TWI449745B - 接合膠片及其所用之樹脂 - Google Patents

接合膠片及其所用之樹脂 Download PDF

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TWI449745B
TWI449745B TW97150102A TW97150102A TWI449745B TW I449745 B TWI449745 B TW I449745B TW 97150102 A TW97150102 A TW 97150102A TW 97150102 A TW97150102 A TW 97150102A TW I449745 B TWI449745 B TW I449745B
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weight
resin composition
parts
resin
epoxy resin
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TW97150102A
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TW201024369A (en
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Bin Jian
Laitu Liu
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Iteq Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Description

接合膠片及其所用之樹脂
本發明是有關於一種接合膠片及其所用之樹脂，且特別是有關於一種多層基板疊合之接合膠片及其所用之樹脂。
隨著科技的進步，並因應各式電子產品的設計、發展與應用，所需的電路板結構越趨複雜，因此常有多層電路板疊合之設計，如印表機列印頭、摺疊手機、手提電腦等。多層電路板常由不同特性的電路板疊合而成。
一般而官，電路板所使用的基板可區分為軟性基板(簡稱軟板)與硬性基板(簡稱硬板)。軟板多以聚亞醯胺(polyimide,PI)、聚對苯二甲酸乙二酯(Poly(ethylene Terephthalate),PET)、聚萘二甲酸乙二醇酯(poly(ethylene 2,6－naphthalate),PEN)或含掺橡膠樹脂等材料所製成，而硬板則多以環氧樹脂所製作而成。
由於各種軟硬板在材質上的差異，為使兩種不同特性的軟硬板有良好的接合效果，目前多為以黏合膠片作為界面，再進一步利用熱壓合方式使軟硬板相互貼合。然而，在熱壓合過程中，黏合膠片常會有溢膠現象，且隨著電子產品的尺寸越來越小，溢膠現象往往使得高密度之電路板的可靠性受到影響。根據電子電路互聯與封裝協會(The Institute for Interconnecting and Packing Electronic Circuits, IPC)之IPC－6013 3.3.1.3規範，軟硬板過度區之溢膠限制需小於1.5公釐(millimeter,mm)，才能滿足加工及可靠性要求。
因此本發明的目的就是在提供一種樹脂組成物，用於含浸製程中以製造接合膠片，且此樹脂組成物於基板接合之熱壓合製程中，溢膠範圍小於1.5 mm。
根據本發明之上述目的，提出一種樹脂組成物，包含含溴環氧樹脂、經胺基甲酸酯改質之共聚酯、硬化劑與溶劑，其中含溴環氧樹脂為100重量份，共聚酯為5~15重量份，硬化劑為2.5~45重量份，而溶劑為40~70重量份。
本發明的另一目的是在提供一種接合膠片，於基板接合之熱壓合製程中，接合膠片之溢膠範圍小於1.5 mm。
根據本發明之上述目的，提出一種接合膠片，包含玻璃纖維布，其上分佈有樹脂層。其中樹脂層包含樹脂組成物，而樹脂組成物包含含溴環氧樹脂、經胺基甲酸酯改質之共聚酯、硬化劑與溶劑，其中含溴環氧樹脂為100重量份，共聚酯為5~15重量份，硬化劑為2.5~45重量份，而溶劑為40~70重量份。
本發明的又一目的是在提供一種以接合膠片接合多層基板之印刷電路板結構，且於基板接合之熱壓合製程中，接合膠片之溢膠範圍小於1.5 mm。
根據本發明之上述目的，提出一種印刷電路板，包含 第一基板、第二基板與接合膠片。其中接合膠片位於第一基板與第二基板間，以接合第一基板與第二基板。接合膠片包含玻璃纖維布，其上分佈有樹脂層。其中樹脂層包含樹脂組成物，而樹脂組成物包含含溴環氧樹脂、經胺基甲酸酯改質之共聚酯、硬化劑與溶劑，其中含溴環氧樹脂為100重量份，共聚酯為5~15重量份，硬化劑為2.5~45重量份，而溶劑為40~70重量份。
