201104777 六、發明說明： 【發明所屬之技術領域】 本發明關於一種基板清潔設備。並且特別地，本發明關於一 種大尺寸基板清’m其能夠p；$：止—多孔清潔面板與組成一雜 質清潔單元的歧管之間的’/¾漏且抑制由於緊固引起的一多孔清潔 面板之損傷。 【先前技術】 在最近的資訊社會之中，作為一視訊傳輸媒體，顯示裝置之 重要性受到更夕的重視’但疋應該滿足例如低功耗、薄外形、輕 重量、高晝質之需求，用以在將來佔據主要位置。 顯示裝置可分類為一能夠自發射光線的自發光型顯示器，例 如陰極射線管（Cathode Ray Tube, CRT)、電致發光顯示器 (Electroluminescent，EL)、發光二極體（丨ight emitting Di〇de， LED)、真空螢光顯示器（Vacuum Fluorescent Display, VFD)、場 致發射顯示器（Field Emission Display, FED )、電毁顯示面板 (Plasma Display Panel，PDP)等，以及非自發光型顯示裝置，非 自發光型顯示裝置不能夠自發射光線，例如液晶顯示裝置。 液晶顯示裝置係為一種使用液晶分子之光學各向異性表示影 像的裝置’並且在近些年，由於液晶顯示裝置之可見性相比較於 陰極射線管（CRT)更優良，並且相比較於同樣螢幕尺寸之陰極 射線管（CRT)平均功耗及熱損耗更低’因此液晶顯示裝置與電 201104777 聚顯示面板（PDP)-起成為第二代裝置之焦點。 由於液晶顯示裝置之中使用的液晶不為自發射光線的發光材 料’而疋為-調節光線量錢幕之上顯示影像的糾接收材料， 亚且因此’液晶顯示裝置需要具有—單獨絲，即，用以向液晶 顯示面板照射光線之背光組件。 以下’將詳細描述此液晶顯示裝置。 如果沒有特別提及’在—形成的液晶顯示裝置之巾，放置有 一燈管的部份稱作—底部份，並且放置有-液晶面板的部份稱作 一頂部份。 液曰a顯示裝置可包含有一液晶面板，在此液晶面板之中， 液晶分子注人於-陣列基板與—彩色航基板之_以顯示一影 像 ί光組件，其提供於液晶面板之一後表面之上用以在液晶 面板之全部表面之上發射光線，以及複數個殼元件，用以將液 晶面板固定於背光組件用以將它們彼此相結合。 通常，液晶顯示裝置根據-視訊訊號控制液晶晶胞之光透射 比用以顯示—影像，並且—絲轉型液晶顯示裝置在顯示移動 晝面中具有優，點，主動矩陣型液晶顯示裝置之中在每一晝素單元 形成有開關元件。同時，薄膜電晶體主要用作開關元件。 這裡，液晶面板之製造過程可大致分類為一陣列製程，在陣 列製程之中用以形成複數個開關元件於一底陣列基板之上，一彩 色濾光器製程，用以形成複數個彩色濾光器於一頂彩色濾光基板 201104777 之上，以及一單元製程，並且在這些製程之前或之後，基板將通 過一清潔製程。 不同的清潔設備使用於基板清潔製程，並且在這些清潔設備 之中，一多孔鄰近清潔設備使用於一清潔方法之中，此清潔方法 包含使用-空氣浮置單元浮置—賴基板㈣將玻璃基板傳送至 一清潔器’並且在清潔區域之中在玻璃基板之頂及底部形成小於 100微米（um)之間隙的狀態之下，供給去離子水及空氣，同時 產生去離子水流及氣泡流財_粒及被吸收物質。 此多孔清潔設備可包含有—多孔清潔面板、一歧管、以及一 頂框架’並且乡孔清潔面板與歧管之齡透過—有齡合劑等製 造。 然而，習知技術之一多孔清潔設備具有下述之問題。 在！知技術之多孔清潔設備之中，當多孔清潔面板與歧管之 門緊固之時’可使用—有機黏合劑，但是有齡合劑具有不適合 於具有許多孔之清潔器之缺點。_地，具有一種有機黏合劑不 均勻塗覆之情況且由此產生空氣茂漏。 【發明内容】 主因此’馨於以上的問題，本發明之目的之一在於提供一種基 ^清潔設備’其能夠防止域—_清料元的—纽清潔面板 與一歧管之間的洩漏。 本發明之另-目的在於提供一種基板清潔設備，其在一大尺 201104777 透過使用一插入塊的 多孔清潔面板之損傷 寸多孔清潔面板與 間接緊固方法，能夠抑制由於緊固引起的一 及應力。 x月’、他之目的及特徵將在本發明所記載的說明書和申請 專利範圍之中進行說明。 為了疋成上述之目的’本發明之—基板清潔設備包含有：一 基板插入導向單％’其用以自外部插人—基板；—雜質去除單元， 其自基板插人導向單70接收—基板用以去除基板之上形成之雜 質；-雜質清潔單元’用以自雜質去除單元接收基板且清潔及去 除基板之上保留之雜質；以及—位置控制單元，用以控制自雜質 /月潔單70運送出之基板之位置，其中雜質清潔單元包含有一具有 複數個緊·之插人塊，面板，在纽清潔面板之中， 插入塊插人至以較間隔形成的—凹槽之#，以及—歧管，歧管 之中-緊_釘通過插人塊之中的—緊固孔插人，用以與多孔清 潔面板相結合。 如上所述，根據本發明之一基板清潔設備，透過使用一插入 塊’ -多孔清潔面板與-歧管彼此緊固，由此防止在其結合部份 產生空氣搞，並且增強-大尺寸清潔面板與—歧管之間的緊固 力0 而且，如上所述，在一大尺寸多孔清潔面板與一歧管之間的 緊固之中，應用-使用-插人塊之間接緊固方法，由此最小化由 201104777 於緊固產生的多孔清潔面板之損傷及應力。 此外，根據本發明之基板清潔設備，多孔清潔面板與歧管之 間的緊固係為-簡單之作業，並且在緊固過_間不損傷多孔清 潔面板，由此具有能夠清潔一大尺寸基板之優點。 【實施方式】 以下’將結合圖式部份詳細描述本發明之一種基板清潔設備。 「第1圖」係為本發明第一實施例之一基板清潔設備之橫戴 面圖。而且，「第2圖」係為「第i圖」所示之本發明第一實施例 之一基板清潔設備之中的雜質清潔單元之透視圖。 如圖所示，本發明之第一實施例之基板清潔設備可包含有一 基板插入導向單元卿，基板插人導向單元用以將—來自外部 的基板10插入於一正確之方向；一雜質去除單元12〇，其自基板 插入導向單元励接收一基板10用以去除基板10之上形成的雜 質；-雜質清潔單元130’其自雜質去除單元12〇接收基板1〇用 以清潔且去除基板1G之上保留的雜f ;以及—位置控制單元 140，其用以控制自雜質清潔單以3G運送出之基板1()之位置。 這裡，基板插入導向單元100、雜質去除單元12〇、雜質清潔 單元130、以及位置控制單元⑽係由一金屬多孔材料形成。舉例 而言，基板插入導向單元100、雜質去除單元12〇、雜質清潔單元 130、以及位置控制單元14G可由具有不賴、|g (A1)、紹合金、 κ銅、哈式合金（Hastelloy)、以及鍅之中任何一個的多孔材料製 201104777 造。 特別地，基板插入導向單元100 '雜質去除單元12〇、雜質清 潔單元130、以及位置控鮮元140可配設為不同之金屬多孔材 料。舉例而言，基板插入導向單元100可由一不銹鋼材料製造， 雜質去除單元120可由鋁（A1)製造，雜質清潔單元13〇可由鋁 合金製造，以及位置控制單元14〇可由黃銅製造。 這裡，不銹鋼、鋁（A1)、鋁合金、黃銅、哈式合金（Hastdl〇y )、 以及錯係為高硬度之金屬，並且#透過制频金屬形成基板插 入導向單it 1GG、雜質去除單元12〇、雜質清潔單元13()、以及位 置控制單元140之時，可能提高清潔設備之耐化學性質。 而且，上述所列金屬之硬度相比較於待清潔物體，即，一基 板10之硬度更小，並且因此—清潔設備可使卿些金屬製造，由 此甚至在—清雜程期，紐與清潔設備彼此相接觸之時， 防止損傷基板10。 以下將描述上述之組成元件。 基板插入導向單元觸可包含有一插入導向路徑（圖未示）， 該插入導向路徑導向透過__輥子5G自外部進人之基板⑴，用以將 基板10正確插入至雜質去除單元120之中。 插入導向路㉟具有自外㈣向雜質去除單元12〇寬度逐漸減 V之形式。透過此類型之插入導向路徑，甚至在基板10不準確沿 插入導向路！之精確中心排列提供的狀態下，基板川能夠朝向插 201104777 入導向路徑之精確中心自動移動。 而且，基板插入導向單元100可包含有彼此相面對的―頂結 構100a及-底結構100b。頂結構隐與底結構嶋透過一預定 距離彼此相間隔，並且前述之插人導向路徑形成與彼此相間隔= 頂結構100a與底結構100b之間。 頂結構100a朝向插入導向路徑喷射空氣且同樣吸入喷射之空 氣’底結構100b朝向插入導向路徑喷射$氣且同樣吸入喷射之* 氣。因此’插入至插人導向路徑之中的基板1〇將在插人導向路: 之空間之上為一浮置狀態。 二 城，頂結構l〇〇a與底結構勵之間彼此相面對的兩個表 面係為具有-縣角度的斜度之傾斜表面。特別地，頂結構贿 之傾斜表面係為姆於基板1G之—頂表面具有—預定肢的傾斜 表面，並且底結構腿之傾斜表⑽為相對於基板⑺之—底表 面具有一預定角度_斜表面。這兩個傾斜表面之_空間係為 插入導向雜，並且透馳難結構職與底_職之間的 一間隙，可改變插入導向路徑之間隙。 項、培構100a與底結構 -π —心土媸田一金屬多孔材料製造， =以通過頂結構職與底結構嶋之主體將外部供給之空氣喷 射至基板10。換句話而言，自外部朝向頂結構施之—頂部份喷 ^空氣穿過頂結構⑽供給至插入導向路徑，並且自外部朝 向底、麵聰之-底部份_之_職結構麵且供給至 201104777 插入導向路徑 這裡複數個用以吸入空氣的吸入孔（圖未示）形成於每一 頂結構100a及底結構100b <上。形成於頂結構職《上的吸入 孔朝向插入導向路控穿透頂結構1〇〇a，並且形成於底結構l〇〇b之 上的吸入孔朝向插入導向路徑穿透底結構100b。 而且雜質去除單元120可包含有一頂雜質去除單元12〇a及 一底雜質絲單元遍。獅質去除單元與底㈣去除單元 =〇b以-歡距離彼此相間隔’並且—用以移動—基板川之移動 空間（圖未示）形成於這兩個相間隔之結構之間。 頂雜質去除單元·通過與基板10之一頂表面之上形成的 雜胸質，並城雜質去除單元·通過與基板 w之底表面之上形成的雜質的物理接觸去除雜質。 ,2裡’基板物卿去除單元12Ga及絲㈣單元隱 =罪奴位’並且因此’當基板1G通過移蝴移動之時，當 2 Π»之，_成_塊之_綱去除單元 =目顧時，_這些向上，並且當在基板10之 -底表面軸靖辦 2去除這麵·。靖铜元 早70㈣之間的間隙可根據基板10之厚度控制。、 質二方面’雜質凊潔單元13。可包含有彼此相面對的一頂雜 質〉月潔早元聽及―底雜質清潔單元-_質清料元2 12 201104777 與底雜質清潔單元·彼此以—敢轉相賴，並且一用以移 動一基板H)之移触間（圖未示）形成於相間個的頂雜質清潔單 兀13〇a與底雜質清潔單元1勘之間的空間之中。 這裡’頂雜質清料元13Ga躺該鶴空間儒空氣且通過 吸入孔m吸入空氣，類似地，底雜質清潔單元拠朝向該移動 空間喷射空氣且通過吸入孔115吸入空氣。 …因此’插入至移動空間之中的基板ίο在該移動空間之上變為 浮置狀態。換句話而言，頂雜質清料元13Qa朝向插人至移動空 間^的基板H)之-頂表面喷射空氣且吸人噴射之空氣，並且底 雜質清料元13Gb編插人至義空間之巾的基板1Q之一絲 面喷射空氣域人仙之找’自此在該軸找之巾，基板川 為浮置狀態，同時，喷射力相比較於吸入力更大。 而且’頂雜質清潔單元施通過複數個去離子水孔⑴朝向 移動空間喷射清潔溶液（去離子水）且使用清潔溶液及喷射之空 氣產生氣泡’由此通過移動空間自基板1G之頂表面去除雜質。而 且，底雜質清潔單元130b通過複數個去離子水孔113朝向移動空 間喷射清潔溶液（去離子水）且使用清潔溶液及噴射之空氣產生 氣泡，由此通過移動空間自基板10之底表面去除雜質。 而且，頂雜質清潔單元臟與底雜質清潔單元·使用吸 入之空氣將清潔水排空至外部。去離子水、化學溶液或者去離子 水及化學溶液之混合溶液可用作清潔溶液。 13 201104777 頂雜質清潔單元130a與底雜質清潔單元n〇b之主體係由一 金屬多孔材料製造，用以將自外部供給的空氣通過頂雜質清潔^ 7L 130a及底雜質清潔單元·之主體噴射至移動空間。換句= 而言，自外部朝向頂雜質清潔單元咖之—頂部喷射之空氣 頂雜質清潔單元隱且供給至移動空間，並且自外部朝向底雜^ 且 清潔單it 1施之-底部侧之空氣通過底㈣清潔單元丨娜、 供給至移動空間。 按照這樣，複數姻㈣射清潔錢的去離子水孔ii3以及 複數個用以吸入空氣的吸入孔m形成於每一頂雜質清潔單元 施與底㈣清料元礙之上。複數個去離子水孔⑴及吸入 孔115形成於一歧管101之上，並且這些去離子水孔113及吸入 孔出與-頂緊固螺釘⑴提供的—穿透孔ina相聯繫，頂緊固 螺釘111用以緊固與歧管1G1相結合的—多孔清潔面板⑶。 夕這裡，一形成有穿透孔肋的頂緊固螺釘lu插入至歧管101 與々多孔清潔面板131之間的—接觸部份之中，用以防止自設計的 2管101的每—效用之間的交互誠，以使得每-效用區自多孔 清潔面板131隔離’由此防止誠且更加增強歧管101與多孔清 潔面板131之間的黏合力。 ”此外’ _空氣孔103形成於歧管101之上，並且由此多孔清 潔面板131與歧管101相結合，用以在其間提供-空氣路徑105。 因此I氣將通過空氣路徑105，通過頂雜質清潔單元130a與底 14 201104777 雜質清潔單元13Gb之中的多孔清潔面板131之全部表面喷射。 /且’-具有狀深度㈣道133之形翁錢得複數個與 歧管101相緊固且相結合的頂緊固螺釘ln以一預定距離相間 隔，以便岐於_f清料元脑與清料元㈣之 每一多孔清潔面板131之上。 複數個去離子水孔113及吸入孔115與固定於溝道133之上 的頂緊固螺釘111之穿透孔llla相聯繫。複數個吸入孔115通過 溝道133吸入空氣或清潔溶液，並且去離子水孔113通過頂緊固 螺釘111之穿透孔llla喷射清潔溶液。