TWI460919B - 射頻耦合之數位隔離器 - Google Patents

射頻耦合之數位隔離器 Download PDF

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TWI460919B
TWI460919B TW097112605A TW97112605A TWI460919B TW I460919 B TWI460919 B TW I460919B TW 097112605 A TW097112605 A TW 097112605A TW 97112605 A TW97112605 A TW 97112605A TW I460919 B TWI460919 B TW I460919B
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Taiwan
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finger
die
coupled
signal
digital isolator
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TW097112605A
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TW200901551A (en
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Barry Harvey
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Intersil Inc
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Description

射頻耦合之數位隔離器 【相關申請案之交互參照】
本申請案主張2007年10月23日申請之美國專利申請案第11/877,333號之優先權，其係在35 U.S.C.119(e)下主張2007年5月11日申請之美國臨時申請案第60/928,856號以及2007年9月17日申請之美國臨時申請案第60/973,020號之優先權，其係在此全部合併參照之。
本發明之實施例係有關於隔離器，且特別是有關於較佳操作於RF頻率下的數位隔離器。
就諸多不同因素而言，隔離乃是重要的。例如，在共模雜訊成為問題之處，隔離即重要。於磁場及相似者造成高速資料傳輸可能受到干擾之處，隔離同樣重要。此外，在兩裝置接地不相容之處，隔離亦重要。再者，在醫學應用上保護病患，隔離則可能有其重要性。這些僅為一些範例，而非限制之意。
已經發展出用以提供隔離之各種不同裝置。例如，光隔離器(同樣已知為一種光隔離器、光耦合器、或者光MOS)為一種使用相對較短的光學傳輸路徑來傳送一個或多個典型為傳輸器與接收器的電路構件之間的訊號並同時保持其電氣隔離之裝置。然而，光隔離器之缺點為其典型不能操 作在數位通訊通常所需的高速之下。此外，由於光隔離器需要一光學傳輸構件以及一光學檢測構件，因此此種裝置的尺寸、成本及電力消耗通常會較大於所需的。
為了克服光隔離器諸多的缺陷，已經發展出了數位隔離器。某些數位隔離器是電容耦合的。然而，此種裝置通常較大於所需的，及/或與積體電路製造技術不相容。其他的數位隔離裝置結合高速的CMOS以及氣心或磁心變壓器技術，藉以支援高資料速度與低電力。然而，如此的變壓器典型是依賴通常會致使變壓器尺寸與成本大於所需的繞組。
本發明的實施例係有關於RF耦合之數位隔離器、以及提供數位隔離之方法。根據本發明的實施例，一種RF耦合數位隔離器包含彼此電氣隔離之第一導線架部分以及第二導線架部分。根據特定之實施例，第一與第二導線架部分乃是一分離導線架之部分。第一導線架部分包含一第一主體與一第一指部。第二導線架部分包含一第二主體與一第二指部。第一主體連接至第一接地，而第二主體則連接至與第一接地電氣隔離之第二接地。
根據一實施例，第一指部與第二指部藉由形成數位隔離器封裝之塑膠模製化合物而彼此電氣隔離。根據一實施例，當射頻(RF)訊號驅動至第一指部時，第一指部便充當變壓器之一次側，而第二指部則充當變壓器之二次側。在 某些實施例中，第一指部與第二指部彼此實質平行。在其他之實施例中，第一與第二指部彼此實質反向平行。在某些實施例中，第一與第二指部各個實質為筆直的。在其他實施例中，第一與第二指部為彎曲的，例如，實質為螺旋狀，然彼此仍實質平行或反向平行的。
根據某些實施例，一第一晶粒架置於第一主體之上，而一第二晶粒則架置於第二主體之上。一第一焊接線將第一晶粒連接至第一指部，而一第二焊接線則將第二晶粒連接至第二指部。根據某些實施例，第一晶粒包含一產生用來驅動第一指部的RF訊號之振盪器。第二晶粒可包含一放大器，在RF訊號驅動第一指部時，將第二指部所產生的訊號放大。第一晶粒同樣也可包含一調變器，而第二晶粒同樣也可包含一解調變器。根據第一晶粒所提供的一或多個訊號，第一晶粒內的調變器便能夠控制振盪器。解調變器能夠將放大器所輸出的訊號解調變，並且能夠將已解調變後的輸出訊號提供給第二晶粒之輸出。
經由以下所提之細節說明、附圖以及申請專利範圍，本發明之其他實施例以及特徵、觀點與優點將更為明顯。
圖1A描繪根據本發明實施例之一種RF耦合數位隔離器100(此後簡化地稱為數位隔離器)。數位隔離器100包含一分離導線架104，包含一第一導線架部分104a以及一第二導線架部分104b。將導線架部分104a與104b封入一 包裝材質(例如，塑膠)內，藉以形成數位隔離器之封裝102。每個導線架部分104a與104b皆能夠由諸如印壓或蝕刻之銅質或者製成薄片之鋼合金所製作，但並不受限於此。
每個導線架部分104a與104b皆包含相應的主體110a與110b、以及相應的指部120a與120b。藉由封裝材質(例如，塑膠模製化合物)而彼此隔離的指部120a與120b共同提供一變壓器，此同樣也可稱為一種“指式(finger)變壓器”。在此一實施例中，當射頻(RF)訊號驅至指部120a時，指部120a充當變壓器之一次側，而第二指部120b則充當變壓器之二次側。
此外，晶粒130a(同樣也稱為“晶粒A”)架置於導線架部分104a的主體110a之上，而晶粒130b(同樣也稱為”晶粒B”)則架置於導線架部分104b的主體110b之上。晶粒130a可包含一提供傳輸能力之積體電路，因而同樣也可稱為一種傳輸器晶粒。晶粒130b同樣也能夠包含一提供接收能力之積體電路，因而同樣也可稱為一種接收器晶粒。同樣也可行的是，每個晶粒130a與130b都能夠提供傳輸與接收能力兩者，因而可以是一種收發機晶粒。此種雙向通訊能夠是半雙工的。
晶粒130a同樣也包含多個焊接墊，在晶粒130a內由小方形所表示。晶粒130a的焊接墊是透過由粗體線所表示的焊接線，連接至晶粒130a外部之組件。晶粒130a其中之一焊接墊是藉由一焊接線132a連接至指部120a。晶粒130a之另一焊接墊是透過一接地焊接線連接至主體110a， 其依序是透過另一接地焊接線連接至一接地(亦即，Gnd_A)。晶粒130a之另一焊接墊接收一輸入訊號。晶粒130a之另一焊接墊接收一用來給予晶粒130a電力之電壓(Vs_A)。
相似的是，晶粒130b包含多個焊接墊，在晶粒130b內由小方形所表示，透過由粗體線所表示的焊接線，連接至晶粒130b外部之組件。晶粒130b其中之一焊接墊是藉由一焊接線132b連接至指部120b。晶粒130b之另一焊接墊是透過一接地焊接線連接至主體110b，其依序透過另一焊接線連接至一接地(亦即，Gnd_B)。Gnd_A與Gnd_B彼此電氣隔離。晶粒130b之另一焊接墊提供一輸出訊號。晶粒130b之又一焊接墊係接收用來提供電力給晶粒130b的電壓(Vs_B)。在晶粒130a與130b能夠用作收發機的情形中，每個晶粒上相同的焊接墊皆能夠接收一輸入並且提供一輸出，或者能夠針對每個功能，提供個別的焊接墊。
