TWI440128B - Apparatus for fixing substrate block - Google Patents

Description

Device for fixing a substrate block

The present invention relates to a device for fixing a substrate block; and more particularly to a fixed substrate block for fixing a substrate block when cutting a substrate block to form a cutting process of a plurality of substrates Device.

In order to produce a substrate (wafer), a cutting process for cutting the substrate block into a thin block shape is performed. In order to fix the substrate block during the cutting process, a fixed substrate block device is used.

1 is a conceptual diagram of a fixed substrate block device 1 according to one of the prior art.

As shown in FIG. 1, a substrate block (10) is generally in the shape of a rectangular segment as a whole. The four corner portions of the substrate block (10) are torn away, and the substrate block (10) includes a side surface (11) which is a planar shape; and a corner surface (12) which is attached to the side surface ( 11) The side surfaces (11) of both ends are formed obliquely.

In order to perform the process of cutting the substrate block (10), first, the substrate block (10) is attached and fixed to a beam member (20) of the fixture. Specifically, an adhesive (30) is applied to an attachment surface (21) of the beam member (20), and the side surface (11) of the substrate block (10) is pressed down and attached to the attachment surface (21). .

In the case where the substrate block (10) is attached and fixed to the beam member (20), a wire saw (40) enters a surface with respect to the side surface (11), and when moving in the direction of the arrow (51), the cutting substrate Block (10). The wire saw (40) is coated with a slurry (41) to provide the frictional force required to slide the substrate block (10) (i.e., to provide the blade edge of the cutting substrate block (10)).

At this time, when the entire wire saw (40) moves in the direction of the arrow (51) while moving rapidly in the direction of the arrow (52) of the substrate block (10), the wire saw (40) cuts the substrate block (10). ). As shown in Figure 1, the wire saw (40) will enter the substrate block (10) from the left and exit from the right, depending on the predetermined length of the wire saw (40).

As shown in FIG. 1, according to the prior art, in order to attach and fix the substrate block (10) to the beam member (20), the side surface (11) of the substrate block (10) is pressed and attached to the beam member (20). The process of attaching the surface (21). Here, it may be the case that the adhesive (30) will be depressed and flow down to cover the corner surface (12).

Therefore, as shown in FIG. 1, when the wire saw (40) is moved to the vicinity of the corner surface (12) of the substrate block (10) and the substrate block (10) is cut, the wire saw (40) is brought into contact with the corner surface ( 12) Adhesive (30). Here, the slurry (41) coated by the wire saw (40) is peeled off by the adhesive (30), which reduces the number of effective blades of the cutting substrate block (10). Therefore, the cutting ability of the wire saw (40) is significantly reduced, and a large amount of saw marks remain on the cut surface. Therefore, the substrate quality is also lowered.

During the cutting process, the substrate block (10) and the beam member (20) are simultaneously cut. After the cutting process is completed, the thin substrate and the beam member (20) are separated from each other, and then a separation process is performed to remove the adhesive (30) remaining on the substrate.

However, according to the prior art, since the adhesive (30) is applied to the side surface (11) of the substrate block (10) and the corner surface (12), the area of the substrate block (10) contacting the adhesive (30) is larger than that of the beam. The member (20) has a wider area. Therefore, when the substrate and the beam member (20) are separated from each other, most of the adhesive (30) remains on the substrate by the surface tension with the adhesive (30).

Therefore, the adhesive (30) needs to be removed from the substrate; and during the removal process, the frequency of damage, or the bending of the substrate, is increased.

SUMMARY OF THE INVENTION The present invention is directed to providing a fixed substrate block device that avoids saw marks remaining on the substrate during the cutting process and that reduces substrate damage during removal of the adhesive from the substrate.

In a comprehensive aspect, the present invention provides a fixed substrate block device for: cutting a substrate block, the substrate block including a planar side surface, and a corner surface formed on both ends of the side surface inclined by the side surface; and fixing the substrate block to form a plurality of substrates, the device comprising: a beam member, wherein a side surface is formed to be attached to the substrate block An adhesion surface to which a mucus adhesive attached to a side surface of the substrate block to the attachment surface is applied, and a width of the adhesion surface is formed to be smaller than a width of a side surface of the substrate block, such that When the substrate block is attached to the beam member, the adhesive can be prevented from flowing to the corner surface of the substrate block.

The beam member may include an inclined surface formed at both ends of the attachment surface, the attachment surface being inclined with respect to the attachment surface away from the substrate block direction.

The inclined surface is formed obliquely from 10 to 80 degrees of the attachment surface. More specifically, the inclined surface is formed at an angle of 45 degrees to the attachment surface.

The beam member may be formed of any of glass, steel, carbon composite materials, and plastic materials.

According to the present invention, the adhesive does not flow along the corner surface of the substrate block, and the slurry is prevented from peeling off from the wire saw, so that the substrate can be prevented from leaving a saw mark.

