CN101966525B - Apparatus for cleaning substrate - Google Patents

Apparatus for cleaning substrate Download PDF

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Publication number
CN101966525B
CN101966525B CN2009102623877A CN200910262387A CN101966525B CN 101966525 B CN101966525 B CN 101966525B CN 2009102623877 A CN2009102623877 A CN 2009102623877A CN 200910262387 A CN200910262387 A CN 200910262387A CN 101966525 B CN101966525 B CN 101966525B
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substrate
impurity
manifold
cleaning
unit
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CN101966525A (en
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李殷河
崔荣奭
李在贞
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LG Display Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides an apparatus for cleaning a substrate, which can inhibit the damage and stress of a porous cleaning board caused by being fastened and can prevent the gas leakage by adopting an indirect fastening method of fastening a large size porous cleaning board with a manifold by utilizing an insertion block, the invention is characterized by comprising a substrate insertion guiding unit for inserting the substrate from outside, an impurity removing unit for receiving the substrate from the substrate insertion guiding unit to remove the impurity formed on the substrate; an impurity cleaning unit for receiving the substrate from the impurity removing unit to clean and remove the impurity on the substrate; and a position control unit for controlling the position of the substrate conveyed from the impurity cleaning unit, wherein, the impurity cleaning unit comprises an insertion block forming with a plurality of fastening holes, wherein, the insertion block is inserted into the porous cleaning board in the grooves formed at the regular intervals; and the manifold for combining the manifold with the porous cleaning board by inserting the fastening screws into the fastening holes of the insertion block.

Description

The device that is used for cleaning base plate
Technical field
The present invention relates to a kind of device that is used for cleaning base plate; More specifically; Relate to the device that is used to clean large-size substrate, it can prevent the porous clean plate and constitute the leakage between the manifold (manifold) of matter cleaning unit, can also suppress because the fastening damage to the porous clean plate that causes.
Background technology
In present information-intensive society, display device comes into one's own as the visual information communications media day by day, but in order to occupy the top priority in the future, and they should satisfy like low in energy consumption, slim body, in light weight, requirement that image quality is high.
Display device can be divided into can own luminous emissive display; Like cathode ray tube (CRT), electroluminescent (EL), light emitting diode (LED), vacuum fluorescent display (VFD), Field Emission Display (FED), plasma display panel (PDP) etc.; With can not own luminous non-emissive display, like liquid crystal display.
LCD is the equipment that a kind of optical anisotropy that utilizes liquid crystal molecule presents image; In recent years; It receives publicity as second generation equipment with the PDP display, because its definition is better than CRT, and its average power consumption is lower than the CRT of same screen size with heat radiation.
Owing to be used for the liquid crystal of liquid crystal display is not the own luminous luminescent material of ability; But to light quantity regulate in case on screen display image receive luminescent material, therefore, it need have independent light source; That is, be used for backlight assembly to the liquid crystal panel irradiates light.
Hereinafter, will describe liquid crystal display in detail.
If not special the proposition then in completed liquid crystal display, is not called the bottom with the part that lamp is set, and the part that liquid crystal panel will be set is called top.
Liquid crystal display can comprise: liquid crystal panel, wherein inject liquid crystal molecule with output image between array base palte and filter substrate; The backlight assembly that on the back of the body surface of liquid crystal panel, provides is used in the whole surface of liquid crystal panel luminous; With a plurality of casing members, be used for liquid crystal panel is fixed to backlight assembly so that they are bonded to each other.
Usually, liquid crystal display comes display image based on the light transmission of vision signal control liquid crystal cells, and the active array type liquid crystal display that is formed with switch element at each pixel cell place is being favourable showing aspect the moving image.At this moment, thin film transistor (TFT) is mainly as this switch element.
Here; The manufacture craft of liquid crystal panel can roughly be divided on following array base palte colour filter technology and the cell process that forms the array processes of switch element, on last filter substrate, forms colour filter, and each substrate all will experience cleaning before or after these technologies.
Multiple cleaning equipment is used to this substrate cleaning; And it is a kind of like this cleaning method that porous is wherein closed on formula (porous proximity) cleaning equipment: it utilizes the air unit of floating that glass substrate is floated; So that this glass substrate is sent into cleaning machine; And cleaning under the state that forms the place, upper and lower that is positioned at glass substrate in the zone less than the gap at 100um place a kind of; Supplying deionized water and air to produce flow di water and foam stream, remove particulate and adsorbent simultaneously.
