股份有限公司 一种蒸镀源设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002324493A (ja) * 2001-04-24 2002-11-08 Nissin Electric Co Ltd イオン源用オーブン
JP2004359985A (ja) * 2003-06-03 2004-12-24 Nissin Ion Equipment Co Ltd イオンビーム発生方法およびイオン源
KR20050097525A (ko) * 2003-02-07 2005-10-07 비수비우스 크루서블 컴패니 내화재 요소에 유체 순환 라인을 연결하는 장치 및 그러한내화재 요소

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2318458B2 (de) * 1973-04-12 1980-09-04 Lechler Gmbh & Co Kg, 7012 Fellbach Einrichtung zur dichtenden Befestigung von Düsen an Leitungsteilen
JPH03116553U (ja) * 1990-03-08 1991-12-03
JPH03293293A (ja) * 1990-04-12 1991-12-24 Nippon Chemicon Corp 機器の搬送補助治具
JPH08200956A (ja) * 1995-01-23 1996-08-09 Sumitomo Electric Ind Ltd 気密容器のシ−ル装置
CN2285395Y (zh) * 1997-04-18 1998-07-01 王平 一种机械密封装置
US6641673B2 (en) * 2000-12-20 2003-11-04 General Electric Company Fluid injector for and method of prolonged delivery and distribution of reagents into plasma
KR100714304B1 (ko) * 2001-03-22 2007-05-02 삼성전자주식회사 반도체 제조장치의 반응가스 공급노즐
SE530106C2 (sv) * 2006-07-03 2008-03-04 Lind Finance & Dev Ab Fastsättningsanordning vid en spindelenhet
CN101240850A (zh) * 2007-02-07 2008-08-13 财团法人工业技术研究院 密封结构及其衬垫组件
US7871019B1 (en) * 2009-07-01 2011-01-18 Active Products International Limited Pressure-adjustable jet spray nozzle for cleaning machine
CN201841141U (zh) * 2010-11-11 2011-05-25 中国石油天然气股份有限公司 油气管道用在线清管器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002324493A (ja) * 2001-04-24 2002-11-08 Nissin Electric Co Ltd イオン源用オーブン
KR20050097525A (ko) * 2003-02-07 2005-10-07 비수비우스 크루서블 컴패니 내화재 요소에 유체 순환 라인을 연결하는 장치 및 그러한내화재 요소
JP2004359985A (ja) * 2003-06-03 2004-12-24 Nissin Ion Equipment Co Ltd イオンビーム発生方法およびイオン源

Also Published As

Publication number Publication date
KR101394265B1 (ko) 2014-05-13
JP5594503B2 (ja) 2014-09-24
CN103623962B (zh) 2016-03-02
KR20140025792A (ko) 2014-03-05
CN103623962A (zh) 2014-03-12
JP2014040664A (ja) 2014-03-06
TW201408378A (zh) 2014-03-01

Similar Documents

Publication Publication Date Title
JP7345397B2 (ja) 基板支持装置
TWI490047B (zh) 噴嘴單元
US20120031339A1 (en) Deposition head and film forming apparatus
KR20140119654A (ko) 단일 포인트 선형 증발원 시스템
US9790588B2 (en) Heating device for evaporation of OLED material
US10036949B2 (en) Method for manufacturing photo mask and photo mask manufactured with same
TW201821633A (zh) 用於被蒸發材料分佈組件的噴嘴及其使用，與對應之材料沉積源配置， 真空沉積系統和沈積材料的方法
KR20120015387A (ko) 유기물 증발원 및 그를 포함하는 증착 장치
US10458718B2 (en) Airtight penetration structure for heat dissipation device
US20180105924A1 (en) Vapor Deposition Crucible
KR102036597B1 (ko) 선형증발원, 이를 구비한 증착장치 및 이를 이용하는 증착방법
CN107002221B (zh) 用于真空沉积的材料沉积布置和材料分配布置
US20200080193A1 (en) Carrier plate for evaporating device and evaporating device thereof
KR20150000327A (ko) 증발원 및 이를 구비한 증착장치
KR101156430B1 (ko) 증착 소스 및 유기 발광 소자 제조 방법
US20140299060A1 (en) Thin film deposition apparatus
CN206849845U (zh) Oled显示基板和oled显示装置
KR20080098813A (ko) 캐니스터 온도조절장치, 유기물 공급라인 및 이를 이용한유기물 증착장치
KR101599505B1 (ko) 증착장치용 증발원
CN112420966B (zh) 一种显示面板的制造方法以及掩模板
TW201425608A (zh) 蒸鍍裝置及蒸鍍方法
KR100611674B1 (ko) 증착장치
KR102150436B1 (ko) 증발원 및 이를 포함하는 증착 장치
KR101457081B1 (ko) 가스킷 역할을 포함한 이너플레이트를 사용한 대용량 선형 증발원
KR100814847B1 (ko) 유기 발광 표시 장치 제조용 증착 장치

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees