TWI456706B - 矽穿孔自我繞線電路及其繞線方法 - Google Patents

矽穿孔自我繞線電路及其繞線方法 Download PDF

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Publication number
TWI456706B
TWI456706B TW101139290A TW101139290A TWI456706B TW I456706 B TWI456706 B TW I456706B TW 101139290 A TW101139290 A TW 101139290A TW 101139290 A TW101139290 A TW 101139290A TW I456706 B TWI456706 B TW I456706B
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TW
Taiwan
Prior art keywords
self
built
circuit
turns
puncturing
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TW101139290A
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English (en)
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TW201417219A (zh
Inventor
Tsungchu Huang
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Univ Nat Changhua Education
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Priority to TW101139290A priority Critical patent/TWI456706B/zh
Priority to US13/845,059 priority patent/US8754704B2/en
Publication of TW201417219A publication Critical patent/TW201417219A/zh
Application granted granted Critical
Publication of TWI456706B publication Critical patent/TWI456706B/zh

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3187—Built-in tests
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/31813—Test pattern generators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)

Claims (7)

  1. 一種矽穿孔自我繞線電路，包含：複數矽穿孔；以及複數平面晶片層，藉由該些矽穿孔連接，各該平面晶片層包含：一內建自我測試電路，具有複數有效位元引線及複數矽穿孔引線連接該些矽穿孔；一內建自我繞線交換網路，連接該內建自我測試電路，藉以選擇導通之該些矽穿孔；及一核心電路，具有複數輸出入引線連接該內建自我繞線交換網路。
  2. 如請求項1之矽穿孔自我繞線電路，該內建自我測試電路包含：一第一多工器，其連接其中一該矽穿孔及其中一該矽穿孔引線；一第二多工器，其連接該第一多工器；一第一正反器，其連接該第二多工器；一反互斥或閘，其連接該第一正反器；以及一第二正反器，其連接該反互斥或閘及其中一該有效位元引線。
  3. 如請求項1之矽穿孔自我繞線電路，其中該內建自我繞線交換網路更包含：一交換網路元件，包含：一及閘，其連接其中一該有效位元引線； 一開關，其連接該及閘、其中一該矽穿孔引線及其中一該輸出入引線；以及一或閘，其連接該開關及該及閘。
  4. 如請求項3之矽穿孔自我繞線電路，該交換網路元件係呈一迭代式邏輯陣列。
  5. 一種繞線方法，該繞線方法應用於請求項1之矽穿孔自我繞線電路，依序包含：決定該核心電路之一優先權；令該內建自我測試電路判斷該些矽穿孔；令該內建自我測試電路產生相對於導通該些矽穿孔之複數有效位元；以及令該內建自我繞線網路選擇無錯誤之該些矽穿孔，並予以連結導通該核心電路。
  6. 如請求項5之繞線方法，其中令該內建自我測試電路判斷該些矽穿孔之步驟更包含：選擇對應該矽穿孔之該矽穿孔引線；儲存通過一待測矽穿孔訊號；及比較該待測矽穿孔訊號。
  7. 如請求項5之繞線方法，其中令該內建自我繞線網路選擇無錯誤之該些矽穿孔，並予以連結導通之步驟包含：比較該有效位元； 決定該矽穿孔是否導通；及輸出已連結訊號。
TW101139290A 2012-10-24 2012-10-24 矽穿孔自我繞線電路及其繞線方法 TWI456706B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101139290A TWI456706B (zh) 2012-10-24 2012-10-24 矽穿孔自我繞線電路及其繞線方法
US13/845,059 US8754704B2 (en) 2012-10-24 2013-03-17 Through-silicon via self-routing circuit and routing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101139290A TWI456706B (zh) 2012-10-24 2012-10-24 矽穿孔自我繞線電路及其繞線方法

Publications (2)

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TW201417219A TW201417219A (zh) 2014-05-01
TWI456706B true TWI456706B (zh) 2014-10-11

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TW101139290A TWI456706B (zh) 2012-10-24 2012-10-24 矽穿孔自我繞線電路及其繞線方法

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US (1) US8754704B2 (zh)
TW (1) TWI456706B (zh)

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US10209298B2 (en) 2016-05-24 2019-02-19 National Central University Delay measurement circuit and measuring method thereof

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WO2014146264A1 (zh) * 2013-03-20 2014-09-25 华为终端有限公司 电容式开关、信号收发装置及制造方法
KR102125340B1 (ko) * 2014-06-19 2020-06-23 삼성전자주식회사 신호 전달을 위한 주 경로 및 우회 경로를 갖는 집적 회로 및 그것을 포함하는 집적 회로 패키지
US9496154B2 (en) 2014-09-16 2016-11-15 Invensas Corporation Use of underfill tape in microelectronic components, and microelectronic components with cavities coupled to through-substrate vias
US9869713B2 (en) 2015-03-05 2018-01-16 Qualcomm Incorporated Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems
US9401312B1 (en) * 2015-06-11 2016-07-26 Globalfoundries Inc. TSV redundancy scheme and architecture using decoder/encoder
US9588174B1 (en) * 2016-03-08 2017-03-07 International Business Machines Corporation Method for testing through silicon vias in 3D integrated circuits
US9871020B1 (en) 2016-07-14 2018-01-16 Globalfoundries Inc. Through silicon via sharing in a 3D integrated circuit
US11862736B2 (en) 2018-09-17 2024-01-02 GBT Tokenize Corp. Multi-dimensional photonic integrated circuits and memory structure having optical components mounted on multiple planes of a multi-dimensional package
US10854763B2 (en) * 2018-09-17 2020-12-01 Gbt Technologies Inc. Multi-dimensional integrated circuit having multiple planes and memory architecture having a honeycomb or bee hive structure
WO2020083284A1 (en) * 2018-10-22 2020-04-30 Changxin Memory Technologies, Inc. Through-silicon via crack detecting apparatus, detecting method, and semiconductor device fabrication method having the same
US11809797B1 (en) 2022-07-31 2023-11-07 Gbt Technologies Inc. Systems and methods of predictive manufacturing of three-dimensional, multi-planar semiconductors

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Publication number Priority date Publication date Assignee Title
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Publication number Publication date
US8754704B2 (en) 2014-06-17
TW201417219A (zh) 2014-05-01
US20140111269A1 (en) 2014-04-24

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