TWI471964B - Apparatus for cleaning substrate - Google Patents

Description

Substrate cleaning equipment

The present invention relates to a substrate cleaning apparatus. And in particular, the present invention relates to a large-sized substrate cleaning apparatus capable of preventing leakage between a porous cleaning panel and a manifold constituting an impurity cleaning unit and suppressing damage of a porous cleaning panel due to fastening.

In the recent information society, as a video transmission medium, the importance of display devices has received more attention, but should meet the needs of, for example, low power consumption, thin profile, light weight, and high image quality for future use. Main location.

The display device can be classified into a self-luminous display capable of self-emitting light, such as a cathode ray tube (CRT), an electroluminescent display (EL), a light emitting diode (LED), Vacuum Fluorescent Display (VFD), Field Emission Display (FED), Plasma Display Panel (PDP), etc., and non-self-illuminating display devices, non-self-illuminating display The device is not capable of self-emitting light, such as a liquid crystal display device.

A liquid crystal display device is a device that uses an optical anisotropy of liquid crystal molecules to represent an image, and in recent years, since the visibility of the liquid crystal display device is superior to that of a cathode ray tube (CRT), and compared with the same screen The size of the cathode ray tube (CRT) has lower average power consumption and heat loss, so the liquid crystal display device together with the plasma display panel (PDP) becomes the focus of the second generation device.

Since the liquid crystal used in the liquid crystal display device is not a light-emitting material that emits light, but is a light-receiving material that displays an image on the screen by adjusting the amount of light, and therefore, the liquid crystal display device needs to have a single light source, that is, A backlight assembly for illuminating a liquid crystal display panel.

Hereinafter, this liquid crystal display device will be described in detail.

If not specifically mentioned, among the liquid crystal display devices formed, a portion in which a tube is placed is referred to as a bottom portion, and a portion in which a liquid crystal panel is placed is referred to as a top portion.

A liquid crystal display device can include a liquid crystal panel in which liquid crystal molecules are injected between an array substrate and a color filter substrate for displaying an image, and a backlight assembly is provided behind one of the liquid crystal panels. Above the surface is used to emit light over all of the surface of the liquid crystal panel, and a plurality of shell elements for fixing the liquid crystal panel to the backlight assembly for bonding them to each other.

Generally, the liquid crystal display device controls the light transmittance of the liquid crystal cell according to a video signal to display an image, and an active matrix type liquid crystal display device has advantages in displaying a moving picture, and each of the active matrix type liquid crystal display devices The pixel unit is formed with a switching element. At the same time, a thin film transistor is mainly used as a switching element.

Here, the manufacturing process of the liquid crystal panel can be roughly classified into an array process for forming a plurality of switching elements on a bottom array substrate in the array process, and a color filter process for forming a plurality of color filters. The device is placed on top of a color filter substrate, and a unit process, and before or after these processes, the substrate will pass through a cleaning process.

Different cleaning devices are used in the substrate cleaning process, and among these cleaning devices, a porous adjacent cleaning device is used in a cleaning method, which comprises using an air floating unit to float a glass substrate for The glass substrate is transferred to a cleaner, and deionized water and air are supplied under the condition that a gap of less than 100 micrometers (um) is formed at the top and bottom of the glass substrate in the cleaning region, and deionized water flow and bubble flow are generated simultaneously. To remove particles and absorbed substances.

The porous cleaning apparatus may include a porous cleaning panel, a manifold, and a top frame, and the porous cleaning panel is bonded to the manifold through an organic binder or the like.

However, one of the prior art porous cleaning devices has the following problems.

Among the porous cleaning apparatuses of the prior art, an organic binder can be used when the porous cleaning panel is fastened to the manifold, but the organic binder has the disadvantage that it is not suitable for a cleaner having many holes. In particular, there is a case where the organic binder is unevenly coated and thus air leakage occurs.

Accordingly, in view of the above problems, it is an object of the present invention to provide a substrate cleaning apparatus capable of preventing leakage between a porous cleaning panel constituting an impurity cleaning unit and a manifold.

Another object of the present invention is to provide a substrate cleaning apparatus capable of suppressing fastening due to fastening by using an indirect fastening method using an insert block in fastening between a large-sized porous cleaning panel and a manifold. Damage and stress of a porous cleaning panel.

Other objects and features of the present invention will be described in the description and claims of the present invention.

In order to accomplish the above object, a substrate cleaning apparatus of the present invention comprises: a substrate insertion guiding unit for inserting a substrate from the outside; and an impurity removing unit for receiving a substrate from the substrate insertion guiding unit for removing the substrate. An impurity formed thereon; an impurity cleaning unit for receiving the substrate from the impurity removing unit and cleaning and removing impurities remaining on the substrate; and a position control unit for controlling the position of the substrate transported from the impurity cleaning unit, wherein The impurity cleaning unit comprises an insert block having a plurality of fastening holes, a porous cleaning panel in which the insert block is inserted into a recess formed at a fixed interval, and a manifold, the manifold One of the fastening screws is inserted through a fastening hole in the insertion block for combination with the porous cleaning panel.

As described above, according to the substrate cleaning apparatus of the present invention, a porous cleaning panel and a manifold are fastened to each other by using an insertion block, thereby preventing air leakage at the joint portion thereof and enhancing a large-size cleaning. The fastening force between the panel and a manifold.

Moreover, as described above, in the fastening between the large-sized porous cleaning panel and a manifold, the application uses an insert block inter-engaging fastening method, thereby minimizing the porous cleaning panel due to the fastening. Damage and stress.

Further, according to the substrate cleaning apparatus of the present invention, the fastening between the porous cleaning panel and the manifold is a simple operation, and the porous cleaning panel is not damaged during the fastening process, thereby being capable of cleaning a large-sized substrate. advantage.

Hereinafter, a substrate cleaning apparatus of the present invention will be described in detail in conjunction with the drawings.

Fig. 1 is a cross-sectional view showing a substrate cleaning apparatus according to a first embodiment of the present invention. Further, Fig. 2 is a perspective view of the impurity cleaning unit in the substrate cleaning apparatus of the first embodiment of the present invention shown in Fig. 1.

As shown in the figure, the substrate cleaning apparatus of the first embodiment of the present invention may include a substrate insertion guiding unit 100 for inserting an external substrate 10 into a correct direction; an impurity removing unit 120, which receives a substrate 10 from the substrate insertion guiding unit 100 for removing impurities formed on the substrate 10; an impurity cleaning unit 130 that receives the substrate 10 from the impurity removing unit 120 for cleaning and removing the remaining on the substrate 10. Impurities; and a position control unit 140 for controlling the position of the substrate 10 transported from the impurity cleaning unit 130.

Here, the substrate insertion guide unit 100, the impurity removal unit 120, the impurity cleaning unit 130, and the position control unit 140 are formed of a metal porous material. For example, the substrate insertion guide unit 100, the impurity removal unit 120, the impurity cleaning unit 130, and the position control unit 140 may have stainless steel, aluminum (Al), aluminum alloy, brass, Hastelloy, and zirconium. Made of any of the porous materials.

In particular, the substrate insertion guide unit 100, the impurity removal unit 120, the impurity cleaning unit 130, and the position control unit 140 may be configured to be different metal porous materials. For example, the substrate insertion guide unit 100 may be made of a stainless steel material, the impurity removal unit 120 may be made of aluminum (Al), the impurity cleaning unit 130 may be made of aluminum alloy, and the position control unit 140 may be made of brass.

Here, stainless steel, aluminum (Al), aluminum alloy, brass, Hastelloy, and zirconium are metals of high hardness, and when the substrate is formed by using these metals, the substrate is inserted into the guiding unit 100, the impurity removing unit 120, and impurities. When the cleaning unit 130 and the position control unit 140 are cleaned, it is possible to improve the chemical resistance of the cleaning device.

Moreover, the hardness of the metals listed above is smaller than that of the object to be cleaned, that is, the hardness of a substrate 10, and thus a cleaning apparatus can be fabricated using those metals, whereby the substrate 10 and the cleaning apparatus are even in a cleaning process. When it comes into contact with each other, the substrate 10 is prevented from being damaged.

The constituent elements described above will be described below.

The substrate insertion guide unit 100 may include an insertion guide path (not shown) that guides the substrate 10 that is externally accessed through a roller 50 for correctly inserting the substrate 10 into the impurity removal unit 120.

The insertion guide path has a form in which the width of the impurity removing unit 120 is gradually reduced from the outside. Through this type of insertion guide path, the substrate 10 can be automatically moved toward the precise center of the insertion guide path even in a state where the substrate 10 is not accurately aligned along the precise center of the insertion guide path.

Moreover, the substrate insertion guide unit 100 may include a top structure 100a and a bottom structure 100b facing each other. The top structure 100a and the bottom structure 100b are spaced apart from each other by a predetermined distance, and the aforementioned insertion guide path is formed between the top structure 100a and the bottom structure 100b which are spaced apart from each other.

The top structure 100a injects air toward the insertion guide path and also sucks in the injected air, and the bottom structure 100b injects air toward the insertion guide path and also sucks in the injected air. Therefore, the substrate 10 inserted into the insertion guide path will be in a floating state above the space in which the guide path is inserted.

Here, the two surfaces facing each other between the top structure 100a and the bottom structure 100b are inclined surfaces having a slope of a predetermined angle. In particular, the inclined surface of the top structure 100a is an inclined surface having a predetermined angle with respect to a top surface of the substrate 10, and the inclined surface of the bottom structure 100b is inclined at a predetermined angle with respect to one of the bottom surfaces of the substrate 10. surface. The space between the two inclined surfaces is an insertion guide path, and the gap between the insertion guide paths can be changed by controlling a gap between the top structure 100a and the bottom structure 100b.

The main body of the top structure 100a and the bottom structure 100b is made of a metal porous material for injecting externally supplied air to the substrate 10 through the main body of the top structure 100a and the bottom structure 100b. In other words, the air ejected from the outside toward the top portion of the top structure 100a passes through the top structure 100a and is supplied to the insertion guide path, and the air ejected from the outside toward the bottom portion of the bottom structure 100b passes through the bottom structure. 100b is supplied to the insertion guide path.

Here, a plurality of suction holes (not shown) for taking in air are formed on each of the top structure 100a and the bottom structure 100b. The suction hole formed over the top structure 100a penetrates the top structure 100a toward the insertion guide path, and the suction hole formed over the bottom structure 100b penetrates the bottom structure 100b toward the insertion guide path.

Moreover, the impurity removing unit 120 may include a top impurity removing unit 120a and a bottom impurity removing unit 120b. The top impurity removing unit 120a and the bottom impurity removing unit 120b are spaced apart from each other by a predetermined distance, and a moving space (not shown) for moving a substrate 10 is formed between the two spaced structures.

The top impurity removing unit 120a removes impurities by physical contact with impurities formed over the top surface of one of the substrates 10, and the bottom impurity removing unit 120b removes impurities by physical contact with impurities formed over one of the bottom surfaces of the substrate 10.

Here, the substrate 10 and the top impurity removing unit 120a and the bottom impurity removing unit 120b are positioned close to each other, and therefore, when the substrate 10 is moved by the moving space, when the substrate 10 is formed on the top surface of the substrate 10, the upwardly protruding impurities and the top impurity are formed. When the removing unit 120a collides, these upwardly protruding impurities are removed, and when the downwardly protruding impurities formed on one of the bottom surfaces of the substrate 10 collide with the bottom impurity removing unit 120b, these downwardly protruding impurities are removed. The gap between the top impurity removing unit 120a and the bottom impurity removing unit 120b can be controlled according to the thickness of the substrate 10.

On the other hand, the impurity cleaning unit 130 may include a top impurity cleaning unit 130a and a bottom impurity cleaning unit 130b facing each other. The top impurity cleaning unit 130a and the bottom impurity cleaning unit 130b are spaced apart from each other by a predetermined distance, and a moving space (not shown) for moving a substrate 10 is formed between the adjacent top impurity cleaning unit 130a and the bottom impurity cleaning unit. In the space between 130b.

Here, the top impurity cleaning unit 130a injects air toward the moving space and sucks in air through the suction hole 115, and similarly, the bottom impurity cleaning unit 130b injects air toward the moving space and sucks in air through the suction hole 115.