This porous cleaning equipment can comprise porous clean plate, manifold and upper frame, and forms the combination of porous clean plate and manifold through organic bond etc.
Yet, have the problem that is described below according to the porous cleaning equipment of prior art.
In the porous cleaning equipment according to prior art, when between porous clean plate and manifold, can using organic bond fixedly the time, but this has a shortcoming, and that is exactly not to be suitable for the washer with a lot of holes.Specifically, the organic bond coating can take place possibly produce the situation of gas leakage inhomogeneous and thus.
Summary of the invention
The present invention manages to solve above-mentioned problem, and the purpose of this invention is to provide a kind of equipment of cleaning base plate, can prevent the porous clean plate and form the leakage between the manifold of impurity cleaning unit.
Another object of the present invention provides a kind of equipment of cleaning base plate, can suppress owing to fastening damage and the stress for the porous clean plate that causes through adopting use insertion piece between big size porous clean plate and manifold, to carry out fastening indirect fastening.
Other purposes of the present invention and characteristic will be described at structure of the present invention with in the claim after being attached to.
To achieve these goals, the apparatus characteristic according to cleaning base plate of the present invention is to comprise: substrate inserts guidance unit, is used for the insertion substrate from the outside; Impurity removes the unit, is used for inserting guidance unit from substrate and receives substrate to remove the impurity that is formed on this substrate; The impurity cleaning unit is used for removing the unit from impurity and receives substrate, to clean and to remove the impurity that remains on this substrate; And position control unit, be used to control the position of the substrate that transports from the impurity cleaning unit, wherein the impurity cleaning unit comprises: the insertion piece that is formed with a plurality of fastener holes; The porous clean plate wherein inserts piece and inserts in the groove that forms at interval with rule; And manifold, insert holding screw so that manifold and porous clean plate are made up via the fastener hole that inserts in the piece.
As stated,, utilize to insert piece and make porous clean plate and manifold secured to one another, provide thus to prevent to produce the effect of leaking gas, and strengthened the fastening force between large scale clean plate and the manifold at its built-up section according to substrate cleaning apparatus of the present invention.
In addition, as stated, adopt and use the insertion piece between big size porous clean plate and manifold, to carry out fastening indirect fastening, make damage and the minimise stress that cause owing to fastening thus the porous clean plate.
In addition, according to according to the equipment of cleaning base plate of the present invention, fastening between porous clean plate and the manifold is shirtsleeve operation, and the porous clean plate does not sustain damage during fastening process, and the advantage that can clean large-size substrate is provided thus.
Description of drawings
Accompanying drawing comprises its part further understanding of the present invention to be provided and to incorporate and form this specification into, shows embodiments of the invention and comes together to explain principle of the present invention with description.
In the drawings:
Fig. 1 is the sectional view that schematically shows according to the substrate cleaning apparatus of first embodiment of the invention;
Fig. 2 schematically shows the perspective view according to the impurity cleaning unit in the substrate cleaning apparatus of first embodiment of the invention as shown in Figure 1;
Fig. 3 is the perspective view that schematically shows according to the impurity cleaning unit in the substrate cleaning apparatus of second embodiment of the invention;
Fig. 4 A and 4B illustrate the perspective view that is inserted into the state of porous clean plate according to insertion piece in the impurity cleaning unit of second embodiment of the invention as shown in Figure 3;
Fig. 5 schematically shows the perspective view according to the impurity cleaning unit in the substrate cleaning apparatus of second embodiment of the invention as shown in Figure 3.
The specific embodiment
Hereinafter, will be described in detail with reference to the attached drawings according to substrate cleaning apparatus of the present invention.
Fig. 1 is the sectional view that schematically shows according to the substrate cleaning apparatus of first embodiment of the invention.And Fig. 2 schematically shows the perspective view according to the impurity cleaning unit in the substrate cleaning apparatus of first embodiment of the invention as shown in Figure 1.
