CN101681901A - 射频耦合的数字隔离器 - Google Patents
射频耦合的数字隔离器 Download PDFInfo
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- CN101681901A CN101681901A CN200880015420A CN200880015420A CN101681901A CN 101681901 A CN101681901 A CN 101681901A CN 200880015420 A CN200880015420 A CN 200880015420A CN 200880015420 A CN200880015420 A CN 200880015420A CN 101681901 A CN101681901 A CN 101681901A
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Abstract
一种RF耦合数字隔离器包含彼此电气隔离的第一导线架部分以及第二导线架部分。第一导线架部分包含第一主体与第一指部。第二导线架部分包含第二主体与第二指部。第一主体连接至第一接地,而第二主体则连接至与第一接地电气隔离的第二接地。第一指部与第二指部通过诸如形成数字隔离器封装的塑料模制化合物而彼此电气隔离。当RF信号驱动至第一指部时,第一指部便充当变压器的一次侧,而第二指部则充当变压器的二次侧。第一指部与第二指部彼此基本上平行或者反向平行。
Description
相关申请的交互参照
本申请主张2007年10月23日提交的美国专利申请第11/877,333号的优先权,其是在35U.S.C.119(e)下主张2007年5月11日提交的美国临时申请第60/928,856号以及2007年9月17日提交的美国临时申请第60/973,020号的优先权,其全部引用在此作为参考。
技术领域
本发明的实施例是有关于隔离器,且特别是有关于较佳操作于RF频率下的数字隔离器。
背景技术
就诸多不同因素而言,隔离乃是重要的。例如,在共模噪声成为问题之处,隔离是重要的。在磁场等造成高速数据传输受到干扰之处,隔离同样重要。此外,在两个装置的接地不兼容之处,隔离亦重要。再者,在医学应用上保护病患,隔离则可能有其重要性。这些仅为一些范例,而非限制之意。
已经发展出用以提供隔离的各种不同装置。例如,光隔离器(同样已知为一种光隔离器、光耦合器、或者光MOS)是一种使用相对较短的光学传输路径在一个或多个电路元件(通常为传输器与接收器)之间传送信号并同时保持其电气隔离的装置。然而,光隔离器的缺点是其通常不能操作在数字通讯通常所需的高速之下。此外,由于光隔离器需要一光学传输元件以及一光学检测元件,因此此种装置的尺寸、成本及电力消耗通常会较大于所需的。
为了克服光隔离器诸多的缺陷,已经发展出了数字隔离器。某些数字隔离器是电容耦合的。然而,此种装置通常较大于所需的,及/或与集成电路制造技术不兼容。其它的数字隔离装置结合高速的CMOS以及气芯或磁芯变压器技术,藉以支持高数据速度与低功率。然而,如此的变压器通常是依赖通常会致使变压器尺寸与成本大于所需的绕组。
发明内容
本发明的实施例是有关于RF耦合的数字隔离器、以及提供数字隔离的方法。根据本发明的实施例,一种RF耦合数字隔离器包含彼此电气隔离的第一导线架部分以及第二导线架部分。根据特定的实施例,第一与第二导线架部分乃是一分离导线架的部分。第一导线架部分包含第一主体与第一指部。第二导线架部分包含第二主体与第二指部。第一主体连接至第一接地,而第二主体则连接至与第一接地电气隔离的第二接地。
根据一实施例,第一指部与第二指部通过形成数字隔离器封装的塑料模制化合物而彼此电气隔离。根据一实施例,当射频(RF)信号驱动至第一指部时,第一指部便充当变压器的一次侧,而第二指部则充当变压器的二次侧。在某些实施例中,第一指部与第二指部彼此基本上平行。在其它的实施例中,第一与第二指部彼此基本上反向平行。在某些实施例中,第一与第二指部各个基本上为笔直的。在其它实施例中,第一与第二指部为弯曲的,例如,基本上为螺旋状,然而彼此仍基本上平行或反向平行的。