這裡，頂緊固螺釘m應 該相比杈於溝道133之高度更低，並且該螺釘之直徑應該相比較 於溝道133之直徑更小。 在與基板10之行進方向相垂直之方向上，複數個溝道133以 一預定距離相間離，並且清潔溶液填充於溝道133之中，由此提 高基板10之清潔效果。 而且’歧管101透過底緊固螺釘121連同頂緊固螺釘ill彼 此相結合，並且底緊固螺釘121自歧管1〇1之底部插入用以緊固 於多孔清潔面板131 ’並且因此歧管ιοί與緊固多孔清潔面板131 以牛固之方式彼此雙倍相結合。 而且’一密封件107插入至歧管101與多孔清潔面板131之 間的一接觸部份之中，用以防止設計的歧管101之每一效用之間 的交互洩漏’以使得每一效用區自多孔清潔面板131隔離，由此 15 201104777 進一步增強歧管101與多孔清潔面板131之間的一黏合力。 這裡，一具有低物理、化學形變之材料，例如，鐵氟龍基 (Teflon-based )或氟基材料用作密封件1 ο? 0 另一方面，位置控制單元14〇朝向進行的基板1〇噴射空氣且 吸入喷射之空氣，由此將基板1〇保持為一浮置狀態。自位置控制 單το 140載運出之基板10通過一輥子6〇移動至隨後的製程設備。 这樣，根據本發明之第一實施例之基板清潔設備，透過使用 具有穿透孔的頂緊m螺域底緊固騎，其巾穿透孔與去離子水 及吸入孔相聯繫，-多孔清潔面板與—歧管彼此緊固在一起，由 此防止在去離子水及吸人孔產生^輯漏，並且增騎潔面板與 歧管之間的緊固力。 然而’根據本發明之第—實施例之基板清潔設備，在一將緊 固螺釘（或螺栓）直接緊固至多孔清潔面板的方法之中，一插入 針應插入至多孔清潔面板之中用以緊明釘。為了插入該插入 針’因為複數個孔必須形成料孔清潔面板之上，因此在多孔清 /糸面板之巾可產生損傷及應力。換姑的，為了透過使用螺釘 在多孔清潔面板與歧管之間緊固，―用以緊固螺釘的插入針應該 插入至多孔清潔面板之中，但是在靖程_，在清潔面板之中 可產生H或者當制—過度力固定之時可插人針可變鬆。對 於-個清細板可具钱讎人件，但是如果插人財之任何一 個有缺陷時’可產生全部清潔面板不能翻之危險。 201104777 在一基板清潔設備中增加多孔清潔面板之面積的情況之下， 增加螺釘之數目，由此增加作用至清潔面板之損傷及應力。而且， 可根據緊固每一螺釘之固定大小改變清潔面板之均勻度’並且因 為夾緊力矩具有限制，因此並不能夠充分提高緊固力。 因此，透過在大尺寸多孔清潔面板與一歧管之間使用一插入 塊的間接固定’可抑制透過上述之直接蚊作錢生之損傷或應 力，並且透過在插入塊中形成去離子水及吸入孔，可有效抑制洩 漏，並且以下將通過本發明之一第二實施例進行詳細描述。 「第3圖」係為本發明第二實施例之一基板清潔設備之中的 一雜質清潔單之透視圖。而且，「第4A圖」及「第4B圖」係 為「第3圖」所示之本發明第二實施例的—插人塊插人至雜質清 潔單元中的一多孔清潔面板之中之透視圖。 此外’第5圖」係為「第3圖」所示之本發明第二實施例之 -基板清潔設備之中清潔單元之透視圖。 之一基板清潔設備之中，除雜 大致與本發明之第一實施例之 這裡，在本發明之第二實施例 質清潔單元之外的所有組成元件， 刖述基板清潔設備之元件相同。 ，雖細絲’本㈣之第二實施敬基板清潔 汉備可包含有-基板插人導向單元，基板插人導 來自外部的基板插入於-正確之方向;-雜質去除單元二基 板插入導向單祕收-基板肋去除基板之上形相雜^ 一雜 17 201104777 質/月潔單7C ’其自雜質絲單元接收基板用以清潔且去除基板之 上保4的雜質’以及-位置控制單元’其用以控制自雜質清潔單 元運送出之基板之位置。 _ ’基板插人導向單元、雜質去除單元、雜f清潔單元、 以及位置控制單元係由—金屬纽材料形成。舉綱言，基板插 入導向單元、㈣去除單元、雜㈣料元、以及位置控制單元 可由具有不銹鋼、紹㈤、銘合金、黃銅、哈式合金（Η_^ )、 以及鍅之中任何一個的多孔材料製造。 辅，不錄鋼、紹（A1)、紹合金、黃銅、哈式合金（Hastelloy )、 以及錯係為高硬度之金屬’並且當透過使用這些金屬形成基板插 入導向早το、雜質去除單元、雜質清潔單元、以及位置控制單元 之時，可能提高清潔設備之耐化學性質。 而且’上述所列金屬之硬度相比較於待清潔物體，即，一基 板之硬度更小，並且因此_清潔設備可使卿些金屬製造，由此 甚至在-清潔縣_，基板與清潔設備彼此相接觸之時，防止 損傷基板。 而且如上所述’雜質去除單元可包含有一頂雜質去除單元 (圖未示）及—底雜質絲單以圖未示）。頂雜質去除單元（圖 未丁）與底雜質去除單几（圖未示）以一預定距離彼此相間隔， 2用以移動基板之移動空間（圖未示）形成於這兩個相間 隔之結構之間。 201104777 這裡’如圖所示，頂雜質清潔單元朝向該移動空間嘴射— 且通過多個孔2Ub吸人噴射之空氣，類似地，底雜質清潔單2 向该移動空間喷射空氣且通過多個孔2i jb吸入噴射之*氣 月 f此’插人至移動空間之㈣基板在該移動郎::變為浮 置狀態。換句話而言，頂雜質清潔單元朝向插入至移動空間之= 的基板之-頂表面喷射空氣且狀噴射之空氣，並域 k朝向插人至移毅間之中的基板之—絲面噴射空氣且吸二 喷射之空氣’減在該移動空間之中’基板保持為浮置狀態，同 時’喷射力相比較於吸入力更大。 而且，頂雜質清潔單元通過多個孔皿朝向移動空間喷射清 潔溶液（去離子水）城崎潔溶液及儒之空氣產生氣泡，2 此通過移動空間自基板之頂表面去。而且，底㈣清潔單 70通過多佩211b朝向移動空間喷射清潔溶液（去離子水）且使 用清潔溶液及喷射之空氣產生氣泡，由此通過移動空間自基板之 底表面去除雜質。 而且’頂雜質清潔單元與底雜㈣潔單元使祕人之空氣將 清潔水排Μ外部。去離子水、化學溶液或者去離子水及化學溶 液之混合溶液可用作清潔溶液。 這裡’多個孔2llb可包含有複數個吸入孔以及複數個去離子 水孔’吸人孔用以將空氣喷射至移動空間且吸人喷射的空氣，並 且去離子水孔用以將清潔溶液喷射至移動空間。 201104777 这裡’頂雜質清潔單元與底雜質清潔單元之主體係由一金屬 夕孔材料k ’収將自外部供給的空氣通過頂雜質清潔單元及 底雜質清潔料之主體噴射至移動空間。換句話而言，自外部朝 向頂雜質清料元之-頂部噴射之空魏顧肺清料元且供 。至移動工間’並且自外部朝向雜質清料元之—底部喷射之 空氣通過底雜質清潔單元且供給轉魅間。 、 這樣’複數個用以噴射清潔溶液的去離子水孔以及複數個用 以吸入^氣的吸人孔形成於每—_f清潔單元與底雜質清潔單 兀之上。制地，減本發明之第二實關之複數個去離子水孔 及及入孔即，多個孔21ib形成於一插入塊250之中，並且在插 入塊250與歧管201相緊固之位置，多個孔2ub與提供於一歧管 201的連接孔215相聯繫。 而且，複數個用以緊固至歧管210的緊固孔211a形成於插入 塊250，並且複數個緊固螺釘通過插入塊25〇之緊固孔21 u插入， 用以在插入塊250插入至一凹槽231a之中的狀態下與歧管201相 結合’其中凹槽231a以固定間隔形成於多孔清潔面板231之上， 由此防止洩漏以及抑制由於緊固產生的多孔清潔面板231之損傷 及應力。 一具有預定深度的溝道233以規則間隔縱向形成於多孔清潔 面板231之上，該預定深度用以插入透過一預定距離相間隔的插 入塊250,並且凹槽231a形成於溝道233之中，凹槽231a具有之 20 201104777 長度與插入塊250之長度相對應。 這裡，舉例而言，插入塊250可具有一"TT型橫截面的頂頭 部250a以及一底部主體250b，並且此種情況之下，頂頭部25〇a 具有之寬度相比較於多孔清潔面板231之凹槽231a之寬度更大， 用以容納於溝道233之中’並且底部主體25〇b具有與多孔清潔面 板231之凹槽231a大致相同之寬度，用以當其一部份適合於歧管 201且與歧管201相結合之時可插入至凹槽23la之中。 這樣，插入塊250之底部主體250b形成為相比較於多孔清潔 面板231與歧管201之間的一接觸表面更深。 這裡’例如在圖式之中，緊固螺釘211自與插入塊250定位 的多孔清潔面板231之頂部朝向下部之歧管2〇1緊固。然而，本 發明並不限制於此，而且本發明可應用於自歧管2〇1之一底部朝 向上部之多孔清潔面板231固定緊固螺釘211之情況。 而且，一空氣孔（圖未示）形成於歧管2〇1之上用以透過在 彼此相結合之多孔清潔面板231與歧管201之間提供一空氣路徑 205。因此，空氣通過空氣路徑205通過頂雜質清潔單元與底雜質 清潔單元之中的多孔清潔面板231之一全部表面喷射。 然而，本發明並不限制於此，並且空氣路徑205可形成於多 孔清潔面板231或歧管201中之一。 而且，一密封件207，例如一墊圈插入至歧管2〇1與多孔清潔 面板231之間的一接觸部份之中’用以防止設計的歧管2〇1的每 21 201104777 一效用之間的交互洩漏，由此更進一步增強歧管201與多孔清潔 面板231之間的一黏合力。 這裡，一具有低物理、化學形變之材料，例如，鐵氟龍基 (Teflon-based)或氟基材料用作密封件2〇7。 由此，根據本發明之第二實施例之基板清潔設備，透過使用 一插入塊，一多孔清潔面板與一歧管彼此緊固在一起，由此防止 在結合部份產生空氣洩漏，並且增強大尺寸多孔清潔面板與歧管 之間的緊固力。 特別地，根據本發明之第二實施例之基板清潔設備，在大尺 寸多孔清潔面板與歧管之間的緊固之中，透過使用一插入塊的間 接緊固方法，可不需要向一多孔清潔面板插入一插針之作業，由 此減少多孔清潔面板之損傷及應力且提高使用清潔面板之效率。 此外，多孔清潔面板與歧管之間的一緊固係為一簡單之作業，並 且因此在緊固過程之中可不損傷多孔清潔面板，由此簡化—大尺 寸多孔清潔面板之製造。 雖然本發明以前述之說明揭露如上，其應看作對本發明之較 佳實施例之說明且並非用以限定本發明之範圍。因此，關於本發 明所界定之保護範圍請參照所附之申請專利範圍。 【圖式簡單說明】 第1圖係為本發明第一實施例之一基板清潔設備之橫戴面 IS! · 圖， 22 201104777 第2圖係為第1圖所示之本發明第一實施例之一基板清潔設 備之中的雜質清潔單元之透視圖； 第3圖係為本發明第二實施例之一基板清潔設備之中的一雜 質清潔單元之透視圖； 第4A圖及第4B圖係為第3圖所示之本發明第二實施例的一 插入塊插入至雜質清潔單元中的一多孔清潔面板之中之透視圖； 以及 第5圖係為第3圖所示之本發明第二實施例之·一基板清潔設 備之中的雜質清潔單元之透視圖。 【主要元件符號說明】 10 基板 50 輥子 60 輥子 100 基板插入導向單元 100a 頂結構 100b 底結構 101 歧管 103 空氣孔 105 空氣路徑 107 密封件 111 頂緊固螺釘 23 201104777201104777 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a substrate cleaning apparatus. And in particular, the present invention relates to a large-sized substrate that can be used to reduce the '/3⁄4 leakage between the porous cleaning panel and the manifold constituting an impurity cleaning unit and suppresses a large amount due to fastening. Hole cleaning panel damage. [Prior Art] In the recent information society, as a video transmission medium, the importance of display devices has received more attention. However, it should meet the needs of, for example, low power consumption, thin profile, light weight, and high quality. Used to occupy the main position in the future. The display device can be classified into a self-luminous display capable of self-emitting light, such as a cathode ray tube (CRT), an electroluminescent display (EL), and a light emitting diode (丨ight132 Di〇de, LED), Vacuum Fluorescent Display (VFD), Field Emission Display (FED), Plasma Display Panel (PDP), etc., and non-self-illuminating display devices, non-self The light-emitting display device is not capable of self-emitting light, such as a liquid crystal display device. A liquid crystal display device is a device that