TWI256151B - Optical semiconductor component - Google Patents

Optical semiconductor component

Info

Publication number
TWI256151B
TWI256151B TW94110409A TW94110409A TWI256151B TW I256151 B TWI256151 B TW I256151B TW 94110409 A TW94110409 A TW 94110409A TW 94110409 A TW94110409 A TW 94110409A TW I256151 B TWI256151 B TW I256151B
Authority
TW
Taiwan
Prior art keywords
conducting wire
wire holder
chip
semiconductor chip
component
Prior art date
Application number
TW94110409A
Other languages
Chinese (zh)
Other versions
TW200635079A (en
Inventor
Hung-Yuan Su
Jen-Chun Weng
Original Assignee
Lite On Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lite On Technology Corp filed Critical Lite On Technology Corp
Priority to TW94110409A priority Critical patent/TWI256151B/en
Application granted granted Critical
Publication of TWI256151B publication Critical patent/TWI256151B/en
Publication of TW200635079A publication Critical patent/TW200635079A/en

Links

Abstract

An optical semiconductor component has a conducting wire holder, at least one chip carrier secured, at least one semiconductor chip, a first curved surface made of the conducting wire holder, the semiconductor chip being placed at its focus, at least one connecting component made of the conducting wire holder, and a second curved surface surrounded by a package body, the semiconductor chip being placed at its focus. The chip carrier is an independent component and has a multi-layer structure. The middle layer is an insulator used to separate the chip from the conducting wire holder electrically or thermally. Hence, when connected with a metal radiator, the chip carrier does not cause electric leakage. Further, the connecting components of the present invention are mutually independent, which can provide multiple photodiodes with different driving voltages to connect with each other in series or parallel.
TW94110409A 2005-03-31 2005-03-31 Optical semiconductor component TWI256151B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94110409A TWI256151B (en) 2005-03-31 2005-03-31 Optical semiconductor component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94110409A TWI256151B (en) 2005-03-31 2005-03-31 Optical semiconductor component

Publications (2)

Publication Number Publication Date
TWI256151B true TWI256151B (en) 2006-06-01
TW200635079A TW200635079A (en) 2006-10-01

Family

ID=37614092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94110409A TWI256151B (en) 2005-03-31 2005-03-31 Optical semiconductor component

Country Status (1)

Country Link
TW (1) TWI256151B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447893B (en) * 2009-06-24 2014-08-01 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448646B (en) * 2011-05-13 2014-08-11 Brightek Optoelectronic Co Ltd Manufacturing method for lamp heat-dissipation structure and manufacturing method for lamp assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447893B (en) * 2009-06-24 2014-08-01 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same

Also Published As

Publication number Publication date
TW200635079A (en) 2006-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees