KR102086415B1 - Deposition Apparatus for Manufacturing Display Panel Device and Method for Manufacturing Display Panel Device - Google Patents

Abstract

The present invention provides a panel substrate for manufacturing a display panel and a support for supporting a carrier substrate coupled to the panel substrate, a deposition unit for depositing a thin film on the panel substrate supported on the support, a panel substrate supported on the support and A deposition apparatus for manufacturing a display panel including a shield mask disposed to be positioned between the deposition units, and a blocking mechanism positioned between the shield mask and the carrier substrate to cover a protrusion protruding from the panel substrate on the carrier substrate. To a display panel manufacturing method,
According to the present invention, by preventing the deposition of the thin film on the carrier substrate so that the carrier substrate can be reused, it is possible to reduce the consumption of the carrier substrate, thereby contributing to reducing the process cost of manufacturing the display panel.

Description

Deposition Apparatus for Manufacturing Display Panel Device and Method for Manufacturing Display Panel Device}

The present invention relates to a deposition apparatus for manufacturing a display panel and a display panel manufacturing method for manufacturing a display panel.

Display devices such as liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), plasma display panels (PDPs), and electrophoretic displays (EPDs) are manufactured through various processes. Such a manufacturing process includes a deposition process for forming a thin film transistor or the like on a panel substrate for manufacturing a display panel.

Recently, there is an increasing demand for slim display devices manufactured in thin thickness for weight reduction, ease of placement, and emphasis on design aspects of the display device. In order to manufacture a slim display device, a slim display panel having a reduced thickness of the display panel constituting the display device should be manufactured.

As a method of manufacturing a thin display panel, a method of using a panel substrate formed with a thin thickness has been proposed. However, as the panel substrate is formed with a thin thickness, durability of the panel substrate is reduced. The panel substrate is easily damaged during the process.

In order to solve this problem, a method of manufacturing a slim display panel by etching a part of the panel substrate after manufacturing the display panel using a panel substrate formed to a thickness thicker than the panel substrate finally provided in the display apparatus has been proposed. This prior art is disclosed in Korean Unexamined Patent Publication No. 10-2011-0119368 (published November 2, 2011). However, this prior art has the following problems.

First, the conventional technology not only consumes a large amount of etchant to etch the entire panel substrate, but also has to periodically replace the etchant since the etchant is contaminated due to foreign substances generated by etching the panel substrate. Therefore, the prior art has a problem of increasing the process cost for the consumables due to the use of the etchant, thereby increasing the manufacturing cost for the display panel.

Second, in the prior art, since the inside of the chamber in which the process of etching the panel substrate is performed is contaminated due to the etchant, the foreign substances generated by etching the panel substrate, it is necessary to periodically clean the inside of the chamber. Therefore, the conventional technology not only increases the process cost due to the periodic cleaning operation, but also has to stop the manufacturing process of the display panel during the cleaning operation. There is a problem of deterioration.

Third, according to the prior art, as an etchant uses an environmental pollutant such as hydrogen fluoride (HF, Hydrogen Fluoride), there is a problem that may cause an environmental pollution problem.

The present invention has been made to solve the above problems and to provide a deposition apparatus for manufacturing a display panel and a display panel manufacturing method using the same that can prevent the panel substrate from being damaged in the process of manufacturing a slim display panel. .

The present invention is to provide a deposition apparatus for manufacturing a display panel capable of manufacturing a slim display panel without using an etchant and a display panel manufacturing method using the same.

In order to solve the problems as described above, the present invention may include the following configuration.

Deposition apparatus for manufacturing a display panel according to the present invention includes a panel substrate for manufacturing a display panel and a support for supporting a carrier substrate coupled to the panel substrate; A deposition unit for depositing a thin film on the panel substrate supported by the support unit; A shield mask disposed between the panel substrate supported by the support unit and the deposition unit; And a blocking mechanism coupled to the support to prevent the thin film from being deposited on the carrier substrate. The blocking mechanism may include a blocking member positioned between the shield mask and the carrier substrate to cover a protrusion protruding from the panel substrate on the carrier substrate.

Display panel manufacturing method according to the present invention comprises the steps of bonding the carrier substrate to the panel substrate for manufacturing the display panel; Mounting a carrier substrate coupled to the panel substrate on a support unit; Depositing a thin film on the panel substrate while the protrusion protruding from the carrier substrate to the panel substrate is covered by the blocking member; And separating the carrier substrate from the panel substrate.

According to the present invention, the following effects can be achieved.

The present invention can reduce the consumption of the carrier substrate by preventing the thin film is deposited on the carrier substrate so that the carrier substrate can be reused, thereby contributing to reducing the process cost of manufacturing the display panel.

The present invention is implemented to prevent the panel substrate from being easily damaged during the manufacturing process, thereby improving the yield and quality of the thin film panel panel, thereby improving the yield and quality of the slim display panel. Can be.

The present invention is implemented to prevent the panel substrate from being damaged without using an etchant in the manufacturing process of the display panel, thereby reducing the process cost, and prevents the loss of process time due to the cleaning operation to deposit thin films. The productivity of the panel panel and the slim display panel can be improved.

The present invention is implemented so that the etching solution, which is an environmental pollutant, is not used in the manufacturing process of the display panel, thereby preventing an environmental pollution problem. It can contribute to environmentally friendly implementation.