Therefore, the substrate 10 inserted into the moving space becomes a floating state above the moving space. In other words, the top impurity cleaning unit 130a injects air toward the top surface of one of the substrates 10 inserted into the moving space and sucks in the injected air, and the bottom impurity cleaning unit 130b faces the substrate 10 inserted into the moving space. A bottom surface injects air and sucks in the jetted air, whereby the substrate 10 is in a floating state in the moving space, and at the same time, the ejection force is larger than the suction force.

Moreover, the top impurity cleaning unit 130a sprays the cleaning solution (deionized water) toward the moving space through the plurality of deionized water holes 113 and generates bubbles using the cleaning solution and the jetted air, thereby removing impurities from the top surface of the substrate 10 through the moving space. . Further, the bottom impurity cleaning unit 130b ejects the cleaning solution (deionized water) toward the moving space through the plurality of deionized water holes 113 and generates bubbles using the cleaning solution and the ejected air, thereby removing impurities from the bottom surface of the substrate 10 through the moving space. .

Moreover, the top impurity cleaning unit 130a and the bottom impurity cleaning unit 130b evacuate the cleaning water to the outside using the inhaled air. Deionized water, a chemical solution, or a mixed solution of deionized water and a chemical solution can be used as the cleaning solution.

The main system of the top impurity cleaning unit 130a and the bottom impurity cleaning unit 130b is made of a metal porous material for injecting air supplied from the outside to the moving space through the main body of the top impurity cleaning unit 130a and the bottom impurity cleaning unit 130b. In other words, the air ejected from the outside toward the top of one of the top impurity cleaning units 130a passes through the top impurity cleaning unit 130a and is supplied to the moving space, and the air ejected from the outside toward the bottom of one of the bottom impurity cleaning units 130b passes through the bottom impurities. The cleaning unit 130b is supplied to the moving space.

In this manner, a plurality of deionized water holes 113 for ejecting the cleaning solution and a plurality of suction holes 115 for taking in air are formed on each of the top impurity cleaning unit 130a and the bottom impurity cleaning unit 130b. A plurality of deionized water holes 113 and suction holes 115 are formed on a manifold 101, and the deionized water holes 113 and the suction holes 115 are associated with a through hole 111a provided by a top fastening screw 111. The fixing screw 111 is used to fasten a porous cleaning panel 131 combined with the manifold 101.

Here, a top fastening screw 111 formed with a penetration hole 111a is inserted into a contact portion between the manifold 101 and the porous cleaning panel 131 for preventing each effect of the self-designed manifold 101. The interaction leaks such that each utility zone is isolated from the porous cleaning panel 131, thereby preventing leakage and further enhancing the adhesion between the manifold 101 and the porous cleaning panel 131.

Further, an air hole 103 is formed above the manifold 101, and thereby the porous cleaning panel 131 is combined with the manifold 101 to provide an air path 105 therebetween. Therefore, air will be ejected through the air path 105 through the entire surface of the porous cleaning panel 131 in the top impurity cleaning unit 130a and the bottom impurity cleaning unit 130b.

Moreover, a channel 133 having a predetermined depth is formed in such a manner that a plurality of top fastening screws 111 fastened to and coupled with the manifold 101 are spaced apart by a predetermined distance so as to be fixed to the top impurity cleaning unit 130a and the bottom impurity. Above each of the porous cleaning panels 131 of the cleaning unit 130b.

A plurality of deionized water holes 113 and suction holes 115 are associated with the penetration holes 111a of the top fastening screws 111 fixed to the channel 133. A plurality of suction holes 115 suck air or a cleaning solution through the channel 133, and the deionized water holes 113 spray the cleaning solution through the penetration holes 111a of the top fastening screws 111. Here, the top fastening screw 111 should be lower than the height of the channel 133, and the diameter of the screw should be smaller than the diameter of the channel 133.

In a direction perpendicular to the traveling direction of the substrate 10, a plurality of channels 133 are separated by a predetermined distance, and a cleaning solution is filled in the channel 133, thereby improving the cleaning effect of the substrate 10.

Moreover, the manifold 101 is coupled to each other through the bottom fastening screw 121 together with the top fastening screw 111, and the bottom fastening screw 121 is inserted from the bottom of the manifold 101 for fastening to the porous cleaning panel 131, and thus the manifold 101 and The fastening porous cleaning panels 131 are double-folded to each other in a firm manner.

Moreover, a sealing member 107 is inserted into a contact portion between the manifold 101 and the porous cleaning panel 131 to prevent interaction leakage between each of the designed manifolds 101 so that each utility region The porous cleaning panel 131 is isolated, thereby further enhancing an adhesive force between the manifold 101 and the porous cleaning panel 131.

Here, a material having a low physical and chemical deformation, for example, a Teflon-based or fluorine-based material is used as the sealing member 107.

On the other hand, the position control unit 140 injects air toward the performed substrate 10 and sucks in the ejected air, thereby holding the substrate 10 in a floating state. The substrate 10 carried from the position control unit 140 is moved by a roller 60 to a subsequent process apparatus.

Thus, the substrate cleaning apparatus according to the first embodiment of the present invention uses a top fastening screw having a penetration hole and a bottom fastening screw, wherein the penetration hole is associated with the deionized water and the suction hole, and a porous cleaning The panel and a manifold are fastened to each other, thereby preventing air leakage in the deionized water and the suction hole, and enhancing the fastening force between the cleaning panel and the manifold.

However, according to the substrate cleaning apparatus of the first embodiment of the present invention, in a method of directly fastening a fastening screw (or bolt) to the porous cleaning panel, an insertion needle should be inserted into the porous cleaning panel for use. Tighten the screws. In order to insert the insertion needle, since a plurality of holes must be formed on the porous cleaning panel, damage and stress can be generated in the porous cleaning panel. In other words, in order to fasten between the porous cleaning panel and the manifold by using screws, an insertion needle for fastening the screw should be inserted into the porous cleaning panel, but during the process, the cleaning panel is Cracks may be generated in the middle, or the needle may be loosened when an excessive force is used. There may be several inserts for one cleaning panel, but if any of the insertion pins are defective, there is a risk that all cleaning panels will not be used.

In the case where the area of the porous cleaning panel is increased in a substrate cleaning apparatus, the number of screws is increased, thereby increasing the damage and stress acting on the cleaning panel. Moreover, the uniformity of the cleaning panel can be changed according to the fixed size of fastening each screw, and since the clamping torque is limited, the fastening force cannot be sufficiently increased.

Therefore, by using an indirect fixing of the insert block between the large-sized porous cleaning panel and a manifold, damage or stress generated by the direct fixing operation described above can be suppressed, and deionized water and suction holes can be formed in the insert block. The leakage can be effectively suppressed, and will be described in detail below by a second embodiment of the present invention.

Fig. 3 is a perspective view showing an impurity cleaning unit in the substrate cleaning apparatus of the second embodiment of the present invention. Further, "4A" and "4B" are perspective views of an insert block of the second embodiment of the present invention shown in "Fig. 3" inserted into a porous cleaning panel in the impurity cleaning unit. .

In addition, the "fifth diagram" is a perspective view of the impurity cleaning unit in the substrate cleaning apparatus of the second embodiment of the present invention shown in "Fig. 3".

Here, among the substrate cleaning apparatuses of the second embodiment of the present invention, all the constituent elements except the impurity cleaning unit are substantially the same as those of the foregoing substrate cleaning apparatus of the first embodiment of the present invention.

In other words, although not shown, the substrate cleaning apparatus of the second embodiment of the present invention may include a substrate insertion guide unit for inserting a substrate from the outside into a correct direction; An impurity removing unit that receives a substrate from the substrate insertion guiding unit to remove impurities formed on the substrate; an impurity cleaning unit that receives the substrate from the impurity removing unit to clean and remove impurities remaining on the substrate; and a position A control unit for controlling the position of the substrate transported from the impurity cleaning unit.

Here, the substrate insertion guide unit, the impurity removal unit, the impurity cleaning unit, and the position control unit are formed of a metal porous material. For example, the substrate insertion guide unit, the impurity removal unit, the impurity cleaning unit, and the position control unit may be made of any one of stainless steel, aluminum (Al), aluminum alloy, brass, Hastelloy, and zirconium. Made of porous materials.

