JP2016056220A5 - - Google Patents

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Publication number
JP2016056220A5
JP2016056220A5 JP2014181015A JP2014181015A JP2016056220A5 JP 2016056220 A5 JP2016056220 A5 JP 2016056220A5 JP 2014181015 A JP2014181015 A JP 2014181015A JP 2014181015 A JP2014181015 A JP 2014181015A JP 2016056220 A5 JP2016056220 A5 JP 2016056220A5
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JP
Japan
Prior art keywords
water
soluble polymer
slurry composition
composition according
polymer
Prior art date
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Application number
JP2014181015A
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English (en)
Japanese (ja)
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JP2016056220A (ja
JP6559936B2 (ja
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Application filed filed Critical
Priority claimed from JP2014181015A external-priority patent/JP6559936B2/ja
Priority to JP2014181015A priority Critical patent/JP6559936B2/ja
Priority to CN201580047704.7A priority patent/CN107075309B/zh
Priority to TW104129403A priority patent/TWI633178B/zh
Priority to PCT/JP2015/004504 priority patent/WO2016035346A1/en
Priority to KR1020177008862A priority patent/KR102524838B1/ko
Publication of JP2016056220A publication Critical patent/JP2016056220A/ja
Publication of JP2016056220A5 publication Critical patent/JP2016056220A5/ja
Publication of JP6559936B2 publication Critical patent/JP6559936B2/ja
Application granted granted Critical
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JP2014181015A 2014-09-05 2014-09-05 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法 Active JP6559936B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014181015A JP6559936B2 (ja) 2014-09-05 2014-09-05 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法
KR1020177008862A KR102524838B1 (ko) 2014-09-05 2015-09-04 슬러리 조성물, 린스 조성물, 기판 연마 방법 및 린스 방법
TW104129403A TWI633178B (zh) 2014-09-05 2015-09-04 漿液組合物、清洗組合物、基板拋光方法及清洗方法
PCT/JP2015/004504 WO2016035346A1 (en) 2014-09-05 2015-09-04 Slurry composition, rinse composition, substrate polishing method and rinsing method
CN201580047704.7A CN107075309B (zh) 2014-09-05 2015-09-04 浆料组合物、漂洗组合物、基板抛光方法以及漂洗方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014181015A JP6559936B2 (ja) 2014-09-05 2014-09-05 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法

Publications (3)

Publication Number Publication Date
JP2016056220A JP2016056220A (ja) 2016-04-21
JP2016056220A5 true JP2016056220A5 (zh) 2017-10-19
JP6559936B2 JP6559936B2 (ja) 2019-08-14

Family

ID=54197031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014181015A Active JP6559936B2 (ja) 2014-09-05 2014-09-05 スラリー組成物、リンス組成物、基板研磨方法およびリンス方法

Country Status (5)

Country Link
JP (1) JP6559936B2 (zh)
KR (1) KR102524838B1 (zh)
CN (1) CN107075309B (zh)
TW (1) TWI633178B (zh)
WO (1) WO2016035346A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6801964B2 (ja) * 2016-01-19 2020-12-16 株式会社フジミインコーポレーテッド 研磨用組成物及びシリコン基板の研磨方法
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
EP3508550A4 (en) * 2016-08-31 2020-03-25 Fujimi Incorporated POLISHING COMPOSITION AND POLISHING COMPOSITION SET
JP6495230B2 (ja) * 2016-12-22 2019-04-03 花王株式会社 シリコンウェーハ用リンス剤組成物
CN110023449B (zh) * 2016-12-28 2021-08-17 霓达杜邦股份有限公司 研磨用组合物和研磨方法
KR20190098142A (ko) * 2016-12-28 2019-08-21 니타 하스 인코포레이티드 연마용 조성물
WO2019187969A1 (ja) * 2018-03-30 2019-10-03 株式会社フジミインコーポレーテッド 研磨用組成物
JP7361467B2 (ja) * 2018-12-25 2023-10-16 ニッタ・デュポン株式会社 研磨用組成物
JP2020203980A (ja) * 2019-06-17 2020-12-24 日本キャボット・マイクロエレクトロニクス株式会社 化学機械研磨組成物、リンス組成物、化学機械研磨方法及びリンス方法
CN112457930A (zh) * 2019-09-06 2021-03-09 福吉米株式会社 表面处理组合物、表面处理组合物的制造方法、表面处理方法和半导体基板的制造方法
CN115873508A (zh) * 2022-12-26 2023-03-31 博力思(天津)电子科技有限公司 去除速率高且表面粗糙度低的SiC衬底抛光液及抛光工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11140427A (ja) * 1997-11-13 1999-05-25 Kobe Steel Ltd 研磨液および研磨方法
US6503418B2 (en) * 1999-11-04 2003-01-07 Advanced Micro Devices, Inc. Ta barrier slurry containing an organic additive
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP2006005246A (ja) * 2004-06-18 2006-01-05 Fujimi Inc リンス用組成物及びそれを用いたリンス方法
KR20130041084A (ko) * 2010-06-18 2013-04-24 히타치가세이가부시끼가이샤 반도체 기판용 연마액 및 반도체 웨이퍼의 제조 방법
KR101970858B1 (ko) * 2012-03-14 2019-04-19 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 반도체 기판의 제조 방법
EP2858096B1 (en) * 2012-05-25 2017-01-11 Nissan Chemical Industries, Ltd. Polishing solution composition for wafers
JP2014038906A (ja) * 2012-08-13 2014-02-27 Fujimi Inc 研磨用組成物、当該研磨用組成物の製造方法、及び当該研磨用組成物を用いた半導体基板の製造方法
JP5893706B2 (ja) * 2013-10-25 2016-03-23 花王株式会社 シリコンウェーハ用研磨液組成物

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