1 and 2 are schematic cross-sectional views for explaining the operation and effect of manufacturing a display panel using a carrier substrate in the present invention
3 to 5 is a schematic side cross-sectional view of a deposition apparatus for manufacturing a display panel according to the present invention
6 is a partially enlarged cross-sectional view of a portion A of FIG.
7 is a schematic diagram of a blocking mechanism in a deposition apparatus for manufacturing a display panel according to the present invention;
8 is a schematic view of the blocking frays in the deposition apparatus for manufacturing a display panel according to the present invention.
9 and 10 are operating state diagram showing a state in which the blocking member is moved relative to the line II-II of FIG.
11 is a schematic flowchart of a manufacturing method of a display panel according to the present invention.
12 is a schematic cross-sectional view of an example of a coupling device for coupling the carrier substrate to the panel substrate in the display panel manufacturing method according to the present invention.
Figure 13 is a schematic cross-sectional view of an example of a separation device for separating the carrier substrate from the panel substrate in the display panel manufacturing method according to the present invention.

Hereinafter, with reference to the accompanying drawings, a deposition apparatus for manufacturing a display panel according to the present invention will be described in detail.

1 to 3, the deposition apparatus 1 for manufacturing a display panel according to the present invention includes the panel substrate 100 in a state in which a carrier substrate 200 is coupled to a panel substrate 100 for manufacturing a display panel. It is for depositing a thin film on. Prior to describing the deposition apparatus 1 for manufacturing a display panel according to the present invention, the panel substrate 100 and the carrier substrate 200 will be described.

First, the panel substrate 100 is for manufacturing a display panel of a display device such as an LCD (Liquid Crystal Display), an OLED (Organic Light Emitting Diodes), a Plasma Display Panel (PDP), an Electrophoretic Display (EPD), or the like. A predetermined thin film is formed on the panel substrate 100 through a deposition process. For example, the panel substrate 100 may be manufactured as a display panel by forming a thin film transistor array through the deposition process. The panel substrate 100 may be formed of glass. The panel substrate 100 may be formed of plastic, metal, or the like. The panel substrate 100 may be bonded to another panel substrate 300 after the deposition process. An intermediate layer 310 is formed between the panel substrate 100 and the other panel substrate 300. The intermediate layer 310 may include different configurations according to the type of display device. For example, when the display device is an LCD, the intermediate layer 310 may include a liquid crystal. When the display device is an OLED, the intermediate layer 310 may include a fluorescent organic compound. When the display device is a PDP, the intermediate layer 310 may include an inert gas. When the display device is an EPD, the intermediate layer 310 may include an electrophoretic dispersion.

Next, the carrier substrate 200 is coupled to the panel substrate 100 to reinforce the durability of the panel substrate 100. The carrier substrate 200 is formed in a larger size than the panel substrate 100. The carrier substrate 200 may be formed to a thicker thickness than the panel substrate 100. The carrier substrate 200 may be thinner than the panel substrate 100 or may have a thickness substantially equal to that of the panel substrate 100. The carrier substrate 200 may be formed of glass, plastic, metal, or the like.

The carrier substrate 200 is separated from the panel substrate 100 before the process for manufacturing the display apparatus is completed, thereby enabling a slim display panel and a slim display apparatus using the same.

1 to 3, the deposition apparatus 1 for manufacturing a display panel according to the present invention includes a support part 2 and a panel substrate 100 for supporting a carrier substrate 200 coupled to the panel substrate 100. The thin film is deposited on the deposition unit 3 for depositing a thin film on the substrate, the shield substrate 4 disposed between the panel substrate 100 and the deposition unit 3, and the carrier substrate 200. And a blocking mechanism 5 for preventing it.

The blocking mechanism 5 includes a blocking member 51 covering the protrusion 210 (shown in FIG. 1) of the carrier substrate 200. The protrusion 210 refers to a portion protruding from the panel substrate 100 in the carrier substrate 200 coupled to the panel substrate 100. The blocking member 51 may block the thin film from being deposited on the protrusion 210 while the deposition process is performed by covering the protrusion 210. Therefore, the deposition apparatus 1 for manufacturing a display panel according to the present invention can achieve the following effects.

First, the deposition apparatus 1 for manufacturing a display panel according to the present invention prevents the thin film from being deposited on the carrier substrate 200 by blocking the thin film from being deposited on the protrusion 210. Can be. This is because the remaining portion of the carrier substrate 200 except for the protrusion 210 is covered by the panel substrate 100 so that a thin film is not deposited. Accordingly, in the deposition apparatus 1 for manufacturing a display panel according to the present invention, when the carrier substrate 200 is separated from the panel substrate 100, the separated carrier substrate 200 uses a different panel substrate to form a display panel. It can be implemented to be reused for manufacturing. Accordingly, the deposition apparatus 1 for manufacturing a display panel according to the present invention reduces the consumption of the carrier substrate 200 in the process of manufacturing the display panel by using the carrier substrate 200, thereby producing a display panel. It can contribute to reducing process costs.

In addition, the deposition apparatus 1 for manufacturing a display panel according to the present invention blocks a thin film from being deposited on the entire carrier substrate 200, and thus separates the thin film from the carrier substrate 200 separated from the panel substrate 100. The carrier substrate 200 may be reused to manufacture the display panel using another panel substrate 100 without a removing process. Therefore, the deposition apparatus 1 for manufacturing a display panel according to the present invention can further reduce the process cost for manufacturing the display panel by reducing the cost of reusing the carrier substrate 200.