在圖1A中是顯示指部120a與120b為彼此平行的。在圖1B所示的另一實施例中，一RF耦合數位隔離器100’包含彼此反向平行的指部120a與120b，使之反相(亦即，180度反相)。當指部彼此平行時，乃至當指部反向平行時，在指部120a與120b之間會有寄生性電容耦合。然而，指部彼此反向平行的效益為由於磁性與耦合模式之間的關係，在反向平行配置中的寄生性電容耦合會增加訊號的轉送。相反的是，在平行配置中的寄生性電容耦合將會減低訊號的轉送。
在圖1A與1B中是顯示指部120a與120b為實質筆直的，然而並不需要是如此的狀況，如同能夠從圖1C所察知的。更特別的是，圖1C顯示一種RF耦合數位隔離器100”之實施例，其中的指部120a與120b為反向平行的，但指部120a與120b為螺旋形狀的，其具有增加相互耦合電感之影響(因而增加其耦合係數)。圖1C中的指部120a與120b或可彼此平行。圖示(包含圖1A一1C)中相似或者共同的參考數字是用來指稱相似的組件或構件。
指部120a與120b之間的距離、指部120a與120b的形狀、以及指部120a與120b的長度會影響指部之間的寄生電容(Cparasitic )與耦合係數(K)。指部120a與120b之間典型的距離為10毫英吋，但其他的距離同樣也在於本發明範疇之內。
此時將參考圖2所說明的是，晶粒A(130a)會迫使較佳在GHz範圍內的電流進入指部120a，其返回至導線架主體110a並且回到晶粒A’的接地焊接線。如上述彼此隔離的指部120a與120b具有磁性耦合以及互感。寄生電容是以虛線電容器描繪於圖2，標示為Cparasitic 。耦合係數以“K”描繪於圖2，其指示在兩指部120a與120b之間會存在一耦合係數(另一種說法為在兩指部120a與120b之間會有互感)。該轉換係有利地隨著頻率而增加。所以，需要高操作頻率。操作頻率較佳位於手機與藍芽裝置所指定的頻譜之外。更特別的是，期望本發明的數位耦合器之操作頻率大於或者小於2.4GHz。在特定實施例中，操作為額定約 3GHz。
參照圖2之電路圖，其提供晶粒130a與130b某些額外的細節，而且由於電感特性，故將各不相同的焊接線顯示為電感器。此外，在圖2中，同樣也因電感特性，每個指部120a與120b同樣也顯示為電感器。同樣也顯示晶粒130a包含一振盪器220以及一調變器210。根據特定的實施例，振盪器220會產生一約3GHz與約3毫安的峰對峰值(mApp)之振盪訊號，然而較低或較高頻率、及/或較低或較高振幅同樣也是可行的，並且在於本發明的範疇之內。調變器210會接收一條或者多條輸入訊號線，其指示調變器210如何控制振盪器220。在簡單的二進制調變(同樣也已知為“開/關調變”)使用之處，調變器210可以如緩衝器一般簡單，如圖3的310所顯示的。任何一種已知或者未來將要發展的其他技術或能使用之，包含而不受限於振幅調變、正交調變等等。調變器210可以是一種數位或者類比的調變器，而要由調變器210所調變的訊號亦能夠是一種數位或者類比的訊號。更特別的是，在一實施例中，晶粒130a的控制輸入端上所接收到的訊號可以是一種類比訊號，在此狀況下，於晶粒130b的隔離輸出端上，則會輸出一類比訊號。在另一實施例中，晶粒130a的控制輸入端上所接收到的訊號能夠是一種數位訊號，在此狀況下，於晶粒130b的隔離輸出端上，則會輸出一數位訊號。所以，本發明實施例的RF耦合數位隔離器能夠用來將類比或者數位訊號從電路的其中一部份傳輸至電路的另一部份。
返回到圖2的電路圖，其顯示晶粒130b包含一RF放大器230以及一解調變器240。RF放大器230會將指部120b所接收到的訊號放大，並且提供已放大後的訊號給予解調變器240。所使用的解調變器之型式應該相應於調變器210所提供的調變之型式。例如，在簡單的二進制調變使用之處，解調變器240可包含一位於比較器340之前的整流器330，如圖3所示。圖3同樣也描繪整流器330能夠包含一個二極體D1以及一個電容器CR ，但並不受限於此。
再次回到圖2，每個晶粒130a與130b同樣也隨選地包含一調諧電容器，標示為CA 與CB ，用來調諧每個晶粒電路之共振。指部120a與120b之間的寄生電容(Cparasitic )、互感(M)、以及耦合係數(K)同樣也會影響共振。所以，可選擇指部120a與120b的尺寸、其間的距離、以及每個晶粒130a與130b的電路組件(包含調諧電容器CA 與CB 之數值)，藉以提供所需的共振。
仍參照圖2，供給晶粒A(130a)的輸入訊號會致使振盪器200振盪，並且提供一RF訊號給予指式變壓器。更特別的是，透過焊接線132a，從振盪器220提供一振盪訊號給予指式變壓器120a。提供給予指部120a的振盪電流(及/或電壓)會在第二指部120b上產生一振盪電流(及/或電壓)，藉由放大器230將之放大。藉由解調變器240，對放大器230的輸出進行解調變。
根據本發明的特定實施例，假定一來自晶粒A(130a)的3GHz振盪頻率與約3mApp的驅動訊號，指式變壓器的 輸出便能夠取得約45毫伏峰對峰值(mVpp)。假定在每個晶粒130a與130b上約3的Q值，則當與電容器CA 和CB 共振時，便能夠取得約400mVpp。
如以上所述，圖2所示的電路能夠用於訊號單向的傳輸，例如從晶粒A至晶粒B，或者用於雙向之半雙工通訊。為了提供雙向半雙工之通訊，晶粒A同樣也能夠包含一RF放大器以及一解調變器，而晶粒B同樣也能夠包含一振盪器以及一調變器。或者，同樣也能夠將一類似於晶粒B之晶粒架置於導線架部分104a的主體110a之上，而同樣也能夠將一類似於晶粒A之晶粒架置於導線架部分104b的主體110b之上。換言之，每個導線架部分110a與110b皆能夠包含一用來傳輸訊號之晶粒、以及一用來接收訊號之另一晶粒、或者一能夠用於傳輸與接收訊號兩者之共用晶粒。
在使用半雙工之通訊的情形中，每個導線架部分104a與104b僅需要包含一個指部。例如，參照圖1A－1C，能夠使用指部120a來傳輸訊號以及接收訊號，只要傳輸與接收是發生在不同的時間點上即可，如同半雙工通訊之例子。
或者，每個導線架部分104a與104b能夠具有一額外的指部，如圖4A與4B所示。參照圖4A與4B，其顯示導線架部分104a同樣也具有一指部420a，而且顯示導線架部分104b同樣也具有一指部420b，彼此藉由封裝材質(例如，塑膠模製化合物)而彼此隔離的額外指部420a與420b係共同提供一第二變壓器，其同樣也可稱為第二“指式變壓 器”。圖4A與4B彼此並不相同，其中圖4A形成指式變壓器的每對指部彼此平行，而圖4B形成指式變壓器的每對指部則彼此反向平行。儘管顯示圖4A與4B中的指部實質為筆直的，但並不需要是如此狀況，如同從以上所探討的圖1C所能夠察知的。在圖4A與4B的實施例中，當藉由RF訊號驅動指部120a與420b之時，指部120a與120b分別充當第一指式變壓器的一次側與二次側，而指部420b與420a則分別充當第二指式變壓器的一次側與二次側。
參照圖4A與4B的數位隔離器400與400’，指部120a能夠專用於傳輸訊號，而指部420a能夠專用於接收訊號，反之亦然。同樣的是，指部120b能夠專用於接收訊號，而指部420b能夠專用於傳輸訊號，反之亦然。以此種方式，便能夠提供全雙工之通訊。
圖4A與4B同樣也顯示兩個架置於導線架部分104a之上的晶粒130a與430a、以及兩個架置於導線架部分104b之上的晶粒130b與430b。在每個導線架部分之上的其中一個晶粒能夠用來產生用以驅動指部之訊號，以為傳輸之用(例如，包含執行調變)，而導線架部分上的另一個晶粒則能夠用來諸如放大與解調變所接收到的訊號。或者，每個導線架部分上所示的晶粒能夠組合，致使每個導線架部分具有架置於其上而用於接收與傳輸兩種功能的單一晶粒。同樣也在於本發明範疇內的是，增加一或多個額外的指部至每個導線架部分。同樣的是，可增加一或多個額外的導線架部分，以及使用超過兩個的導線架部分，致使存 在更多的隔離區域。例如，圖4A與4B所示的每個導線架部分能夠分離成為兩個導線架部分，產生四個導線架部分，每個皆具有一個指部。再者，同樣也要強調的是，導線架部分並不需要彼此對稱，亦即同樣也能夠使用非對稱的佈局。
在某些實施例中，能夠以陶瓷封裝來形成數位隔離器，諸如而不受限於一種密封的陶瓷封裝。如此的陶瓷封裝同樣也能夠包含一導線架，嵌入於陶瓷頂部與底部封底之間的糊漿層中。換言之，能夠將包含相應指部120與主體110之導線架部分104a與104b嵌入於陶瓷層之間。晶粒(例如，130a與130b)能夠連接至一陶瓷層，其可以是也可以不是指部120形成於其上的相同一層。在如此的實施例中，空氣或者某些其他的氣體能夠提供指部對之間的隔離。同樣也可使用任何一種技術，例如而不受限於化學氣相沈積、濺鍍、蝕刻、照相微影、遮罩等等，將主體(例如，110a與110b)以及指部(例如，120a與120b)直接形成於陶瓷層之上。晶粒(例如，130a與130b)能夠連接至此層，其可以是也可以不是指部120形成於其上的相同一層。再者，空氣或者某些氣體能夠提供指部對之間的電氣隔離。在另一實施例中，能夠將數位隔離器形成如同一種混合積體電路。例如，能夠將主體(例如，110a與110b)以及指部(例如，120a與120b)形成於晶粒(例如，130a與130b)所附著的印刷電路板上。在如此的實施例中，模製化合物能夠提供指部之間的電氣隔離與機械支撐。在以上才解釋過的可 替代實施例中，能夠使用導電性軌跡及/或貫孔來替代將晶粒連接至指部的焊接線，或者仍能使用焊接線。
本發明某些實施例的優點為藉由使用典型晶片裝配處理中有效用的分離導線架與塑膠模製化合物來產生一變壓器，便能夠提供一種數位隔離器。本發明某些實施例的優點為不需要任何繞組來提供數位隔離器之變壓器，降低所產生的數位隔離器之尺寸與成本而能合乎所求。本發明某些實施例的另一優點為以上所探討的設計在高於手機與藍芽頻譜的頻率下仍能正常工作，而且倘若經由適當調諧，如此的實施例同樣也能夠在本質上拒斥手機與藍芽頻譜內的頻率。
本發明的RF耦合數位隔離器能夠使用於多種不同的應用中。例如，RF耦合數位隔離器能夠使用於電力H橋式中，例如電源供應器或者馬達控制器，如同圖5所示的。H橋式的其他體現同樣也是可行的，此並且在於本發明的範疇之內。
此外，能夠使用RF耦合數位隔離器，以與切換式功率電晶體以及電力線通訊交連。再者，本發明的RF耦合數位隔離器能夠使用於長距離的通訊(例如，RS485)。本發明的RF耦合數位隔離器特別有用於50W或者更大的電力切換。本發明的RF耦合數位隔離器同樣也能夠使用來減短DC對DC轉換器之停滯時間(dead time)至諸如10奈秒。此僅為本發明的數位隔離器之一些應用，並無限制之意。
前述的說明是本發明的較佳實施例。已經針對闡述與 說明之目的提供了這些實施例，然而並不意指其為窮盡的，或者並不意指其限制本發明於所揭示的精確型式。對熟習該項技術者而言，諸多修改與變更乃是明顯的。選擇與說明該實施例乃是為最佳說明本發明之原理與其實際應用，藉此致使熟知該項技術者能夠了解本發明。意思是藉由以下的申請專利範圍及其等效者來界定本發明之範疇。
100‧‧‧RF耦合數位隔離器
100’‧‧‧RF耦合數位隔離器
100”‧‧‧RF耦合數位隔離器
102‧‧‧封裝
104‧‧‧分離導線架
104a‧‧‧第一導線架部分
104b‧‧‧第二導線架部分
110a‧‧‧第一導線架部分之主體