Here, stainless steel, aluminum (Al), aluminum alloy, brass, Hastelloy, and zirconium are metals of high hardness, and when the substrate is formed by using these metals, the substrate is inserted into the guiding unit, the impurity removing unit, and the impurity cleaning unit. As well as the position control unit, it is possible to improve the chemical resistance of the cleaning device.

Moreover, the hardness of the metals listed above is smaller than that of the object to be cleaned, that is, the hardness of a substrate, and thus a cleaning device can be fabricated using those metals, whereby the substrate and the cleaning device are mutually in contact during a cleaning process. Prevent damage to the substrate when in contact.

Moreover, as described above, the impurity removing unit may include a top impurity removing unit (not shown) and a bottom impurity removing unit (not shown). The top impurity removing unit (not shown) and the bottom impurity removing unit (not shown) are spaced apart from each other by a predetermined distance, and a moving space (not shown) for moving a substrate is formed between the two spaced spaces. Between the structures.

Here, as shown, the top impurity cleaning unit injects air toward the moving space and sucks the injected air through the plurality of holes 211b, and similarly, the bottom impurity cleaning unit injects air toward the moving space and suctions the jet through the plurality of holes 211b. air.

Therefore, the substrate inserted into the moving space becomes a floating state above the moving space. In other words, the top impurity cleaning unit injects air toward the top surface of one of the substrates inserted into the moving space and sucks in the injected air, and the bottom impurity cleaning unit ejects toward the bottom surface of one of the substrates inserted into the moving space. The air is sucked into the jetted air, whereby the substrate is kept in a floating state in the moving space, and at the same time, the ejection force is larger than the suction force.

Moreover, the top impurity cleaning unit ejects the cleaning solution (deionized water) toward the moving space through the plurality of holes 211b and generates bubbles using the cleaning solution and the ejected air, thereby removing impurities from the top surface of the substrate through the moving space. Moreover, the bottom impurity cleaning unit ejects the cleaning solution (deionized water) toward the moving space through the plurality of holes 211b and generates bubbles using the cleaning solution and the ejected air, thereby removing impurities from the bottom surface of the substrate through the moving space.

Moreover, the top impurity cleaning unit and the bottom impurity cleaning unit evacuate the cleaning water to the outside using the inhaled air. Deionized water, a chemical solution, or a mixed solution of deionized water and a chemical solution can be used as the cleaning solution.

Here, the plurality of holes 211b may include a plurality of suction holes for injecting air into the moving space and sucking the injected air, and a plurality of deionized water holes for injecting the cleaning solution to the movement. space.

Here, the main system of the top impurity cleaning unit and the bottom impurity cleaning unit is made of a metal porous material for injecting air supplied from the outside to the moving space through the main body of the top impurity cleaning unit and the bottom impurity cleaning unit. In other words, the air ejected from the outside toward the top of one of the top impurity cleaning units passes through the top impurity cleaning unit and is supplied to the moving space, and the air ejected from the outside toward the bottom of one of the bottom impurity cleaning units passes through the bottom impurity cleaning unit and Supply to the mobile space.

Thus, a plurality of deionized water holes for ejecting the cleaning solution and a plurality of suction holes for taking in air are formed on each of the top impurity cleaning unit and the bottom impurity cleaning unit. In particular, a plurality of deionized water holes and suction holes according to the second embodiment of the present invention, that is, a plurality of holes 211b are formed in an insertion block 250, and are fastened to the manifold 201 at the insertion block 250. In position, a plurality of apertures 211b are associated with connection apertures 215 provided in a manifold 201.

Moreover, a plurality of fastening holes 211a for fastening to the manifold 210 are formed in the insertion block 250, and a plurality of fastening screws are inserted through the fastening holes 211a of the insertion block 250 for insertion into the concave portion at the insertion block 250. The state in the groove 231a is combined with the manifold 201, wherein the grooves 231a are formed at a fixed interval over the porous cleaning panel 231, thereby preventing leakage and suppressing damage and stress of the porous cleaning panel 231 due to fastening.

A channel 233 having a predetermined depth is formed longitudinally on the porous cleaning panel 231 at regular intervals for insertion through the insertion block 250 spaced apart by a predetermined distance, and the groove 231a is formed in the channel 233, The groove 231a has a length corresponding to the length of the insertion block 250.

