KR200455865Y1 - A Tester for sensing of pile-up in semiconductor packages - Google Patents

A Tester for sensing of pile-up in semiconductor packages Download PDF

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KR200455865Y1
KR200455865Y1 KR2020090005077U KR20090005077U KR200455865Y1 KR 200455865 Y1 KR200455865 Y1 KR 200455865Y1 KR 2020090005077 U KR2020090005077 U KR 2020090005077U KR 20090005077 U KR20090005077 U KR 20090005077U KR 200455865 Y1 KR200455865 Y1 KR 200455865Y1
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package
tester
jig
semiconductor package
test
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KR20100010869U (en
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유인선
최상규
윤점채
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윤점채
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 고안은 반도체 패키지의 불량여부를 테스트 하기 위하여 지지판과 테스트용 지그, 상기 테스트용 지그상에 패키지를 흡착이송시키기 위하여 승강되도록 설치되는 흡착지그로 구성되는 반도체 패키지 테스터에 있어서, 패키지가 안착부에 적층되는지 여부를 감지하여 신호를 발함으로써 패키지의 불량여부테스트에서 에러가 발생하지 않도록 적층감지수단을 갖추되, 이 적층감지수단은 레이저센서이거나 압력센서가 알림수단 연결되어 이루어지는 적층감지수단을 갖춘 반도체 패키지 테스터이다.

Figure R2020090005077

반도체 패키지, 적층감지수단, 레이저센서, 압력센서, 알림수단

The present invention is a semiconductor package tester comprising a support plate, a test jig, and an adsorption jig installed to lift and lift the package on the test jig to test whether the semiconductor package is defective, wherein the package is located in the seating part. A stack sensing means is provided to detect whether the stack is stacked and to generate a signal so that an error does not occur in a package defect test. The stack sensing means is a laser sensor or a semiconductor having stack sensing means in which a pressure sensor is connected to a notification means. Is a package tester.

Figure R2020090005077

Semiconductor package, stacking detection means, laser sensor, pressure sensor, notification means

Description

적층감지수단을 갖춘 반도체 패키지 테스터{A Tester for sensing of pile-up in semiconductor packages}A tester for sensing of pile-up in semiconductor packages

본 고안은 반도체 패키지(Package) 테스트터에 패키지 적층감지수단을 갖춘것으로, 패키지 적층감지수단은 테스트용 지그(Jig)의 일정위치에 레이저 센서를 설치하여 패키지의 적층여부를 감지하거나, 흡착지그의 흡착력이 소정의 수치 이하로 떨어지면 흡착불량을 감지하여 신호를 발하게 한 적층감지수단을 갖춘 반도체 패키지 테스터에 관한 것이다.The present invention has a package stack detection means in a semiconductor package tester, and the package stack detection means installs a laser sensor at a predetermined position of a test jig to detect whether a package is stacked or not. The present invention relates to a semiconductor package tester having a stack detection means for detecting a poor adsorption and generating a signal when the adsorption force drops below a predetermined value.

반도체 패키지(Package)는 각종부품이 집적회로로 연결되어 몰딩된 반도체 칩(Chip)으로, 회로연결용 리드의 성형방법에 따라 여러종류가 있으나 그 종류에 상관없이 불량여부를 테스트하여 양품의 반도체 패키지만 선별하는 과정을 거치게 된다.A semiconductor package is a semiconductor chip in which various components are connected to an integrated circuit and molded, and there are various types according to the molding method of the circuit connection lead. Only the screening process will be performed.

이러한 반도체 패키지의 불량여부 테스트 장치(이하 '반도체 패키지 테스터'라 함)의 개략적인 구성은 도1과 같이 장비의 지지판(10)을 기준으로 이 지지판 (10)의 절단공(12) 하부에 설치되는 테스트용 지그(20)와, 상기 테스트용 지그(20)상에 패키지(1)를 흡착이송시키기 위하여 승강되도록 설치되는 흡착지그(30)로 이 루어진다. The schematic configuration of such a semiconductor package failure test apparatus (hereinafter referred to as a semiconductor package tester) is installed below the cutting hole 12 of the support plate 10 based on the support plate 10 of the equipment as shown in FIG. It consists of a test jig 20, and a suction jig 30 which is installed to be elevated in order to suck and transport the package 1 on the test jig 20.