As shown in the figure, can comprise according to the substrate cleaning apparatus of first embodiment of the invention: substrate inserts guidance unit 100, is used for inserting the substrate 10 that is transported into from the outside with correct direction; Impurity removes unit 120, is used to receive the substrate that inserts guidance unit 100 from substrate, to remove the impurity that is formed on the substrate 10; Impurity cleaning unit 130 is used to receive the substrate 10 that removes unit 120 from impurity, to clean and to remove the impurity that remains on the substrate 10; With position control unit 140, be used for controlling the position of the substrate 10 that transports from impurity cleaning unit 130.
Here, substrate inserts guidance unit 100, impurity removes unit 120, impurity cleaning unit 130 and position control unit 140 and all processed by porous metal material.For example, substrate inserts guidance unit 100, impurity removes unit 120, impurity cleaning unit 130 and position control unit 140 and can be processed by any porous material that has in stainless steel, aluminium, aluminium alloy, brass, Hastelloy (Hastelloy) and the zirconium.
Particularly, substrate inserts guidance unit 100, impurity removes unit 120, impurity cleaning unit 130 and position control unit 140 and can be made up of different porous materials.For example, substrate inserts guidance unit 100 and can be processed by stainless steel material, and impurity removes unit 120 can be made of aluminum, and impurity cleaning unit 130 can be processed by aluminium alloy, and position control unit 140 can be processed by brass.
Here; Stainless steel, aluminium, aluminium alloy, brass, Hastelloy and zirconium all are the high rigidity metals; And insert guidance unit 100, when impurity removes unit 120, impurity cleaning unit 130 and position control unit 140, can strengthen the chemical resistance of cleaning equipment when forming substrate with these metals.
In addition, the hardness of the metal of listing above be lower than the hardness of the cleaning target that will clean, i.e. the hardness of substrate 10; Therefore cleaning equipment can use these materials to form; Thus, even substrate 10 comes in contact with cleaning equipment each other during cleaning, can prevent that still substrate 10 is damaged.
Each element in the preceding text will be described as follows.
Substrate inserts guidance unit 100 can comprise insertion path of navigation (not shown), is used for the substrate of sending into from the outside through roller 50 10 guiding are removed unit 120 for correctly inserting impurity.
Insert path of navigation and have following shape: its width removes unit 120 from the outside to impurity and reduces gradually.Through such insertion path of navigation, the accurate center position that substrate 10 inserts path of navigation from trend moves, even substrate 10 is under the state at accurate center that is not correct aligning insertion path of navigation, to provide.
In addition, substrate insertion guidance unit 100 can comprise superstructure 100a and the substructure 100b that faces with each other.Superstructure 100a and substructure 100b predetermined distance separated from each other, and the insertion path of navigation in the preceding text is formed in these two structure 100a that separate, the space between the 100b.
Superstructure 100a is towards insertion path of navigation injection air, and the air that sucks injection.Equally, substructure 100b is also towards insertion path of navigation injection air, and the air that sucks injection.Thereby, be inserted into the substrate 10 that inserts path of navigation and can be in the state that floats over the top, space of inserting path of navigation.
Here, two faces respect to one another are inclined surfaces between superstructure 100a and the substructure 100b, have the gradient of predetermined angular.Specifically, the inclined surface of superstructure 100a is the inclined surface that the upper surface with respect to substrate 10 tilts at a predetermined angle, and the inclined surface of substructure 100b is the inclined surface that the lower surface with respect to substrate 10 tilts at a predetermined angle.Space between two inclined surfaces is to insert path of navigation, and can change the gap of inserting path of navigation through the gap between control superstructure 100a and the substructure 100b.
The main body of superstructure 100a and substructure 100b is processed by metal polyporous material, is used for being ejected into substrate 10 via the gas that the main body of superstructure 100a and substructure 100b will be supplied from the outside.In other words; The gas that sprays into to the top of superstructure 100a from the outside passes superstructure 100a; And being provided to the insertion path of navigation, the gas that sprays into to the bottom of substructure 100b from the outside passes substructure 100b, and is provided to the insertion path of navigation.
Here, a plurality of suction hole (not shown) that are used to suck air are formed on each of superstructure 100a and substructure 100b.The suction hole that is formed on the superstructure 100a penetrates superstructure 100a towards the direction of inserting path of navigation, and the suction hole that is formed on the substructure 100b penetrates substructure 100b towards the direction of inserting path of navigation.
In addition, impurity removes unit 120 and can comprise that impurity removes unit 120a and following impurity and removes unit 120b.Last impurity removes unit 120a and removes unit 120b predetermined distance separated from each other with following impurity, and is formed for the mobile space (not shown) of moving substrate 10 in the space between these two structures of separating.
