TWI445976B - Module ic handler and loading method in module ic handler - Google Patents

Module ic handler and loading method in module ic handler Download PDF

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Publication number
TWI445976B
TWI445976B TW100117115A TW100117115A TWI445976B TW I445976 B TWI445976 B TW I445976B TW 100117115 A TW100117115 A TW 100117115A TW 100117115 A TW100117115 A TW 100117115A TW I445976 B TWI445976 B TW I445976B
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Prior art keywords
carrier
integrated circuit
module
loading
module integrated
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TW100117115A
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Chinese (zh)
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TW201144196A (en
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Yun-Sung Na
Dong-Hyun Yo
Seok-Hee Lee
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Tech Wing Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02Measures preceding sorting, e.g. arranging articles in a stream orientating
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Description

模組積體電路分選機及模組積體電路分選機的上載方法Upload method of module integrated circuit sorting machine and module integrated circuit sorting machine

本發明涉及模組積體電路(Module IC)等,具體地講,涉及用於檢測模組IC是否裝載到載體(carrier)的技術。The present invention relates to a module integrated circuit (Module IC) and the like, and in particular to a technique for detecting whether a module IC is loaded to a carrier.

模組積體電路(Module IC,或者又稱為「模組隨機存取器(Module RAM)」)是將多個積體電路(IC)和其他元件固定到在電路板的一面或兩面而構成的獨立的電路,是電腦裝置的運行所必需的重要部件並且價格高昂。A module IC (also known as a "module random accessor") is a device that fixes a plurality of integrated circuits (ICs) and other components to one or both sides of a circuit board. The independent circuit is an important part of the operation of the computer device and is expensive.

因此,在產品製造之後並在出廠之前,必需執行嚴格的性能測試。Therefore, rigorous performance testing must be performed after the product is manufactured and before it leaves the factory.

為了這種模組IC的測試,除測試器之外,還需要將模組IC與測試器電性連接的模組IC分選機(handler)。In order to test the module IC, in addition to the tester, a module IC sorter electrically connecting the module IC and the tester is required.

模組IC分選機執行如下的操作,即,通過拾取(pick up)裝置將模組IC裝載到位於上載位置處的載體,通過移送裝置將裝載有模組IC的載體移送到測試艙(test chamber)來對裝載到載體的模組IC進行測試,並通過另一移送裝置將裝載有完成測試的模組IC的載體移送到分類(sorting)位置之後,將模組IC從載體卸載的同時根據測試結果進行分類,而卸載了模組IC的空載體通過另一移送裝置從分類位置被移送到上載位置。The module IC sorting machine performs the operation of loading the module IC to the carrier at the uploading position by a pick up device, and transferring the carrier loaded with the module IC to the test chamber through the transfer device (test The chamber IC is used to test the module IC loaded into the carrier, and the carrier loaded with the module IC for completing the test is transferred to the sorting position by another transfer device, and the module IC is unloaded from the carrier. The test results are classified, and the empty carrier from which the module IC is unloaded is transferred from the sorting position to the uploading position by another transfer device.

然而,如果載體以在分類位置處沒有完全清空模組IC 的狀態被移送到上載位置,則對裝載操作產生不良影響。However, if the carrier does not completely empty the module IC at the sorting position The status is moved to the upload location, which adversely affects the load operation.

另外,如果其他因素對裝載操作產生不良影響,則產生這種問題,即,在裝載位置處的載體以沒有裝滿模組IC的狀態被移送到測試艙。另外,韓國授權專利355422號(發明名稱:半導體裝置實驗裝置)揭示具有能夠感測測試盤(test tray)是否裝載了半導體元件的IC檢測感測器的技術(以下,稱作「現有技術」)。In addition, if other factors adversely affect the loading operation, the problem arises that the carrier at the loading position is transferred to the test chamber without being filled with the module IC. In addition, Korean Patent No. 355422 (invention name: semiconductor device experimental device) discloses a technology having an IC detecting sensor capable of sensing whether or not a test tray is loaded with a semiconductor element (hereinafter, referred to as "prior art") .

根據現有技術,IC檢測感測器佈置於上載位置與卸載位置之間,並包括位於上側的光源和位於下側的收光器。因此,現有技術形成為,在卸載位置處清空半導體元件的測試盤向上載位置移送的程序中根據收光器是否感測到光,來確認測試盤是否裝載有半導體元件。According to the prior art, the IC detecting sensor is disposed between the loading position and the unloading position, and includes a light source on the upper side and a light receiver on the lower side. Therefore, the prior art is formed to confirm whether or not the test disc is loaded with the semiconductor element in the procedure of transferring the test disc of the semiconductor element to the upload position at the unloading position, depending on whether the light is sensed by the light receiver.

但是,難以將所述現有技術直接應用於模組IC分選機。However, it is difficult to directly apply the prior art to a module IC sorting machine.

原因在於,對於支援半導體元件的測試的測試分選機,由圖1a可知,裝載到測試盤的半導體元件D具有較寬的水平面積,所以可通過在上下側形成光源O和收光器I來進行較準確的檢測。然而,對於支援模組IC的測試的模組IC分選機,由圖1b可知,模組IC M以垂直的狀態立起的同時被裝載到載體,所以小的水平面積導致難以通過現有技術進行準確的檢測。The reason is that, for the test sorter supporting the test of the semiconductor element, as can be seen from FIG. 1a, the semiconductor element D loaded to the test disc has a wide horizontal area, so that the light source O and the light receiver I can be formed on the upper and lower sides. Perform a more accurate test. However, for the module IC sorting machine that supports the test of the module IC, as can be seen from FIG. 1b, the module IC M is loaded into the carrier while standing in a vertical state, so that a small horizontal area makes it difficult to perform by the prior art. Accurate detection.

