TWI447893B - Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same - Google Patents

Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same

Info

Publication number
TWI447893B
TWI447893B TW098121155A TW98121155A TWI447893B TW I447893 B TWI447893 B TW I447893B TW 098121155 A TW098121155 A TW 098121155A TW 98121155 A TW98121155 A TW 98121155A TW I447893 B TWI447893 B TW I447893B
Authority
TW
Taiwan
Prior art keywords
light
manufacturing
same
package structure
led package
Prior art date
Application number
TW098121155A
Other languages
English (en)
Other versions
TW201101456A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW098121155A priority Critical patent/TWI447893B/zh
Priority to JP2009196834A priority patent/JP2011009680A/ja
Priority to US12/550,699 priority patent/US8187899B2/en
Priority to EP10165723A priority patent/EP2267773A3/en
Priority to KR1020100059111A priority patent/KR101160248B1/ko
Publication of TW201101456A publication Critical patent/TW201101456A/zh
Priority to US13/160,679 priority patent/US8415701B2/en
Application granted granted Critical
Publication of TWI447893B publication Critical patent/TWI447893B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW098121155A 2009-06-24 2009-06-24 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same TWI447893B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW098121155A TWI447893B (en) 2009-06-24 2009-06-24 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
JP2009196834A JP2011009680A (ja) 2009-06-24 2009-08-27 発光効率の向上及び出射光角度の制御が可能な発光ダイオード封止構造、ベース構造及びその製造方法
US12/550,699 US8187899B2 (en) 2009-06-24 2009-08-31 LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
EP10165723A EP2267773A3 (en) 2009-06-24 2010-06-11 LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
KR1020100059111A KR101160248B1 (ko) 2009-06-24 2010-06-22 발광 효율의 향상 및 출사광 각도의 제어가 가능한 발광 다이오드 봉지 구조 및 그 제조 방법
US13/160,679 US8415701B2 (en) 2009-06-24 2011-06-15 LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098121155A TWI447893B (en) 2009-06-24 2009-06-24 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW201101456A TW201101456A (en) 2011-01-01
TWI447893B true TWI447893B (en) 2014-08-01

Family

ID=43012773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098121155A TWI447893B (en) 2009-06-24 2009-06-24 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same

Country Status (5)

Country Link
US (2) US8187899B2 (zh)
EP (1) EP2267773A3 (zh)
JP (1) JP2011009680A (zh)
KR (1) KR101160248B1 (zh)
TW (1) TWI447893B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011199211A (ja) * 2010-03-24 2011-10-06 Kowa Denki Sangyo Kk 照明装置
TWI501428B (zh) * 2011-01-14 2015-09-21 Lextar Electronics Corp 發光二極體封裝結構
JP5582048B2 (ja) * 2011-01-28 2014-09-03 日亜化学工業株式会社 発光装置
KR20120119350A (ko) * 2011-04-21 2012-10-31 삼성전자주식회사 발광소자 모듈 및 이의 제조방법
CN103137843A (zh) * 2011-11-24 2013-06-05 展晶科技(深圳)有限公司 发光二极管装置
TWI464920B (zh) * 2012-01-19 2014-12-11 Paragon Sc Lighting Tech Co 多晶片封裝結構及其製作方法
TW201507214A (zh) * 2013-08-12 2015-02-16 Lextar Electronics Corp 發光二極體封裝結構及其製造方法
KR102410527B1 (ko) * 2014-12-19 2022-06-20 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP6790602B2 (ja) * 2015-10-30 2020-11-25 日亜化学工業株式会社 発光装置及びその製造方法
JP6915983B2 (ja) * 2015-12-25 2021-08-11 シチズン電子株式会社 発光装置および調色装置
CN106299084B (zh) * 2016-08-30 2018-10-16 开发晶照明（厦门）有限公司 Led封装结构
CN207123684U (zh) * 2016-09-30 2018-03-20 深圳市玲涛光电科技有限公司 柔性面光源及其电子设备
TWM555604U (zh) * 2017-03-01 2018-02-11 Paragon Semiconductor Lighting Technology Co Ltd 具有環境光感應功能的發光裝置
USD843356S1 (en) * 2017-04-12 2019-03-19 Kymeta Corporation Antenna

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM271252U (en) * 2004-12-14 2005-07-21 Niching Ind Corp Package structure of light-emitting device
TWI256151B (en) * 2005-03-31 2006-06-01 Lite On Technology Corp Optical semiconductor component
TWM339082U (en) * 2008-03-21 2008-08-21 chang-jun Shen Fluorscent with acrylic shade surface mounted diodes

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237462A (ja) * 2000-02-22 2001-08-31 Sanyo Electric Co Ltd Ｌｅｄ発光装置
US7145182B2 (en) * 2003-09-12 2006-12-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Integrated emitter devices having beam divergence reducing encapsulation layer
JP2005223112A (ja) * 2004-02-05 2005-08-18 Citizen Electronics Co Ltd 表面実装型発光ダイオード
JP4754850B2 (ja) * 2004-03-26 2011-08-24 パナソニック株式会社 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法
US7064424B2 (en) * 2004-05-06 2006-06-20 Wilson Robert E Optical surface mount technology package
JP2006324589A (ja) * 2005-05-20 2006-11-30 Sharp Corp Ｌｅｄ装置およびその製造方法
KR100799553B1 (ko) * 2006-07-11 2008-01-31 주식회사 우리이티아이 댐 인캡 식 엘이디 패키지 및 그의 제조방법
JP2008041290A (ja) * 2006-08-02 2008-02-21 Akita Denshi Systems:Kk 照明装置及びその製造方法
JP4857185B2 (ja) * 2007-05-14 2012-01-18 株式会社アキタ電子システムズ 照明装置及びその製造方法
JP5233170B2 (ja) * 2007-05-31 2013-07-10 日亜化学工業株式会社 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法
JP2009135485A (ja) * 2007-11-07 2009-06-18 Mitsubishi Chemicals Corp 半導体発光装置及びその製造方法
TWI411143B (en) * 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
TW201103170A (en) * 2009-07-08 2011-01-16 Paragon Sc Lighting Tech Co LED package structure with concave area for positioning heat-conducting substance and method for manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM271252U (en) * 2004-12-14 2005-07-21 Niching Ind Corp Package structure of light-emitting device
TWI256151B (en) * 2005-03-31 2006-06-01 Lite On Technology Corp Optical semiconductor component
TWM339082U (en) * 2008-03-21 2008-08-21 chang-jun Shen Fluorscent with acrylic shade surface mounted diodes

Also Published As

Publication number Publication date
EP2267773A2 (en) 2010-12-29
US20100327294A1 (en) 2010-12-30
US8187899B2 (en) 2012-05-29
KR20100138798A (ko) 2010-12-31
US8415701B2 (en) 2013-04-09
EP2267773A3 (en) 2012-07-25
TW201101456A (en) 2011-01-01
JP2011009680A (ja) 2011-01-13
US20110241035A1 (en) 2011-10-06
KR101160248B1 (ko) 2012-06-27

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MM4A Annulment or lapse of patent due to non-payment of fees