Last impurity remove unit 120a through be formed on substrate 10 upper surfaces on impurity carry out physics and contact and remove impurity, and down impurity remove unit 120b through be formed on substrate 10 lower surfaces on impurity carry out physics and contact and remove impurity.
Here; Substrate 10 removes unit 120a with up and down impurity, 120b is set to closely approaching each other; Therefore; When substrate 10 moves through mobile space, the impurity that projects upwards formation on substrate 10 upper surfaces will be removed when removing unit 120a collision with last impurity, and the outstanding downwards impurity that forms on substrate 10 lower surfaces will be removed when removing unit 120b collision with following impurity.Can be based on the thickness of substrate 10, control that impurity removes unit 120a and following impurity removes the gap between the unit 120b.
On the other hand, impurity cleaning unit 130 can comprise impurity cleaning unit 130a of going up respect to one another and following impurity cleaning unit 130b.Last impurity cleaning unit 130a and following impurity cleaning unit 130b predetermined distance separated from each other, and between two structure 130a that separate, 130b, be formed for the mobile space (not shown) of moving substrate 10.
Here, last impurity cleaning unit 130a is towards the mobile space injection air, and the air that passes through suction hole 115 suction injections.Equally, following impurity cleaning unit 130b is towards the mobile space injection air, and the air that passes through suction hole 115 suction injections.
Thereby the substrate 10 that inserts in the mobile space becomes the state that floats over the mobile space top.In other words; Last impurity cleaning unit 130a is towards the upper surface injection air that is inserted into the substrate 10 in the mobile space and suck the air that sprays; And impurity cleaning unit 130b remains the state that floats over the mobile space top with substrate thus towards the air of lower surface injection air that is inserted into the substrate 10 in the mobile space and suction injection down.At this moment, ejaculation power is better than inhalation power.
In addition; Last impurity cleaning unit 130a passes through deionization water hole 113 towards mobile space jet cleaning solution (deionized water); And utilize the air of cleaning solution and injection to produce bubble, remove the impurity that on the upper surface of the substrate that passes mobile space 10, forms thus.And; Following impurity cleaning unit 130b passes through deionization water hole 113 towards mobile space jet cleaning solution (deionized water); And utilize the air of cleaning solution and injection to produce bubble, remove the impurity that on the lower surface of the substrate that passes mobile space 10, forms thus.
In addition, last impurity cleaning unit 130a is expelled to outside through utilizing inhaled air with rinse water with following impurity cleaning unit 130b.For cleaning solution, can use the mixed solution of deionized water, chemical solution or deionized water and chemical solution.
The main body of last impurity cleaning unit 130a and following impurity cleaning unit 130b is processed by metal polyporous material, is used for spraying the air that provides from the outside to mobile space via the main body of last impurity cleaning unit 130a and following impurity cleaning unit 130b.In other words; The air that sprays into towards the top of last impurity cleaning unit 130a from the outside passes impurity cleaning unit 130a; And be provided to mobile space; And the air that sprays into towards the bottom of following impurity cleaning unit 130b from the outside passes down impurity cleaning unit 130b, and is provided to mobile space.
By this way, a plurality of suction holes 115 that on each of last impurity cleaning unit 130a and following impurity cleaning unit 130b, are formed for a plurality of deionizations water hole 113 of jet cleaning solution and are used to suck air.A plurality of deionizations water hole 113 is formed on the manifold 101 with suction hole 115; And deionization water hole 113 is configured to communicate with the through hole 111a that on last holding screw 111, provides with suction hole 115, and the wherein said holding screw 111 of going up is fixed on the porous clean plate 131 that makes up with manifold 101.
Here; The last holding screw 111 that is formed with through hole 111a is inserted in the contact portion between manifold 101 and the porous cleaning disc 131; To leak each other between each entity that prevents set manifold 101; Thereby each entity area is all kept apart with porous cleaning disc 131, prevented to leak and more strengthened the bonding force between them thus.
In addition, on manifold 101, form pore 103, thus porous cleaning disc 131 and manifold 101 are combined, so that air flue 105 is provided between them.Thereby through air flue 105, air is injected on the whole surface of the porous cleaning disc 131 among impurity cleaning unit 130a and the following impurity cleaning unit 130b.