此外,現有技術是關於在測試盤從卸載位置移送到上載位置的途中檢測測試盤是否完全清空了半導體元件的技術,所以在上載位置處難以檢測測試盤是否裝滿了半導體元件。Further, the prior art relates to a technique of detecting whether or not the test disc completely empties the semiconductor element on the way from the unloading position to the loading position, so it is difficult to detect whether the test disc is full of semiconductor elements at the loading position.

此外,通過參照圖2a可知,對於模組IC M,偏向一側形成有用於將電性連接端子恰當地連接到被連接對象並辨識連接端子的正確方向的方向槽DS。因此,當模組IC M以如圖2b所示的狀態裝載到載體時,必然會引起測試不良。Further, as can be seen from FIG. 2a, for the module IC M, a direction groove DS for appropriately connecting the electrical connection terminal to the connected object and recognizing the correct direction of the connection terminal is formed on one side of the module IC M. Therefore, when the module IC M is loaded into the carrier in the state shown in Fig. 2b, the test failure is inevitably caused.

因此,對於模組IC分選機,也需要在安裝操作程序中自動地確認模組IC是否從載體完全清空,進一步地,需要確認模組IC是否裝載到載體或者模組IC是否以正確的方向裝載到載體,但是由於上述的原因,難以將現有技術應用於模組IC分選機。Therefore, for the module IC sorting machine, it is also necessary to automatically confirm whether the module IC is completely emptied from the carrier in the installation operation program. Further, it is necessary to confirm whether the module IC is loaded into the carrier or whether the module IC is in the correct direction. Loading to the carrier, but for the above reasons, it is difficult to apply the prior art to the module IC sorting machine.

本發明的第一目的在於提供在模組IC分選機中也能夠確認模組IC是否裝載到載體的技術。A first object of the present invention is to provide a technique for confirming whether or not a module IC is loaded into a carrier in a module IC sorting machine.

另外,本發明的第二目的在於提供能夠確認模組IC是否以正確的方向裝載到載體的技術。Further, a second object of the present invention is to provide a technique capable of confirming whether or not a module IC is loaded into a carrier in a correct direction.

為了達到上述的目的,根據本發明,一種模組積體電路分選機包括:載體,用以裝載及搬運模組積體電路;操作裝置,操作所述載體,以能夠在所述載體上裝載模組積體電路;及,裝載檢測裝置,用於檢測所述載體上是否裝載有模組積體電路,其中所述裝載檢測裝置搭載於所述操作裝置。In order to achieve the above object, according to the present invention, a modular integrated circuit sorting machine includes: a carrier for loading and transporting a modular integrated circuit; and an operating device that operates the carrier to be capable of loading on the carrier a module integrated circuit; and a load detecting device for detecting whether or not the module integrated circuit is mounted on the carrier, wherein the loading detecting device is mounted on the operating device.

為了檢測裝載到所述載體的模組積體電路,優選地還可包括搭載到所述操作裝置的方向檢測裝置。In order to detect the module integrated circuit loaded to the carrier, it is preferable to further include a direction detecting device mounted to the operating device.

此外,為了達到上述目的,根據本發明,一種模組積體 電路分選機包括:載體,用以裝載及搬運模組積體電路;操作裝置,操作所述載體,以能夠在所述載體上裝載模組積體電路;及,方向檢測裝置,用於檢測裝載到所述載體的模組積體電路的方向,其中所述方向檢測裝置搭載於所述操作裝置。Further, in order to achieve the above object, according to the present invention, a modular integrated body The circuit sorting machine includes: a carrier for loading and transporting the module integrated circuit; an operating device, the carrier is operated to be capable of loading the module integrated circuit on the carrier; and a direction detecting device for detecting Loading in the direction of the module integrated circuit of the carrier, wherein the direction detecting device is mounted on the operating device.

所述方向檢測裝置包括固定於所述操作裝置的固定部件和結合到所述固定部件的方向檢測器。所述固定部件具有凸出於裝載到所述載體的模組積體電路之間的凸出部分。所述凸出部分具有通過槽,所述通過槽位於與形成於正確的裝載到所述載體的模組積體電路的方向槽處於同一直線的位置。所述方向檢測器包括結合於所述固定部件的一側面並發出通過所述方向槽和所述通過槽的光的發光元件和結合於所述固定部件的另一側,並用於辨識來自所述發光元件的光的辨識元件。The direction detecting device includes a fixing member fixed to the operating device and a direction detector coupled to the fixing member. The fixing member has a convex portion that protrudes between the module integrated circuits loaded to the carrier. The protruding portion has a through groove located at a position in line with a direction groove formed in a module integrated circuit that is correctly loaded to the carrier. The direction detector includes a light emitting element coupled to one side of the fixing member and emitting light passing through the direction groove and the passing groove, and another side coupled to the fixing member, and is used for recognizing from the An identification component of the light of the illuminating element.

此外,為了達到上述目的,根據本發明,一種模組積體電路分選機的上載方法包括:當載體移動到上載位置時,使用操作裝置對在載體進行操作,以將模組積體電路裝載到載體的操作步驟;將模組積體電路裝載到載體的裝載步驟;當在載體上裝滿模組積體電路時,在載體被操作為在載體上能夠裝載模組積體電路的狀態下,檢測是否裝載有模組積體電路的上載檢測步驟;當檢測到在載體上裝滿模組積體電路時,解除載體的操作狀態的解除步驟。In addition, in order to achieve the above object, according to the present invention, a method for uploading a modular integrated circuit sorter includes: when the carrier is moved to an uploading position, operating the carrier using an operating device to load the modular integrated circuit The operation step to the carrier; the loading step of loading the module integrated circuit into the carrier; when the carrier integrated circuit is filled on the carrier, the carrier is operated to be capable of loading the module integrated circuit on the carrier And detecting an upload detecting step of loading the module integrated circuit; and when detecting that the module integrated circuit is filled on the carrier, releasing the step of releasing the operating state of the carrier.

在所述操作步驟與裝載步驟之間,優選地還可包括:在操作為在載體上能夠裝載模組積體電路的狀態下,檢測載體 是否清空模組積體電路的卸載檢測步驟。Between the operating step and the loading step, preferably, the method further comprises: detecting the carrier in a state of being operable to load the module integrated circuit on the carrier Whether to clear the uninstall detection step of the module integrated circuit.

在所述解除步驟之後,優選地還可包括檢測裝載到載體的模組積體電路的裝載方向的方向檢測步驟。After the releasing step, it is preferable to further include a direction detecting step of detecting the loading direction of the module integrated circuit loaded to the carrier.

根據如上的本發明,在操作載體,以能夠在載體上裝載模組IC裝的操作裝置上搭載裝載檢測裝置及/或方向檢測裝置,具有如下的效果。According to the present invention as described above, the load detecting device and/or the direction detecting device are mounted on the operation device capable of loading the module IC on the carrier, and have the following effects.

首先,在模組IC分選機也可以正確地確認載體是否完全清空模組IC。First, the module IC sorter can also correctly confirm whether the carrier completely empties the module IC.

其次,還可確認載體是否裝滿模組IC。Secondly, it can also be confirmed whether the carrier is full of the module IC.

最後,可確認模組IC是否以正確的方向裝載到載體。Finally, it can be confirmed whether the module IC is loaded into the carrier in the correct direction.

以下,將參照附圖說明如上的根據本發明的優選實施例,為了說明的簡潔,盡可能地省略或壓縮重複的說明。Hereinafter, the preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, and the repeated description is omitted or compressed as much as possible for the sake of brevity.

<對於載體的示例><Example for carrier>

圖3是根據本發明實施例的載體300的立體圖,圖4是圖3的載體300的局部分解立體圖。3 is a perspective view of a carrier 300 according to an embodiment of the present invention, and FIG. 4 is a partially exploded perspective view of the carrier 300 of FIG.

由圖3和圖4的參照可知,載體300形成為包括框架310、一對結合台321、322、2×16個插頭331a至331p、332a至332p、2×16個彈簧341a至341p、342a至342p和一對防止脫離桿351、352等。3 and FIG. 4, the carrier 300 is formed to include a frame 310, a pair of bonding stages 321, 322, 2×16 plugs 331a to 331p, 332a to 332p, and 2×16 springs 341a to 341p, 342a to 342p and a pair of prevention levers 351, 352 and the like.

框架310是四角框架形狀,直接或間接地支撐所述一對 結合桿321、322、所述2×16個插頭331a至331p、332a至332p、所述2×16個彈簧341a至341p、342a至342p和所述一對防止脫離桿351、352The frame 310 is in the shape of a square frame that directly or indirectly supports the pair Bonding rods 321, 322, said 2 x 16 plugs 331a to 331p, 332a to 332p, said 2 x 16 springs 341a to 341p, 342a to 342p, and said pair of separation preventing levers 351, 352

一對結合桿321、322固定於框架310,並沿相互面對的方向(以下,稱作「內側方向」)對稱地佈置。這種一對結合桿321、322中的每一個形成有能夠插入插頭331a至331p、332a至332p的朝內側方向開口的16個插頭插入槽IG。A pair of coupling bars 321, 322 are fixed to the frame 310 and are symmetrically arranged in a direction facing each other (hereinafter, referred to as "inside direction"). Each of the pair of coupling bars 321, 322 is formed with 16 plug insertion grooves IG that can be inserted into the plugs 331a to 331p, 332a to 332p in the inward direction.

2×16個插頭331a至331p、332a至332p沿與內側方向相反的方向(以下,稱作「外側方向」)能夠移動預定間隔地分別設置到一對結合桿321、322,其中16個插頭設置到一側的結合桿321,剩餘16個設置到另一側的結合桿322。這種插頭331a至331p、332a至332p是為了夾持模組IC而設置的,由圖5的參照圖可知,相互面對的一對插頭331a、332a將夾持一個模組IC M的兩端。而且,插頭331a至331p、332a至332p中的每一個在其底面具有用於引導插頭331a至331p、332a至332p的位置的引導槽GG。2 × 16 plugs 331a to 331p, 332a to 332p are respectively disposed in a direction opposite to the inner direction (hereinafter referred to as "outer direction") to a pair of coupling bars 321, 322 at predetermined intervals, of which 16 plugs are provided To the coupling rod 321 on one side, the remaining 16 are coupled to the coupling rod 322 on the other side. The plugs 331a to 331p, 332a to 332p are provided for clamping the module IC. As can be seen from the reference drawing of Fig. 5, the pair of plugs 331a, 332a facing each other will clamp the two ends of a module IC M. . Moreover, each of the plugs 331a to 331p, 332a to 332p has a guide groove GG at its bottom surface for guiding the positions of the plugs 331a to 331p, 332a to 332p.