uses an optical anisotropy of liquid crystal molecules to represent an image' and in recent years, since the visibility of the liquid crystal display device is superior to that of a cathode ray tube (CRT), and compared to the same screen The size of the cathode ray tube (CRT) has lower average power consumption and lower heat loss. Therefore, the liquid crystal display device and the 201104777 poly display panel (PDP) have become the focus of the second generation device. Since the liquid crystal used in the liquid crystal display device is not a light-emitting material that emits light, the light-receiving material for displaying an image on the screen of the light is adjusted, and thus the liquid crystal display device needs to have a separate wire, that is, a backlight assembly for illuminating the liquid crystal display panel. This liquid crystal display device will be described in detail below. If the towel of the liquid crystal display device formed is not specifically mentioned, the portion where the lamp is placed is referred to as the bottom portion, and the portion where the liquid crystal panel is placed is referred to as a top portion. The liquid helium a display device may include a liquid crystal panel in which liquid crystal molecules are injected into the array substrate and the color navigation substrate to display an image light component which is provided on one rear surface of the liquid crystal panel Above is used to emit light over the entire surface of the liquid crystal panel, and a plurality of shell members for fixing the liquid crystal panel to the backlight assembly for bonding them to each other. Generally, the liquid crystal display device controls the light transmittance of the liquid crystal cell according to the video signal to display the image, and the silk transition liquid crystal display device has an excellent point in the display moving surface, and the active matrix type liquid crystal display device is Each of the pixel units is formed with a switching element. At the same time, a thin film transistor is mainly used as a switching element. Here, the manufacturing process of the liquid crystal panel can be roughly classified into an array process for forming a plurality of switching elements on a bottom array substrate in the array process, and a color filter process for forming a plurality of color filters. The device is mounted on a color filter substrate 201104777, and a unit process, and before or after these processes, the substrate will pass through a cleaning process. Different cleaning devices are used in the substrate cleaning process, and among these cleaning devices, a porous adjacent cleaning device is used in a cleaning method including using an air floating unit to float the substrate (four) to glass The substrate is transferred to a cleaner' and a deionized water and air are supplied in a state where a gap of less than 100 micrometers (um) is formed at the top and bottom of the glass substrate in the cleaning region, and a deionized water stream and a bubble flow are generated. _ granules and absorbed substances. The porous cleaning apparatus may comprise a porous cleaning panel, a manifold, and a top frame and the home hole cleaning panel and the age of the manifold are passed through an ageing agent or the like. However, one of the prior art porous cleaning devices has the following problems. in! Among the porous cleaning apparatuses of the prior art, an organic binder can be used when the porous cleaning panel is fastened to the door of the manifold, but the ageing agent has the disadvantage of being unsuitable for a cleaner having many holes. _ Ground has a case where the organic binder is unevenly coated and thereby causes air leakage. SUMMARY OF THE INVENTION The main object of the present invention is to provide a base cleaning apparatus which is capable of preventing leakage between a field cleaning panel and a manifold. Another object of the present invention is to provide a substrate cleaning apparatus capable of suppressing stress and stress caused by fastening by using a porous cleaning panel and an indirect fastening method of a porous cleaning panel using an insert block in a large scale 201104777. . The purpose and characteristics of the present invention will be described in the description of the present invention and the scope of the patent application. In order to achieve the above object, the substrate cleaning apparatus of the present invention comprises: a substrate insertion guide unit % for inserting a substrate from the outside - an impurity removal unit, which is received from the substrate insertion guide unit 70 - the substrate For removing impurities formed on the substrate; - an impurity cleaning unit for receiving the substrate from the impurity removing unit and cleaning and removing impurities remaining on the substrate; and - a position control unit for controlling the impurity/month cleaning sheet 70 The position of the substrate to be transported, wherein the impurity cleaning unit comprises a plurality of inserted blocks, a panel, in the cleaning panel of the button, the insert block is inserted into the gap-shaped groove #, and - The manifold, the manifold - the nail is inserted through the fastening hole in the insert block for integration with the porous cleaning panel. As described above, according to one of the substrate cleaning apparatuses of the present invention, by using an insert block--a porous cleaning panel and a manifold, it is fastened to each other, thereby preventing generation of air at the joint portion thereof, and reinforcing - large-sized cleaning panel And the fastening force between the manifold and the above, in the fastening