根据某些实施例,第一管芯被置于第一主体之上,而第二管芯则被置于第二主体之上。第一焊接线将第一管芯连接至第一指部,而第二焊接线则将第二管芯连接至第二指部。根据某些实施例,第一管芯包含一振荡器,产生用来驱动第一指部的RF信号。第二管芯可包含一放大器,在RF信号驱动第一指部时,将第二指部所产生的信号放大。第一管芯同样也可包含一调制器,而第二管芯同样也可包含一解调器。根据第一管芯所提供的一个或多个信号,第一管芯内的调制器便能够控制振荡器。解调器能够将放大器所输出的信号解调,并且能够将已解调后的输出信号提供给第二管芯的输出。
经由以下所提的细节说明、附图以及权利要求书,本发明的其它实施例以及特征、观点与优点将更为明显。
附图说明
图1A阐述根据本发明实施例的一种RF耦合数字隔离器。
图1B阐述根据本发明另一实施例的一种RF耦合数字隔离器。
图1C阐述根据本发明另一实施例的一种RF耦合数字隔离器。
图2为阐述图1A-1C的数字隔离器某些额外细节的高阶电路图,其将图1A-1C某些各不相同的元件以模型将之建立为等效电路组件。
图3为提供图2的图示某些额外细节的高阶电路图,其中乃是使用简单的二进制调制。
图4A阐述根据本发明实施例的一种RF耦合数字隔离器,其能够提供全双工的通讯。
图4B阐述根据本发明另一实施例的一种RF耦合数字隔离器,其同样也能够提供全双工的通讯。
图5阐述一种能够使用本发明的数字隔离器来实现的典型H桥式电路。
具体实施方式
图1A描绘根据本发明实施例的一种RF耦合数字隔离器100(此后简化地称为数字隔离器)。数字隔离器100包含一分离导线架104,包含第一导线架部分104a以及第二导线架部分104b。将导线架部分104a与104b封入一包装材质(例如,塑料)内,藉以形成数字隔离器的封装102。每个导线架部分104a与104b皆能够由诸如印压或蚀刻的铜或者制成薄片的钢合金所制作,但并不受限于此。
每个导线架部分104a与104b皆包含相应的主体110a与110b、以及相应的指部120a与120b。通过封装材质(例如,塑料模制化合物)而彼此隔离的指部120a与120b共同提供一变压器,此同样也可称为一种“指式(finger)变压器”。在此实施例中,当射频(RF)信号驱至指部120a时,指部120a充当变压器的一次侧,而第二指部120b则充当变压器的二次侧。
此外,管芯130a(同样也称为“管芯A”)被置于导线架部分104a的主体110a之上,而管芯130b(同样也称为”管芯B”)则被置于导线架部分104b的主体110b之上。管芯130a可包含一提供传输能力的集成电路,因而同样也可称为一种传输器管芯。管芯130b同样也能够包含一提供接收能力的集成电路,因而同样也可称为一种接收器管芯。同样也可行的是,每个管芯130a与130b都能够提供传输与接收能力,因而可以是一种收发机管芯。此种双向通讯能够是半双工的。
管芯130a同样也包含多个焊接垫,在管芯130a内由小方形所表示。管芯130a的焊接垫是通过由粗体线所表示的焊接线,连接至管芯130a外部的组件。管芯130a的一焊接垫是通过一焊接线132a连接至指部120a。管芯130a的另一焊接垫是通过一接地焊接线连接至主体110a,其依序是通过另一接地焊接线连接至一接地(亦即,Gnd_A)。管芯130a的另一焊接垫接收一输入信号。管芯130a的另一焊接垫接收一用来给予管芯130a电力的电压(Vs_A)。
相似的是,管芯130b包含多个焊接垫,在管芯130b内由小方形所表示,通过由粗体线所表示的焊接线,连接至管芯130b外部的组件。管芯130b的一焊接垫是通过一焊接线132b连接至指部120b。管芯130b的另一焊接垫是通过一接地焊接线连接至主体110b,其依序通过另一焊接线连接至一接地(亦即,Gnd_B)。Gnd_A与Gnd_B彼此电气隔离。管芯130b的另一焊接垫提供一输出信号。管芯130b的又一焊接垫接收用来提供电力给管芯130b的电压(Vs_B)。在管芯130a与130b能够用作收发机的情形中,每个管芯上相同的焊接垫皆能够接收一输入并且提供一输出,或者能够针对每个功能,提供个别的焊接垫。
在图1A中,示出了指部120a与120b为彼此平行的。在图1B所示的另一实施例中,一RF耦合数字隔离器100’包含彼此反向平行的指部120a与120b,使之反相(亦即,180度反相)。当指部彼此平行时,乃至当指部反向平行时,在指部120a与120b之间会有寄生性电容耦合。然而,指部彼此反向平行的益处是在反向平行配置中的寄生性电容耦合会增加信号的转送,这是因磁性与耦合模式之间的关系导致的。相反的是,在平行配置中的寄生性电容耦合将会减低信号的转送。