2×16個彈簧341a至341p、342a至342p中的每一個佈置為彈性支撐結合桿321、322與插頭331a至331p、332a至332p之間,並設置為用於向插頭331a至331p、332a至332p施加內側方向的彈性力的彈性部件。Each of the 2×16 springs 341a to 341p, 342a to 342p is disposed between the elastic support coupling bars 321, 322 and the plugs 331a to 331p, 332a to 332p, and is provided for the plugs 331a to 331p, 332a to 332p An elastic member that applies an elastic force in the inner direction.

一對防止脫離桿351、352分別固定設置於一對結合桿321、322,並用於防止插頭331a至331p、332a至332p朝上方向脫離。The pair of prevention levers 351, 352 are fixedly disposed to the pair of coupling bars 321, 322, respectively, and are used to prevent the plugs 331a to 331p, 332a to 332p from being detached upward.

<對於操作裝置的示例><Example of operating device>

如上所述,為了在載體300上裝載模組IC,通過對插頭331a至331p、332a至332p施加額外的外力來增加相互面對的成對的插頭331a-332a至331p-332p之間的間距,並為了執行這種功能而設置如圖6所示的專門的操作裝置600。As described above, in order to mount the module IC on the carrier 300, the distance between the pair of plugs 331a-332a to 331p-332p facing each other is increased by applying an additional external force to the plugs 331a to 331p, 332a to 332p, In order to perform such a function, a special operating device 600 as shown in Fig. 6 is provided.

如圖6所示,操作裝置600形成為包括操作板610和升降源620。As shown in FIG. 6, the operation device 600 is formed to include an operation panel 610 and a lifting source 620.

操作板610可以進行升降,並在其上面具有2×16個引導棒GB1a至GB1p、GB2a至GB2p。2×16個引導棒GB1a至GB1p、GB2a至GB2p通過分別插入到形成於載體300的2×16個插頭331a至331p、332a至332p的底面的引導槽GG,來執行作為向2×16個插頭331a至331p、332a至332p施加朝外側方向的外力的主體的功能。The operation panel 610 can be lifted and lowered, and has 2 × 16 guide bars GB1a to GB1p, GB2a to GB2p thereon. The 2 × 16 guide bars GB1a to GB1p, GB2a to GB2p are respectively inserted into the guide grooves GG formed on the bottom surfaces of the 2 × 16 plugs 331a to 331p, 332a to 332p of the carrier 300 as 2 × 16 plugs The functions of the main body of the external force in the outward direction are applied to 331a to 331p, 332a to 332p.

由圖7的參照圖可知,當從平面看時,相比於插頭331a至331p、332a至332p的引導槽GG的中心Cb,引導棒GB1a至GB1p、GB2a至GB2p的中心(Ca)向外偏離一定距離S。此外,引導棒GB1a至GB1p、GB2a至GB2p具有沿下方向外徑逐漸變大的形狀。因此,如圖8的參照圖一樣,當操作板610上升時,從引導棒GB1a至GB1p、GB2a至GB2p的較尖的端部插入到引導槽GG的邊緣部分開始,向插頭331a至331p、332a至332p施加朝外側方向的力。As can be seen from the reference drawing of Fig. 7, when viewed from the plane, the centers (Ca) of the guide bars GB1a to GB1p, GB2a to GB2p are outwardly deviated from the center Cb of the guide grooves GG of the plugs 331a to 331p, 332a to 332p. A certain distance S. Further, the guide bars GB1a to GB1p, GB2a to GB2p have a shape in which the outer diameter gradually increases in the lower direction. Therefore, as in the reference drawing of Fig. 8, when the operation panel 610 is raised, the sharper end portions of the guide bars GB1a to GB1p, GB2a to GB2p are inserted into the edge portion of the guide groove GG, and the plugs 331a to 331p, 332a are started. The force to the outside direction is applied to 332p.

升降源620執行作為使操作板610升降移動的移動源的作用。The lift source 620 functions as a movement source that moves the operation panel 610 up and down.

在此,升降源620被構造為,當使操作板610下降時通 過兩個階段逐次地下降操作板610。這種升降源620可由電機或多個汽缸構成。Here, the lift source 620 is configured to pass when the operation panel 610 is lowered The operation panel 610 is successively lowered in two stages. Such a lift source 620 can be constructed from a motor or a plurality of cylinders.

以下描述在具有上述結構的載體300和操作裝置600中,操作裝置600操作載體300以將模組IC裝載到載體300或者解除載體300的操作的動作。In the carrier 300 and the operation device 600 having the above structure, the operation of the operation device 600 to operate the carrier 300 to load the module IC to the carrier 300 or to release the operation of the carrier 300 will be described below.

當升降源620運行,使得操作板610上升時,操作板610的引導棒GB1a至GB1p、GB2a至GB2p插入到引導槽GG,並且插頭331a至331p、332a至332p被推向外側方向;當達到操作裝置600的操作結束的狀態時,插頭331a至331p、332a至332p變成最大限度地被推向外側的狀態,從而可在載體300上裝載模組IC。When the elevation source 620 is operated such that the operation panel 610 is raised, the guide bars GB1a to GB1p, GB2a to GB2p of the operation panel 610 are inserted into the guide groove GG, and the plugs 331a to 331p, 332a to 332p are pushed to the outer direction; when the operation is reached When the operation of the apparatus 600 is completed, the plugs 331a to 331p, 332a to 332p are pushed to the outside as much as possible, so that the module IC can be loaded on the carrier 300.