Second, in the deposition apparatus 1 for manufacturing a display panel according to the present invention, the panel substrate 100 performs the deposition process with the durability reinforced by the carrier substrate 200. Accordingly, the deposition apparatus 1 for manufacturing a display panel according to the present invention prevents the panel substrate 100 from being easily damaged during the deposition process even if the panel substrate 100 is formed to have a thin thickness. can do. Therefore, the deposition apparatus 1 for manufacturing a display panel according to the present invention can prevent the panel substrate 100 from being damaged during the deposition process, thereby improving the quality of the slim display panel.

Third, the deposition apparatus 1 for manufacturing a display panel according to the present invention may be implemented such that a slim display panel is manufactured while preventing the panel substrate 100 from being damaged without using an etchant as in the prior art. Therefore, compared to the prior art, the deposition apparatus 1 for manufacturing a display panel according to the present invention can reduce the manufacturing cost for a slim display panel by not using an etchant as a consumable in the display panel manufacturing process. In addition, since the deposition apparatus 1 for manufacturing a display panel according to the present invention is implemented such that the chamber cleaning operation due to the use of an etchant is omitted as in the prior art, not only can the process cost be further reduced, but also the process time is lost due to the cleaning operation. This can be prevented from occurring.

Fourth, the deposition apparatus 1 for manufacturing a display panel according to the present invention is implemented such that an etching solution, which is an environmental pollutant, is not used in a display panel manufacturing process as in the prior art, thereby preventing an environmental pollution problem from occurring. Therefore, the deposition apparatus 1 for manufacturing a display panel according to the present invention may contribute to implementing an environmentally friendly process line for manufacturing a display panel.

Hereinafter, the support part 2, the deposition part 3, the shield mask 4, and the blocking mechanism 5 will be described in detail with reference to the accompanying drawings.

3 to 5, the support part 2 supports the panel substrate 100 and the carrier substrate 200 coupled to the panel substrate 100. The support part 2 is provided to be spaced apart from the deposition part 3 by a predetermined distance. The support part 2 supports the carrier substrate 200 so that the panel substrate 100 faces the deposition part 3. In this case, the carrier substrate 200 is in contact with the support 2. The panel substrate 100 and the carrier substrate 200 coupled to the panel substrate 100 may be transported by a separate transfer device (not shown), thereby being seated on the support 2.

The support part 2 may be installed to be located inside the chamber unit 10. In this case, a deposition process of depositing a thin film on the panel substrate 100 may be performed in the chamber unit 10. The chamber unit 10 may be formed in a rectangular parallelepiped shape as a whole, but is not limited thereto, and may be formed in another form as long as it may provide a working space in which the deposition process may be performed.

Here, the deposition apparatus 1 for manufacturing a display panel according to the present invention may perform the deposition process on the panel substrate 100 in a horizontal state as shown in FIG. 3. In this case, the support part 2 supports the carrier substrate 200 so that the panel substrate 100 is maintained in a horizontal state. The deposition unit 3 may be installed to be located above the support unit 2.

As illustrated in FIG. 4, the deposition apparatus 1 for manufacturing a display panel according to the present invention may perform the deposition process on the panel substrate 100 in a vertical state. In this case, the support part 2 supports the carrier substrate 200 so that the panel substrate 100 is maintained in a vertical state. The panel substrate 100 may be supported in a perpendicular state to the support part 2 by the carrier substrate 200 being supported by the blocking mechanism 5. When the panel substrate 100 and the carrier substrate 200 coupled to the panel substrate 100 are seated on the support portion 2 by the transfer device, the support portion 2 may be in a horizontal state. After the panel substrate 100 and the carrier substrate 200 coupled to the panel substrate 100 are seated on the support portion 2 by the transfer device, the support portion 2 is connected to the panel substrate 100. Rotate to be vertical. To this end, the support 2 may be coupled to a rotary mechanism 20 that provides a rotational force. The rotating mechanism 20 may be a motor that generates a rotating force. The motor may be directly coupled to the rotating shaft of the support 2 to rotate the support 2. When the rotation axis of the motor and the support part 2 are spaced apart by a predetermined distance, the rotation mechanism 20 may further include a transmission means (not shown) for transmitting the rotational force of the motor to the rotation axis of the support part 2. have. The delivery means may be a pulley, a belt or the like. The deposition apparatus 1 for manufacturing a display panel according to the present invention shown in FIG. 4 may be used in a cluster type manufacturing system.

The deposition apparatus 1 for manufacturing a display panel according to the present invention may be implemented to perform the deposition process in an inline manufacturing system, as shown in FIG. 5. In this case, the support part 2 supports the carrier substrate 200 so that the panel substrate 100 is maintained in a vertical state. The panel substrate 100 may be supported in a perpendicular state to the support part 2 by the carrier substrate 200 being supported by the blocking mechanism 5. The support part 2 may be transferred between process chambers of the in-line manufacturing system by the transfer mechanism 30. Accordingly, the panel substrate 100 supported by the support part 2 may be transferred between the process chambers in a vertical state, and processes for manufacturing the display panel may be performed. The transfer mechanism 30 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, etc., a motor, a rack gear and a pinion gear, etc. The support part 2 may be moved using a gear method, a belt method using a motor, a pulley, a belt, or the like, or a linear motor method using a coil and a permanent magnet.