在图1A与1B中,示出了指部120a与120b是基本上笔直的,然而并不需要是如此的状况,如同能够从图1C所察知的。更特别的是,图1C显示一种RF耦合数字隔离器100”的实施例,其中的指部120a与120b为反向平行的,但指部120a与120b为螺旋形状的,其具有增加相互耦合电感的影响(因而增加其耦合系数)。图1C中的指部120a与120b或可彼此平行。图示(包含图1A-1C)中相似或者共同的参考数字是用来指称相似的组件或元件。
指部120a与120b之间的距离、指部120a与120b的形状、以及指部120a与120b的长度会影响指部之间的寄生电容(C寄生)与耦合系数(K)。指部120a与120b之间典型的距离为10毫英寸,但其它的距离同样也在于本发明范畴之内。
此时将参考图2所说明的是,管芯A(130a)会迫使较佳在GHz范围内的电流进入指部120a,其返回至导线架主体110a并且回到管芯A’的接地焊接线。如上述彼此隔离的指部120a与120b具有磁性耦合以及互感。寄生电容是以虚线电容器描绘于图2,标示为C寄生。耦合系数以“K”描绘于图2,其指示在两指部120a与120b之间会存在一耦合系数(另一种说法为在两指部120a与120b之间会有互感)。该转换有利地随着频率而增加。所以,需要高操作频率。操作频率较佳位于手机与蓝芽装置所指定的频谱之外。更特别的是,期望本发明的数字耦合器的操作频率大于或者小于2.4GHz。在特定实施例中,操作为额定约3GHz。
参照图2的电路图,其提供管芯130a与130b某些额外的细节,而且由于电感特性,故将各不相同的焊接线显示为电感器。此外,在图2中,同样也因电感特性,每个指部120a与120b同样也显示为电感器。同样也显示管芯130a包含一振荡器220以及一调制器210。根据特定的实施例,振荡器220会产生一约3GHz与约3毫安的峰对峰值(mApp)的振荡信号,然而较低或较高频率、及/或较低或较高振幅同样也是可行的,并且在于本发明的范畴之内。调制器210会接收一条或者多条输入信号线,其指示调制器210如何控制振荡器220。在简单的二进制调制(同样也已知为“开/关调制”)使用之处,调制器210可以如缓冲器一般简单,如图3的310所显示的。任何一种已知或者未来将要发展的其它技术都能替换使用,包含而不受限于振幅调制、正交调制等等。调制器210可以是一种数字或者模拟的调制器,而要由调制器210所调制的信号亦能够是一种数字或者模拟的信号。更特别的是,在一实施例中,管芯130a的控制输入端上所接收到的信号可以是一种模拟信号,在此状况下,在管芯130b的隔离输出端上,则会输出一模拟信号。在另一实施例中,管芯130a的控制输入端上所接收到的信号能够是一种数字信号,在此状况下,在管芯130b的隔离输出端上,则会输出一数字信号。所以,本发明实施例的RF耦合数字隔离器能够用来将模拟或者数字信号从电路的其中一部份传输至电路的另一部份。
返回到图2的电路图,示出了管芯130b包含一RF放大器230以及一解调器240。RF放大器230会将指部120b所接收到的信号放大,并且提供已放大后的信号给予解调器240。所使用的解调器的型式应该相应于调制器210所提供的调制的型式。例如,在使用简单的二进制调制之处,解调器240可包含一位于比较器340之前的整流器330,如图3所示。图3同样也描绘整流器330能够包含一个二极管D1以及一个电容器CR,但并不受限于此。
再次回到图2,每个管芯130a与130b同样也任选地包含一调谐电容器,标示为CA与CB,用来调谐每个管芯电路的谐振。指部120a与120b之间的寄生电容(C寄生)、互感(M)、以及耦合系数(K)同样也会影响谐振。所以,可选择指部120a与120b的尺寸、其间的距离、以及每个管芯130a与130b的电路组件(包含调谐电容器CA与CB的数值),藉以提供所需的谐振。
仍参照图2,供给管芯A(130a)的输入信号会致使振荡器200振荡,并且提供一RF信号给予指式变压器。更特别的是,通过焊接线132a,从振荡器220提供一振荡信号给予指式变压器120a。提供给予指部120a的振荡电流(及/或电压)会在第二指部120b上产生一振荡电流(及/或电压),通过放大器230将之放大。通过解调器240,对放大器230的输出进行解调。
