TWI447838B - Vacuum processing device - Google Patents

Vacuum processing device Download PDF

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Publication number
TWI447838B
TWI447838B TW099127567A TW99127567A TWI447838B TW I447838 B TWI447838 B TW I447838B TW 099127567 A TW099127567 A TW 099127567A TW 99127567 A TW99127567 A TW 99127567A TW I447838 B TWI447838 B TW I447838B
Authority
TW
Taiwan
Prior art keywords
vacuum
wafer
chamber
container
arm
Prior art date
Application number
TW099127567A
Other languages
English (en)
Chinese (zh)
Other versions
TW201205710A (en
Inventor
磯村僚一
田內勤
近藤英明
Original Assignee
日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TW201205710A publication Critical patent/TW201205710A/zh
Application granted granted Critical
Publication of TWI447838B publication Critical patent/TWI447838B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099127567A 2010-07-27 2010-08-18 Vacuum processing device TWI447838B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010167689A JP2012028659A (ja) 2010-07-27 2010-07-27 真空処理装置

Publications (2)

Publication Number Publication Date
TW201205710A TW201205710A (en) 2012-02-01
TWI447838B true TWI447838B (zh) 2014-08-01

Family

ID=45526905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099127567A TWI447838B (zh) 2010-07-27 2010-08-18 Vacuum processing device

Country Status (5)

Country Link
US (1) US20120027542A1 (https=)
JP (1) JP2012028659A (https=)
KR (1) KR20120010945A (https=)
CN (1) CN102347256A (https=)
TW (1) TWI447838B (https=)

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JP5785712B2 (ja) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ 真空処理装置
US8918203B2 (en) * 2011-03-11 2014-12-23 Brooks Automation, Inc. Substrate processing apparatus
JP2014036025A (ja) * 2012-08-07 2014-02-24 Hitachi High-Technologies Corp 真空処理装置または真空処理装置の運転方法
JP6120621B2 (ja) * 2013-03-14 2017-04-26 株式会社日立ハイテクノロジーズ 真空処理装置及びその運転方法
CN106162906B (zh) * 2015-03-31 2019-01-15 中兴通讯股份有限公司 调度信息发送、接收方法及装置
US9889567B2 (en) 2015-04-24 2018-02-13 Applied Materials, Inc. Wafer swapper
US11077535B2 (en) * 2018-02-14 2021-08-03 Samsung Electronics Co., Ltd. Process system having locking pin and locking pin
JP7115879B2 (ja) 2018-03-23 2022-08-09 株式会社日立ハイテク 真空処理装置の運転方法
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
KR102515863B1 (ko) 2020-03-24 2023-03-31 주식회사 히타치하이테크 진공 처리 장치
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
CN112249685B (zh) * 2020-10-27 2022-04-01 光驰科技(上海)有限公司 进行基板快速交互搬送的机构及其搬送方法
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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US20050111938A1 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
TW200839927A (en) * 2006-12-05 2008-10-01 Shibaura Mechatronics Corp Robot device, treatment device with the robot device, ashing device, and ashing method
CN101310041A (zh) * 2006-01-13 2008-11-19 东京毅力科创株式会社 真空处理装置和真空处理方法

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US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
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US6944517B2 (en) * 2003-07-03 2005-09-13 Brooks Automation, Inc. Substrate apparatus calibration and synchronization procedure
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KR100754245B1 (ko) * 2006-02-06 2007-09-03 삼성전자주식회사 반도체 제조용 웨이퍼 이송로봇 및 그를 구비한 반도체제조설비
KR100847888B1 (ko) * 2006-12-12 2008-07-23 세메스 주식회사 반도체 소자 제조 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050111938A1 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
CN101310041A (zh) * 2006-01-13 2008-11-19 东京毅力科创株式会社 真空处理装置和真空处理方法
TW200839927A (en) * 2006-12-05 2008-10-01 Shibaura Mechatronics Corp Robot device, treatment device with the robot device, ashing device, and ashing method

Also Published As

Publication number Publication date
JP2012028659A (ja) 2012-02-09
CN102347256A (zh) 2012-02-08
TW201205710A (en) 2012-02-01
KR20120010945A (ko) 2012-02-06
US20120027542A1 (en) 2012-02-02

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