3 to 5, the deposition unit 3 performs the deposition process by depositing a thin film on the panel substrate 100 supported by the support unit 2. The deposition unit 3 is installed to be spaced apart from the support unit 3 by a predetermined distance. The deposition unit 3 may be installed to be located inside the chamber unit 10. As shown in FIG. 3, when the deposition apparatus 1 for manufacturing a display panel according to the present invention performs a deposition process on the panel substrate 100 in a horizontal state, the deposition unit 3 is the support unit 2. From the upper side in the vertical direction. As shown in FIGS. 4 and 5, when the deposition apparatus 1 for manufacturing a display panel according to the present invention performs a deposition process on the panel substrate 100 in a vertical state, the deposition unit 3 may include the support unit ( 2) is spaced apart a predetermined distance in the horizontal direction.

The deposition unit 3 may deposit a thin film on the panel substrate 100 using plasma. For example, when the deposition apparatus 1 for manufacturing a display panel according to the present invention is a sputter, the deposition unit 3 includes a target 31 formed of a thin film material and a cathode 32 coupled to the target 31. It may include a magnet (33) coupled to the cathode 32, and a gas supply unit (not shown) for supplying an inert gas into the chamber unit 10. The cathode 32 is installed to be located between the target 31 and the magnet 33.

3 to 6, the shield mask 4 is installed to be positioned between the panel substrate 100 supported by the support part 2 and the deposition part 3. The shield mask 4 covers a portion of the panel substrate 100 with respect to the deposition unit 3, thereby preventing the thin film from being deposited on a portion of the panel substrate 100. The shield mask 4 may cover an outer region 110 (shown in FIG. 6) of the panel substrate 100. The outer area 110 may correspond to a non-display area in which an image is not displayed on the display panel. The carrier substrate 200 is coupled to the panel substrate 100 such that the protrusion 210 protrudes from the outer region 110. The shield mask 4 may be formed in the form of a rectangular ring as a whole, but is not limited thereto and may be formed in another form as long as the shield mask 4 may cover the outer region 110 of the panel substrate 100. The shield mask 4 may be installed to be located inside the chamber unit 10.

The shield mask 4 covers the outer region 110 of the panel substrate 100 at a position separated by a predetermined distance from the panel substrate 100 supported by the support part 2. When the deposition process is performed while the shield mask 4 is in contact with the panel substrate 100 supported by the support part 2, the shield mask 4 is the panel substrate 100 after the deposition process is completed. This is because there is a risk that the panel substrate 100 is damaged or broken as static electricity is generated when spaced apart from. Accordingly, the thin film material provided from the deposition unit 3 may move to the protrusion 210 protruding from the outer region 110 through a gap between the shield mask 4 and the panel substrate 100. have. Accordingly, a thin film may be deposited on the protrusion 210. As such, in order to prevent the thin film from being deposited on the protrusion 210, the deposition apparatus 1 for manufacturing a display panel according to the present invention includes a blocking mechanism 5 for preventing the thin film from being deposited on the carrier substrate 200. ).

3 to 6, the blocking mechanism 5 is coupled to the support 2. The blocking device 5 may block the protrusion 210 to prevent the thin film material entering the gap between the shield mask 4 and the panel substrate 100 from moving to the protrusion 210. Accordingly, the blocking mechanism 5 may prevent the thin film from being deposited on the protrusion 210. The blocking mechanism 5 may be installed to be located inside the chamber unit 10. When the deposition process is performed with respect to the panel substrate 100 in a vertical state, the blocking mechanism 5 maintains the carrier substrate 200 so that the panel substrate 100 is maintained perpendicular to the support part 2. I can support it. The blocking mechanism 5 includes a blocking member 51 for covering the protrusion 210.

The blocking member 51 may be disposed between the shield mask 4 and the carrier substrate 200 to cover the protrusion 210. The blocking member 51 may block the entire surface of the protrusion 210 to prevent the thin film from being deposited on the entirety of the protrusion 210. To this end, the blocking member 51 may be formed to a size substantially coincident with the protrusion 210. The blocking member 51 may be formed in a larger size than the protrusion 210. In this case, the blocking member 51 may be formed to have a size capable of covering a part of the outer region 110 of the panel substrate 100 including the protrusion 210. The blocking member 51 may be coupled to the support part 2 from the outside of the protrusion 210. When the deposition process is performed with respect to the panel substrate 100 in a vertical state, the blocking member 51 holds the carrier substrate 200 such that the panel substrate 100 is maintained perpendicular to the support part 2. I can support it.

The blocking member 51 may cover the protrusion 210 at a position spaced apart from the protrusion 210 by a predetermined distance. When the deposition process is performed while the blocking member 51 is in contact with the protrusion 210, the static electricity is generated when the blocking member 51 is spaced apart from the protrusion 210 after the deposition process is completed. Therefore, the carrier substrate 200 may be damaged or damaged. Accordingly, the deposition apparatus 1 for manufacturing a display panel according to the present invention may not only prevent the thin film from being deposited on the protrusion 210, but also damage the carrier substrate 200 by static electricity after the deposition process is completed. By preventing from being damaged, the reuse rate for the carrier substrate 200 can be increased. Therefore, the deposition apparatus 1 for manufacturing a display panel according to the present invention can further reduce the process cost for manufacturing the display panel by further reducing the consumption of the carrier substrate 200.

When the blocking member 51 covers the outer region 110 and the protruding portion 210 of the panel substrate 100, the blocking member 51 may be spaced apart from the panel substrate 100 at a predetermined distance. The protrusion 210 may be covered. In this case, the blocking member 51 has a distance (511D, FIG. 6) from one side (511, shown in FIG. 6) facing the protrusion 210 to the panel substrate 100 from 0.1 mm to 0.5 mm. May be spaced apart). When the blocking member 51 is positioned so that one surface 511 is spaced apart from the panel substrate 100 by a distance 511D of less than 0.1 mm, the panel substrate 100 may be discharged by static electricity after the deposition process is completed. Damage or breakage. When the blocking member 51 is positioned so that one surface 511 is spaced apart from the panel substrate 100 by a distance 511D greater than 0.5 mm, a thin film is deposited on the protrusion 210. Since the blocking member 51 is positioned so that one surface 511 is spaced apart from the panel substrate 100 by a distance 511D of 0.1 mm or more and 0.5 mm or less, the deposition apparatus 1 for manufacturing a display according to the present invention may include the panel. The substrate 100 may be prevented from being damaged or broken by static electricity, and at the same time, the thin film may be prevented from being deposited on the protrusion 210. The blocking member 51 may be disposed such that one surface 511 is spaced apart from the panel substrate 100 at a distance 511D of 0.3 mm.

When the blocking member 51 covers the protrusion 210, the shield mask 4 may include an insertion groove 41 (shown in FIG. 6) in which the blocking member 51 is located. The blocking member 51 may cover the protrusion 210 in a state of being inserted into the insertion groove 41. Accordingly, the deposition apparatus 1 for manufacturing a display panel according to the present invention positions the shield mask 4 closer to the outer region 110 of the panel substrate 100 than when the insertion groove 41 is not provided. You can. Therefore, the deposition apparatus 1 for manufacturing a display panel according to the present invention can enhance the function of preventing the thin film from being deposited on the outer region 110 of the shield substrate 4 of the panel substrate 100.

3 to 7, the blocking mechanism 5 includes a through hole 52 (shown in FIG. 7) for passing the thin film material provided from the deposition unit 3 toward the panel substrate 100. It may include.

The through hole 52 is formed through the blocking member 51. Accordingly, even when the blocking member 51 covers the protrusion 210, a thin film may be deposited on the panel substrate 100. The blocking member 51 may be formed in a shape in which a center thereof is bored by the through hole 52. For example, the blocking member 51 may be formed in the shape of a square ring formed with a square plate-shaped through hole 52. In this case, the carrier substrate 200 may be coupled to the panel substrate 100 such that the protrusion 210 protrudes from the panel substrate 100 in a square ring shape.

The blocking member 51 may be formed such that its size is reduced such that the other surface 512 toward the shield mask 4 is closer to the one surface 511 toward the through hole 52. Therefore, the deposition apparatus 1 for manufacturing a display panel according to the present invention can reduce the degree of mechanical interference between the blocking member 51 and the shield mask 4.

Here, when the other surface 512 of the blocking member 51 has an edge, the thin film material may be deposited on the blocking member 51 by a force that attracts electrons from the corresponding edge portion. In order to prevent this, the blocking member 51 may be formed such that the other surface 512 facing the shield mask 4 forms a curved surface. Accordingly, the deposition apparatus 1 for manufacturing a display panel according to the present invention prevents the thin film material from being deposited on the other surface 512 of the blocking member 51, whereby the blocking member 51 is conductively formed in the deposition process. The influence can be prevented. In addition, the deposition apparatus 1 for manufacturing a display panel according to the present invention prevents a thin film material from being deposited on the other surface 512 of the blocking member 51, thereby preventing the loss of the thin film material. The deposition rate may be increased, and the quality of the panel substrate 100 in which the deposition process is completed may be improved.

3 to 9, the blocking mechanism 5 may include a moving mechanism 53 (shown in FIG. 9) for moving the blocking member 51.

The movement mechanism 53 may move the blocking member 51 such that the blocking member 51 covers the entire surface of the protrusion 210. Accordingly, the moving mechanism 53 may block the entire surface of the protrusion 210 from being blocked by the blocking member 51, thereby preventing the thin film from being deposited on the entirety of the protrusion 210. The moving mechanism 53 has one surface 511 (shown in FIG. 9) of the blocking member 51 at a distance (511D, shown in FIG. 6) of 0.1 mm or more and 0.5 mm or less from the panel substrate 100. The blocking member 51 may be moved to be spaced apart from each other. Accordingly, the moving mechanism 53 may prevent the panel substrate 100 from being damaged or broken by static electricity and may prevent the thin film from being deposited on the protrusion 210.

The moving mechanism 53 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor, a rack gear and a pinion gear, a belt using a motor, a pulley and a belt, and the like. The moving mechanism 53 may be moved by using a linear motor method using a method, a coil, a permanent magnet, and the like. The moving mechanism 53 may be coupled to the support part 2 or the chamber unit 10. The blocking member 51 may be coupled to the moving mechanism 53.