根据本发明的特定实施例,假定一来自管芯A(130a)的3GHz振荡频率与约3mApp的驱动信号,指式变压器的输出便能够取得约45毫伏峰对峰值(mVpp)。假定在每个管芯130a与130b上约3的Q值,则当与电容器CA和CB谐振时,便能够取得约400mVpp。
如以上所述,图2所示的电路能够用于信号单向的传输,例如从管芯A至管芯B,或者用于双向的半双工通讯。为了提供双向半双工的通讯,管芯A同样也能够包含一RF放大器以及一解调器,而管芯B同样也能够包含一振荡器以及一调制器。或者,同样也能够将一类似于管芯B的管芯被置于导线架部分104a的主体110a之上,而同样也能够将一类似于管芯A的管芯被置于导线架部分104b的主体110b之上。换言之,每个导线架部分110a与110b皆能够包含一用来传输信号的管芯、以及一用来接收信号的另一管芯、或者一能够用于传输与接收信号两者的共享管芯。
在使用半双工的通讯的情形中,每个导线架部分104a与104b仅需要包含一个指部。例如,参照图1A-1C,能够使用指部120a来传输信号以及接收信号,只要传输与接收是发生在不同的时间点上即可,如同半双工通讯的例子。
或者,每个导线架部分104a与104b能够具有一额外的指部,如图4A与4B所示。参照图4A与4B,其显示导线架部分104a同样也具有一指部420a,而且显示导线架部分104b同样也具有一指部420b,彼此通过封装材质(例如,塑料模制化合物)而彼此隔离的额外指部420a与420b共同提供一第二变压器,其同样也可称为第二“指式变压器”。图4A与4B彼此并不相同,其中图4A形成指式变压器的每对指部彼此平行,而图4B形成指式变压器的每对指部则彼此反向平行。尽管显示图4A与4B中的指部基本上为笔直的,但并不需要是如此状况,如同从以上所探讨的图1C所能够察知的。在图4A与4B的实施例中,当通过RF信号驱动指部120a与420b之时,指部120a与120b分别充当第一指式变压器的一次侧与二次侧,而指部420b与420a则分别充当第二指式变压器的一次侧与二次侧。
参照图4A与4B的数字隔离器400与400’,指部120a能够专用于传输信号,而指部420a能够专用于接收信号,反之亦然。同样的是,指部120b能够专用于接收信号,而指部420b能够专用于传输信号,反之亦然。以此种方式,便能够提供全双工的通讯。
图4A与4B同样也显示两个被置于导线架部分104a之上的管芯130a与430a、以及两个被置于导线架部分104b之上的管芯130b与430b。在每个导线架部分之上的其中一个管芯能够用来产生用以驱动指部的信号,以为传输的用(例如,包含执行调制),而导线架部分上的另一个管芯则能够用来诸如放大与解调所接收到的信号。或者,每个导线架部分上所示的管芯能够组合,致使每个导线架部分具有被置于其上而用于接收与传输两种功能的单一管芯。同样也在于本发明范畴内的是,增加一个或多个额外的指部至每个导线架部分。同样的是,可增加一个或多个额外的导线架部分,以及使用超过两个的导线架部分,致使存在更多的隔离区域。例如,图4A与4B所示的每个导线架部分能够分离成为两个导线架部分,产生四个导线架部分,每个皆具有一个指部。再者,同样也要强调的是,导线架部分并不需要彼此对称,亦即同样也能够使用非对称的布局。
在某些实施例中,能够以陶瓷封装来形成数字隔离器,诸如而不受限于一种密封的陶瓷封装。如此的陶瓷封装同样也能够包含一导线架,嵌入于陶瓷顶部与底部封底之间的糊浆层中。换言的,能够将包含相应指部120与主体110的导线架部分104a与104b嵌入于陶瓷层之间。管芯(例如,130a与130b)能够连接至一陶瓷层,其可以是也可以不是指部120形成于其上的相同一层。在如此的实施例中,空气或者某些其它的气体能够提供指部对之间的隔离。同样也可使用任何一种技术,例如而不受限于化学气相沈积、溅镀、蚀刻、照相微影、屏蔽等等,将主体(例如,110a与110b)以及指部(例如,120a与120b)直接形成于陶瓷层之上。管芯(例如,130a与130b)能够连接至此层,其可以是也可以不是指部120形成于其上的相同一层。再者,空气或者某些气体能够提供指部对之间的电气隔离。在另一实施例中,能够将数字隔离器形成如同一种混合集成电路。例如,能够将主体(例如,110a与110b)以及指部(例如,120a与120b)形成于管芯(例如,130a与130b)所附着的印刷电路板上。在如此的实施例中,模制化合物能够提供指部之间的电气隔离与机械支撑。在以上才解释过的可替代实施例中,能够使用导电性轨迹及/或贯孔来替代将管芯连接至指部的焊接线,或者仍能使用焊接线。