In addition, substrate damage during the process of removing the adhesive from the substrate is reduced.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be readily <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; It should be understood by those skilled in the art that the present invention is not limited to the spirit and scope of the invention.

2 is a perspective view of a fixed substrate block device 100 in accordance with an embodiment of the present invention.

As shown in FIG. 2, a fixed substrate block device 100 includes a beam member (110), wherein a substrate block (130) is fixable; and a mounting member (101) that engages the beam member (110). Upper surface.

The mounting member (101) is a fixing member for fixing the beam member (110) and a substrate block (130) (fixed to the beam member (110)) to a device (not shown) for cutting a substrate The block, and including a joint member (102), is engageable to the device for cutting a substrate block. The structure of the mounting member (101) is out of the scope of the technical concept of the present invention, and therefore will not be described in detail herein.

The beam member (110) includes: an attachment surface (111) to which a substrate block (130) is attached; and an inclined surface (112) formed at both ends of the attachment surface (111), the attachment surface being attached The direction away from the substrate block (130) forms an inclination with the attachment surface (111).

In the beam member (110), the upper surface may have a width of 100 mm (mm) to 300 mm (millimeter), a length of 200 mm (millimeter) to 2000 mm (millimeter), and a thickness of 3 to 80 mm (mm). And the inclined surface (112) may have a length of 2.5 to 100 mm (millimeter). In this embodiment, the upper surface has a width of 158 mm (mm) and a length of 820 mm (millimeter), the attachment surface (111) has a width of 138 mm (millimeter), and a thickness of 15 mm (millimeter).

Further, the inclined surface (112) may be formed to be inclined from 10 to 80 degrees from the attachment surface (111) according to the process conditions. In this particular embodiment, the angled surface (112) is formed obliquely to the attachment surface (111) by 45 degrees.

The beam member (110) may be formed of any of glass, steel, carbon composite materials, and plastic materials. In this particular embodiment, the beam member (110) is formed from a glass material.

3 is a plan view of a fixed substrate block device 100 in accordance with this embodiment. A schematic illustration of the mounting member (101) is omitted in FIG.

As shown in FIG. 3, the fixed substrate block device 100 can fix a substrate block (130) that is generally rectangular in shape. The four corner portions of the substrate block (130) are chamfered, and the substrate block (130) includes: a side surface 131 which is a planar shape; and a corner surface 132 which is formed with the side surface (131) Both ends of the inclined side surface (131) are formed.

According to this particular embodiment, the width of the attachment surface (111) provided at the beam member (110) is less than the width of the side surface (131) of the substrate block (130).

In order to perform the process of cutting the substrate block (130), first, the substrate block (130) is attached and fixed to the beam member (110) of the fixture (100). Specifically, an adhesive (120) is applied to the attachment surface (111) of the beam member (110), and the side surface (131) of the substrate block (130) is depressed and adhered to the attachment surface (111). In this embodiment, the mucilage in the mucus state is used as the adhesive (120).

In order for the substrate block (130) to be firmly fixed to the beam member (110), the adhesive (120) needs to be uniformly applied to the entire attachment surface (111).

In the case where the substrate section (130) is attached and fixed to the beam member (110), a wire saw (140) may enter a surface relative to one side surface (131) of the substrate block (130), and when in the arrow ( 151) When the direction is moved, the substrate block (130) is cut. The wire saw (140) is coated with a slurry (141) for providing the frictional force required to cut the substrate block (130) (i.e., providing a blade edge for cutting the substrate block (130)).

At this time, when the entire wire saw (140) moves in the direction of the arrow (151) while moving rapidly in the direction of the arrow (152) of the substrate block (130), the wire saw (140) cuts the substrate block (130). ). That is, as shown in FIG. 3, according to the predetermined length of the wire saw (140), the wire saw (140) enters the substrate block (130) from the left side and exits from the right side.

According to this embodiment, the width of the attachment surface (111) provided at the beam member (110) is less than the width of the side surface (131) of the substrate block (130), and the inclined surface (112) is the two at the attachment surface (111) Side formation. Therefore, as shown in FIG. 3, when the substrate block (130) is pressed down and attached to the attachment surface (111) of the beam member (110), it is depressed. Adhesive (120), a portion of the adhesive (120) will detach from the attachment surface (111). Here, too much adhesive (120) is applied to the inclined surface (112), and the adhesive will flow along the inclined surface (112) due to the surface tension with the inclined surface (112). Therefore, when the substrate block (130) is attached to the beam member (110), the adhesive (120) does not flow to the corner surface (132) of the substrate block (130).

