TWI480368B - 安定之化學機械研磨組成物及研磨基材之方法 - Google Patents

安定之化學機械研磨組成物及研磨基材之方法 Download PDF

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Publication number
TWI480368B
TWI480368B TW100120653A TW100120653A TWI480368B TW I480368 B TWI480368 B TW I480368B TW 100120653 A TW100120653 A TW 100120653A TW 100120653 A TW100120653 A TW 100120653A TW I480368 B TWI480368 B TW I480368B
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TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
hydroxide
anion
group
Prior art date
Application number
TW100120653A
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English (en)
Chinese (zh)
Other versions
TW201204816A (en
Inventor
郭毅
劉振東
肯查拉阿瑞 庫瑪 瑞迪
張廣云
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
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Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201204816A publication Critical patent/TW201204816A/zh
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Publication of TWI480368B publication Critical patent/TWI480368B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW100120653A 2010-06-15 2011-06-14 安定之化學機械研磨組成物及研磨基材之方法 TWI480368B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/815,564 US8232208B2 (en) 2010-06-15 2010-06-15 Stabilized chemical mechanical polishing composition and method of polishing a substrate

Publications (2)

Publication Number Publication Date
TW201204816A TW201204816A (en) 2012-02-01
TWI480368B true TWI480368B (zh) 2015-04-11

Family

ID=45047467

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100120653A TWI480368B (zh) 2010-06-15 2011-06-14 安定之化學機械研磨組成物及研磨基材之方法

Country Status (7)

Country Link
US (2) US8232208B2 (https=)
JP (1) JP5843093B2 (https=)
KR (1) KR101718798B1 (https=)
CN (1) CN102363713B (https=)
DE (1) DE102011104161B4 (https=)
FR (1) FR2961214B1 (https=)
TW (1) TWI480368B (https=)

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US8232208B2 (en) * 2010-06-15 2012-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized chemical mechanical polishing composition and method of polishing a substrate
US8865013B2 (en) * 2011-08-15 2014-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing tungsten
US9293339B1 (en) * 2015-09-24 2016-03-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing semiconductor substrate
US9803108B1 (en) 2016-10-19 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aqueous compositions of stabilized aminosilane group containing silica particles
CN111318956A (zh) * 2018-12-13 2020-06-23 夏泰鑫半导体(青岛)有限公司 聚氨酯研磨垫及其制造方法、及化学机械研磨装置
JP7681402B2 (ja) * 2021-01-14 2025-05-22 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法、研磨方法、基板の製造方法
JP7778621B2 (ja) * 2021-03-31 2025-12-02 株式会社フジミインコーポレーテッド 第四級アンモニウム系表面修飾シリカ、その組成物、作製方法、および使用方法

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CN101451049A (zh) * 2007-11-30 2009-06-10 安集微电子（上海）有限公司 一种化学机械抛光液

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US7005382B2 (en) * 2002-10-31 2006-02-28 Jsr Corporation Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
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JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
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US8232208B2 (en) * 2010-06-15 2012-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stabilized chemical mechanical polishing composition and method of polishing a substrate
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Patent Citations (2)

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CN101168647A (zh) * 2006-10-27 2008-04-30 安集微电子（上海）有限公司 一种用于抛光多晶硅的化学机械抛光液
CN101451049A (zh) * 2007-11-30 2009-06-10 安集微电子（上海）有限公司 一种化学机械抛光液

Also Published As

Publication number Publication date
DE102011104161A1 (de) 2012-01-26
US20120258598A1 (en) 2012-10-11
TW201204816A (en) 2012-02-01
JP5843093B2 (ja) 2016-01-13
US8232208B2 (en) 2012-07-31
US20110306211A1 (en) 2011-12-15
FR2961214B1 (fr) 2015-02-27
CN102363713A (zh) 2012-02-29
JP2012039087A (ja) 2012-02-23
DE102011104161B4 (de) 2022-12-15
FR2961214A1 (fr) 2011-12-16
KR101718798B1 (ko) 2017-03-22
KR20110136742A (ko) 2011-12-21
US8444728B2 (en) 2013-05-21
CN102363713B (zh) 2014-12-10

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