TWI489012B - 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物 - Google Patents

包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物 Download PDF

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Publication number
TWI489012B
TWI489012B TW099110629A TW99110629A TWI489012B TW I489012 B TWI489012 B TW I489012B TW 099110629 A TW099110629 A TW 099110629A TW 99110629 A TW99110629 A TW 99110629A TW I489012 B TWI489012 B TW I489012B
Authority
TW
Taiwan
Prior art keywords
group
composition
copper
inhibitor
substrate
Prior art date
Application number
TW099110629A
Other languages
English (en)
Chinese (zh)
Other versions
TW201042096A (en
Inventor
可那利亞 羅吉
羅曼 班尼狄克 瑞索
夏落特 伊尼特
亞力山佐 賀格
迪爾特 梅爾
Original Assignee
巴地斯顏料化工廠
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 巴地斯顏料化工廠 filed Critical 巴地斯顏料化工廠
Publication of TW201042096A publication Critical patent/TW201042096A/zh
Application granted granted Critical
Publication of TWI489012B publication Critical patent/TWI489012B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW099110629A 2009-04-07 2010-04-06 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物 TWI489012B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09157542 2009-04-07
US25632909P 2009-10-30 2009-10-30

Publications (2)

Publication Number Publication Date
TW201042096A TW201042096A (en) 2010-12-01
TWI489012B true TWI489012B (zh) 2015-06-21

Family

ID=42935667

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099110629A TWI489012B (zh) 2009-04-07 2010-04-06 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物

Country Status (11)

Country Link
US (1) US20120027948A1 (enExample)
EP (1) EP2417284B1 (enExample)
JP (1) JP5702360B2 (enExample)
KR (2) KR20120005023A (enExample)
CN (2) CN102369315B (enExample)
IL (1) IL215017A (enExample)
MY (1) MY157214A (enExample)
RU (1) RU2542178C2 (enExample)
SG (2) SG10201401324YA (enExample)
TW (1) TWI489012B (enExample)
WO (1) WO2010115756A1 (enExample)

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US12302985B2 (en) 2021-12-21 2025-05-20 Glory Steel Enterprise Co., Ltd. Eco-friendly method of manufacturing shoe material, semi-finished, and foamed shoe material made thereby

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EP3415664B1 (en) * 2017-06-16 2019-09-18 ATOTECH Deutschland GmbH Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating
EP3679179B1 (en) 2017-09-04 2023-10-11 Basf Se Composition for metal electroplating comprising leveling agent
JP2021522410A (ja) 2018-04-20 2021-08-30 ビーエイエスエフ・ソシエタス・エウロパエアＢａｓｆ Ｓｅ 抑制剤を含むスズ又はスズ合金電気メッキのための組成物
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EP4034697A1 (en) * 2019-09-27 2022-08-03 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
CN114073170B (zh) * 2020-04-01 2025-01-03 住友电气工业株式会社 柔性印刷布线板及其制造方法
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Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
KR20170034948A (ko) 2017-03-29
SG10201401324YA (en) 2014-08-28
WO2010115756A1 (en) 2010-10-14
JP2012522898A (ja) 2012-09-27
EP2417284B1 (en) 2015-01-14
SG174265A1 (en) 2011-10-28
CN104195602A (zh) 2014-12-10
CN102369315B (zh) 2014-08-13
MY157214A (en) 2016-05-13
RU2011144618A (ru) 2013-05-20
EP2417284A1 (en) 2012-02-15
KR20120005023A (ko) 2012-01-13
IL215017A0 (en) 2011-12-01
CN104195602B (zh) 2017-05-31
TW201042096A (en) 2010-12-01
US20120027948A1 (en) 2012-02-02
IL215017A (en) 2016-03-31
CN102369315A (zh) 2012-03-07
RU2542178C2 (ru) 2015-02-20
JP5702360B2 (ja) 2015-04-15

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