Here, for example, the insertion block 250 may have a top portion 250a of a T-shaped cross-section and a bottom body 250b, and in this case, the top portion 250a has a width that is concave compared to the porous cleaning panel 231. The slot 231a has a larger width for receiving in the channel 233, and the bottom body 250b has substantially the same width as the recess 231a of the porous cleaning panel 231 for a portion thereof to be adapted to the manifold 201 and The manifold 201 can be inserted into the recess 231a when combined.

Thus, the bottom body 250b of the insert block 250 is formed to be deeper than a contact surface between the porous cleaning panel 231 and the manifold 201.

Here, for example, in the drawings, the fastening screw 211 is fastened from the top of the porous cleaning panel 231 positioned with the insertion block 250 toward the lower manifold 201. However, the present invention is not limited thereto, and the present invention can be applied to the case where the fastening screw 211 is fixed from the bottom of one of the manifolds 201 toward the upper porous cleaning panel 231.

Moreover, an air hole (not shown) is formed over the manifold 201 for providing an air path 205 between the porous cleaning panel 231 and the manifold 201 that are coupled to each other. Therefore, air is ejected through the air path 205 through the entire surface of one of the top impurity cleaning unit and the porous cleaning panel 231 among the bottom impurity cleaning units.

However, the present invention is not limited thereto, and the air path 205 may be formed in one of the porous cleaning panel 231 or the manifold 201.

Moreover, a seal 207, such as a gasket, is inserted into a contact portion between the manifold 201 and the porous cleaning panel 231 to prevent leakage of interaction between each of the designed manifolds 201, thereby An adhesive force between the manifold 201 and the porous cleaning panel 231 is further enhanced.

Here, a material having a low physical and chemical deformation, for example, a Teflon-based or fluorine-based material is used as the sealing member 207.

Thus, according to the substrate cleaning apparatus of the second embodiment of the present invention, a porous cleaning panel and a manifold are fastened to each other by using an insertion block, thereby preventing air leakage at the joint portion and enhancing The fastening force between the large-sized porous cleaning panel and the manifold.

In particular, according to the substrate cleaning apparatus of the second embodiment of the present invention, in the fastening between the large-sized porous cleaning panel and the manifold, the indirect fastening method using an insert block does not require a porous The cleaning panel is inserted into a pin, thereby reducing damage and stress of the porous cleaning panel and improving the efficiency of using the cleaning panel. In addition, a fastening between the porous cleaning panel and the manifold is a simple operation and thus does not damage the porous cleaning panel during the fastening process, thereby simplifying the manufacture of a large size porous cleaning panel.

The invention has been described above in terms of the preferred embodiments of the invention and is not intended to limit the scope of the invention. Therefore, please refer to the attached patent application scope for the scope of protection defined by the present invention.

10. . . Substrate

50. . . Roller

60. . . Roller

100. . . Substrate insertion guide unit

100a. . . Top structure

100b. . . Bottom structure

101. . . Manifold

103. . . Air hole

105. . . Air path

107. . . Seals

111. . . Top fastening screw

111a. . . Penetrating hole

113. . . Deionized water hole

115. . . Suction hole

120. . . Impurity removal unit

120a. . . Top impurity removal unit

120b. . . Bottom impurity removal unit

121. . . Bottom fastening screw

130. . . Impurity cleaning unit

130a. . . Top impurity cleaning unit

130b. . . Bottom impurity cleaning unit

131. . . Porous cleaning panel

133. . . Channel

140. . . Position control unit

201. . . Manifold

205. . . Air path

207. . . Seals

211. . . Fastening screw

211a. . . Fastening hole

211b. . . hole

215. . . Connection hole

231. . . Porous cleaning panel

231a‧‧‧ Groove

233‧‧‧Channel

250‧‧‧ Insert block

250a‧‧‧ head

250b‧‧‧ bottom body

1 is a cross-sectional view of a substrate cleaning apparatus according to a first embodiment of the present invention;

Figure 2 is a perspective view of the impurity cleaning unit in the substrate cleaning apparatus of the first embodiment of the present invention shown in Figure 1;

3 is a perspective view of an impurity cleaning unit in a substrate cleaning apparatus according to a second embodiment of the present invention;

4A and 4B are perspective views of an insert block of the second embodiment of the present invention shown in FIG. 3 inserted into a porous cleaning panel in the impurity cleaning unit;

Fig. 5 is a perspective view showing an impurity cleaning unit in the substrate cleaning apparatus of the second embodiment of the present invention shown in Fig. 3.

10. . . Substrate

50. . . Roller

60. . . Roller

100. . . Substrate insertion guide unit

100a. . . Top structure

100b. . . Bottom structure

101. . . Manifold

111. . . Top fastening screw

111a. . . Penetrating hole

113. . . Deionized water hole

115. . . Suction hole

120. . . Impurity removal unit

120a. . . Top impurity removal unit

120b. . . Bottom impurity removal unit

121. . . Bottom fastening screw

130. . . Impurity cleaning unit

130a. . . Top impurity cleaning unit

130b. . . Bottom impurity cleaning unit

140. . . Position control unit

Claims (14)

A substrate cleaning device includes: a substrate insertion guiding unit for inserting a substrate from the outside; an impurity removing unit receiving a substrate from the substrate insertion guiding unit for removing impurities formed on the substrate; An impurity cleaning unit for receiving the substrate from the impurity removing unit and cleaning and removing impurities remaining on the substrate; and a position control unit for controlling the position of the substrate transported from the impurity cleaning unit, Wherein the impurity cleaning unit comprises: a plurality of insertion blocks having a plurality of fastening holes, and a porous cleaning panel having a plurality of channels, wherein the insertion blocks are respectively inserted at regular intervals Forming a plurality of grooves in each of the channels, and a manifold having a plurality of fastening screws, each of the fastening screws respectively passing through each of the insertion blocks A fixed hole is inserted for bonding with the porous cleaning panel. The substrate cleaning apparatus of claim 1, wherein the impurity cleaning unit comprises a top impurity cleaning unit and a bottom impurity cleaning unit facing each other. The substrate cleaning apparatus of claim 2, wherein the top impurity cleaning unit and the bottom impurity cleaning unit are spaced apart from each other by a predetermined distance, and a moving empty Formed in a space between the top impurity cleaning unit and the bottom impurity cleaning unit for moving the substrate. The substrate cleaning apparatus of claim 3, further comprising: a plurality of holes having a plurality of suction holes formed in the insertion blocks and a deionized water hole for moving to the movement The space injects air and draws in the injected air, and the deionized water hole is used to inject a cleaning solution into the moving space. The substrate cleaning apparatus of claim 4, wherein the holes are configured to be associated with a plurality of connection holes provided on the manifold at a position where the insertion blocks are secured to the manifold. The substrate cleaning apparatus of claim 1, wherein each of the channels has a predetermined depth and is longitudinally formed on the hole cleaning panel at regular intervals for insertion through a predetermined distance Each of these intervals is inserted into the block. The substrate cleaning apparatus of claim 6, wherein each of the insert blocks is configured to have a top portion having a 〞T〞-shaped cross section and a bottom body having a width corresponding to the porous Each of the grooves of the cleaning panel has a greater width for receiving in each of the channels, and the bottom body has a width corresponding to each of the grooves of the porous cleaning panel, A portion can be inserted into each of the grooves when one of the bottom bodies is adapted to the manifold and combined with the manifold. The substrate cleaning device of claim 7, wherein each of the insert blocks The bottom body is formed to be deeper than a contact surface between the porous cleaning panel and the manifold. The substrate cleaning apparatus of claim 1, wherein each of the fastening screws is fastened from the top of the porous cleaning panel positioned with the insert block toward the lower portion of the manifold. The substrate cleaning apparatus of claim 1, wherein each of the fastening screws is fixed from the bottom of the manifold toward the upper portion of the porous cleaning panel. The substrate cleaning apparatus of claim 1, wherein an air hole is formed in the manifold to provide an air path therebetween by bonding the porous cleaning panel and the manifold to each other. The substrate cleaning apparatus of claim 11, wherein the air path is formed in one of the porous cleaning panel or the manifold. The substrate cleaning apparatus of claim 1, wherein a seal member is inserted into a contact portion between the manifold and the porous cleaning panel. The substrate cleaning apparatus of claim 13, wherein the seal is a Teflon-based or fluorine-based material.