between the large-size porous cleaning panel and a manifold, as described above, the application-use-insert block inter-connecting fastening method is This minimizes the damage and stress of the porous cleaning panel created by the fastening of 201104777. Further, according to the substrate cleaning apparatus of the present invention, the fastening between the porous cleaning panel and the manifold is a simple operation, and the porous cleaning panel is not damaged during the fastening, thereby being capable of cleaning a large-sized substrate. The advantages. [Embodiment] Hereinafter, a substrate cleaning apparatus of the present invention will be described in detail in conjunction with the drawings. Fig. 1 is a cross-sectional view showing a substrate cleaning apparatus according to a first embodiment of the present invention. Further, "Fig. 2" is a perspective view of the impurity cleaning unit in the substrate cleaning apparatus of the first embodiment of the present invention shown in "ith diagram". As shown in the figure, the substrate cleaning apparatus of the first embodiment of the present invention may include a substrate insertion guide unit for inserting the substrate 10 from the outside into a correct direction; an impurity removing unit 12〇, it receives a substrate 10 from the substrate insertion guiding unit to remove impurities formed on the substrate 10; the impurity cleaning unit 130' receives the substrate 1 from the impurity removing unit 12〇 for cleaning and removing the substrate 1G. The remaining impurity f; and the position control unit 140 is for controlling the position of the substrate 1 () transported from the impurity cleaning sheet by 3G. Here, the substrate insertion guide unit 100, the impurity removing unit 12A, the impurity cleaning unit 130, and the position control unit (10) are formed of a metal porous material. For example, the substrate insertion guide unit 100, the impurity removal unit 12A, the impurity cleaning unit 130, and the position control unit 14G may have a defect, |g (A1), a sinter alloy, a κ copper, a Hastelloy, and Any one of the porous materials made of 201104777. Specifically, the substrate insertion guide unit 100' impurity removing unit 12', the impurity cleaning unit 130, and the position control unit 140 may be provided with different metal porous materials. For example, the substrate insertion guide unit 100 may be made of a stainless steel material, the impurity removal unit 120 may be made of aluminum (A1), the impurity cleaning unit 13 may be made of an aluminum alloy, and the position control unit 14 may be made of brass. Here, stainless steel, aluminum (A1), aluminum alloy, brass, Hastelloy (Hastdl〇y), and a metal having a high hardness, and # through the frequency-forming metal forming substrate insertion guide unit it 1GG, impurity removal unit At 12 o'clock, the impurity cleaning unit 13 (), and the position control unit 140 may improve the chemical resistance of the cleaning device. Moreover, the hardness of the above-listed metals is smaller than that of the object to be cleaned, that is, the hardness of a substrate 10, and therefore, the cleaning device can make the metal, and thus even during the cleaning process, cleaning and cleaning When the devices are in contact with each other, the substrate 10 is prevented from being damaged. The constituent elements described above will be described below. The substrate insertion guide unit contact may include an insertion guide path (not shown) which guides the substrate (1) which is inserted from the outside through the __roller 5G for correctly inserting the substrate 10 into the impurity removing unit 120. The insertion guide path 35 has a form in which the width of the impurity removing unit 12 is gradually decreased by V from the outer (four). Through this type of insertion guide path, even the substrate 10 is not accurately inserted along the guide path! In the state provided by the precise center arrangement, the substrate can be automatically moved toward the precise center of the insertion guide 201104777. Moreover, the substrate insertion guide unit 100 may include a top structure 100a and a bottom structure 100b facing each other. The top structure hidden and bottom structures are spaced apart from each other by a predetermined distance, and the aforementioned insertion guide paths are formed to be spaced apart from each other = between the top structure 100a and the bottom structure 100b. The top structure 100a injects air toward the insertion guide path and also sucks in the air of the injection. The bottom structure 100b injects gas toward the insertion guide path and also sucks in the injected gas. Therefore, the substrate 1 inserted into the insertion guide path will be in a floating state above the space in which the guide path is inserted. In the second city, the two surfaces facing each other between the top structure l〇〇a and the bottom structure are inclined surfaces having a slope of a county angle. In particular, the inclined surface of the top structural bribe is such that the top surface of the substrate 1G has an inclined surface of the predetermined limb, and the inclined table (10) of the bottom structural leg has a predetermined angle with respect to the bottom surface of the substrate (7) surface. The space of the two inclined surfaces is the insertion guide miscellaneous, and a gap between the hard-to-structure structure and the bottom-to-back position can change the gap of the insertion guide path. The item, the structure 100a and the bottom structure - π - heart soil 一 field - made of a porous metal material, = externally supplied air is sprayed onto the substrate 10 through the main body of the top structure structure and the bottom structure. In other words, from the outside toward the top structure, the top portion of the air is supplied through the top structure (10) to the insertion guide path, and from the outside toward the bottom, the surface of the surface is The supply to 201104777 is inserted into the guide path. Here, a plurality of suction holes (not shown) for taking in air are formed on each of the top structure 100a and the bottom structure 100b. The suction hole formed in the top structure is oriented toward the insertion guide passage through-top structure 1a, and the suction hole formed on the bottom structure 10b penetrates the bottom structure 100b toward the insertion guide path. Further, the impurity removing unit 120 may include a top impurity removing unit 12a and a bottom impurity wire unit. The lion removal unit and the bottom (four) removal unit = 〇b are spaced apart from each other and - the movement space for moving the substrate (not shown) is formed between the two spaced structures. The top impurity removing unit removes impurities by physical contact with impurities formed on the bottom surface of the substrate w by a hetero-thorax formed on the top surface of one of the substrates 10. 2, 'substrate material removal unit 12Ga and wire (four) unit hidden = sin slave 'and therefore 'when the substrate 1G moves by moving the butterfly, when 2 Π», _ into _ block _ _ removal unit = head Gu Shi, _ these upwards, and when the substrate 10 - bottom surface axis Jing 2 remove this side. The gap between Jing Tongyuan and 70 (4) can be controlled according to the thickness of the substrate 10. , quality two aspects 'impurity cleaning unit 13. Can contain a top impurity facing each other> Yue Jie early yuan listening and "bottom impurity cleaning unit -_ quality clearing element 2 12 201104777 with the bottom impurity cleaning unit · with each other - dare to turn, and one used A shifting chamber (not shown) for moving a substrate H) is formed in a space between the adjacent top impurity cleaning unit 13A and the bottom impurity cleaning unit 1. Here, the top impurity cleaning element 13Ga lies the crane space and draws air through the suction hole m. Similarly, the bottom impurity cleaning unit 喷射 injects air toward the moving space and sucks in air through the suction hole 115. ...so the substrate ίο inserted into the moving space becomes a floating state above the moving space. In other words, the top impurity cleaning element 13Qa injects air toward the top surface of the substrate H) inserted into the moving space and sucks the air, and the bottom impurity clearing element 13Gb is inserted into the space of the person. One of the substrates of the towel 1Q is sprayed into the air area. The person looking for it on the axis has been in the floating state since the axis is in the floating state, and the ejection force is larger than the suction force. Moreover, the 'top impurity cleaning unit applies a plurality of deionized water holes (1) to spray the cleaning solution (deionized water) toward the moving space and uses the cleaning solution and the injected air to generate bubbles' thereby removing impurities from the top surface of the substrate 1G through the moving space. . Further, the bottom impurity cleaning unit 130b ejects the cleaning solution (deionized water) toward the moving space through the plurality of deionized water holes 113 and generates bubbles using the cleaning solution and the ejected air, thereby removing impurities from the bottom surface of the substrate 10 through the moving space. . Moreover, the top impurity cleaning unit dirty and bottom impurity cleaning unit empties the cleaning water to the outside using the sucked air. Deionized water, a chemical solution, or a mixed solution of deionized water and a chemical solution can be used as the cleaning solution. 13 201104777 The main system of the top impurity cleaning unit 130a and the bottom impurity cleaning unit n〇b is made of a metal porous material for injecting air supplied from the outside through the main body of the top impurity cleaning unit 7L 130a and the bottom impurity cleaning unit. Move space. In other words, from the outside toward the top impurity cleaning unit, the top-topped air-top impurity cleaning unit is hidden and supplied to the moving space, and is cleaned from the outside toward the bottom and cleans the air of the single-input-bottom side Through the bottom (four) cleaning unit, it is supplied to the moving space. In this way, a plurality of deionized water holes ii3 for cleaning money and a plurality of suction holes m for taking in air are formed on each of the top impurity cleaning units to be applied to the bottom (four) cleaning element. A plurality of deionized water holes (1) and a suction hole 115 are formed on a manifold 101, and the deionized water holes 113 and the suction holes are connected with the through hole ina provided by the top fastening screw (1). The fixing screw 111 is used to fasten the porous cleaning panel (3) combined with the manifold 1G1. At this time, a top fastening screw lu formed with a penetration rib is inserted into the contact portion between the manifold 101 and the 々 porous cleaning panel 131 to prevent each effect of the self-designed 2 tube 101. The interaction between the two is such that the per-utility zone is isolated from the porous cleaning panel 131' thereby preventing the adhesion between the manifold 101 and the porous cleaning panel 131 from being enhanced. Further, the air hole 103 is formed above the manifold 101, and thus the porous cleaning panel 131 is combined with the manifold 101 to provide an air path 105 therebetween. Therefore, the I