The moving mechanism 53 may move the blocking member 51 between a blocking position and a spaced position. The blocking position is a position at which the blocking member 51 covers the entire surface of the protrusion 210. When the blocking member 51 is positioned at the blocking position, the blocking member 51 is located between the shield mask 4 and the protrusion 210. The spaced position is a position at which the blocking member 51 is spaced apart from the protrusion 210 and does not cover the protrusion 210.

The moving mechanism 53 is adapted to secure the blocking member 51 before the transfer device seats the panel substrate 100 and the carrier substrate 200 coupled to the panel substrate 100 on the support portion 2. It can be moved to the spaced position. Accordingly, the movement mechanism 53 prevents the blocking member 51 from interposing the panel substrate 100 and the carrier substrate 200 coupled to the panel substrate 100 to the support part 2. Can be prevented. The moving mechanism 53 may allow the transfer member 53 to mount the blocking member 51 when the transfer device seats the support substrate 2 on the panel substrate 100 and the carrier substrate 200 coupled to the panel substrate 100. Can be moved to the blocking position.

When the blocking member 51 is formed as one body, the moving mechanism 53 moves the blocking member 51 in the first axial direction to move the blocking member 51 to the blocking position or the spaced apart position. Can be located at In this case, the moving mechanism 53 may move the blocking member 51 to the outside of the chamber unit 10 to position the blocking member 51 at the spaced position.

When the blocking member 51 includes a plurality of blocking frames 51a, 51b, 51c, and 51d, the moving mechanism 53 moves the blocking frames 51a, 51b, 51c, and 51d to the blocking position. And the spaced apart position. The blocking frames 51a, 51b, 51c, and 51d may be moved in different directions by the moving mechanism 53 to be located at the blocking position or the separation position. When the blocking frames 51a, 51b, 51c, and 51d are positioned at the blocking position as shown by the solid line in FIG. 8, the blocking frames 51a, 51b, 51c, and 51d may cover the entire surface of the protrusion 210 (shown in FIG. 9). . In this case, the blocking frames 51a, 51b, 51c, and 51d may be in contact with each other to form a frame, thereby covering the entire surface of the protrusion 210 (shown in FIG. 9). When the blocking frames 51a, 51b, 51c, and 51d are positioned at the spaced positions as illustrated by the dotted lines in FIG. 8, the blocking frames 51a, 51b, 51c, and 51d are spaced apart from each other to cover the protrusions 210 (shown in FIG. 9).

As illustrated in FIG. 9, the moving mechanism 53 may move the blocking member 51 between the blocking position and the spaced position by linearly moving the blocking member 51. The moving mechanism 53 may move the blocking member 51 between the blocking position and the spaced position by rotating the blocking member 51 as shown in FIG. 10. In this case, the blocking member 51 may be rotatably coupled to the support 2. The moving mechanism 53 rotates the blocking frames 51a, 51b, 51c, 51d (shown in FIG. 8) rotatably coupled to the support part 2, thereby blocking the blocking frames 51a, 51b. , 51c, 51d (shown in FIG. 8) may be moved between the blocking position and the spaced position.

Hereinafter, a preferred embodiment of a display panel manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings.

1 to 12, the display panel manufacturing method according to the present invention may be performed using the above-described deposition apparatus 1 for manufacturing a display panel according to the present invention. The display panel manufacturing method according to the present invention may include the following configuration.

First, the carrier substrate 200 is coupled to the panel substrate 100 (S10). This process (S10) may be performed by a coupling device 400 (shown in FIG. 12) for coupling the panel substrate 100 and the carrier substrate 200.

For example, as shown in FIG. 12, the coupling device 400 may include a chamber mechanism 410, a first surface plate 420, a second surface plate 430, and a pressure regulator 440. The panel substrate 100 is supported by the first surface plate 420, and the carrier substrate 200 is attached to the second surface plate 430 using at least one of adsorption force, electrostatic force, and adhesive force. In this state, the coupling device 400 may couple the carrier substrate 200 to the panel substrate 100.

In this case, the step (S10) of coupling the carrier substrate 200 to the panel substrate 100 may include contacting the carrier substrate 200 to the panel substrate 100 inside the chamber mechanism 410; And it may include a step of lowering the pressure in the chamber mechanism 410.

The process of bringing the carrier substrate 200 into contact with the panel substrate 100 may be performed by separating the carrier substrate 200 attached to the second surface plate 430 from the second surface plate 430. This may be achieved by removing the attachment force of the coupling device 400 from attaching the carrier substrate 200 to the second surface plate 430. For example, the carrier substrate 200 is removed by the suction force, electrostatic force, adhesive force, etc. provided from the second surface plate 430, the first surface 420 after falling by the weight from the second surface plate 430 The panel substrate 100 may be in contact with the panel substrate 100.

In the process of lowering the pressure inside the chamber mechanism 410, when the carrier substrate 200 is spaced apart from the second surface plate 430 and contacts the panel substrate 100, the pressure regulating unit 440 may be disposed. The pressure inside the chamber mechanism 410 may be lowered to a predetermined vacuum pressure. Accordingly, the pressure adjusting unit 440 discharges the gas remaining between the panel substrate 100 and the carrier substrate 200 from the panel substrate 100 and the carrier substrate 200. The panel substrate 100 and the carrier substrate 200 may be bonded using a molecular bond without an adhesive such as a sealant.