目前多以環氧樹脂為主材料之含浸樹脂製作黏合膠片，並以此黏合膠片作為軟硬板之接合界面。而為了減少溢膠現象，會於含浸樹脂中添加具橡膠成分或經橡膠改質之環氧樹脂。其中，具橡膠成分或經橡膠改質之環氧樹脂與未改質之主環氧樹脂的重量比值需大於0.3，才能夠改變未經改質之主環氧樹脂的流動性而減少溢膠現象，但也因此造成以此含浸樹脂含浸製作出之黏合膠片的熱安定性變差且膨脹特性改變，造成軟硬板黏合之熱壓合過程容易產生軟硬板之變形。
此外，具橡膠成分或經橡膠改質之環氧樹脂與主環氧樹脂所用之溶劑特性間往往具有明顯的極性差異，因此調和不易。若只使用環氧樹脂所用之溶劑來調和的話，則具橡膠成分或經橡膠改質之環氧樹脂需要以大量溶劑稀釋後，才能與主環氧樹脂進行調和使用。
另外，目前也有以製作軟板的胺基甲酸酯高分子聚合 物製作樹脂，所製作之樹脂黏度高可以塗覆於軟板。然而，由於胺基甲酸酯高分子聚合物之特性，無法直接調製為低黏度之樹脂膠液，使其利於以含浸方式製作黏合膠片，須混摻環氧樹脂才可製成含浸樹脂。由於胺基甲酸酯高分子聚合物與環氧樹脂溶劑之間極性的差異，若只使用環氧樹脂所用之溶劑來調和的話，胺基甲酸酯高分子聚合物也需經過大量溶劑稀釋才能與環氧樹脂調和。上述方式不僅製程繁複，成本也高。
有鑑於上述問題，在本發明的實施例中提出一種樹脂組成物，可使用含浸製程來製作接合膠片。此樹脂組成物具有含溴環氧樹脂、經胺基甲酸酯(urethane)改質之共聚酯(co－polyester)、硬化劑與溶劑。
上述含溴環氧樹脂為樹脂組成物中之主要樹脂成份，作為高分子聚合硬化反應之主要反應物。含溴環氧樹脂由四溴雙酚A與基礎型環氧樹脂於觸媒存在與高溫下反應所得，含溴環氧樹脂之化學式如下： 環氧樹脂中含溴可提高樹脂組成物之玻璃轉移溫度(glass transition temperature,Tg)與增加耐燃與耐熱程度，使得樹脂組成物適用於高溫耐熱之電路板接合。含溴環氧樹脂 例如可為陶氏化學之XU－19074，其樹脂成份重量比例為70%。
以胺基甲酸酯改質共聚酯作為樹脂組成物中之流膠控制樹脂，其中被改質之共聚酯極性與環氧樹脂相近。而由於共聚酯之特性與環氧樹脂相近，因此經胺基甲酸酯改質之共聚酯不需經過大量溶劑之稀釋，即可與主成份之環氧樹脂調和。此外，加入胺基甲酸酯改質之共聚酯所製備之樹脂組成物的膨脹係數與接合之軟硬板之膨脹係數相近，因此以熱壓合處理軟硬板接合時，不會產生軟硬板之變形。在每100重量份之主要樹脂成份添加5~15重量份的胺基甲酸酯改質之共聚酯即可。以胺基甲酸酯改質之共聚酯例如可為東洋紡UR3500，分子量大於10000，而平均分子量為15000，樹脂成份重量比例為40%。
與含溴環氧樹脂進行聚合硬化反應之硬化劑可為酚醛硬化劑、二氰二胺(Dicyandiamide)或兩者之組合物。其中，每100重量份之主要樹脂成份添加25~45重量份之酚醛硬化劑。或者是，每100重量份之主要樹脂成份添加2.5~4.0重量份之二氰二胺。
上述樹脂組成物之所有成份需要分散於共同溶劑中進行調和。溶劑可為環己酮(Cyclohexanone)、丙二醇甲醚醋酸酯(Propylene－glycol Methyl－ether Acetate,PMA)、丙二醇甲醚(Propylene－glycol Methyl－ether,PM)或上述之任意組成物。每100重量份之主要樹脂成份需分散於40~70重量份之溶劑中。
上述樹脂組成物除單獨以含溴環氧樹脂作為主要樹脂成份外，也可包含四官能基環氧樹脂或者高溴環氧樹脂。其中含溴環氧樹脂混掺四官能基環氧樹脂可提高樹脂組成物之玻璃轉移溫度，以及使樹脂組成物具有抗紫外光之特性。四官能基環氧樹脂之化學式如下： 四官能基環氧樹脂例如可為長春公司TNE 190A70，其樹脂成份重量比例為70%。而含溴環氧樹脂混掺高溴環氧樹脂可增加樹脂組成物之耐燃程度。高溴環氧樹脂例如可為四溴雙酚A二縮水甘油醚，或者是長春公司之BEB 400T60，其樹脂成份重量比例為70%。
上述樹脂組成物也可含有微量之促進劑，作為聚合硬化反應之觸媒，縮短樹脂組成物之硬化時間。促進劑可為二－甲基咪唑(2－Methyl－Imidazole)。
根據本發明之一實施例，取100重量份之含溴環氧樹脂混掺4.7重量份之四官能基環氧樹脂與16重量份之高溴環氧樹脂，成為一主成份樹脂。上述含溴環氧樹脂為購自陶氏化學型號為XU－19074之樹脂，其樹脂成分重量比例 為75%。四官能基環氧樹脂為購自長春公司型號TNE 190A70之樹脂，其樹脂成分重量比例為70%。而高溴環氧樹脂則為購自長春公司型號為BEB 400 T60之樹脂，其樹脂成分重量比例為60%。
接著，取上述主成份樹脂100重量份置於攪拌器內，一邊攪拌一邊添加11.4重量份之胺基甲酸酯改質之共聚酯(購自東洋紡公司，型號UR3500，分子量大於10000，且平均分子量為15000，樹脂成份重量比例為40%)，再加入31.5重量份之酚醛硬化劑、0.11重量份之二－甲基咪唑與62重量份之環己酮，於室溫下使用攪拌器混合180分鐘。即成樹脂組成物，可用於含浸製程中製造接合膠片。