110b‧‧‧第二導線架部分之主體
120a‧‧‧第一導線架部分之指部
120b‧‧‧第二導線架部分之指部
130a‧‧‧晶粒A
130b‧‧‧晶粒B
132a‧‧‧焊接線
132b‧‧‧焊接線
210‧‧‧調變器
220‧‧‧振盪器
230‧‧‧RF放大器
240‧‧‧解調變器
310‧‧‧緩衝器
330‧‧‧整流器
340‧‧‧比較器
400‧‧‧數位隔離器
400’‧‧‧數位隔離器
420a‧‧‧數位隔離器之指部
420b‧‧‧數位隔離器之指部
430a‧‧‧晶粒A2
430b‧‧‧晶粒B2
圖1A闡述根據本發明實施例之一種RF耦合數位隔離器。
圖1B闡述根據本發明另一實施例之一種RF耦合數位隔離器。
圖1C闡述根據本發明另一實施例之一種RF耦合數位隔離器。
圖2為闡述圖1A一1C的數位隔離器某些額外細節的高階電路圖，其將圖1A一1C某些各不相同的構件以模型將之建立為等效電路組件。
圖3為提供圖2的圖示某些額外細節之高階電路圖，其中乃是使用簡單的二進制調變。
圖4A闡述根據本發明實施例之一種RF耦合數位隔離器，其能夠提供全雙工之通訊。
圖4B闡述根據本發明另一實施例之一種RF耦合數位隔離器，其同樣也能夠提供全雙工之通訊。
圖5闡述一種能夠使用本發明的數位隔離器來實現的 典型H橋式電路。
100’‧‧‧RF耦合數位隔離器
102‧‧‧封裝
104‧‧‧分離導線架
104a‧‧‧第一導線架部分
104b‧‧‧第二導線架部分
110a‧‧‧第一導線架部分之主體
110b‧‧‧第二導線架部分之主體
120a‧‧‧第一導線架部分之指部
120b‧‧‧第二導線架部分之指部
132a‧‧‧焊接線
132b‧‧‧焊接線

Claims (21)

  1. 一種RF耦合數位隔離器，其係包含：一第一導線架部分，其包含一第一主體與一第一指部，該第一指部係延伸自該第一主體；一第二導線架部分，其包含一第二主體與一第二指部，該第二指部係延伸自該第二主體，該第二導線架部分電氣隔離於第一導線架部分；該第一主體連接至第一接地；該第二主體連接至與該第一接地電氣隔離之第二接地；一第一晶粒，其架置於該第一主體之上；以及一第二晶粒，其架置於該第二主體之上；其中第一指部與第二指部彼此電氣隔離；以及其中當一RF訊號驅動該第一指部時，該第一指部便充當變壓器之一次側，而該第二指部則充當該變壓器之二次側。
  2. 如申請專範圍第1項之RF數位耦合隔離器，其中藉由形成數位隔離器封裝之塑膠模製化合物，該第一指部與第二指部彼此電氣隔離。
  3. 如申請專範圍第1項之RF耦合數位隔離器，其進一步包含：一第一焊接線，將該第一晶粒連接至第一指部；以及一第二焊接線，將該第二晶粒連接至第二指部。
  4. 如申請專範圍第1項之RF耦合數位隔離器，其中的 第一與第二導線架部分為一分離導線架之部分。
  5. 如申請專範圍第1項之RF耦合數位隔離器，其中的第一指部與第二指部彼此實質平行。
  6. 如申請專範圍第5項之RF耦合數位隔離器，其中的第一指部與第二指部每個皆為實質筆直的。
  7. 如申請專範圍第5項之RF耦合數位隔離器，其中的第一指部與第二指部每個皆為彎曲的。
  8. 如申請專範圍第7項之RF耦合數位隔離器，其中的第一指部與第二指部為實質螺旋狀的。
  9. 如申請專範圍第1項之RF耦合數位隔離器，其中的第一指部與第二指部彼此實質反向平行。
  10. 如申請專範圍第9項之RF耦合數位隔離器，其中的第一指部與第二指部每個皆為筆直的。
  11. 如申請專範圍第9項之RF耦合數位隔離器，其中的第一指部與第二指部每個皆為彎曲的。
  12. 如申請專範圍第11項之RF耦合數位隔離器，其中的第一指部與第二指部為實質螺旋狀的。
