TWI479583B - 光學檢驗的系統與方法 - Google Patents

光學檢驗的系統與方法 Download PDF

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Publication number
TWI479583B
TWI479583B TW098111147A TW98111147A TWI479583B TW I479583 B TWI479583 B TW I479583B TW 098111147 A TW098111147 A TW 098111147A TW 98111147 A TW98111147 A TW 98111147A TW I479583 B TWI479583 B TW I479583B
Authority
TW
Taiwan
Prior art keywords
plane
beam path
lens
imaging
optical system
Prior art date
Application number
TW098111147A
Other languages
English (en)
Chinese (zh)
Other versions
TW200952102A (en
Inventor
Lars Markwort
Rajeshwar Chhibber
Klaus Eckerl
Norbert Harendt
Original Assignee
Nanda Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanda Technologies Gmbh filed Critical Nanda Technologies Gmbh
Publication of TW200952102A publication Critical patent/TW200952102A/zh
Application granted granted Critical
Publication of TWI479583B publication Critical patent/TWI479583B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW098111147A 2008-04-04 2009-04-03 光學檢驗的系統與方法 TWI479583B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6494908P 2008-04-04 2008-04-04

Publications (2)

Publication Number Publication Date
TW200952102A TW200952102A (en) 2009-12-16
TWI479583B true TWI479583B (zh) 2015-04-01

Family

ID=41059655

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098111147A TWI479583B (zh) 2008-04-04 2009-04-03 光學檢驗的系統與方法

Country Status (7)

Country Link
US (4) US8072591B2 (OSRAM)
JP (1) JP5749641B2 (OSRAM)
KR (1) KR101697240B1 (OSRAM)
CN (1) CN102016554B (OSRAM)
DE (1) DE112009000832T5 (OSRAM)
TW (1) TWI479583B (OSRAM)
WO (1) WO2009121628A2 (OSRAM)

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JP2011203245A (ja) * 2010-03-02 2011-10-13 You-Na Tech Corp 半導体ウェハの表面検査システム及び表面検査方法
EP2378548A1 (en) 2010-04-19 2011-10-19 Nanda Technologies GmbH Methods of processing and inspecting semiconductor substrates
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CN102269858A (zh) * 2010-06-02 2011-12-07 北京智朗芯光科技有限公司 自动聚焦系统和自动聚焦方法
EP2609419A1 (en) 2010-08-24 2013-07-03 Nanda Technologies GmbH Methods and systems for inspecting bonded wafers
US8501503B2 (en) 2011-04-28 2013-08-06 Nanda Technologies Gmbh Methods of inspecting and manufacturing semiconductor wafers
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US9213156B2 (en) 2011-08-17 2015-12-15 Source Photonics, Inc. Optical receiver with reduced cavity size and methods of making and using the same
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DE102012111835A1 (de) 2012-12-05 2014-06-05 Hseb Dresden Gmbh Inspektionsvorrichtung
US9810892B2 (en) 2013-03-15 2017-11-07 The Board Of Trustees Of The Leland Stanford Junior University Optical lens fabrication
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US9176070B2 (en) 2014-04-07 2015-11-03 Hseb Dresden Gmbh Inspection assembly
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JP6670561B2 (ja) * 2014-07-17 2020-03-25 オルボテック リミテッド テレセントリック明視野および環状暗視野のシームレス融合型照明
US9377596B2 (en) * 2014-07-22 2016-06-28 Unimicron Technology Corp. Optical-electro circuit board, optical component and manufacturing method thereof
WO2016015734A1 (en) * 2014-08-01 2016-02-04 Dfm A/S A scatterometer apparatus
KR101741659B1 (ko) 2014-11-03 2017-05-31 주식회사 엠티엠 카메라 모듈 이물 검사를 위한 광원장치
IL243167B (en) * 2014-12-18 2021-02-28 Gordon Noam Multiple light sources that can be separated by optical inspection
IL243166B2 (en) * 2014-12-18 2023-10-01 Camtek Imaging Tech Suzhou Co Ltd Modification of the optical properties of line-scan illumination depending on the light angle along the line axis
JP6024056B2 (ja) * 2015-01-13 2016-11-09 新一 土坂 球面検査装置
US10309907B2 (en) * 2015-03-04 2019-06-04 Kla-Tencor Corporation All reflective wafer defect inspection and review systems and methods
EP3411694A4 (en) * 2016-02-03 2019-09-04 Kla-Tencor Corporation WAFER DEFECT INSPECTION AND TESTING SYSTEMS
ES2819699T3 (es) 2016-03-07 2021-04-19 Hyla Inc Detección de daño de pantalla para dispositivos
KR101992042B1 (ko) * 2016-04-12 2019-06-21 닛폰세이테츠 가부시키가이샤 피검사체 촬상 장치, 피검사체 촬상 방법, 표면 검사 장치 및 표면 검사 방법
US10828684B2 (en) 2017-01-31 2020-11-10 Jfe Steel Corporation Steel-products shape measurement device and steel-products shape correction device
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JP7175214B2 (ja) * 2019-02-13 2022-11-18 リコーインダストリアルソリューションズ株式会社 検査装置
JP7665601B2 (ja) 2019-09-16 2025-04-21 アシュラント インコーポレイテッド モバイルデバイスの完全性状態を判断するために機械学習を利用してモバイルデバイスの画像を処理するためのシステム、方法、装置、および持続性コンピュータ可読記憶媒体
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KR102830664B1 (ko) * 2023-11-08 2025-07-07 (주)뮤텍코리아 반도체 웨이퍼의 나노급 파티클 검사를 위한 광학 시스템
CN120314303B (zh) * 2025-03-13 2025-12-23 飞测思凯浦(上海)半导体科技有限公司 一种成像调节装置和光学检测设备

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Also Published As

Publication number Publication date
US8072591B2 (en) 2011-12-06
KR101697240B1 (ko) 2017-01-17
DE112009000832T5 (de) 2011-07-28
US8368881B2 (en) 2013-02-05
WO2009121628A2 (en) 2009-10-08
US20110043796A1 (en) 2011-02-24
US20110043798A1 (en) 2011-02-24
CN102016554A (zh) 2011-04-13
US8102521B2 (en) 2012-01-24
US20100231902A1 (en) 2010-09-16
JP5749641B2 (ja) 2015-07-15
JP2011516844A (ja) 2011-05-26
US8345232B2 (en) 2013-01-01
CN102016554B (zh) 2013-01-30
US20120133760A1 (en) 2012-05-31
WO2009121628A9 (en) 2009-11-26
KR20110000560A (ko) 2011-01-03
TW200952102A (en) 2009-12-16

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