TWI256151B - Optical semiconductor component - Google Patents
Optical semiconductor componentInfo
- Publication number
- TWI256151B TWI256151B TW94110409A TW94110409A TWI256151B TW I256151 B TWI256151 B TW I256151B TW 94110409 A TW94110409 A TW 94110409A TW 94110409 A TW94110409 A TW 94110409A TW I256151 B TWI256151 B TW I256151B
- Authority
- TW
- Taiwan
- Prior art keywords
- conducting wire
- wire holder
- chip
- semiconductor chip
- component
- Prior art date
Links
Abstract
An optical semiconductor component has a conducting wire holder, at least one chip carrier secured, at least one semiconductor chip, a first curved surface made of the conducting wire holder, the semiconductor chip being placed at its focus, at least one connecting component made of the conducting wire holder, and a second curved surface surrounded by a package body, the semiconductor chip being placed at its focus. The chip carrier is an independent component and has a multi-layer structure. The middle layer is an insulator used to separate the chip from the conducting wire holder electrically or thermally. Hence, when connected with a metal radiator, the chip carrier does not cause electric leakage. Further, the connecting components of the present invention are mutually independent, which can provide multiple photodiodes with different driving voltages to connect with each other in series or parallel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94110409A TWI256151B (en) | 2005-03-31 | 2005-03-31 | Optical semiconductor component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94110409A TWI256151B (en) | 2005-03-31 | 2005-03-31 | Optical semiconductor component |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI256151B true TWI256151B (en) | 2006-06-01 |
TW200635079A TW200635079A (en) | 2006-10-01 |
Family
ID=37614092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94110409A TWI256151B (en) | 2005-03-31 | 2005-03-31 | Optical semiconductor component |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI256151B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI447893B (en) * | 2009-06-24 | 2014-08-01 | Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI448646B (en) * | 2011-05-13 | 2014-08-11 | Brightek Optoelectronic Co Ltd | Manufacturing method for lamp heat-dissipation structure and manufacturing method for lamp assembly |
-
2005
- 2005-03-31 TW TW94110409A patent/TWI256151B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI447893B (en) * | 2009-06-24 | 2014-08-01 | Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TW200635079A (en) | 2006-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2164100A3 (en) | Leaded semiconductor power module with direct bonding and double sided cooling | |
TW200644187A (en) | Semiconductor device and method for manufacturing semiconductor device | |
RU100299U1 (en) | OPTOELECTRONIC RELAY | |
EP2360748A3 (en) | Light emitting device and light emitting device package | |
TW200627563A (en) | Bump-less chip package | |
TW200707677A (en) | Package, subassembly and methods of manufacturing thereof | |
TW200733436A (en) | Light emitting diode package structure and fabrication method thereof | |
TW200627561A (en) | Chip package | |
EP2180532A3 (en) | Semiconductor light emitting device | |
NO341529B1 (en) | Light emitting device | |
EP1503433A3 (en) | Mount for semiconductor light emitting device | |
CN102313170B (en) | Light emitting device and illumination apparatus | |
WO2006034671A3 (en) | Optoelectronic component with a wireless contacting | |
WO2003054954A3 (en) | Electrical/optical integration scheme using direct copper bonding | |
EP2317549A3 (en) | Direct bonded substrate for a power semiconductor device. | |
JP2011146353A (en) | Lighting apparatus | |
TW200709456A (en) | Semiconductor chip package and application device thereof | |
SG170099A1 (en) | Integrated circuit package system with warp-free chip | |
JP5655302B2 (en) | Lighting device | |
TW200731433A (en) | Semiconductor device and manufacturing method for the same | |
TW201130108A (en) | High-density integrated circuit module structure | |
US20090085051A1 (en) | Light emitting diode device | |
TWI256151B (en) | Optical semiconductor component | |
EP1391936A3 (en) | Semiconductor array device with single interconnection layer | |
EP1515366A3 (en) | Techniques for pad arrangements on circuit chips |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |