JP4014059B2 - 枚葉式真空処理装置 - Google Patents
枚葉式真空処理装置 Download PDFInfo
- Publication number
- JP4014059B2 JP4014059B2 JP36955197A JP36955197A JP4014059B2 JP 4014059 B2 JP4014059 B2 JP 4014059B2 JP 36955197 A JP36955197 A JP 36955197A JP 36955197 A JP36955197 A JP 36955197A JP 4014059 B2 JP4014059 B2 JP 4014059B2
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- substrate
- wafer
- vacuum processing
- valve body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims description 78
- 238000012546 transfer Methods 0.000 claims description 106
- 239000000758 substrate Substances 0.000 claims description 74
- 238000010438 heat treatment Methods 0.000 claims description 58
- 238000005192 partition Methods 0.000 claims description 26
- 238000001816 cooling Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 9
- 239000011148 porous material Substances 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 238000005468 ion implantation Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 108
- 238000002360 preparation method Methods 0.000 description 51
- 230000015572 biosynthetic process Effects 0.000 description 24
- 238000000605 extraction Methods 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Landscapes
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36955197A JP4014059B2 (ja) | 1997-12-29 | 1997-12-29 | 枚葉式真空処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36955197A JP4014059B2 (ja) | 1997-12-29 | 1997-12-29 | 枚葉式真空処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11195691A JPH11195691A (ja) | 1999-07-21 |
| JPH11195691A5 JPH11195691A5 (https=) | 2005-06-23 |
| JP4014059B2 true JP4014059B2 (ja) | 2007-11-28 |
Family
ID=18494716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36955197A Expired - Fee Related JP4014059B2 (ja) | 1997-12-29 | 1997-12-29 | 枚葉式真空処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4014059B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6468353B1 (en) * | 1997-06-04 | 2002-10-22 | Applied Materials, Inc. | Method and apparatus for improved substrate handling |
| CN116590679A (zh) * | 2023-06-02 | 2023-08-15 | 湘潭宏大真空技术股份有限公司 | 一种真空磁控溅射卧式双面镀膜系统 |
| CN117845184A (zh) * | 2023-12-28 | 2024-04-09 | 湘潭宏大真空技术股份有限公司 | 一种卧式双面镀膜机 |
-
1997
- 1997-12-29 JP JP36955197A patent/JP4014059B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11195691A (ja) | 1999-07-21 |
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