JPH11195691A5 - - Google Patents

Info

Publication number
JPH11195691A5
JPH11195691A5 JP1997369551A JP36955197A JPH11195691A5 JP H11195691 A5 JPH11195691 A5 JP H11195691A5 JP 1997369551 A JP1997369551 A JP 1997369551A JP 36955197 A JP36955197 A JP 36955197A JP H11195691 A5 JPH11195691 A5 JP H11195691A5
Authority
JP
Japan
Prior art keywords
wafer
chamber
department
valve body
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997369551A
Other languages
English (en)
Japanese (ja)
Other versions
JP4014059B2 (ja
JPH11195691A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP36955197A priority Critical patent/JP4014059B2/ja
Priority claimed from JP36955197A external-priority patent/JP4014059B2/ja
Publication of JPH11195691A publication Critical patent/JPH11195691A/ja
Publication of JPH11195691A5 publication Critical patent/JPH11195691A5/ja
Application granted granted Critical
Publication of JP4014059B2 publication Critical patent/JP4014059B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP36955197A 1997-12-29 1997-12-29 枚葉式真空処理装置 Expired - Fee Related JP4014059B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36955197A JP4014059B2 (ja) 1997-12-29 1997-12-29 枚葉式真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36955197A JP4014059B2 (ja) 1997-12-29 1997-12-29 枚葉式真空処理装置

Publications (3)

Publication Number Publication Date
JPH11195691A JPH11195691A (ja) 1999-07-21
JPH11195691A5 true JPH11195691A5 (https=) 2005-06-23
JP4014059B2 JP4014059B2 (ja) 2007-11-28

Family

ID=18494716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36955197A Expired - Fee Related JP4014059B2 (ja) 1997-12-29 1997-12-29 枚葉式真空処理装置

Country Status (1)

Country Link
JP (1) JP4014059B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468353B1 (en) * 1997-06-04 2002-10-22 Applied Materials, Inc. Method and apparatus for improved substrate handling
CN116590679A (zh) * 2023-06-02 2023-08-15 湘潭宏大真空技术股份有限公司 一种真空磁控溅射卧式双面镀膜系统
CN117845184A (zh) * 2023-12-28 2024-04-09 湘潭宏大真空技术股份有限公司 一种卧式双面镀膜机

Similar Documents

Publication Publication Date Title
WO2000028587A1 (en) Processing device
JP4821074B2 (ja) 処理システム
KR100514160B1 (ko) 기판처리장치 및 기판처리방법
US6382895B1 (en) Substrate processing apparatus
EP0398365B1 (en) Multiple chamber staged-vacuum semiconductor wafer processing system
JP3447698B2 (ja) 2ウエハ・ロードロック・ウエハ処理装置ならびにその装填および排出方法
CN102099907B (zh) 工件传送系统和方法
JPH10144757A (ja) 基板処理システム
JP2000208589A (ja) 処理装置
JP3215643B2 (ja) プラズマ処理装置
JP2002517088A (ja) 半導体ウエハハンドリング用バッチ式エンドエフェクタ
KR100850815B1 (ko) 처리 장치
JPH05304197A (ja) マルチチャンバシステム
JP3604241B2 (ja) 縦型熱処理装置
JPH07122618A (ja) 真空処理装置
JPH08340036A (ja) 処理装置
JPH09246351A (ja) クリーン搬送方法、クリーン搬送装置及びクリーン装置
JPH11195691A5 (https=)
JPH11102951A (ja) 処理装置
JP3188956B2 (ja) 成膜処理装置
JP4014059B2 (ja) 枚葉式真空処理装置
JPH0615720B2 (ja) 真空処理装置
JP2767142B2 (ja) 真空処理装置用ユニット
JP3121022B2 (ja) 減圧処理装置
JP3160691B2 (ja) 処理装置