또한, 상기 테스트용 지그(20)는 상기 흡착지그(30)가 승강하는 중심위치에 수납구(22)가 형성되며, 이 수납구(22)는 대칭의 경사면(23)이 상광하협(上廣下狹)의 깔때기 형상을 이루면서 그 하부중심에는 패키지(1)가 놓여지는 안착부(24)가 형성되며, 이 안착부(24)에는 패키지(1)의 종류에 따라 회로의 불량여부를 테스트하기 위한 회로연결구(26)가 형성되어 이루어지는 특징을 갖는다.In addition, the test jig 20 is formed with an accommodating opening 22 at a center position where the adsorption jig 30 moves up and down, and the accommodating opening 22 has an inclined surface 23 having a symmetrical surface. In the lower center, a seating part 24 is formed in which the package 1 is placed, and the seating part 24 has a circuit for testing whether the circuit is defective according to the type of the package 1. The connector 26 is formed.

또한, 상기 흡착지그(30)는 수평부(32)와 수직부(34)가 일체로 성형된 T자형 단면구성을 이루면서 도시되지 아니한 승강수단에 의해 소정의 높이 만큼 승강되는 구조이며, 수직부(34)의 하단부는 흡착구(36)가 형성되어서 이 흡착구(36)의 관통구(도시 않됨)가 외부의 부압회로와 연결된 구조를 이룸에 따라 이 흡착구(36)밑면에 패키지(1)가 접촉되면 부압에 의한 흡착력으로 패키지(1)를 흡착하여 이송하고, 부압을 해제하여 이송을 완료하는 구조로 이루어져 있다.           In addition, the adsorption jig 30 has a structure in which the horizontal portion 32 and the vertical portion 34 are elevated by a predetermined height by a lifting means (not shown) while forming a T-shaped cross-sectional configuration integrally. 34, the lower end of the suction hole 36 is formed so that the through hole (not shown) of the suction hole 36 is connected to the external negative pressure circuit structure, so that the package (1) Is in contact with the package (1) by the adsorption force by the negative pressure, and the structure is configured to complete the transfer by releasing the negative pressure.

상기한 구성에 따라 패키지(1)가 흡착구(36)에 흡착된 상태로 이송되어 오면 이 패키지(1)를 테스트용 지그(20)의 수납구(22)로 하강하여 안착부(24)에 안착시키고, 패키지(1)는 회로연결구(26)에 회로가 연결되어져 그 불량여부가 테스트 되는 것이다(여기서, 불량여부는 패키지(1)의 종류에 따라 미리 마련된 회로연결구 (26)에 패키지(1)회로가 연결되어져 별도의 단락유무 감지장치등으로 그 불량여부를 감지하여 선별해내는 것이지만, 이들 회로의 연결구조가 본고안의 안출목적이 아니므로 상세한 설명은 생략한다).When the package 1 is transported in the state adsorbed by the suction port 36 according to the above configuration, the package 1 is lowered to the receiving opening 22 of the test jig 20 and seated on the seating part 24. In this case, the package 1 is connected to a circuit connector 26, and a defect thereof is tested (here, the package 1 is installed in a circuit connector 26 prepared in advance according to the type of the package 1). Although the circuit is connected, it detects and selects whether the short circuit is detected by a separate short circuit detection device or the like, but the detailed description is omitted since the connection structure of these circuits is not intended for the purpose of this paper.

테스트가 끝난 패키지(1)는 안착의 역동작으로 흡착지그(30)가 하강하여 패 키지(1)상에 흡착구(36)가 접근하여 흡착력으로 흡착하면 다음공정으로 이송되지만, 불량여부가 설정된 신호에 따라 양품과 불량품이 구분되어 소정의 공정으로 이송된다.The tested package (1) is transferred to the next step when the adsorption jig (30) descends due to the reverse operation of the seating, and the adsorption port (36) approaches the package (1) and is adsorbed by the adsorption force, but the defect is set. According to the signal, good and bad goods are classified and transferred to a predetermined process.