此外,當通過拾取裝置(未示出)在載體300上裝載全部16個模組IC時,升降源620運行,使得操作板610稍微下降一階段,據此,插頭331a至331p、332a至332p通過彈簧341a至341p、342a至342p的作用而朝內側方向移動的同時對裝載的模組IC的兩端進行彈性施壓,從而堅固地固定模組IC,然後,升降源620運行,使得操作板610完全下降。Further, when all of the 16 module ICs are loaded on the carrier 300 by the pickup device (not shown), the elevation source 620 operates, causing the operation panel 610 to be slightly lowered by one stage, whereby the plugs 331a to 331p, 332a to 332p pass When the springs 341a to 341p, 342a to 342p are moved in the inward direction, the two ends of the loaded module IC are elastically pressed, thereby firmly fixing the module IC, and then the lifting source 620 is operated, so that the operation panel 610 is operated. Completely down.

<對於裝載及方向檢測裝置的示例><Example of loading and direction detecting device>

參照圖9可知,裝載及方向檢測裝置900形成為包括固定部件910、16個裝載檢測器920a至920p和方向檢測器930。Referring to FIG. 9, the loading and direction detecting device 900 is formed to include a fixing member 910, 16 loading detectors 920a to 920p, and a direction detector 930.

參照圖10可知,固定部件910設置為固定地搭載到操作裝置600的操作板610,更為詳細地講,位於以每列16個佈置為2列的引導棒GB1a至GB1p、GB2a至GB2p的列與列 之間。這種固定部件910具有凸出於裝載到載體300的模組IC M之間的凸出部分PP。此外,凸出部分PP具有以一列整齊地位於與形成於模組IC M的方向槽DS相同的直線上的位置的多個通過槽PS。Referring to Fig. 10, the fixing member 910 is provided to be fixedly mounted to the operation panel 610 of the operation device 600, and more specifically, to the columns of the guide bars GB1a to GB1p, GB2a to GB2p arranged in two columns of 16 columns per column. With columns between. This fixing member 910 has a convex portion PP protruding from between the modules IC M loaded to the carrier 300. Further, the convex portion PP has a plurality of through grooves PS which are positioned neatly in a position on the same straight line as the direction groove DS formed in the module IC M.

在此,如果後述的方向檢測器930的發光元件931和辨識元件932的直進性能好,則無需製造凸出部分PP和凸出部分PP的通過槽PS。但是,直進性好的檢測器的價格高,而價格低的檢測器具有發散的性質,因此為了在使用低價的檢測器時阻擋發光元件的發散的部分,應具有凸出部分PP以進行更準確的檢測。Here, if the straight-lighting performance of the light-emitting element 931 and the identification element 932 of the direction detector 930 described later is good, it is not necessary to manufacture the through-grooves PS of the convex portion PP and the convex portion PP. However, the detector with good straightness is expensive, and the detector with low price has a diverging property, so in order to block the diverging portion of the light-emitting element when using a low-cost detector, there should be a protruding portion PP for further Accurate detection.

16個裝載檢測器920a至920p結合到凸出部分PP,並具有成對的發光元件921和辨識元件922。The 16 load detectors 920a to 920p are coupled to the convex portion PP, and have a pair of light-emitting elements 921 and identification elements 922.

可選地,根據實際實施方案,代替所述16個裝載檢測器結合到凸出部分PP,可將16個裝載檢測器920a至920p與凸出部分PP無關地直接固定設置到操作板。Alternatively, according to an actual embodiment, instead of the 16 loading detectors being coupled to the protruding portion PP, the 16 loading detectors 920a to 920p may be directly fixedly set to the operation panel independently of the protruding portion PP.

發光元件921和辨識元件922中間隔著模組IC M而在兩側分別結合到凸出部分PP,其中所述模組IC M的下端部插入到形成於凸出部分PP之間的的凹陷的檢測槽SS。在此,設置於一側的發光元件921發射光,設置於另一側的辨識元件922辨識來自發光元件921的光。因此,當從發光元件921發射的光被辨識元件922辨識時,檢測為不存在模組IC M;當從發光元件921發射的光沒有被辨識元件922辨識時,檢測為存在模組IC M。The light-emitting element 921 and the identification element 922 are respectively coupled to the convex portion PP on both sides with the module IC M interposed therebetween, wherein the lower end portion of the module IC M is inserted into the recess formed between the convex portions PP Detection slot SS. Here, the light-emitting element 921 disposed on one side emits light, and the identification element 922 disposed on the other side recognizes light from the light-emitting element 921. Therefore, when the light emitted from the light-emitting element 921 is recognized by the identification element 922, it is detected that the module IC M is absent; when the light emitted from the light-emitting element 921 is not recognized by the identification element 922, it is detected that the module IC M is present.

方向檢測器930也具有成對的發光元件931和辨識元件 932,發光元件931結合到固定部件910的一側端,辨識元件932結合到固定部件910的另一側端。發光元件931發射通過方向槽DS和通過槽PS的光,辨識元件932辨識由發光元件931發射的光。因此,當下端部插入到檢測槽SS的16片模組IC M的方向正確地一致時,從發光元件931發射的光就會被辨識元件932辨識;當在16片模組IC M中,即使有一片以上的模組IC M位於錯誤的方向時,從發光元件931發射的光將無法被辨識元件932所辨識。The direction detector 930 also has a pair of light-emitting elements 931 and identification elements 932, the light-emitting element 931 is coupled to one side end of the fixed member 910, and the identification member 932 is coupled to the other side end of the fixed member 910. The light-emitting element 931 emits light passing through the direction groove DS and passing through the groove PS, and the identification element 932 recognizes the light emitted by the light-emitting element 931. Therefore, when the direction of the 16-chip module IC M inserted into the detecting slot SS is correctly aligned, the light emitted from the light-emitting element 931 is recognized by the identifying component 932; even in the 16-chip IC M, even When more than one module IC M is in the wrong direction, the light emitted from the light-emitting element 931 will not be recognized by the identification element 932.

繼續地,參照圖11的流程圖來描述具有上述的結構部件的包括載體300、操作裝置600、裝載及方向檢測裝置900的模組IC分選機。Continuing, a module IC sorting machine including the carrier 300, the operating device 600, and the loading and direction detecting device 900 having the above-described structural components will be described with reference to the flowchart of FIG.

<對於安裝方法的示例><Example of installation method>

1.操作<S111>1. Operation <S111>

當空的載體300被移送到上載位置時,參照圖12可知,通過操作裝置600的運行來使操作板610上升並操作載體300,使得載體300的相互面對的成對的插頭331a至33p、332a至332p之間的間距加大,從而能夠將模組IC M裝載到載體300。When the empty carrier 300 is transferred to the loading position, referring to FIG. 12, the operation panel 610 is raised and the carrier 300 is operated by the operation of the operating device 600, so that the paired plugs 331a to 33p, 332a of the carrier 300 facing each other. The pitch to 332p is increased, so that the module IC M can be loaded to the carrier 300.

2.卸載檢測<S112>2. Unload detection <S112>

在載體300通過步驟S111被操作的狀態下,裝載檢測器920a至920p運行並檢測是否在先前的卸載作業程序中模組IC M從位於當前上載位置處的載體300全部被卸載,從而使載體300完全清空模組IC M。In a state where the carrier 300 is operated by the step S111, the loading detectors 920a to 920p operate and detect whether the module IC M is completely unloaded from the carrier 300 located at the current uploading position in the previous unloading operation program, thereby causing the carrier 300 The module IC M is completely emptied.

如果檢測到載體300沒有完全清空模組IC M,則模組IC分選機產生中斷(JAM);如果檢測到載體300完全清空模組IC M,則進行到下一階段。If it is detected that the carrier 300 does not completely empty the module IC M, the module IC sorter generates an interrupt (JAM); if it detects that the carrier 300 completely clears the module IC M, it proceeds to the next stage.

3.裝載<S113>3. Load <S113>

對於清空模組IC M的載體300運行單獨的拾取裝置(未示出),如圖13所示,從而裝載新的模組IC M。A separate pick-up device (not shown) is run for the carrier 300 that empties the module IC M, as shown in Figure 13, thereby loading a new module IC M.

4.上載檢測<S114>4. Upload detection <S114>

當拾取裝置完成作業時,在被操作為模組IC M能夠裝載載體300的狀態(即,操作板上升的狀態)下,裝載檢測器920a至920p重新運行來檢測是否裝載了模組IC M。When the pickup device completes the job, in a state in which the module IC M can be loaded with the carrier 300 (i.e., the state in which the operation panel is raised), the load detectors 920a to 920p are re-run to detect whether or not the module IC M is loaded.

如果16個裝載檢測器920a至920p中的任意一個沒有檢測到模組IC M,則產生中斷;如果16個裝載檢測器920a至920p全部檢測到模組IC M,則進行到下一階段。If the module IC M is not detected by any of the 16 load detectors 920a to 920p, an interrupt is generated; if all of the 16 load detectors 920a to 920p detect the module IC M, the next stage is performed.

5.解除<S115>5. Release <S115>

當裝滿模組IC M時,如圖14所示,操作裝置600通過運行以僅能夠解除載體300的操作狀態的程度將操作板610下降一階段,從而解除載體300的操作狀態。方向檢測器930下降且與DS對準,並能檢測模組IC M的裝載方向。如果將操作板610完全下降,則無法通過結合到操作板610的方向檢測器930來檢測模組IC M的裝載方向,所以僅以結合到操作板610的方向檢測器930檢測到模組IC M的裝載方向的程度下降一階段。When the module IC M is filled, as shown in FIG. 14, the operation device 600 lowers the operation panel 610 by one stage by the operation to the extent that the operation state of the carrier 300 can be released, thereby releasing the operation state of the carrier 300. The direction detector 930 is lowered and aligned with the DS, and can detect the loading direction of the module IC M. If the operation panel 610 is completely lowered, the loading direction of the module IC M cannot be detected by the direction detector 930 coupled to the operation panel 610, so the module IC M is detected only by the direction detector 930 coupled to the operation panel 610. The degree of loading direction is reduced by one stage.

6.方向檢測<S116>6. Direction detection <S116>

在通過操作板610下降一階段來解除載體300的操作的 狀態下,通過方向檢測器930的運行來檢測裝載到載體300的16個模組IC M的裝載方向是否正確。The operation of the carrier 300 is released by one stage of lowering through the operation panel 610. In the state, it is detected by the operation of the direction detector 930 whether the loading direction of the 16 modules IC M loaded to the carrier 300 is correct.

如果方向檢測器930的辨識元件932沒有辨識出從發光元件931發射的光,則產生中斷;如果方向檢測器930的辨識元件932辨識出從發光元件931發射的光,則進行到下一步驟。If the identification element 932 of the direction detector 930 does not recognize the light emitted from the light-emitting element 931, an interruption occurs; if the identification element 932 of the direction detector 930 recognizes the light emitted from the light-emitting element 931, it proceeds to the next step.

當然,雖然還可以實現為在解除載體300之前進行方向檢測,但是如本實施例一樣,可優選實現為在解除載體300的操作之後進行方向檢測。其原因在於,在解除載體之前,模組IC還未處於正確排列並被固定於插頭的狀態,模組IC的方向槽有可能不在同一直線上。Of course, although it is also possible to perform the direction detection before the carrier 300 is released, as in the present embodiment, it may preferably be implemented to perform the direction detection after the operation of the carrier 300 is released. The reason is that before the carrier is released, the module ICs are not properly aligned and fixed to the plug, and the direction slots of the module IC may not be on the same line.

7.下降<S117>7. Fall <S117>

當模組IC M的裝載方向全部正確時,再次運行升降源620從而完全下降操作板620。When the loading direction of the module IC M is all correct, the lifting source 620 is again operated to completely lower the operation panel 620.

另外,當實現為在方向檢測之後解除載體的操作時,在上述的流程中,可實現為裝載檢測步驟和方向檢測步驟同時進行,或者,可實現為方向檢測在裝載檢測之前進行。此外,根據設備結構、裝載檢測器和方向檢測器的大小和設置位置,可充分地實現為先解除載體的操作之後,進行裝載檢測和方向檢測。In addition, when the operation of releasing the carrier after the direction detection is realized, in the above-described flow, the loading detecting step and the direction detecting step may be simultaneously performed, or alternatively, the direction detecting may be performed before the loading detection. Further, according to the device structure, the size of the loading detector and the direction detector, and the setting position, it is possible to sufficiently perform the load detection and the direction detection after the operation of releasing the carrier first.

另外,上述的描述將具有圖3的載體300與圖6的操作裝置600之間的關係的情況作為示例進行了說明。In addition, the above description has been described by taking a case where the relationship between the carrier 300 of FIG. 3 and the operating device 600 of FIG. 6 is taken as an example.

然而,可以理解,具有載體並應用了操作裝置的模組IC 分選機,能夠應用圖9的裝載及方向檢測裝置900,並且還可應用與圖11的流程一樣的安裝方法,其中所述載體用於以裝載模組IC M的狀態進行搬運,所述操作裝置能夠以在相關載體上裝載模組IC的狀態對該相關載體進行操作。However, it can be understood that the module IC having the carrier and applying the operating device The sorting machine can apply the loading and direction detecting device 900 of FIG. 9 and can also apply the same mounting method as the flow of FIG. 11, wherein the carrier is used for carrying in the state of the loading module IC M, the operation The device is capable of operating the associated carrier in a state in which the module IC is loaded on the associated carrier.

因此,雖然參照附圖的實施例進行了本發明的具體說明,然而,所述實施例僅對本發明的優選實施例進行的說明,因此本發明不應理解為局限於上述的實施例,請求項及其等同概念來解釋本發明的權利範圍。Accordingly, the present invention has been described with reference to the embodiments of the accompanying drawings. The equivalents are intended to explain the scope of the invention.

PP‧‧‧凸出部分PP‧‧‧ protruding part

PS‧‧‧通過槽PS‧‧‧through slot

300‧‧‧載體300‧‧‧ Carrier

600‧‧‧操作裝置600‧‧‧Operator

900‧‧‧裝載及方向檢測裝置900‧‧‧Loading and direction detecting device

910‧‧‧固定部件910‧‧‧Fixed parts

920‧‧‧裝載檢測器920‧‧‧Load detector

920a至920p‧‧‧裝載檢測器920a to 920p‧‧‧Load detector

921‧‧‧發光元件921‧‧‧Lighting elements

922‧‧‧辨識元件922‧‧‧ Identification component

930‧‧‧方向檢測器930‧‧‧ Directional Detector

931‧‧‧發光元件931‧‧‧Lighting elements

932‧‧‧辨識元件932‧‧‧ Identification component

SS‧‧‧檢測槽SS‧‧‧Detector

圖1a至1b及圖2a至2b是用於說明背景技術的參照圖。1a to 1b and Figs. 2a to 2b are reference drawings for explaining the background art.

圖3和圖4是應用於根據本發明實施例的模組IC分選機的載體的立體圖和局部分解立體圖。3 and 4 are a perspective view and a partially exploded perspective view of a carrier applied to a module IC sorting machine according to an embodiment of the present invention.

圖5是用於說明圖2的載體上裝載有模組IC的狀態的參照圖。Fig. 5 is a view for explaining a state in which a module IC is mounted on the carrier of Fig. 2;

圖6是應用於根據本發明實施例的模組IC分選機的操作裝置的立體圖6 is a perspective view of an operation device applied to a module IC sorting machine according to an embodiment of the present invention.

圖7和圖8是在說明圖6的操作裝置時所需參照的參照圖。7 and 8 are reference drawings which are required to be referred to when the operation device of Fig. 6 is explained.

圖9是應用於根據本發明實施例的模組IC分選機的裝載及方向檢測裝置的立體圖。9 is a perspective view of a loading and direction detecting device applied to a module IC sorting machine according to an embodiment of the present invention.

圖10是用於示出圖9的裝載及方向檢測裝置搭載到圖6的操作裝置的參照圖。Fig. 10 is a reference view for showing that the loading and direction detecting device of Fig. 9 is mounted to the operating device of Fig. 6;

圖11是根據本發明實施例的模組IC分選機中實現的上載方法的流程圖。11 is a flow chart of an uploading method implemented in a module IC sorting machine according to an embodiment of the present invention.

圖12至圖14是在說明參照圖11的流程圖時所要參照的參照圖。12 to 14 are reference drawings to be referred to when explaining the flowchart of Fig. 11.

900‧‧‧裝載及方向檢測裝置900‧‧‧Loading and direction detecting device

910‧‧‧固定部件910‧‧‧Fixed parts

920a至920p‧‧‧裝載檢測器920a to 920p‧‧‧Load detector

921‧‧‧發光元件921‧‧‧Lighting elements

922‧‧‧辨識元件922‧‧‧ Identification component

930‧‧‧方向檢測器930‧‧‧ Directional Detector

931‧‧‧發光元件931‧‧‧Lighting elements

932‧‧‧辨識元件932‧‧‧ Identification component

SS‧‧‧檢測槽SS‧‧‧Detector

Claims (7)

一種模組積體電路分選機,其中包括:載體,用以裝載及搬運模組積體電路;操作裝置,操作所述載體,以能夠在所述載體上裝載模組積體電路;及裝載檢測裝置,用於檢測所述載體上是否裝載有模組積體電路,其中所述裝載檢測裝置搭載於所述操作裝置,且其中所述檢測所述載體上是否裝載有模組積體電路之步驟,是在所述載體被所述操作裝置操作時之狀態下被實施。 A modular integrated circuit sorting machine, comprising: a carrier for loading and transporting a modular integrated circuit; an operating device for operating the carrier to be capable of loading a modular integrated circuit on the carrier; and loading a detecting device, configured to detect whether the module integrated circuit is mounted on the carrier, wherein the loading detecting device is mounted on the operating device, and wherein detecting whether the carrier is loaded with a module integrated circuit The step is carried out in a state in which the carrier is operated by the operating device. 如請求項1所述之模組積體電路分選機,還包括:搭載到所述操作裝置的方向檢測裝置,用於檢測裝載於所述載體的模組積體電路的方向。 The modular integrated circuit sorting machine according to claim 1, further comprising: a direction detecting device mounted to the operating device for detecting a direction of the module integrated circuit mounted on the carrier. 一種模組積體電路分選機,其中包括:載體,用以裝載及搬運模組積體電路;操作裝置,操作所述載體,以能夠在所述載體上裝載模組積體電路;及方向檢測裝置,用於檢測裝載到所述載體的模組積體電路的方向,其中所述方向檢測裝置搭載於所述操作裝置,且其中所述檢測裝載到所述載體的模組積體電路的方向之步驟,是在所述載體被所述操作裝置操作時之狀態下被實施。 A modular integrated circuit sorting machine, comprising: a carrier for loading and transporting a module integrated circuit; an operating device, operating the carrier to be capable of loading a module integrated circuit on the carrier; and a direction a detecting device for detecting a direction of a module integrated circuit loaded to the carrier, wherein the direction detecting device is mounted on the operating device, and wherein the detecting is performed on a module integrated circuit of the carrier The step of direction is carried out in a state in which the carrier is operated by the operating device. 如請求項3所述之模組積體電路分選機,其中所述方向檢測裝置包括固定於所述操作裝置的固定部件和結合到所述固定部件的方向檢測器,所述固定部件具有凸出於裝載到所述載體的模組積體電路之間的凸出部分,所述凸出部分具有通過槽,所述通過槽位於與形成於正確的裝載到所述載體的模組積體電路的方向槽處於同一直線的位置;所述方向檢測器包括結合於所述固定部件的一側面並發出通過所述方向槽和所述通過槽的光的發光元件和結合於所述固定部件的另一側,並用於辨識來自所述發光元件的光的辨識元件。 The modular integrated circuit sorting machine according to claim 3, wherein the direction detecting means includes a fixing member fixed to the operating device and a direction detector coupled to the fixing member, the fixing member having a convex a protruding portion having a passing portion between the module integrated circuits loaded to the carrier, the through portion being located in a module integrated circuit formed on the correct loading to the carrier The direction grooves are in the same straight line position; the direction detector includes a light emitting element coupled to one side of the fixing member and emitting light passing through the direction groove and the passing groove, and another coupling coupled to the fixing member One side, and an identification element for identifying light from the light-emitting element. 一種模組積體電路的上載方法,其中包括以下步驟:當載體移動到上載位置時,使用操作裝置對在載體進行操作,以將模組積體電路裝載到載體的操作步驟;將模組積體電路裝載到載體的裝載步驟;當在載體上裝滿模組積體電路時,在載體被操作為在載體上能夠裝載模組積體電路的狀態下,檢測是否裝載有模組積體電路的上載檢測步驟;當檢測到在載體上裝滿模組積體電路時,解除載體的操作狀態的解除步驟。 A method for uploading a module integrated circuit includes the following steps: when the carrier moves to the uploading position, using an operating device to operate the carrier to load the module integrated circuit into the carrier; Loading step of loading the body circuit into the carrier; when the module integrated circuit is filled on the carrier, detecting whether the module integrated circuit is loaded in a state in which the carrier is operated to be able to load the module integrated circuit on the carrier The upload detecting step; when it is detected that the module integrated circuit is filled on the carrier, the step of releasing the operating state of the carrier is released. 如請求項5所述之模組積體電路的上載方法,其中在所述操作步驟與裝載步驟之間,還包括以下步驟:在操作為在載體上能夠裝載模組積體電路的狀態下,檢測載體是否清 空模組積體電路的卸載檢測步驟。 The uploading method of the module integrated circuit of claim 5, wherein between the operating step and the loading step, the method further comprises the step of: in the state of being able to load the module integrated circuit on the carrier, Check if the carrier is clear The unloading detection step of the empty module integrated circuit. 如請求項5所述之模組積體電路的上載方法,還包括以下步驟:在所述解除步驟之後,檢測裝載到載體的模組積體電路的裝載方向的方向檢測步驟。 The method for uploading a module integrated circuit according to claim 5, further comprising the step of detecting a direction detecting step of a loading direction of the module integrated circuit loaded to the carrier after the releasing step.
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