TWI456744B - 攝像基板之加工方法 - Google Patents

攝像基板之加工方法 Download PDF

Info

Publication number
TWI456744B
TWI456744B TW098139112A TW98139112A TWI456744B TW I456744 B TWI456744 B TW I456744B TW 098139112 A TW098139112 A TW 098139112A TW 98139112 A TW98139112 A TW 98139112A TW I456744 B TWI456744 B TW I456744B
Authority
TW
Taiwan
Prior art keywords
substrate
soluble resin
layer
polishing
cover glass
Prior art date
Application number
TW098139112A
Other languages
English (en)
Other versions
TW201030955A (en
Inventor
Nobuyuki Takada
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201030955A publication Critical patent/TW201030955A/zh
Application granted granted Critical
Publication of TWI456744B publication Critical patent/TWI456744B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Claims (2)

  1. 一種攝像基板之加工方法，係於蓋玻璃基板層積形成有元件層之元件基板者，其特徵在於，具有：溶解性樹脂層形成步驟，係於前述蓋玻璃基板之表面以可以洗淨液溶解之樹脂形成溶解性樹脂層者；吸附步驟，係於該溶解性樹脂層形成步驟後，將前述溶解性樹脂層吸附至研磨台者；研磨步驟，係於該吸附步驟後，將前述元件基板研磨者；及洗淨步驟，係於該研磨步驟後，在使前述元件基板之被研磨面與前述蓋玻璃基板之表面露出之狀態下，將前述洗淨液供給至前述元件基板之被研磨面與前述蓋玻璃基板之表面而洗淨者。
  2. 如申請專利範圍第1項之攝像基板之加工方法，其具有：層積步驟，係於前述洗淨步驟後，於前述攝像基板之前述元件層上層積形成有另一元件層之新元件基板者；於該層積步驟後，依序反覆進行前述溶解性樹脂層形成步驟、前述吸附步驟、前述研磨步驟及前述洗淨步驟。
TW098139112A 2009-01-07 2009-11-18 攝像基板之加工方法 TWI456744B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009001759A JP2010161163A (ja) 2009-01-07 2009-01-07 撮像基板の加工方法

Publications (2)

Publication Number Publication Date
TW201030955A TW201030955A (en) 2010-08-16
TWI456744B true TWI456744B (zh) 2014-10-11

Family

ID=42578147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098139112A TWI456744B (zh) 2009-01-07 2009-11-18 攝像基板之加工方法

Country Status (3)

Country Link
JP (1) JP2010161163A (zh)
KR (1) KR20100081924A (zh)
TW (1) TWI456744B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200411755A (en) * 2002-11-01 2004-07-01 Disco Corp Method of processing a semiconductor wafer
TW200729371A (en) * 2005-12-21 2007-08-01 Sanyo Electric Co Semiconductor device and manufacturing method of the same, camera module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148452A (ja) * 1994-11-15 1996-06-07 Sony Corp 基板表面保護テープ及び基板裏面研削方法
JP4797677B2 (ja) * 2006-02-14 2011-10-19 旭硝子株式会社 マルチチップ素子とその製造方法
JP4825538B2 (ja) * 2006-02-17 2011-11-30 富士通セミコンダクター株式会社 半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200411755A (en) * 2002-11-01 2004-07-01 Disco Corp Method of processing a semiconductor wafer
TW200729371A (en) * 2005-12-21 2007-08-01 Sanyo Electric Co Semiconductor device and manufacturing method of the same, camera module

Also Published As

Publication number Publication date
JP2010161163A (ja) 2010-07-22
TW201030955A (en) 2010-08-16
KR20100081924A (ko) 2010-07-15

Similar Documents

Publication Publication Date Title
JP2016508106A5 (zh)
JP2012151312A5 (zh)
JP2010538468A5 (zh)
WO2010132371A3 (en) Multi-stage substrate cleaning method and apparatus
JP2014107313A5 (zh)
JP2010525128A5 (zh)
EP1930938A4 (en) POLISHING AGENT, METHOD FOR POLISHING A POLISHED SURFACE AND METHOD FOR PRODUCING AN INTEGRATED SEMICONDUCTOR CIRCUIT ARRANGEMENT
JP2010245412A5 (zh)
WO2010120956A3 (en) Wafer manufacturing cleaning apparatus, process and method of use
TW200740536A (en) Method and apparatus for cleaning a semiconductor substrate
JP2007123859A5 (zh)
JP2016056220A5 (zh)
TW200903607A (en) Sticking device, method for preventing adhesive from dissolving, and method for sticking
JP2013089720A5 (zh)
JP2010245396A5 (zh)
TWI456744B (zh) 攝像基板之加工方法
JP2009194374A5 (ja) Ｓｏｉ基板の作製方法
JP2011245364A5 (zh)
JP2009300735A5 (zh)
JP2008291958A5 (zh)
JP2016195185A5 (zh)
JP4308832B2 (ja) 基板洗浄装置および基板洗浄方法
JP2006016684A5 (zh)
JP2013197425A5 (zh)
SG194481A1 (en) Method of forming non-planar membranes using cmp