In addition; Form groove 133 in such a way: will carry out a plurality of holding screw 111 of going up fastening and combination with it to manifold 101 and separate predetermined distance, so that holding screw on these 111 is installed on each porous cleaning disc 131 of impurity cleaning 130a and following impurity cleaning unit 130b with desired depth.
A plurality of deionizations water hole 113 and suction hole 115 communicate with the through hole 111a of last holding screw 111 on being installed in groove 133.A plurality of suction holes 115 suck air or cleaning solutions through groove 133, and the through hole 111a of deionization water hole 113 through last holding screw 111 comes jet cleaning solution.Here, the height of last holding screw 111 should be lower than the height of groove 133, and the diameter of screw should be less than the diameter of groove 133.
On the direction vertical with the direction of advance of substrate 10, groove 133 is formed with predetermined separating distance and opens, and cleaning solution is filled in these grooves 133, has strengthened the cleaning performance of substrate 10 thus.
In addition; Through following holding screw 121 and last holding screw 111; Manifold 101 and porous cleaning disc 131 combinations with one another; And following holding screw 121 inserts from the bottom of the manifold 101 that will tighten together with porous cleaning disc 131, and manifold 101 and porous cleaning disc 131 are with the dual each other combination of firm mode thus.
And; Sealing ring 107 is inserted in the contact portion between manifold 101 and the porous cleaning disc 131; Leak each other preventing between each entity in the set manifold 101, thereby each entity area is all kept apart with porous cleaning disc 131, more strengthened the bonding force between them thus.
Here, for sealing ring 107, used have low physics, the material of chemomorphosis character, for example, fluorine-based material, particularly special teflon sill.
On the other hand, the air that position control unit 140 sprays to the lower surface injection air and the suction of the substrate that transports 10 makes substrate 10 remain on float state thus.To move to next treatment facility from the substrate 10 that position control unit 140 transports through roller bearing 60.
By this way; According to substrate cleaning apparatus according to first embodiment of the invention; The last holding screw that is formed with the through hole that communicates with deionized water and suction hole through use is together with following holding screw; Porous clean plate and manifold are interfixed, prevent thus to produce gas leakage, and strengthened the fastening force between clean plate and the manifold at deionized water and suction hole place.
Yet, according to substrate cleaning apparatus, screw (bolt) directly is being fastened in the method for porous clean plate according to first embodiment of the invention, should be inserted in the porous clean plate with trip bolt inserting the termination.In order to insert this insertion termination, may in the porous clean plate, cause damage and stress, this is because must on the porous clean plate, form a plurality of holes.In other words; Fix between porous clean plate and manifold in order to utilize screw; Should the insertion termination that be used for fixing screw be inserted in the porous clean plate; But during this process, may in clean plate, cause the crack, perhaps may make that when straining this insertion termination gets loose with excessive force.A clean plate can have several insertion ends, if but any one insertion end defectiveness, the risk that all may cause whole clean plate to use.
Under the situation of the area of the porous clean plate in increasing substrate cleaning apparatus, the quantity of screw increases, and has increased the damage that is applied on the clean plate and the amount of stress thus.In addition, the uniformity of clean plate can change according to the degree of fastening each screw, and possibly be not enough to strengthen fastening force, and this is because aspect tightening torque, there is restriction.
Therefore; Can between big size porous clean plate and manifold, carry out fastening indirectly through using the insertion piece; The damage and the stress of the porous clean plate that suppresses to cause by aforesaid direct fastening operation; And through in inserting plate, forming deionized water and suction hole, can suppress effectively to leak, will describe in detail through the second embodiment of the present invention below.
Fig. 3 is schematically illustrated perspective view according to the impurity cleaning unit in the substrate cleaning apparatus of second embodiment of the invention.In addition, Fig. 4 A and 4B illustrate to be inserted into the perspective view according to the state in the porous clean plate in the impurity cleaning unit of second embodiment of the invention as shown in Figure 3 with inserting piece.
In addition, Fig. 5 is schematically illustrated perspective view according to the impurity cleaning unit in the substrate cleaning apparatus of second embodiment of the invention as shown in Figure 3.
Here, in the substrate cleaning apparatus according to second embodiment of the invention, outer all composed components of removal of impurity cleaning unit are all basic identical with the composed component according to the aforesaid base plate cleaning equipment of first embodiment of the invention.