gas will pass through the air path 105 through the top. The entire surface of the porous cleaning panel 131 among the impurity cleaning unit 130a and the bottom 14 201104777 impurity cleaning unit 13Gb is sprayed. And the shape of the depth (four) track 133 is fastened to the manifold 101. The combined top fastening screws ln are spaced apart by a predetermined distance so as to be placed on each of the porous cleaning panels 131 of the _f cleaning element brain and the cleaning element (4). The plurality of deionized water holes 113 and the suction holes 115 It is associated with a through hole 111la of a top fastening screw 111 fixed to the channel 133. The plurality of suction holes 115 suck air or a cleaning solution through the channel 133, and the deionized water hole 113 passes through the top fastening screw 111. The penetration hole 111a sprays the cleaning solution. Here, the top fastening screw m should be lower than the height of the channel 133, and the diameter of the screw should be smaller than the diameter of the channel 133. The direction of travel is perpendicular Above, the plurality of channels 133 are separated by a predetermined distance, and the cleaning solution is filled in the channel 133, thereby improving the cleaning effect of the substrate 10. Moreover, the 'manifold 101 passes through the bottom fastening screw 121 together with the top fastening screw The ills are combined with each other, and the bottom fastening screw 121 is inserted from the bottom of the manifold 1〇1 for fastening to the porous cleaning panel 131' and thus the manifold ιοί and the fastening porous cleaning panel 131 are doubled to each other in a cow-solid manner And a 'seal 107 is inserted into a contact portion between the manifold 101 and the porous cleaning panel 131 to prevent interaction leakage between each of the designed manifolds 101 so that each A utility zone is isolated from the porous cleaning panel 131, whereby 15 201104777 further enhances an adhesive force between the manifold 101 and the porous cleaning panel 131. Here, a material having low physical and chemical deformation, for example, Teflon-based ( Teflon-based or fluorine-based material is used as the sealing member 1 ο 0. On the other hand, the position control unit 14 〇 ejects air toward the substrate 1 and performs the suction of the ejected air, thereby maintaining the substrate 1〇 as In a floating state, the substrate 10 carried from the position control unit το 140 is moved to a subsequent process apparatus by a roller 6〇. Thus, the substrate cleaning apparatus according to the first embodiment of the present invention transmits through the use of a through hole. The top of the m-spinning bottom is fastened, and the towel penetration hole is connected with the deionized water and the suction hole, and the porous cleaning panel and the manifold are fastened to each other, thereby preventing the deionized water and the suction hole. Producing a leak, and increasing the fastening force between the cleaning panel and the manifold. However, the substrate cleaning apparatus according to the first embodiment of the present invention directly fastens the fastening screw (or bolt) to the porous Among the methods of cleaning the panel, an insertion needle should be inserted into the porous cleaning panel to tighten the nail. In order to insert the insertion needle, since a plurality of holes must be formed on the hole cleaning panel, damage and stress can be generated in the perforated clear/tank panel. In order to tighten the porous cleaning panel and the manifold by using screws, the insertion needle for fastening the screw should be inserted into the porous cleaning panel, but in the Jingcheng _, it can be produced in the cleaning panel. H or when the system is too strong, the needle can be inserted loosely. For a plate, it can be used for money, but if any one of the money is defective, it can create a risk that all the panels cannot be turned over. 201104777 In the case where the area of the porous cleaning panel is increased in a substrate cleaning apparatus, the number of screws is increased, thereby increasing the damage and stress acting on the cleaning panel. Moreover, the uniformity of the cleaning panel can be changed according to the fixed size of each screw to be tightened and since the clamping torque is limited, the fastening force cannot be sufficiently increased. Therefore, by using an indirect fixing of an insert block between the large-sized porous cleaning panel and a manifold, damage or stress transmitted through the above-mentioned direct mosquito can be suppressed, and deionized water and inhalation can be formed through the inserted block. The holes are effective for suppressing leakage, and will be described in detail below by a second embodiment of the present invention. Fig. 3 is a perspective view showing an impurity cleaning sheet in the substrate cleaning apparatus of the second embodiment of the present invention. Further, "4A" and "4B" are the second embodiment of the present invention shown in "Fig. 3" - the insertion block is inserted into a porous cleaning panel in the impurity cleaning unit. perspective. Further, the 'fifth diagram' is a perspective view of the cleaning unit in the substrate cleaning apparatus of the second embodiment of the present invention shown in "Fig. 3". Among the substrate cleaning apparatuses, the components of the substrate cleaning apparatus are the same as those of the first embodiment of the present invention except for the second embodiment of the present invention. Although the second embodiment of the filament 'Ben (4) can be used to include the substrate insertion guide unit, the substrate is inserted into the substrate from the outside to be inserted in the correct direction; - the impurity removal unit is inserted into the guide sheet The secret-substrate ribs are removed from the substrate to form a miscellaneous material. 201104777 质/月洁单单 7C 'The substrate is received from the impurity wire unit to clean and remove the impurities on the substrate 4 and the position control unit' It is used to control the position of the substrate transported from the impurity cleaning unit. The substrate insertion guide unit, the impurity removal unit, the impurity f cleaning unit, and the position control unit are formed of a metal material. To be clear, the substrate insertion guide unit, the (4) removal unit, the miscellaneous (four) material element, and the position control unit may be provided by any one of stainless steel, shovel, alloy, brass, ha-alloy (Η_^), and 鍅. Made of porous materials. Auxiliary, non-recorded steel, Shao (A1), Shao alloy, brass, Hastelloy, and the metal with high hardness, and when the substrate is formed by using these metals, the insertion guide is early, the impurity removal unit, When the impurity cleaning unit and the position control unit are used, it is possible to improve the chemical resistance of the cleaning device. Moreover, the hardness of the metal listed above is smaller than that of the object to be cleaned, that is, the hardness of a substrate, and thus the cleaning device can make the metal, and thus even in the cleaning county, the substrate and the cleaning device are mutually Prevent damage to the substrate when in contact. Further, as described above, the impurity removing unit may include a top impurity removing unit (not shown) and a bottom impurity wire (not shown). The top impurity removing unit (not shown) and the bottom impurity removing unit (not shown) are spaced apart from each other by a predetermined distance, and 2 a moving space for moving the substrate (not shown) is formed in the two spaced structures. between. 201104777 Here 'as shown, the top impurity cleaning unit is directed toward the moving space nozzle - and sucks the injected air through the plurality of holes 2Ub, similarly, the bottom impurity cleaning sheet 2 ejects air to the moving space and passes through the plurality of holes 2i jb suction injection * gas month f this 'inserted into the moving space (four) substrate in the move Lang:: becomes floating state. In other words, the top impurity cleaning unit injects air toward the top surface of the substrate inserted into the moving space = and jets the air, and the field k is directed toward the substrate inserted into the shifting chamber - the surface jet The air and the second jet of air are 'subtracted in the moving space' and the substrate remains in a floating state, while the 'ejection force is larger than the suction force. Moreover, the top impurity cleaning unit generates a bubble by jetting a cleaning solution (deionized water) to the moving space (the deionized water) and the air of the Confucian air through the plurality of holes, and the space is moved from the top surface of the substrate by moving the space. Further, the bottom (four) cleaning sheet 70 ejects a cleaning solution (deionized water) toward the moving space through the multi-peel 211b and generates bubbles by using the cleaning solution and the ejected air, thereby removing impurities from the bottom surface of the substrate through the moving space. Moreover, the top impurity cleaning unit and the bottom impurity (four) cleaning unit allow the air of the secret person to drain the clean water to the outside. Deionized water, a chemical solution, or a mixed solution of deionized water and a chemical solution can be used as the cleaning solution. Here, the 'plurality of holes 2llb may include a plurality of suction holes and a plurality of deionized water holes' suction holes for injecting air into the moving space and sucking air, and the deionized water holes are used to spray the cleaning solution. To the mobile space. 201104777 Here, the main system of the top impurity cleaning unit and the bottom impurity cleaning unit is supplied from the externally supplied air to the moving space through the metal of the top impurity cleaning unit and the bottom impurity cleaning material by a metal etching material k'. In other words, from the outside toward the top of the impurity-clearing element - the top of the jet of air, the Wei Gu lung clearing element and supply. The air injected to the bottom of the mobile station and from the outside toward the impurity cleaning element passes through the bottom impurity cleaning unit and is supplied to the enchantment room. Thus, a plurality of deionized water holes for ejecting the cleaning solution and a plurality of suction holes for inhaling are formed on each of the cleaning unit and the bottom impurity cleaning unit. The plurality of deionized water holes and the inlet holes are reduced in the second embodiment of the present invention. The plurality of holes 21ib are formed in an insert block 250 and fastened to the manifold 201 at the insert block 250. Position, a plurality of holes 2ub are associated with connection holes 215 provided in a manifold 201. Moreover, a plurality of fastening holes 211a for fastening to the manifold 210 are formed in the insertion block 250, and a plurality of fastening screws are inserted through the fastening holes 21u of the insertion block 25, for insertion into the insertion block 250 to a state in which a groove 231a is combined with the manifold 201, wherein the groove 231a is formed at a fixed interval on the porous cleaning panel 231, thereby preventing leakage and suppressing damage of the porous cleaning panel 231 due to fastening and stress. A channel 233 having a predetermined depth is formed longitudinally on the porous cleaning panel 231 at regular intervals for insertion through the insertion block 250 spaced apart by a predetermined distance, and the groove 231a is formed in the channel 233, The groove 231a has a length of 201104777 corresponding to the length of the insert block 250. Here, for example, the insertion block 250 may have a top portion 250a of a "TT type cross section and a bottom body 250b, and in this case, the top head 25A has a width compared to the porous cleaning panel 231. The groove 231a has a larger width for accommodating in the channel 233' and the bottom body 25b has substantially the same width as the groove 231a of the porous cleaning panel 231 for when a part thereof is suitable for the difference The tube 201 can be inserted into the recess 23la when combined with the manifold 201. Thus, the bottom body 250b of the insert block 250 is formed to be deeper than a contact surface between the porous cleaning panel 231 and the manifold 201. Here, for example, in the drawings, the fastening screw 211 is fastened from the top of the porous cleaning panel 231 positioned with the insertion block 250 toward the lower manifold 2〇1. However, the present invention is not limited thereto, and the present invention can be applied to the case where the fastening screw 211 is fixed from the bottom of one of the manifolds 2〇1 toward the upper porous cleaning panel 231. Further, an air hole (not shown) is formed on the manifold 2〇1 for providing an air path 205 between the porous cleaning panel 231 and the manifold 201 which are combined with each other. Therefore, air is ejected through the air path 205 through the entire surface of one of the porous cleaning panel 231 among the top impurity cleaning unit and the bottom impurity cleaning unit. However, the present invention is not limited thereto, and the air path 205 may be formed in one of the porous cleaning panel 231 or the manifold 201. Moreover, a seal member 207, such as a gasket, is inserted into a contact portion between the manifold 2〇1 and the porous cleaning panel 231 to prevent the design of the manifold 2〇1 between every 21 201104777 effect. The interaction leaks, thereby further enhancing an adhesive force between the manifold 201 and the porous cleaning panel 231. Here, a material having a low physical and chemical deformation, for example, a Teflon-based or fluorine-based material is used as the sealing member 2〇7. Thus, according to the substrate cleaning apparatus of the second embodiment of the present invention, a porous cleaning panel and a manifold are fastened to each other by using an insertion block, thereby preventing air leakage at the joint portion and enhancing The fastening force between the large-sized porous cleaning panel and the manifold. In particular, according to the substrate cleaning apparatus of the second embodiment of the present invention, in the fastening between the large-sized porous cleaning panel and the manifold, the indirect fastening method using an insert block does not require a porous The cleaning panel is inserted into a pin, thereby reducing damage and stress of the porous cleaning panel and improving the efficiency of using the cleaning panel. In addition, a fastening between the porous cleaning panel and the manifold is a simple operation and, therefore, does not damage the porous cleaning panel during the fastening process, thereby simplifying the manufacture of a large-sized porous cleaning panel. While the invention has been described above, it is intended to be illustrative of the preferred embodiments of the invention Therefore, please refer to the attached patent application scope for the scope of protection defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a transverse wear surface of a substrate cleaning apparatus according to a first embodiment of the present invention. FIG. 22, 201104777 FIG. 2 is a first embodiment of the present invention shown in FIG. A perspective view of an impurity cleaning unit in a substrate cleaning apparatus; FIG. 3 is a perspective view of an impurity cleaning unit in a substrate cleaning apparatus according to a second embodiment of the present invention; FIGS. 4A and 4B are diagrams A perspective view of an insert block of the second embodiment of the present invention shown in FIG. 3 inserted into a porous cleaning panel in the impurity cleaning unit; and FIG. 5 is a third embodiment of the present invention shown in FIG. A perspective view of an impurity cleaning unit in a substrate cleaning apparatus of the second embodiment. [Main component symbol description] 10 Substrate 50 Roller 60 Roller 100 Substrate insertion guide unit 100a Top structure 100b Bottom structure 101 Manifold 103 Air hole 105 Air path 107 Seal 111 Top fastening screw 23 201104777
Ilia 穿透孔 113 去離子水孔 115 吸入孔 120 雜質去除單元 120a 頂雜質去除單元 120b 底雜質去除單元 121 底緊固螺釘 130 雜質清潔單元 130a 頂雜質清潔單元 130b 底雜質清潔單元 131 多孔清潔面板 133 溝道 140 位置控制單元 201 歧管 205 空氣路徑 207 密封件 211 緊固螺釘 211a 緊固孔 211b 子L 215 連接孔 231 多孔清潔面板 24 201104777 231a 凹槽 233 溝道 250 插入塊 250a 頂頭部 250b 底部主體 25Ilia penetration hole 113 deionization water hole 115 suction hole 120 impurity removal unit 120a top impurity removal unit 120b bottom impurity removal unit 121 bottom fastening screw 130 impurity cleaning unit 130a top impurity cleaning unit 130b bottom impurity cleaning unit 131 porous cleaning panel 133 Channel 140 position control unit 201 manifold 205 air path 207 seal 211 fastening screw 211a fastening hole 211b sub L 215 connection hole 231 porous cleaning panel 24 201104777 231a groove 233 channel 250 insertion block 250a top head 250b bottom body 25