TWI485358B - Closure plate body inspection apparatus and method - Google Patents

Closure plate body inspection apparatus and method Download PDF

Info

Publication number
TWI485358B
TWI485358B TW101121770A TW101121770A TWI485358B TW I485358 B TWI485358 B TW I485358B TW 101121770 A TW101121770 A TW 101121770A TW 101121770 A TW101121770 A TW 101121770A TW I485358 B TWI485358 B TW I485358B
Authority
TW
Taiwan
Prior art keywords
inspection
bubble
line sensor
bubble size
plate
Prior art date
Application number
TW101121770A
Other languages
English (en)
Chinese (zh)
Other versions
TW201305527A (zh
Inventor
Yoshinori Hayashi
Hiroshi Wakaba
Osamu Izutsu
Katsutoshi Seki
Yoko Ono
Takanori Gondo
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201305527A publication Critical patent/TW201305527A/zh
Application granted granted Critical
Publication of TWI485358B publication Critical patent/TWI485358B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8874—Taking dimensions of defect into account

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Textile Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW101121770A 2011-06-30 2012-06-18 Closure plate body inspection apparatus and method TWI485358B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011146833 2011-06-30
JP2012129946A JP6032696B2 (ja) 2011-06-30 2012-06-07 貼り合せ板状体検査装置及び方法

Publications (2)

Publication Number Publication Date
TW201305527A TW201305527A (zh) 2013-02-01
TWI485358B true TWI485358B (zh) 2015-05-21

Family

ID=47789012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101121770A TWI485358B (zh) 2011-06-30 2012-06-18 Closure plate body inspection apparatus and method

Country Status (3)

Country Link
JP (1) JP6032696B2 (ja)
KR (1) KR101374440B1 (ja)
TW (1) TWI485358B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017224670A (ja) * 2016-06-14 2017-12-21 株式会社ディスコ 保護部材形成装置
JP7137439B2 (ja) * 2018-11-02 2022-09-14 株式会社安永 検査装置、検査方法、及び検査プログラム
TWI779268B (zh) 2019-02-28 2022-10-01 日商Ｉｈｉ股份有限公司 超音波探傷裝置
JP7045711B2 (ja) 2019-04-10 2022-04-01 有限会社太田紙工 打上花火用飛翔体部品及び打上花火用飛翔体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06323956A (ja) * 1993-03-19 1994-11-25 Olympus Optical Co Ltd プリズム異物検出方法
TW583389B (en) * 2002-01-10 2004-04-11 Omron Tateisi Electronics Co A surface conduction examination method and a substrate examination device
TWI277719B (en) * 2005-08-03 2007-04-01 Chi-Cheng Ye Image inspection method and structure for attachment machine
TWI289658B (en) * 2005-06-01 2007-11-11 Tecnos Co Ltd Substrate inspection device and inspection method
JP4581424B2 (ja) * 2004-02-24 2010-11-17 パナソニック電工株式会社 外観検査方法及び画像処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH055710A (ja) * 1991-06-18 1993-01-14 Fuji Electric Co Ltd 瓶口天面の外観検査における２値化用しきい値の決定方法
JP3332096B2 (ja) * 1992-11-17 2002-10-07 株式会社東芝 欠陥検査方法および装置
JPH08189903A (ja) * 1995-01-10 1996-07-23 Sekisui Chem Co Ltd 気泡検査装置
JPH08285789A (ja) * 1995-04-18 1996-11-01 Nippon Sheet Glass Co Ltd 欠点検出方法における２値化レベルの決定方法
JP3048342B2 (ja) * 1997-08-19 2000-06-05 三菱化学株式会社 透明板中の気泡検出装置
JP4044770B2 (ja) 2002-02-22 2008-02-06 芝浦メカトロニクス株式会社 基板貼合装置および基板貼合方法
JP2004170329A (ja) * 2002-11-22 2004-06-17 Nippon Steel Corp バンプ電極およびバンプ電極用ボール検査方法
JP2004257776A (ja) 2003-02-25 2004-09-16 Kiyousera Opt Kk 光透過体検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06323956A (ja) * 1993-03-19 1994-11-25 Olympus Optical Co Ltd プリズム異物検出方法
TW583389B (en) * 2002-01-10 2004-04-11 Omron Tateisi Electronics Co A surface conduction examination method and a substrate examination device
JP4581424B2 (ja) * 2004-02-24 2010-11-17 パナソニック電工株式会社 外観検査方法及び画像処理装置
TWI289658B (en) * 2005-06-01 2007-11-11 Tecnos Co Ltd Substrate inspection device and inspection method
TWI277719B (en) * 2005-08-03 2007-04-01 Chi-Cheng Ye Image inspection method and structure for attachment machine

Also Published As

Publication number Publication date
JP6032696B2 (ja) 2016-11-30
KR20130004079A (ko) 2013-01-09
TW201305527A (zh) 2013-02-01
KR101374440B1 (ko) 2014-03-17
JP2013033028A (ja) 2013-02-14

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