상기한 종래의 반도체 패키지 테스터의 적층감지수단은 안착부(24)상에 놓여진 패키지(1)를 단순히 흡착지그(30)가 흡착하고 이송하며, 다시 새로운 패키지를 공급하고 검사후 이송시키는 과정을 반복하는 것으로, 만일 흡착의 불량이 생겨 안착부(24)에 패키지(1)가 그대로 놓인 상태에서 마치 패키지(1)가 흡착구(36)가 흡착된 것으로 여기고 흡착지그(30)가 이송동작을 완료한 후 새로운 패키지(1')를 흡착한 후 수납구(22)로 이송하게 된다.In the stack detection means of the conventional semiconductor package tester, the adsorption jig 30 simply adsorbs and transports the package 1 placed on the seating part 24, and supplies a new package, and then repeats the process of transporting it after inspection. If the adsorption is bad, the package 1 is regarded as if the adsorption port 36 is adsorbed and the adsorption jig 30 completes the transfer operation in the state in which the package 1 is placed on the seating part 24 as it is. After that, the new package 1 'is absorbed and then transferred to the storage port 22.

그러나, 안착부(24)상에는 이미 불량 테스트가 끝난 패키지(1)가 흡착의 실패로 놓여있는 상태이므로 결국 새로운 패키지(1')는 테스트가 끝난 패키지(1)위에 적층된 상태가 되며, 이러한 과정은 작업자가 이러한 오동작을 발견하기 전까지는 테스트가 끝난 패키지(1)의 상태를 패키지(1')들의 상태로 인지하여 신호를 보내줌으로써 예컨대 테스트가 끝난 패키지(1)가 불량품인 경우 후속의 새로운 패키지(1')들은 모두 불량으로 처리되는 문제점이 있게 된다.However, on the seating part 24, since the badly tested package 1 is already in a state of failure of adsorption, the new package 1 'is finally stacked on the tested package 1, and this process is performed. Until the operator detects such a malfunction, the signal recognizes the state of the tested package 1 as the state of the packages 1 'and sends a signal, for example, if the tested package 1 is a defective product, the subsequent new package. (1 ') all have a problem that is treated as bad.

따라서, 테스트용 지그(20)의 수납구(22)에는 하나의 새로운 패키지(1')만 안착되어 그 불량여부를 감지하고 신호를 보내주는 수단이 필요하게 된다.Therefore, only one new package 1 ′ is seated in the receiving opening 22 of the test jig 20, so that a means for detecting a defect and sending a signal is required.

본 고안은 종래 반도체 패키지 테스터의 문제점을 해결하기 위하여 적층감지수단을 갖춘 반도체 패키지 테스터를 제공하는 것이다. The present invention is to provide a semiconductor package tester having a stack detection means to solve the problems of the conventional semiconductor package tester.

여기서 적층감지수단은 그 1실시예로 지지판 상에 레이저센서 를 설치하거나 흡착지그의 부압라인 일측에 압력센서를 설치하여서, 소정의 높이보다 높은 위치에서 흡착지그가 승강되면 패키지의 적층임을 감지하게 하고, 부압라인의 부압이 소정의 수치이하로 내려가면 패키지의 적층이 있게 되므로 압력센서가 그 신호를 알림수단에 전자회로적으로 연결하여 알림으로써 작업자가 패키지 적층상태를 알고 조치할 수 있도록 종래 문제점을 해결한 것이다. Wherein the stack detection means in one embodiment by installing a laser sensor on the support plate or a pressure sensor on one side of the negative pressure line of the adsorption jig, if the suction jig is elevated at a position higher than a predetermined height to detect that the stacking of the package When the negative pressure of the negative pressure line falls below a predetermined value, there is a stack of packages. Therefore, the pressure sensor connects the signal to the notification means electronically to notify the operator so that the operator can know the package stacking state and take action. It is solved.

상기한 구성과 작동의 본고안을 사용함에 따라 종래와 같이 패키지가 적층된 채로 패키지의 불량여부를 테스트하는 에러가 발생하지 않고, 따라서 패키지의 불량여부를 정확히 테스트하여 패키지의 신뢰성을 높이고 불량품 사용을 줄일 수 있는 효과를 얻을 수 있다.By using the above-described configuration and operation of the design, there is no error of testing whether a package is defective while the package is stacked as in the prior art. Therefore, by accurately testing whether the package is defective, it is possible to increase the reliability of the package and to use the defective product. The effect can be reduced.