In other words,, can comprise that according to the substrate cleaning apparatus of second embodiment of the invention substrate inserts guidance unit, be used for inserting the substrate that is transported into from the outside with correct direction although not shown; Impurity removes unit 1, is used to receive the substrate that inserts guidance unit from substrate, to remove the impurity that is formed on the substrate; The impurity cleaning unit is used to receive the substrate that removes the unit from impurity, to clean and to remove the impurity that remains on the substrate; And position control unit, be used to control the position of the substrate that transports from the impurity cleaning unit.
Here, substrate inserts guidance unit, impurity removes unit, impurity cleaning unit and position control unit and processed by metal polyporous material.For example, substrate inserts guidance unit, impurity and removes unit, impurity cleaning unit and position control unit and can be processed by any the porous material that has in stainless steel, aluminium, aluminium alloy, brass, Hastelloy and the zirconium.
Here; Stainless steel, aluminium, aluminium alloy, brass, Hastelloy and zirconium are the metals of high rigidity; And when substrate inserts guidance unit, impurity and removes unit, impurity cleaning unit and position control unit and be to use these metals to process, can strengthen the chemical resistance of cleaning equipment.
In addition; The hardness of the metal of more than listing be lower than the hardness of the cleaning of objects that will clean, just therefore the hardness of substrate can utilize these metals to form cleaning equipment; Even when substrate during cleaning and cleaning equipment come in contact each other, can prevent that still substrate from sustaining damage thus.
In addition, as stated, impurity removes the unit can comprise that impurity removes the unit (not shown) and removes the unit (not shown) with following impurity.Last impurity removes unit and following impurity and removes the unit and be separated from each other out preset distance, and is formed for the mobile space (not shown) of moving substrate in the space between these two structures of separating.
Here, as shown in the figure, last impurity cleaning unit sucks the air that sprays towards the mobile space injection air and through porous 211b.Likewise, following impurity cleaning unit sucks the air that sprays towards the mobile space injection air and through porous 211b.
Therefore, the substrate that is inserted in the mobile space becomes the state that floats over the mobile space top.In other words; Last impurity cleaning unit is towards the upper surface injection air that is inserted into the substrate in the mobile space and suck the air that sprays; Following impurity cleaning unit is towards the lower surface injection air that is inserted into the substrate in the mobile space and suck the air that sprays, and thus substrate is remained on the state that floats over the mobile space top.At this moment, jet power is better than inhalation power.
In addition, last impurity cleaning unit towards mobile space jet cleaning solution (deionized water) and utilize cleaning solution and the air of injection produces bubble, removes the impurity that forms on the upper surface of base plate of mobile space passing through porous 211b thus.And following impurity cleaning unit towards mobile space jet cleaning solution (deionized water) and utilize cleaning solution and the air of injection produces bubble, removes the impurity that on the lower surface of the substrate that passes mobile space 10, forms through porous 211b thus.
In addition, last impurity cleaning unit sucks air with following impurity cleaning unit through utilizing, and rinse water is expelled to the outside.For cleaning solution, can use the mixed solution of deionized water, chemical solution or deionized water and chemical solution.
Here, porous 211b can comprise and is used for air is sprayed to mobile space and sucks the suction hole of the air that sprays and be used for cleaning solution is sprayed the deionization water hole to mobile space.
Here, the main body of last impurity cleaning unit and following impurity cleaning unit is processed by metal polyporous material, so that spray the air that is supplied to mobile space from the outside through last impurity cleaning unit and following impurity cleaning unit.In other words; The air that sprays into towards the top of last impurity cleaning unit from the outside passes the impurity cleaning unit and is provided to mobile space, and the air that sprays into towards the bottom of following impurity cleaning unit from the outside passes down the impurity cleaning unit and is provided to mobile space.
By this way, a plurality of suction holes that on each of last impurity cleaning unit and following impurity cleaning unit, are formed for a plurality of deionizations water hole of jet cleaning solution and are used to suck air.Especially; According to a plurality of deionizations water hole and the suction hole of second embodiment of the invention, promptly porous 211b is formed on and inserts in the piece 250; And porous 211b is configured to be fastened to the position of manifold 201 will inserting piece 250, communicates with the connecting hole 215 that provides at manifold 201 places.
