TWI486723B - 在微影系統中處理基板的方法 - Google Patents

在微影系統中處理基板的方法 Download PDF

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Publication number
TWI486723B
TWI486723B TW101115338A TW101115338A TWI486723B TW I486723 B TWI486723 B TW I486723B TW 101115338 A TW101115338 A TW 101115338A TW 101115338 A TW101115338 A TW 101115338A TW I486723 B TWI486723 B TW I486723B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
load lock
robot
nth
Prior art date
Application number
TW101115338A
Other languages
English (en)
Chinese (zh)
Other versions
TW201250402A (en
Inventor
Vincent Sylvester Kuiper
Erwin Slot
Kervinck Marcel Nicolaas Jacobus Van
Boer Guido De
Jong Hendrik Jan De
Original Assignee
Mapper Lithography Ip Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithography Ip Bv filed Critical Mapper Lithography Ip Bv
Publication of TW201250402A publication Critical patent/TW201250402A/zh
Application granted granted Critical
Publication of TWI486723B publication Critical patent/TWI486723B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW101115338A 2011-04-28 2012-04-30 在微影系統中處理基板的方法 TWI486723B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28

Publications (2)

Publication Number Publication Date
TW201250402A TW201250402A (en) 2012-12-16
TWI486723B true TWI486723B (zh) 2015-06-01

Family

ID=46017897

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101115338A TWI486723B (zh) 2011-04-28 2012-04-30 在微影系統中處理基板的方法
TW101115340A TWI514089B (zh) 2011-04-28 2012-04-30 在微影系統中用於轉移基板的設備

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101115340A TWI514089B (zh) 2011-04-28 2012-04-30 在微影系統中用於轉移基板的設備

Country Status (7)

Country Link
US (4) US8936994B2 (cg-RX-API-DMAC7.html)
EP (1) EP2702452B1 (cg-RX-API-DMAC7.html)
JP (2) JP5787331B2 (cg-RX-API-DMAC7.html)
KR (4) KR20180031082A (cg-RX-API-DMAC7.html)
CN (3) CN106896650A (cg-RX-API-DMAC7.html)
TW (2) TWI486723B (cg-RX-API-DMAC7.html)
WO (2) WO2012146789A1 (cg-RX-API-DMAC7.html)

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WO2012080278A1 (en) * 2010-12-14 2012-06-21 Mapper Lithography Ip B.V. Lithography system and method of processing substrates in such a lithography system
JP6049367B2 (ja) 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
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JP2017520015A (ja) * 2014-05-07 2017-07-20 マッパー・リソグラフィー・アイピー・ビー．ブイ． ターゲット処理マシン用囲い
KR101681185B1 (ko) * 2014-11-04 2016-12-02 세메스 주식회사 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
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Also Published As

Publication number Publication date
USRE48903E1 (en) 2022-01-25
KR20140041501A (ko) 2014-04-04
WO2012146788A1 (en) 2012-11-01
CN106896650A (zh) 2017-06-27
US20130044305A1 (en) 2013-02-21
JP5787331B2 (ja) 2015-09-30
CN106919006A (zh) 2017-07-04
JP2014514769A (ja) 2014-06-19
CN103649837A (zh) 2014-03-19
TWI514089B (zh) 2015-12-21
JP5805851B2 (ja) 2015-11-10
KR101614475B1 (ko) 2016-04-21
US8936994B2 (en) 2015-01-20
CN106919006B (zh) 2020-03-13
US20160004173A1 (en) 2016-01-07
US20130034421A1 (en) 2013-02-07
CN103649837B (zh) 2017-04-12
EP2702452A1 (en) 2014-03-05
JP2014513429A (ja) 2014-05-29
US9575418B2 (en) 2017-02-21
KR101892460B1 (ko) 2018-08-28
TW201250402A (en) 2012-12-16
WO2012146789A1 (en) 2012-11-01
EP2702452B1 (en) 2016-08-03
KR20180031082A (ko) 2018-03-27
KR20140025495A (ko) 2014-03-04
KR101607618B1 (ko) 2016-04-11
TW201250403A (en) 2012-12-16
US9176397B2 (en) 2015-11-03
KR20160047590A (ko) 2016-05-02

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