CN102347256A - 真空处理装置 - Google Patents

真空处理装置 Download PDF

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Publication number
CN102347256A
CN102347256A CN2010102606997A CN201010260699A CN102347256A CN 102347256 A CN102347256 A CN 102347256A CN 2010102606997 A CN2010102606997 A CN 2010102606997A CN 201010260699 A CN201010260699 A CN 201010260699A CN 102347256 A CN102347256 A CN 102347256A
Authority
CN
China
Prior art keywords
vacuum
chamber
transfer
robot
aforementioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102606997A
Other languages
English (en)
Chinese (zh)
Inventor
矶村僚一
田内勤
近藤英明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN102347256A publication Critical patent/CN102347256A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2010102606997A 2010-07-27 2010-08-20 真空处理装置 Pending CN102347256A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010167689A JP2012028659A (ja) 2010-07-27 2010-07-27 真空処理装置
JP2010-167689 2010-07-27

Publications (1)

Publication Number Publication Date
CN102347256A true CN102347256A (zh) 2012-02-08

Family

ID=45526905

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102606997A Pending CN102347256A (zh) 2010-07-27 2010-08-20 真空处理装置

Country Status (5)

Country Link
US (1) US20120027542A1 (https=)
JP (1) JP2012028659A (https=)
KR (1) KR20120010945A (https=)
CN (1) CN102347256A (https=)
TW (1) TWI447838B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051295A (zh) * 2013-03-14 2014-09-17 株式会社日立高新技术 真空处理装置及其运转方法
CN112249685A (zh) * 2020-10-27 2021-01-22 光驰科技(上海)有限公司 进行基板快速交互搬送的机构及其搬送方法

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JP5785712B2 (ja) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ 真空処理装置
US8918203B2 (en) * 2011-03-11 2014-12-23 Brooks Automation, Inc. Substrate processing apparatus
JP2014036025A (ja) * 2012-08-07 2014-02-24 Hitachi High-Technologies Corp 真空処理装置または真空処理装置の運転方法
CN106162906B (zh) * 2015-03-31 2019-01-15 中兴通讯股份有限公司 调度信息发送、接收方法及装置
US9889567B2 (en) 2015-04-24 2018-02-13 Applied Materials, Inc. Wafer swapper
US11077535B2 (en) * 2018-02-14 2021-08-03 Samsung Electronics Co., Ltd. Process system having locking pin and locking pin
JP7115879B2 (ja) 2018-03-23 2022-08-09 株式会社日立ハイテク 真空処理装置の運転方法
US10998209B2 (en) 2019-05-31 2021-05-04 Applied Materials, Inc. Substrate processing platforms including multiple processing chambers
KR102515863B1 (ko) 2020-03-24 2023-03-31 주식회사 히타치하이테크 진공 처리 장치
US12080571B2 (en) 2020-07-08 2024-09-03 Applied Materials, Inc. Substrate processing module and method of moving a workpiece
US11817331B2 (en) 2020-07-27 2023-11-14 Applied Materials, Inc. Substrate holder replacement with protective disk during pasting process
US11749542B2 (en) 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US11600507B2 (en) 2020-09-09 2023-03-07 Applied Materials, Inc. Pedestal assembly for a substrate processing chamber
US11610799B2 (en) 2020-09-18 2023-03-21 Applied Materials, Inc. Electrostatic chuck having a heating and chucking capabilities
US12195314B2 (en) 2021-02-02 2025-01-14 Applied Materials, Inc. Cathode exchange mechanism to improve preventative maintenance time for cluster system
US11674227B2 (en) 2021-02-03 2023-06-13 Applied Materials, Inc. Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure
US12002668B2 (en) 2021-06-25 2024-06-04 Applied Materials, Inc. Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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US5183547A (en) * 1989-09-13 1993-02-02 Sony Corporation Sputtering apparatus and system for sputtering employing same
US20080226429A1 (en) * 2003-11-10 2008-09-18 Van Der Meulen Peter Multi-function vacuum link
CN101310041A (zh) * 2006-01-13 2008-11-19 东京毅力科创株式会社 真空处理装置和真空处理方法

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US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
TW295677B (https=) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
US20040005211A1 (en) * 1996-02-28 2004-01-08 Lowrance Robert B. Multiple independent robot assembly and apparatus and control system for processing and transferring semiconductor wafers
US6201999B1 (en) * 1997-06-09 2001-03-13 Applied Materials, Inc. Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool
US6270306B1 (en) * 1998-01-14 2001-08-07 Applied Materials, Inc. Wafer aligner in center of front end frame of vacuum system
US6267549B1 (en) * 1998-06-02 2001-07-31 Applied Materials, Inc. Dual independent robot blades with minimal offset
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US6440261B1 (en) * 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
US6379095B1 (en) * 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
US6977014B1 (en) * 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
JP3890896B2 (ja) * 2001-01-24 2007-03-07 株式会社明電舎 基板搬送用ロボット
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US20030131458A1 (en) * 2002-01-15 2003-07-17 Applied Materials, Inc. Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing
US20050220582A1 (en) * 2002-09-13 2005-10-06 Tokyo Electron Limited Teaching method and processing system
JP4348921B2 (ja) * 2002-09-25 2009-10-21 東京エレクトロン株式会社 被処理体の搬送方法
JP4816790B2 (ja) * 2003-06-02 2011-11-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
US6944517B2 (en) * 2003-07-03 2005-09-13 Brooks Automation, Inc. Substrate apparatus calibration and synchronization procedure
JP4493955B2 (ja) * 2003-09-01 2010-06-30 東京エレクトロン株式会社 基板処理装置及び搬送ケース
US8029226B2 (en) * 2003-11-10 2011-10-04 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070282480A1 (en) * 2003-11-10 2007-12-06 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
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US20070017445A1 (en) * 2005-07-19 2007-01-25 Takako Takehara Hybrid PVD-CVD system
KR100754245B1 (ko) * 2006-02-06 2007-09-03 삼성전자주식회사 반도체 제조용 웨이퍼 이송로봇 및 그를 구비한 반도체제조설비
KR20120032049A (ko) * 2006-12-05 2012-04-04 시바우라 메카트로닉스 가부시끼가이샤 로봇 장치, 처리 장치, 처리 시스템 및 처리 방법
KR100847888B1 (ko) * 2006-12-12 2008-07-23 세메스 주식회사 반도체 소자 제조 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183547A (en) * 1989-09-13 1993-02-02 Sony Corporation Sputtering apparatus and system for sputtering employing same
US20080226429A1 (en) * 2003-11-10 2008-09-18 Van Der Meulen Peter Multi-function vacuum link
CN101310041A (zh) * 2006-01-13 2008-11-19 东京毅力科创株式会社 真空处理装置和真空处理方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051295A (zh) * 2013-03-14 2014-09-17 株式会社日立高新技术 真空处理装置及其运转方法
CN104051295B (zh) * 2013-03-14 2017-05-10 株式会社日立高新技术 真空处理装置及其运转方法
CN112249685A (zh) * 2020-10-27 2021-01-22 光驰科技(上海)有限公司 进行基板快速交互搬送的机构及其搬送方法
CN112249685B (zh) * 2020-10-27 2022-04-01 光驰科技(上海)有限公司 进行基板快速交互搬送的机构及其搬送方法

Also Published As

Publication number Publication date
JP2012028659A (ja) 2012-02-09
TW201205710A (en) 2012-02-01
KR20120010945A (ko) 2012-02-06
TWI447838B (zh) 2014-08-01
US20120027542A1 (en) 2012-02-02

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Application publication date: 20120208