이하, 첨부도면을 참고하여 본 고안을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

본 고안은 반도체 패키지(1)의 불량여부를 테스트 하기 위하여 지지판(10)과 테스트용 지그(20), 상기 테스트용 지그(20)상에 패키지(1)를 흡착이송시키기 위하여 승강되도록 설치되는 흡착지그(30)로 구성되는 반도체 패키지 테스터에 있어서, 패키지(1)가 안착부(24)에 적층되는지 여부를 감지하여 신호를 발함으로써 패키지(1)의 불량여부테스트에서 에러가 발생하지 않도록 적층감지수단(40)을 갖춘 것을 특징으로 하는 반도체 패키지 테스터이다. The present invention is a suction plate installed to be lifted to lift and transport the package 1 on the support plate 10 and the test jig 20, the test jig 20 to test whether the semiconductor package 1 is defective. In the semiconductor package tester composed of the jig 30, a stack detection is performed to detect whether the package 1 is stacked on the seating part 24 and to generate a signal so that an error does not occur in the failure test of the package 1. It is a semiconductor package tester, characterized in that it has a means (40).

여기서 적층감지수단(40)은 그 1실시예로 지지판(10)상에 레이저센서 (50,50')를 설치한 것이다. 따라서 발광레이저 센서(50)로 부터의 발광은 수광레이저 센서(50')에 감지되며, 감지 가능한 높이는 흡착지그(30)가 하나의 패키지(1)를 적층하여 놓인 높이로 설정된다. 만일 새로운 패키지(1')가 테스트가 끝난 패키지(1)위에 적층되면 설정된 높이보다 높은 위치에서 흡착지그(30)가 승강하게 되므로 흡착지그(30)가 레이저 센서(50)의 발광을 막아 수광레이저 센서(50')에 그 빛이 도달하지 못하게 하여 패키지(1) 위에 새로운 패키지(1')가 적층된 상태의 작업에러임이 감지된다. 이 감지신호는 별도의 알림수단(70,예컨대 타워램프에 표시하거나, 장비를 멈추거나, 스피커로 알리는 등의 수단)으로 연결되어 작업자에게 알리도록 한다.Here, the stack detection means 40 is provided with laser sensors 50 and 50 'on the support plate 10 in one embodiment. Therefore, the light emitted from the light emitting laser sensor 50 is detected by the light receiving laser sensor 50 ', and the detectable height is set to the height at which the suction jig 30 stacks one package 1. If the new package 1 'is stacked on the tested package 1, the suction jig 30 is lifted at a position higher than the set height, so that the suction jig 30 prevents the laser sensor 50 from emitting light. By preventing the light from reaching the sensor 50 ', it is detected that a work error occurs when a new package 1' is stacked on the package 1. This detection signal is connected to a separate notification means 70 (e.g., a means such as displaying on a tower lamp, stopping the equipment, or notifying the speaker) to inform the worker.

적층감지수단(40)의 제2실시예는 흡착지그(30)의 흡착구(36)에 연통된 부압라인(38)의 일측에 압력센서(60)를 설치하여서 일정한 압력수치 이하로 떨어지면 그 신호가 별도의 알림수단(70, 예컨대 타워램프에 표시하거나, 장비를 멈추거나, 스피커로 알리는 등의 수단)으로 연결되어 작업자에게 알리도록 한 것이다. In the second embodiment of the stack detection means 40, the pressure sensor 60 is installed at one side of the negative pressure line 38 connected to the suction port 36 of the suction jig 30, and the signal falls below a predetermined pressure value. Is connected to a separate notification means 70 (for example, a means such as displaying on the tower lamp, stop the equipment, or notify the speaker) to inform the worker.