本发明某些实施例的优点为通过使用典型芯片装配处理中有效用的分离导线架与塑料模制化合物来产生一变压器,便能够提供一种数字隔离器。本发明某些实施例的优点为不需要任何绕组来提供数字隔离器的变压器,降低所产生的数字隔离器的尺寸与成本而能合乎所求。本发明某些实施例的另一优点为以上所探讨的设计在高于手机与蓝芽频谱的频率下仍能正常工作,而且倘若经由适当调谐,如此的实施例同样也能够在本质上拒斥手机与蓝芽频谱内的频率。
本发明的RF耦合数字隔离器能够使用于多种不同的应用中。例如,RF耦合数字隔离器能够使用于电力H桥式中,例如电源供应器或者马达控制器,如同图5所示的。H桥式的其它体现同样也是可行的,此并且在于本发明的范畴之内。
此外,能够使用RF耦合数字隔离器,以与切换式功率晶体管以及电力线通讯交连。再者,本发明的RF耦合数字隔离器能够使用于长距离的通讯(例如,RS485)。本发明的RF耦合数字隔离器特别有用于50W或者更大的电力切换。本发明的RF耦合数字隔离器同样也能够使用来减短DC对DC转换器的停滞时间(dead time)至诸如10奈秒。此仅为本发明的数字隔离器的一些应用,并无限制之意。
前述的说明是本发明的较佳实施例。已经针对阐述与说明的目的提供了这些实施例,然而并不意指其为穷尽的,或者并不意指其限制本发明于所揭示的精确型式。对熟习该项技术者而言,诸多修改与变更乃是明显的。选择与说明该实施例乃是为最佳说明本发明的原理与其实际应用,藉此致使熟知该项技术者能够了解本发明。意思是通过以下的权利要求书及其等效者来界定本发明的范畴。
Claims (21)
1.一种RF耦合数字隔离器,其包含:
第一导线架部分,其包含第一主体与第一指部;
第二导线架部分,其包含第二主体与第二指部,该第二导线架部分与第一导线架部分电气隔离;
该第一主体连接至第一接地;
该第二主体连接至与该第一接地电气隔离的第二接地;
第一管芯,其被置于该第一主体之上;以及
第二管芯,其被置于该第二主体之上;
其中第一指部与第二指部彼此电气隔离;以及
其中当一RF信号驱动至该第一指部时,该第一指部便充当变压器的一次侧,而该第二指部则充当变压器的二次侧。
2.如权利要求1所述的RF耦合数字隔离器,其中通过用于形成数字隔离器封装的塑料模制化合物,该第一指部与第二指部彼此电气隔离。
3.如权利要求1所述的RF耦合数字隔离器,其进一步包含:
第一焊接线,将该第一管芯连接至第一指部;以及
第二焊接线,将该第二管芯连接至第二指部。
4.如权利要求1所述的RF耦合数字隔离器,其中,第一与第二导线架部分是一分离导线架的部分。
5.如权利要求1所述的RF耦合数字隔离器,其中,第一指部与第二指部彼此基本上平行。
6.如权利要求5所述的RF耦合数字隔离器,其中,第一指部与第二指部每个皆是基本上笔直的。
7.如权利要求5所述的RF耦合数字隔离器,其中,第一指部与第二指部每个皆是弯曲的。
8.如权利要求7所述的RF耦合数字隔离器,其中,第一指部与第二指部是基本上螺旋状的。
9.如权利要求1所述的RF耦合数字隔离器,其中,第一指部与第二指部彼此基本上反向平行。
10.如权利要求9所述的RF耦合数字隔离器,其中,第一指部与第二指部每个皆是笔直的。
11.如权利要求9所述的RF耦合数字隔离器,其中,第一指部与第二指部每个皆是弯曲的。
12.如权利要求11所述的RF耦合数字隔离器,其中,第一指部与第二指部是基本上螺旋状的。
13.如权利要求1所述的RF耦合数字隔离器,其进一步包含:
振荡器,其位于产生RF信号的第一管芯之内;
第一焊接线,其将该第一管芯连接至第一指部,并且将来自第一管芯的RF信号提供给第一指部;
第二焊接线,其将该第二指部连接至第二管芯;以及
放大器,其位于该第二管芯之内,当该RF信号驱动第一指部时,将第二指部所产生的信号放大。
14.如权利要求13所述的RF耦合数字隔离器,其进一步包含:
调制器,其位于该第一管芯之内;以及
解调器,其位于该第二管芯之内;
其中根据提供给第一管芯的一个或多个信号,该调制器控制着振荡器;以及
其中,解调器将放大器所输出的信号解调,并且将已解调后的输出信号提供给该第二管芯的输出端。
15.一种RF耦合数字隔离器,其包含:
一分离导线架,其包含彼此电气隔离的第一导线架部分与第二导线架部分;
该第一导线架部分包含第一指部;以及