接合膠片包含玻璃纖維布，而玻璃纖維布上分佈有樹脂層，且樹脂層包含前述樹脂組成物。接合膠片之製造方法為以滾筒含浸機將玻璃纖維布含浸於前述樹脂組成物中，使樹脂組成物塗覆於玻離纖維布上。再經過加熱製程，於溫度150~200℃間將玻璃纖維布與樹脂乾燥成接合膠片成品。其中，玻璃纖維布厚度為0.04~0.06公釐，重量為每平方公尺之玻璃纖維布重46~50公克。
接合膠片根據電子電路互聯與封裝協會之IPC－TM－650檢測規範檢測各種特性，如流膠現象、耐熱性與電子絕緣特性。各特性之檢測數值如表一所示。
表一
由表一檢測結果可知，接合膠片根據IPC－TM－650 2.3.16.1檢測規範所得樹脂含量為63%。樹脂流膠量與流膠範圍(circular flow)均表示膠片與軟硬板壓合後的流膠現象，值越低表示流膠或溢膠現象越少。根據IPC－TM－650 2.3.17檢測規範所測得之接合膠片的樹脂流膠量小於2%，流膠範圍小於20密耳(mil,1 mil＝0.0254 mm)。
玻璃轉移溫度、熱裂解溫度、288度耐熱時間與浸錫耐熱時間之檢測皆為表示接合膠片之耐熱性，玻璃轉移溫度與熱裂解溫度越高，288度耐熱時間與浸錫耐熱時間越長代表膠片之耐熱性與耐燃性越好。根據IPC－TM－650 2.4.25C檢測規範以示差熱分析掃描儀(differential scanning calorimetry,DSC)檢測，接合膠片之玻璃轉移溫度為165℃。而根據IPC－TM－650 2.4.24.6檢測規範以熱重分析儀(Thermal Gravimetric Analysis,TGA)檢測，接合膠片之熱裂解溫度為328℃。又根據IPC－TM－650 2.4.24.1 檢測規範以熱機械分析儀(Thermo－Mechanical Analysis,TMA)檢測，接合膠片之288度耐熱時間為10.5分鐘，同時，根據IPC－TM－650 2.4.13檢測規範測定，接合膠片之浸錫耐熱時間大於10分鐘。
介電常數代表所製膠片的電子絕緣特性，數值越低代表電子絕緣特性越好。而介電損失因子則為表示物質在一定温度下吸收某一頻率之微波的能力，通常在通訊產品的規範裡，介電損失因子數值需越低越好。根據IPC－TM－650 2.5.5檢測規範，本發明之接合膠片之介電常數為3.94，介電損失因子為0.025。
由上述表一之各檢測結果可知，本發明之接合膠片具耐燃性與耐熱性。且在軟硬板間黏合時，流膠範圍控制在小於20密耳，符合電子電路互聯與封裝協會需小於1.5公釐之規範。
此外，將接合膠片與1盎司(oz)銅箔或氧化銅箔進行壓合，再依照IPC－TM－650 2.4.8檢測規範進行黏合強度測試。接合膠片與1盎司銅箔之黏合強度為10.0磅/英吋，而接合膠片與1盎司氧化銅箔之黏合強度為5.3磅/英吋。
上述接合膠片可用於電路板之軟硬板間的疊合。根據本發明之另一實施例，一種印刷電路板包含第一基板、第二基板與接合膠片，其中接合膠片位於第一基板與第二基板間，作為第一基板與第二基板接合之界面。
上述第一基板可為硬性基板或軟性基板，而上述第二基板也可為硬性基板或軟性基板。
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。

Claims (16)

  1. 一種樹脂組合物，用於含浸玻璃纖維布中以製造接合膠片，且該樹脂組成物於基板接合之熱壓合製程中，溢膠範圍小於1.5mm，該樹脂組成物至少包含：100重量份之含溴環氧樹脂；5~15重量份之共聚酯，經胺基甲酸酯改質；2.5~45重量份之硬化劑；以及40~70重量份之溶劑。
  2. 如申請專利範圍第1項所述之樹脂組合物，更包含一四官能基環氧樹脂。
  3. 如申請專利範圍第2項所述之樹脂組成物，其中每100重量份之該含溴環氧樹脂混掺4.7重量份之該四官能基環氧樹脂。
  4. 如申請專利範圍第1項所述之樹脂組合物，更包含一高溴環氧樹脂。
  5. 如申請專利範圍第4項所述之樹脂組成物，其中每100重量份之該含溴環氧樹脂混掺16重量份之該高溴環氧樹脂。
  6. 如申請專利範圍第1項所述之樹脂組成物，其中每 100重量份之該含溴環氧樹脂加入11.4重量份之該共聚酯。
  7. 如申請專利範圍第1項所述之樹脂組成物，其中該硬化劑係選自由酚醛硬化劑、二氰二胺與上述任意組合物所組成之群組。
  8. 如申請專利範圍第7項所述之樹脂組成物，其中每100重量份之該含溴環氧樹脂加入31.5重量份之該酚醛硬化劑。
  9. 如申請專利範圍第1項所述之樹脂組成物，其中該溶劑係選自由環己酮、丙二醇甲醚醋酸酯、丙二醇甲醚與上述任意組合物所組成之群組。
  10. 如申請專利範圍第1項所述之樹脂組成物，其中每100重量份之該含溴環氧樹脂分散於62重量份之該溶劑。
  11. 如申請專利範圍第1項所述之樹脂組成物，更包含一促進劑。
  12. 如申請專利範圍第11項所述之樹脂組成物，其中該促進劑為二-甲基咪唑。
  13. 一種接合膠片，至少包含： 一玻璃纖維布；以及一樹脂層，分佈於該玻璃纖維布上，該樹脂層包含如申請專利範圍第1至8項中任一項所述的樹脂組成物。