Therefore, as shown in FIG. 3, even if the wire saw (140) cuts the substrate block (130) near the corner surface (132), the wire saw (140) does not contact the adhesive (120), so the wire saw is applied. The amount of the slurry (141) of (140) will remain as it is. Therefore, the cutting ability of the wire saw (140) is maintained as it is, and the possibility of saw mark formation is similarly reduced, thereby improving the quality of the substrate.

At the same time, when the adhesive (120) is depressed, the adhesive (120) flows along the inclined surface (112) and is simultaneously applied to the adhesive surface (111) and the inclined surface (112). Therefore, the contact area between the beam member (110) and the adhesive (120) is greater than the contact area between the substrate block (130) and the adhesive (120), so the surface tension with the beam member (110) is greater than that of the substrate block. Surface tension of (130). After the process of cutting the substrate block (130) is completed, when the substrate block (130) and the beam member (110) are separated from each other, most of the adhesive (120) moves along the beam member (110) and adheres. The agent (120) will rarely remain on the substrate.

Therefore, the separation procedure for removing the adhesive (120) remaining on the block can be performed more easily, and the substrate can be prevented from being damaged or bent in the separation process.

4 is a graph comparing performance results of a fixed substrate block according to the prior art with a fixed substrate block device (100) in accordance with an embodiment of the present invention.

In the fixed substrate block device according to the prior art, as shown in FIG. 1, the attachment surface width of the beam member is larger than the side surface width of the substrate block, and the beam member has no inclined surface. Except for a few differences, other process conditions are set in the same way.

In the diagram of Figure 4, the left image of the middle dotted line is displayed by fixing a single The substrate block is subjected to the substrate device inspection result formed by the fixing device (100) according to this embodiment, the cutting process is performed, and then the separation process is completed (the result of this embodiment).

In the drawing of Fig. 4, the right side of the middle dashed line shows the state of the substrate formed by fixing a single substrate block to the fixing device (100) according to the previous embodiment, performing the cutting process, and then completing the separation process. Test results (previous technical results).

A comparison between the results of this specific embodiment and prior art results can be arranged in the following table.

As can be seen from the table, between the results of the specific embodiment and the prior art results In the comparison, it can be seen from the results of the specific embodiment that the damage occurrence ratio of the substrate is significantly reduced in all the aspects. This table shows the improvement in substrate quality and yield.

1‧‧‧Fixed substrate block device

10‧‧‧Substrate block

11‧‧‧ side surface

12‧‧‧ corner surface

20‧‧‧beam components

21‧‧‧ Attachment surface

30‧‧‧Adhesive

40‧‧‧ wire saw

41‧‧‧Slurry

100‧‧‧Fixed substrate block device

101‧‧‧Installation components

102‧‧‧Join parts

110‧‧‧beam components

111‧‧‧ Attachment surface

112‧‧‧Sloping surface

120‧‧‧Adhesive

130‧‧‧Substrate block

131‧‧‧ side surface

132‧‧‧ corner surface

140‧‧‧ line giant

141‧‧‧Slurry

Figure 1 shows a fixed substrate block arrangement in accordance with the prior art.

2 is a perspective view of a fixed substrate block device in accordance with an embodiment of the present invention.

3 is a plan view of a fixed substrate block device in accordance with an embodiment of the present invention.

4 is a graph comparing performance results of a fixed substrate block according to the prior art with a fixed substrate block device in accordance with an embodiment of the present invention.

100‧‧‧Fixed substrate block device

110‧‧‧beam components

111‧‧‧ Attachment surface

112‧‧‧Sloping surface

120‧‧‧Adhesive

131‧‧‧ side surface

132‧‧‧ corner surface

140‧‧‧ line giant

141‧‧‧Slurry

Claims (4)

A fixed substrate block device for: cutting a substrate block, the substrate block comprising a planar side surface; and a plurality of corner surfaces formed on both ends of the side surface inclined to the side surface; And fixing the substrate block to form a plurality of substrates, the fixed substrate block device comprising: a beam member attached to the substrate block, the beam member comprising a planar shape and attached to the side surface of the substrate block An attachment surface, and an inclined surface formed at both ends of the attachment surface and inclined toward the corner surface away from the substrate block with respect to the attachment surface, wherein the side surface of the substrate block is attached to the attachment surface Applying a mucus adhesive to the attachment surface, the width of the attachment surface being less than the width of the side surface of the substrate block, such that when the substrate block is attached to the beam member, the mucus adhesive will A surface tension of the inclined surface flows along the inclined surface to apply the mucus adhesive overflowing from the adhesion surface to the inclined surface, thereby avoiding the mucus The coolant flow to the substrate surface and the corner of the block is applied to the surface of the corner. The device of claim 1, wherein the inclined surface is formed to be inclined from 10 to 80 degrees of the attachment surface. The device of claim 2, wherein the inclined surface is formed to be inclined at 45 degrees to the attachment surface. The device of claim 1, wherein the beam member is formed of any one of glass, steel, carbon composite material, and plastic material.