Therefore, the display panel manufacturing method according to the present invention can omit a process of applying a sealant, a process of curing the sealant, etc. to bond the panel substrate 100 and the carrier substrate 200 to the panel substrate ( 100) and the number of processes for coupling the carrier substrate 200 can be reduced. Accordingly, the display panel manufacturing method according to the present invention can improve the productivity of the manufacturing process of the display panel by reducing the time taken to combine the panel substrate 100 and the carrier substrate 200. In addition, the display panel manufacturing method according to the present invention can reduce the number of devices required to combine the panel substrate 100 and the carrier substrate 200, the process cost for the process of manufacturing the panel substrate 100 And operating cost can be reduced.

Next, referring to FIGS. 1 to 11, the carrier substrate 200 coupled to the panel substrate 100 is seated on the support part 2 (S20). This process (S20) may be achieved by mounting the carrier substrate 200 coupled to the panel substrate 100 to the support unit (2). The step (S20) of mounting the carrier substrate 200 coupled to the panel substrate 100 to the support part 2 is performed when the deposition process is performed on the panel substrate 100 in a vertical state. The carrier substrate 200 may be mounted on the support part 2 so that the 200 is supported by the blocking member 51.

Next, a thin film is deposited on the panel substrate 100 (S30). The process (S30) may be performed by depositing a thin film on the panel substrate 100 by the deposition unit 3 while the blocking member 51 covers the protrusion 210. Accordingly, the display panel manufacturing method according to the present invention by blocking the thin film is deposited on the entire carrier substrate 200 by using the blocking member 51, the carrier substrate 200 using another panel substrate It can be implemented to be reused in manufacturing the display panel. Therefore, the display panel manufacturing method according to the present invention reduces the consumption of the carrier substrate 200 in the process of manufacturing the display panel by using the carrier substrate 200, thereby reducing the process cost of manufacturing the display panel can do. In addition, the display panel manufacturing method according to the present invention by blocking the deposition of the thin film on the entire carrier substrate 200, the carrier substrate 200 is separated from the panel substrate 100 without a separate thin film removal process The carrier substrate 200 may be reused to manufacture the display panel using the panel substrate 100. Therefore, the display panel manufacturing method according to the present invention can further reduce the process cost of manufacturing the display panel by reducing the cost of reusing the carrier substrate 200.

Next, the carrier substrate 200 is separated from the panel substrate 100 (S40). The carrier substrate 200 separated from the panel substrate 100 may be reused to manufacture a display panel using another panel substrate. In the process of separating the carrier substrate 200 from the panel substrate 100 (S40), a separation apparatus 500 (illustrated in FIG. 13) for separating the carrier substrate 200 from the panel substrate 100. It can be performed by.

For example, the separator 500 may include a chamber module 510, a first stage 520, a second stage 530, and an adsorption mechanism 540, as shown in FIG. 13. The panel substrate 100 is supported by the first stage 520 so that the carrier substrate 200 faces the second stage 530. In this state, the separation device 500 may separate the carrier substrate 200 from the panel substrate 100.

In this case, in the process of separating the carrier substrate 200 from the panel substrate 100 (S40), the carrier substrate 200 contacts a sealing member (not shown) coupled to the second stage 530. And a step of adsorbing the carrier substrate 200 to the second stage 530 by sucking the fluid by the adsorption mechanism 540.

The process of contacting the sealing member to the carrier substrate 200 may be performed by lowering the second stage 530. The sealing member may be formed in the form of a hollow square ring. Accordingly, when the sealing member is in contact with the carrier substrate 200, the space between the carrier substrate 200 and the second stage 530 is sealed.

In the process of adsorbing the carrier substrate 200 to the second stage 530, the adsorption mechanism 540 is disposed between the carrier substrate 200 and the second stage 530 that are sealed by the sealing member. This can be done by sucking fluid from the space. Accordingly, the carrier substrate 200 may be separated from the panel substrate 100 by being separated from the panel substrate 100 and adsorbed to the second stage 530. In this case, the panel substrate 100 may be in a state of being fixed to the first stage 520 by adsorption force, electrostatic force, adhesive force, etc. provided from the first stage 520.

The process of separating the carrier substrate 200 from the panel substrate 100 (S40) is performed after the bonding process of bonding the panel substrate 100 and the other panel substrate 300 (shown in FIG. 2) is completed. May be

1 to 11, the step (S30) of depositing a thin film on the panel substrate 100 includes a step (S31) of moving the blocking member 51 to the blocking position, and the blocking member 51. ) Is positioned at the blocking position may include the step (S32) of depositing a thin film on the panel substrate 100.

The step (S31) of moving the blocking member 51 to the blocking position may be performed by the moving mechanism 53 moving the blocking member 51 to the blocking position. According to this process (S31), the blocking member 51 may be positioned to cover the entire surface of the protrusion (210). In the step S31 of moving the blocking member 51 to the blocking position, a distance 511D of one surface 511 of the blocking member 51 is 0.1 mm or more and 0.5 mm or less from the panel substrate 100. It can be made by placing the blocking member 51 in the blocking position so as to be spaced apart (shown in 6).

When the blocking member 51 is positioned at the blocking position, the process of depositing a thin film on the panel substrate 100 (S32) may be performed in the state in which the blocking member 51 is positioned at the blocking position. 3) may be performed by depositing a thin film on the panel substrate 100.

The process of depositing a thin film on the panel substrate 100 (S30) may include a process of moving the blocking member 51 to the spaced position when the thin film is deposited on the panel substrate 100. This process may be performed by the moving mechanism 53 moving the blocking member 51 to the spaced position. The process of moving the blocking member 51 to the spaced position may be performed after the panel substrate 100 is switched to a horizontal state when the deposition process is performed on the panel substrate 100 in a vertical state. have. The process of moving the blocking member 51 to the spaced position may be performed after all processes are completed by the process apparatuses connected to the system when the system for manufacturing the display panel is implemented in an inline manner.

1 to 11, in the step S20 of mounting the carrier substrate 200 coupled to the panel substrate 100 to the support part 2, the blocking member 51 is moved to the spaced position. And a step (S22) of mounting the carrier substrate 200 on the support part 2 when the blocking member 51 is positioned at the spaced position.

The step S21 of moving the blocking member 51 to the spaced position may be performed by the moving mechanism 53 moving the blocking member 51 to the spaced position. Accordingly, the display panel manufacturing method according to the present invention is the blocking member 51 in the job of mounting the panel substrate 100 and the carrier substrate 200 coupled to the panel substrate 100 to the support portion (2). Can be prevented.

When the blocking member 51 is positioned at the spaced position, the step (S22) of seating the carrier substrate 200 on the support part 2 may include the carrier device carrying the carrier substrate 200 on the support part 2. It can be made by seating on. When the carrier substrate 200 is seated on the support 2, a step S31 of moving the blocking member 51 to the blocking position may be performed.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those who have the knowledge of.

1: Deposition apparatus for manufacturing display panel 2: Support part
3: vapor deposition part 4: shield mask
5: blocking mechanism 100: panel substrate
200: carrier substrate 210: protrusion

Claims (11)

A support for supporting a carrier substrate having a panel substrate for manufacturing a display panel and a lower surface of the panel substrate, the carrier substrate protruding from an outer region of the panel substrate;
A deposition unit for depositing a thin film on the panel substrate supported by the support unit;
A shield mask positioned between the panel substrate supported by the support unit and the deposition unit and covering the outer region of the panel substrate; And
A blocking mechanism coupled to the support to prevent a thin film from being deposited on the protrusion of the carrier substrate;
The blocking mechanism includes a blocking member positioned between the shield mask and the carrier substrate to cover the protrusion of the carrier substrate.
The blocking member is a display panel manufacturing deposition apparatus for supporting the carrier substrate when the thin film deposition in the panel substrate vertical state. The method of claim 1,
The blocking member is a deposition apparatus for manufacturing a display panel wherein one surface toward the protrusion is spaced apart from the panel substrate by a distance of 0.1 mm or more and 0.5 mm or less. The method of claim 1,
The blocking mechanism includes a moving mechanism for moving the blocking member, and a passage hole for passing the thin film material provided from the deposition unit toward the panel substrate;
And the moving mechanism moves the blocking member between a blocking position at which the blocking member covers the entire surface of the protrusion and a spaced position spaced apart from the protrusion so that the blocking member does not cover the protrusion. The method of claim 1,
The blocking member includes a plurality of blocking frames,
The blocking mechanism includes a moving mechanism for moving the blocking frames,
The moving mechanism moves the blocking frames between a blocking position where the blocking frames cover the entire surface of the protrusion and a spaced position spaced apart from the protrusion so that the blocking frames do not cover the protrusion.
The blocking frames are in contact with each other when positioned in the blocking position to form a display panel manufacturing deposition apparatus. The method of claim 1,
The shield mask is a deposition apparatus for manufacturing a display panel including an insertion groove in which the blocking member covering the protrusion is located. The method of claim 1,
The blocking device includes a through hole for passing the thin film material provided from the deposition unit toward the panel substrate.
The blocking member is installed on one surface facing the protrusion, the deposition apparatus for manufacturing a display panel is formed such that the size is reduced so that the other surface facing the shield mask toward one side toward the protrusion toward the passage hole toward. Bonding the carrier substrate to the entire lower surface of the panel substrate for manufacturing the display panel;
Mounting a carrier substrate coupled to the entire lower surface of the panel substrate, the carrier substrate having a protrusion projecting from an outer region of the panel substrate to a support unit;
The outer region of the panel substrate is covered by a shield mask,
Depositing a thin film on the panel substrate in a state where the protrusion of the carrier substrate is covered by the blocking member; And
Separating the carrier substrate from the panel substrate,
The mounting of the carrier substrate coupled to the panel on the support unit may include moving the blocking member to a spaced position such that the blocking member does not cover the protruding portion of the carrier substrate, and the blocking member is positioned at the spaced position. And mounting the carrier substrate on the support part,
The depositing of the thin film on the panel substrate may include moving the blocking member to a blocking position where the entire surface of the protrusion is covered by the blocking member. When the blocking member is positioned at the blocking position, the panel substrate may be removed. And depositing a thin film on the panel substrate and moving the blocking member to a spaced apart position from the protrusion so that the blocking member does not cover the protrusion when the thin film is deposited on the panel substrate. delete The method of claim 7, wherein
Depositing a thin film on the panel substrate, the display panel manufacturing method comprising the step of positioning the one surface toward the protrusion in the blocking member spaced apart from the panel substrate by a distance of 0.1 mm or more and 0.5 mm or less. delete The method of claim 7, wherein
The blocking member is a display panel manufacturing method for supporting the carrier substrate when the thin film deposition in the panel substrate vertical state.

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