  14. 一種印刷電路板，至少包含：一第一基板；一第二基板；以及一接合膠片，位於該第一基板與該第二基板間，以接合該第一基板與該第二基板，其中該接合膠片包含：一玻璃纖維布；以及一樹脂層，分佈於該玻璃纖維布上，該樹脂層包含如申請專利範圍第1至8項中任一項所述的樹脂組成物。
  15. 如申請專利範圍第14項所述之印刷電路板，其中該第一基板為一軟性基板或一硬性基板。
  16. 如申請專利範圍第14項所述之印刷電路板，其中該第二基板為一軟性基板或一硬性基板。
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CN106550542B (zh) 2015-09-17 2021-10-26 奥特斯(中国)有限公司 插入保护结构并且靠近保护结构具有纯介质层的部件载体
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US10321560B2 (en) 2015-11-12 2019-06-11 Multek Technologies Limited Dummy core plus plating resist restrict resin process and structure
US20170238416A1 (en) 2016-02-17 2017-08-17 Multek Technologies Limited Dummy core restrict resin process and structure
US9999134B2 (en) 2016-03-14 2018-06-12 Multek Technologies Limited Self-decap cavity fabrication process and structure
US10064292B2 (en) * 2016-03-21 2018-08-28 Multek Technologies Limited Recessed cavity in printed circuit board protected by LPI
US11224117B1 (en) 2018-07-05 2022-01-11 Flex Ltd. Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0262613A2 (en) * 1986-09-26 1988-04-06 Union Carbide Corporation Formable epoxy coatings
CN100432170C (zh) * 2003-05-20 2008-11-12 长兴化学工业股份有限公司 树脂组合物及含此组合物的背胶超薄铜箔介电层材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0432923A1 (en) * 1989-11-30 1991-06-19 Lord Corporation Epoxy-rubber alloy compositions
US5545697A (en) * 1994-02-14 1996-08-13 Ciba-Geigy Corporation Urethane modified epoxy resin compositions
DE69829465T2 (de) * 1997-03-27 2006-02-09 Mitsubishi Rayon Co., Ltd. Epoxidharzzusammensetzung für faserverstärkte kunststoffe, prepeg, und daraus hergestellter schlauchförmiger formkörper
JP4423513B2 (ja) * 1997-10-20 2010-03-03 東洋紡績株式会社 接着用樹脂組成物及び接着用フィルム
JP2007051211A (ja) * 2005-08-17 2007-03-01 Shin Etsu Chem Co Ltd 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
JP2008144141A (ja) * 2006-11-15 2008-06-26 Shin Etsu Chem Co Ltd 接着シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0262613A2 (en) * 1986-09-26 1988-04-06 Union Carbide Corporation Formable epoxy coatings
CN100432170C (zh) * 2003-05-20 2008-11-12 长兴化学工业股份有限公司 树脂组合物及含此组合物的背胶超薄铜箔介电层材料

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