  13. 如申請專範圍第1項之RF耦合數位隔離器，其進一步包含：一振盪器，其位於產生RF訊號的第一晶粒之內；一第一焊接線，將該第一晶粒連接至第一指部，並且提供來自第一晶粒的RF訊號給予第一指部；一第二焊接線，將該第二指部連接至第二晶粒；以及一放大器，其位於該第二晶粒之內，當該RF訊號驅動 第一指部時，將第二指部所產生的訊號放大。
  14. 如申請專範圍第13項之RF耦合數位隔離器，其進一步包含：一調變器，其位於該第一晶粒之內；以及一解調變器，其位於該第二晶粒之內；其中根據提供給第一晶粒的一或多個訊號，該調變器控制著振盪器；以及其中的解調變器係將放大器所輸出的訊號解調變，並且將已解調變後的輸出訊號提供給予該第二晶粒之輸出端。
  15. 一種RF耦合數位隔離器，其係包含：一分離導線架，其包含彼此電氣隔離的第一導線架部分與第二導線架部分；該第一導線架部分包含一第一指部；以及該第二導線架部分包含一第二指部；其中的第一與第二指部具有致使其中一個該指部中的電壓及/或電流變化能夠為另一該指部檢測之互感。
  16. 如申請專範圍第15項之RF耦合數位隔離器，其中：該第一導線架部分包含一第一主體，該第一指部則是從該第一主體延伸；該第二導線架部分包含一第二主體，該第二指部則是從該第二主體延伸；以及其中當該等指部中之一個指部被一RF訊號所驅動時，便驅動該指部以充當變壓器之一次側，而另一該指部則充 當變壓器之二次側。
  17. 如申請專範圍第16項之RF耦合數位隔離器，其進一步包含：一第一晶粒，其架置於該第一主體之上；一第二晶粒，其架置於該第二主體之上；一第一焊接線，其係將第一晶粒連接至第一指部；一第二焊接線，其係將第二晶粒連接至第二指部；以及一位於該第一與第二指部之間的塑膠模製化合物，用以提供指部之間的電氣隔離。
  18. 如申請專範圍第17項之RF耦合數位隔離器，其中：該第一主體連接至第一接地；以及該第二主體連接至與第一接地電氣隔離之第二接地。
  19. 一種提供數位隔離之方法，其係包含：以一RF訊號來驅動一第一導線架之第一指部；以及由於該第一指部被RF訊號所驅動以及第一與第二指部之間的互感，檢測一第二導線架之第二指部上的訊號，其中該第一與第二指部彼此電氣隔離且係配置成一指式變壓器。
  20. 如申請專範圍第19項之方法，其進一步包含：接收一輸入訊號；根據該輸入訊號執行調變，藉以產生要驅動該第一指部之RF訊號；以及解調變該第二指部上所檢測到的訊號、或者該訊號已 放大後的版本，藉以產生一輸出訊號。
  21. 一種使用數位隔離之系統，其係包含：一電路之第一部份；該電路之第二部分；以及一數位隔離器，其位於該電路的第一與第二部分之間；其中的數位隔離器包含：一第一導線架部分，其包含一第一主體與一第一指部，該第一指部係延伸自該第一主體；一第二導線架部分，其包含一第二主體與一第二指部，該第二指部係延伸自該第二主體，該第二導線架部分電氣隔離於第一導線架部分；該第一主體連接至第一接地；該第二主體連接至與第一接地電氣隔離之第二接地；一第一晶粒，其架置於該第一主體之上；以及一第二晶粒，其架置於該第二主體之上；其中該第一指部與第二指部彼此電氣隔離；以及其中當一RF訊號驅動該第一指部時，該第一指部便充當變壓器之一次側，而該第二指部則充當該變壓器之二次側。
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CN101681901B (zh) 2011-07-27
US20080278256A1 (en) 2008-11-13
WO2008140861A1 (en) 2008-11-20
CN101681901A (zh) 2010-03-24
US8080865B2 (en) 2011-12-20
US20080278255A1 (en) 2008-11-13
TW200901551A (en) 2009-01-01

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