In addition; Inserting a plurality of fastener hole 211a that piece 250 places are formed for being fastened to manifold 201; And be inserted under the state among the groove 231a that is formed at interval with rule on the porous clean plate 231 inserting piece 250; Via will with the fastener hole 211a in the insertion piece 250 of manifold 201 combination, insert holding screw 211, anti-thus heads and suppressing because the damage and the stress of the fastening porous clean plate 231 that causes.
On porous clean plate 231, form groove 233 at interval along its length with desired depth with rule; This desired depth is the insertion piece of separating with predetermined space 250 that is used for being inserted into, and in groove 233, forms the groove 231a that has with the corresponding length of length of inserting piece 250.
Here, insert piece 250 and for example can dispose head portion 250a, this head portion 250a has " T " tee section, and the width of this head portion 250a is in this case greater than the width of the groove 231a of porous clean plate 231, so that be contained in the groove 233; With sub-body 250b, the width of the width of this sub-body 250b and the groove 231a of porous clean plate 231 is basic identical, so that be inserted among the groove 231a, its part is mounted in the manifold 201 and with this manifold 201 and makes up simultaneously.
By this way, the following main body 250b of insertion piece 250 is formed the contact surface that is deeper than between porous clean plate 231 and the manifold 201.
Here, for example in the drawings, holding screw 211 is fastening towards the direction of following manifold 201 from being arranged at the top of inserting the porous clean plate 231 in the piece 250.Yet the present invention is not limited to this, and the present invention also can be applicable to holding screw 211 from the bottom of manifold 201 towards the fastening situation of the direction of last porous clean plate 231.
In addition, on manifold 201, form the airport (not shown), be used for through with the combination and air flue 205 is provided between them each other of porous clean plate 231 and manifold 201.Therefore, air will be ejected on the whole surface of the porous clean plate 231 in impurity cleaning unit and the following impurity cleaning unit through this air flue 205.
Yet the present invention is not limited to this, and air flue 205 also can be formed on one of any locating in porous clean plate 231 or the manifold 201.
In addition; Sealing ring 207 such as packing ring is inserted in the contact portion between manifold 201 and the porous clean plate 231; To prevent leakage each other between each entity in the set manifold 201; Make each entity area all keep apart, more strengthened the bonding force between them thus with porous clean plate 231.
,, use material here, fluorine-based material for example, particularly special teflon sill with low physics, chemomorphosis character for sealing ring 207.
By this way; According to substrate cleaning apparatus according to second embodiment of the invention; Through using the insertion piece that porous clean plate and manifold is fastening each other, prevent thus to produce gas leakage, and strengthened the fastening force between big size porous clean plate and the manifold at built-up section.
Especially; According to substrate cleaning apparatus according to second embodiment of the invention; When between big size porous clean plate and manifold, carrying out when fastening, use the indirect fastening that inserts piece through adopting, can no longer need to insert the operation that the termination is inserted into the porous clean plate; Alleviate the damage and the stress of porous clean plate thus, and strengthened the efficient of utilizing clean plate.And fastening between porous clean plate and the manifold is simple operations, so the porous clean plate can not sustain damage during fastening process, is convenient to the manufacturing of big size porous clean plate thus.
Although specifically disclose many themes in the description in front, they should be interpreted as the explanation of preferred embodiment rather than be limited to scope of the present invention.Therefore, the present invention should not confirmed and should be confirmed by claim and its equivalent by embodiment disclosed herein.

Claims (15)

1. equipment that is used for cleaning base plate comprises:
Substrate inserts guidance unit, is used for the insertion substrate from the outside;
Impurity removes the unit, is used to receive the substrate that inserts guidance unit from substrate, to remove the impurity that is formed on the substrate;
The impurity cleaning unit is used to receive the substrate that removes the unit from impurity, to clean and to remove the impurity that remains on the substrate; With
Position control unit is used to control the position of the substrate that transports from the impurity cleaning unit,
Wherein said impurity cleaning unit comprises the insertion piece that is formed with a plurality of fastener holes; The porous clean plate wherein inserts piece and is inserted in the groove that forms at interval with rule; And manifold, wherein insert holding screw so that manifold and porous clean plate are made up via the fastener hole that inserts in the piece.
2. the equipment that is used for cleaning base plate as claimed in claim 1, wherein the impurity cleaning unit comprises the last impurity cleaning unit and following impurity cleaning unit that faces with each other.