该第二导线架部分包含第二指部;
其中,第一与第二指部具有一互感,所述互感能使一个指部中的电压及/或电流变化被另一个指部检测到。
16.如权利要求15所述的RF耦合数字隔离器,其中:
该第一导线架部分包含第一主体,该第一指部则是从该第一主体延伸;
该第二导线架部分包含第二主体,该第二指部则是从该第二主体延伸;以及
其中当这些指部中的一个指部被一RF信号所驱动时,被驱动的指部充当变压器的一次侧,而另一指部则充当变压器的二次侧。
17.如权利要求16所述的RF耦合数字隔离器,其进一步包含:
第一管芯,其被置于该第一主体之上;
第二管芯,其被置于该第二主体之上;
第一焊接线,其将第一管芯连接至第一指部;
第二焊接线,其将第二管芯连接至第二指部;以及
位于该第一与第二指部之间的塑料模制化合物,用以提供指部之间的电气隔离。
18.如权利要求17所述的RF耦合数字隔离器,其中:
该第一主体连接至第一接地;以及
该第二主体连接至与第一接地电气隔离的第二接地。
19.一种提供数字隔离的方法,其包含:
以一RF信号来驱动第一导线架的第一指部;以及
由于该第一指部被RF信号所驱动以及第一与第二指部之间的互感,检测第二导线架的第二指部上的信号,
其中该第一与第二指部彼此电气隔离。
20.如权利要求19所述的方法,其进一步包含:
接收一输入信号;
根据该输入信号执行调制,以产生用于驱动该第一指部的RF信号;以及
解调该第二指部上所检测到的信号、或者该信号已放大后的版本,以产生一输出信号。
21.一种系统,其包含:
一电路的第一部份;
该电路的第二部分;以及
一数字隔离器,其位于该电路的第一与第二部分之间;
其中所述数字隔离器包含:
第一导线架部分,其包含第一主体与第一指部;
第二导线架部分,其包含第二主体与第二指部,该第二导线架部分与第一导线架部分电气隔离;
该第一主体连接至第一接地;
该第二主体连接至与第一接地电气隔离的第二接地;
第一管芯,其被置于该第一主体之上;以及
第二管芯,其被置于该第二主体之上;
其中该第一指部与第二指部彼此电气隔离;以及
其中当一RF信号驱动至该第一指部时,该第一指部便充当变压器的一次侧,而该第二指部则充当变压器的二次侧。
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US60/973,020 | 2007-09-17 | ||
US11/877,333 US7468547B2 (en) | 2007-05-11 | 2007-10-23 | RF-coupled digital isolator |
US11/877,333 | 2007-10-23 | ||
PCT/US2008/057909 WO2008140861A1 (en) | 2007-05-11 | 2008-03-21 | Rf - coupled digital isolator |
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CN101681901A true CN101681901A (zh) | 2010-03-24 |
CN101681901B CN101681901B (zh) | 2011-07-27 |
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US (2) | US7468547B2 (zh) |
CN (1) | CN101681901B (zh) |
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TWI460919B (zh) | 2014-11-11 |
US8080865B2 (en) | 2011-12-20 |
US20080278256A1 (en) | 2008-11-13 |
US20080278255A1 (en) | 2008-11-13 |
WO2008140861A1 (en) | 2008-11-20 |
CN101681901B (zh) | 2011-07-27 |
US7468547B2 (en) | 2008-12-23 |
TW200901551A (en) | 2009-01-01 |
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