즉, 패키지의 적층에 의한 불량패키지 선별의 에러는 안착부(24)에 패키지(1)가 그대로 놓인 상태에서 새로운 패키지(1')가 다시 흡착되어 흡착구(36)에서 적층되어 발생하는 것이므로, 패키지(1)가 흡착되지 아니하였다는 것은 결국 흡착라인(38)상에 문제가 있어서 적정의 부압이 형성되지 못하거나 흡착구(36)와 패키지(1)의 흡착접촉불량에 의하여 적정의 부압이 형성되지 못하는 것이므로 압력 센서의 수치가 일정수치 이하로 내려가면 흡착불량이 발생할 것이므로 이에 대한 감지수단으로 압력센서(60)와 이에 연계되는 알림수단(70) 을 마련한 것이다. That is, the error of the selection of the defective package due to the stacking of the package is that the new package 1 'is again absorbed by the adsorption port 36 while the package 1 is placed on the seating part 24 as it is, and is stacked. If the package 1 is not adsorbed, there is a problem on the adsorption line 38 so that the proper negative pressure cannot be formed or the negative pressure of the package 1 is poor due to the poor adsorption contact between the suction port 36 and the package 1. Since it is not formed because the pressure of the pressure sensor is lowered below a certain value it will cause a poor adsorption, so as a means for detecting the pressure sensor 60 and the notification means 70 associated with it.

도1은 반도체 패키지 테스터의 개략도,1 is a schematic diagram of a semiconductor package tester,

도2는 패키지가 적층된 상태를 설명한 도면,2 is a view illustrating a state in which packages are stacked;

도3은 적층감지수단이 구빈된 본고안의 반도체 패키지 테스터 구성도이다.Fig. 3 is a block diagram of a semiconductor package tester in the present invention in which stacking sensing means is used.

-도면의 주요부호설명-Explanation of Major Symbols in Drawing

1-패키지(Package) 10-지지판1-Package 10-Support Plate

20-테스트용 지그 30-흡착지그20-test jig 30-adsorption jig

40-적층감지수단 50,50'-레이저센서40-stack detection means 50,50'-laser sensor

60-압력센서 70-알림수단60-pressure sensor 70-notification means

Claims (3)

반도체 패키지(1)의 불량여부를 테스트 하기 위하여 지지판(10)과 테스트용 지그(20), 상기 테스트용 지그(20)상에 패키지(1)를 흡착이송시키기 위하여 승강되도록 설치되는 흡착지그(30)로 구성되는 반도체 패키지 테스터에 있어서, 패키지(1)가 안착부(24)에 적층되는지 여부를 감지하여 신호를 발함으로써 패키지(1)의 불량여부테스트에서 에러가 발생하지 않도록 적층감지수단(40)을 갖춘 것을 특징으로 하는 반도체 패키지 테스터.In order to test whether the semiconductor package 1 is defective, an adsorption jig 30 which is installed to be elevated in order to adsorb and transport the package 1 on the support plate 10, the test jig 20, and the test jig 20. In the semiconductor package tester consisting of a), the stack detection means (40) to detect whether the package (1) is stacked on the seating portion 24 and to emit a signal so that no error occurs in the failure test of the package (1) Semiconductor package tester, characterized in that 제1항에 있어서, 적층감지수단(40)은 지지판(10)상의 레이저센서(50,50')와, 이 레이저센서(50,50')에 연계되는 알림수단(70)인 것을 특징으로 하는 반도체 패키지 테스터.The method according to claim 1, wherein the stack detection means (40) is a laser sensor (50, 50 ') on the support plate (10) and a notification means (70) associated with the laser sensors (50, 50'). Semiconductor package tester. 제1항에 있어서, 적층감지수단(40)은 흡착지그(30)의 흡착구(36)에 연통된 부압라인(38)의 일측에 압력센서(60)가 설치되고, 이 압력센서(60)는 알림수단(70)과 연계되어 이루어지는 것을 특징으로 하는 반도체 패키지 테스터.The pressure sensor (60) of claim 1, wherein the stack detecting means (40) is provided at one side of the negative pressure line (38) connected to the suction port (36) of the suction jig (30). The semiconductor package tester, characterized in that is made in conjunction with the notification means (70).
KR2020090005077U 2009-04-28 2009-04-28 A Tester for sensing of pile-up in semiconductor packages KR200455865Y1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100905359B1 (en) * 2007-05-15 2009-07-21 윤점채 Semiconductor material tray withdrawal system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100905359B1 (en) * 2007-05-15 2009-07-21 윤점채 Semiconductor material tray withdrawal system

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