3. the equipment that is used for cleaning base plate as claimed in claim 2 is wherein gone up the impurity cleaning unit and is separated from each other out preset distance with following impurity cleaning unit, and is formed for the mobile space of moving substrate in the space between these two structures of separating.
4. the equipment that is used for cleaning base plate as claimed in claim 3 further comprises:
A plurality of holes, it disposes what insert that the piece place forms and is used for to the mobile space injection air and sucks the suction hole of the air that sprays and be used for the deionization water hole to mobile space jet cleaning solution.
5. the equipment that is used for cleaning base plate as claimed in claim 4, wherein said a plurality of holes are configured to communicate with the connecting hole that on manifold, provides inserting the position that piece is secured to manifold.
6. the equipment that is used for cleaning base plate as claimed in claim 1 wherein forms at interval the groove with desired depth with rule along its length on the porous clean plate, this desired depth is the insertion piece of separating with preset distance that is used for being inserted into.
7. the equipment that is used for cleaning base plate as claimed in claim 6, wherein this insertion piece disposes head portion and sub-body, and this head portion has " T " tee section; And the width of this head portion is greater than the width of the groove of porous clean plate; So that it is contained in the said groove, and the width of this sub-body is corresponding with the width of the groove of porous clean plate, so that be inserted in the said groove; The part of this sub-body is mounted in the manifold simultaneously, and combines with this manifold.
8. the equipment that is used for cleaning base plate as claimed in claim 7, wherein the following main body of this insertion piece is formed the contact surface that is deeper than between porous clean plate and manifold.
9. the equipment that is used for cleaning base plate as claimed in claim 1, wherein from the top of the porous clean plate that is provided with said insertion piece towards the fastening said holding screw of the direction of manifold.
10. the equipment that is used for cleaning base plate as claimed in claim 1, wherein from the bottom of manifold towards the fastening said holding screw of the direction of porous clean plate.
11. the equipment that is used for cleaning base plate as claimed in claim 1 wherein forms airport on manifold, with through porous clean plate and manifold are made up each other, air flue is provided between them.
12. the equipment that is used for cleaning base plate as claimed in claim 11, wherein this air flue is formed on one of any the locating in porous clean plate or the manifold.
13. the equipment that is used for cleaning base plate as claimed in claim 1 wherein inserts sealing ring in the contact portion between manifold and porous clean plate.
14. the equipment that is used for cleaning base plate as claimed in claim 13, wherein the sealing circle is a fluorine-based material.
15. the equipment that is used for cleaning base plate as claimed in claim 14, wherein this fluorine-based material is special teflon sill.
CN2009102623877A 2009-07-17 2009-12-24 Apparatus for cleaning substrate Expired - Fee Related CN101966525B (en)

Applications Claiming Priority (2)

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KR10-2009-0065559 2009-07-17
KR1020090065559A KR101097509B1 (en) 2009-07-17 2009-07-17 Apparatus for cleaning substrate

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CN101966525B true CN101966525B (en) 2012-12-05

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5857474A (en) * 1995-12-28 1999-01-12 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for washing a substrate
US6440864B1 (en) * 2000-06-30 2002-08-27 Applied Materials Inc. Substrate cleaning process
CN101134203A (en) * 2006-08-28 2008-03-05 东京毅力科创株式会社 Cleaning apparatus and cleaning method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19781822B4 (en) * 1996-07-08 2004-09-09 Speedfam-Ipec Corp.(N.D.Ges.D.Staates Delaware), Chandler Cleaning station for use in a system for cleaning, rinsing and drying semiconductor wafers
AU2003262953A1 (en) * 2002-08-27 2004-03-19 Celerity Group, Inc. Modular substrate gas panel having manifold connections in a common plane

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5857474A (en) * 1995-12-28 1999-01-12 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for washing a substrate
US6440864B1 (en) * 2000-06-30 2002-08-27 Applied Materials Inc. Substrate cleaning process
CN101134203A (en) * 2006-08-28 2008-03-05 东京毅力科创株式会社 Cleaning apparatus and cleaning method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2007-214295A 2007.08.23

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TWI471964B (en) 2015-02-01
KR20110007888A (en) 2011-01-25
KR101097509B1 (en) 2011-12-22
TW201104777A (en) 2011-02-01

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