JP2005311044A - Method and device for dividing semiconductor substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device for dividing a semiconductor substrate for preventing any burr or crack from being generated at the time of dividing a semiconductor device, and for preventing any impact force or pressure from being applied to a semiconductor substrate. <P>SOLUTION: Scribe grooves 3 are formed in a strip-shaped wafer 4, and the strip-shaped wafer 4 is attached to the adhesive surface of an expansion tape 10, and the expansion tape 10 is expanded to an almost vertical direction to the scribe groove 3 so that the strip-shaped wafer 4 can be cleaved and separated. Thus, it is possible to precisely divide the strip-shaped wafer 4 without generating any burr or crack regardless of the thickness of the strip-shaped wafer 4, and to improve quality and reliability. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a dividing method and a dividing apparatus for dividing a semiconductor substrate.

  Conventionally, as a technique for dividing a compound semiconductor substrate such as a light emitting diode, one described in Patent Document 1 can be exemplified.

  A conventional method for dividing a semiconductor substrate will be described with reference to FIGS.

  3 is a plan view of the strip-shaped wafer, and FIG. 4 is a front view when the wafer is divided. As shown in FIG. 3, the strip-shaped wafer 4 is formed by cleaving from a circular wafer state, and the strip-shaped wafer is formed. As shown in FIG. 4, grooves or groove-shaped scribes 3 are formed in the portion where the wafer 4 is to be cut. The method is formed by etching or scratches with a diamond needle or the like.

Then, the scribe surface is attached to the conductive sheet 1, placed on the upper surface of the metal table 8, and pressurized or the like is applied from the upper part of the strip-shaped wafer 4 to divide it into individual elements 2 as shown on the right side of FIG. .
JP-A-60-55640

  However, the conventional dividing method utilizes the cleavage of the liquid crystal, and since an impact force and pressure are applied by the hard blade 5 at the time of dividing, the substrate 4 becomes thicker and the burrs 7 are broken as the thickness of the substrate 4 increases. This is likely to occur or chipping 6 of the element is likely to occur.

  An object of the present invention is to solve the above-mentioned conventional problems, and to provide a method and apparatus for dividing a semiconductor substrate that does not generate burrs or chips during the division and does not give an impact force and pressure to the semiconductor substrate. .

  In order to solve the above problems, a method for dividing a semiconductor substrate of the present invention includes a step of forming a dividing line consisting of grooves or scratches on the semiconductor substrate, and a step of attaching the semiconductor substrate to an adhesive surface of an expanded tape The semiconductor substrate is cleaved and separated at the dividing line by extending the expanded tape in a direction substantially perpendicular to the dividing line.

  In the step of attaching the semiconductor substrate to the adhesive surface of the expanded tape, it is preferable to attach the surface of the semiconductor substrate on which the grooves or scratches are formed to the adhesive surface of the expanded tape.

  In addition, the semiconductor substrate dividing apparatus of the present invention includes a semiconductor substrate having a dividing line formed of grooves or scratches, an expanded tape having an adhesive surface and attaching the semiconductor substrate to the adhesive surface, and fixing both ends of the expanded tape. And a roller portion having at least two rollers arranged substantially parallel to the dividing line across the semiconductor substrate, and the roller portion is expanded from the side opposite to the side to which the semiconductor substrate is adhered. The expanded tape is stretched by pressing and the semiconductor substrate is cleaved and separated by a dividing line.

  In addition, it is preferable to affix the surface side in which the groove | channel or the flaw of the semiconductor substrate was formed to the adhesive surface of an expanded tape.

  Thus, the present invention is required for cleaving a semiconductor substrate by providing a scribe line or scratch on the semiconductor substrate, affixing the surface with the scribe line or scratch on the expanded tape, and expanding the expanded substrate. A force in the cleavage direction is applied to divide the semiconductor substrate into individual elements.

  According to the present invention, by cleaving the semiconductor substrate by expanding, no stress is applied to the inside of the semiconductor substrate as in the prior art, so that no stress is generated inside the semiconductor substrate and a stable cleaved surface is obtained. As a result, it can be divided with high accuracy without causing burrs or chipping, and quality and reliability can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing a state in which a plurality of compound semiconductor substrate strip-like wafers 4 are attached to an expanded sheet 10 for explaining an embodiment of the present invention. In addition, the strip-shaped wafer 4 refers to the one obtained by first cleaving a compound semiconductor substrate that was originally circular in the previous step. In the following description, the longitudinal direction of the strip-shaped wafer 4 is referred to as a horizontal direction, and the vertical direction is referred to as a vertical direction.

  2A to 2C are front views showing steps for explaining a compound semiconductor substrate dividing method and manufacturing apparatus according to an embodiment of the present invention.

  First, as shown in FIG. 2 (a), the surface side of the scribe groove 3 of the strip-shaped wafer 4 is attached to the expanded sheet 10 and placed on the sheet extension plate 12. At this time, the scribe groove 3 provided in the strip-shaped wafer 4 is formed by either diamond cutter or etching in the longitudinal direction of the plan view shown in FIG.

  Both ends of the expandable sheet 10 in the horizontal direction are fixed to the sheet fixing holder 11. The sheet fixing holder 11 may be one provided in the apparatus, one in which the expanded sheet 10 is previously attached to a ring-shaped jig, or one in which the jig itself is fixed.

  Subsequently, as shown in FIG. 2B, the sheet stretching roller 13 vertically lifts the sheet stretching plate 12 provided on both sides, whereby the expanded sheet 10 is stretched by the sheet stretching roller 13. The sheet stretching roller 13 has a rolling bearing inside and has a smooth rotation in order to eliminate frictional resistance with the expanded sheet 10.

  The material of the sheet fixing holder 11, the sheet extending plate 12, and the sheet extending roller 13 is not particularly limited as long as it prevents electrostatic breakdown of the strip-shaped wafer 4 and does not damage the strip-shaped wafer 4. For example, the surface of an inexpensive steel (such as SS41) may be hard chrome plated.

  The sheet stretching roller 13 stretches the expanded sheet 10 and simultaneously cleaves the strip-shaped wafer 4 adhered to the expanded sheet 10 by applying a lateral force. After the cleavage, as shown in FIG. 2 (c), the divided elements 2 can be sufficiently widened to facilitate the next process.

  As described above, according to the present embodiment, it is not necessary to apply an impact force and pressure by the conventional hard blade 5 shown in FIG. It does not occur and can be divided with high accuracy, and the quality and reliability can be improved. Moreover, since the structure is extremely simple as compared with the expensive equipment that requires positioning by image processing at the time of division as in the prior art, an inexpensive device can be manufactured.

  In this embodiment, the compound semiconductor dividing method is described as an example. However, the present invention is not limited to the compound semiconductor, and may be applied to other semiconductor substrates such as a silicon substrate.

  Note that it is also possible to make it easy to remove the divided semiconductor substrate from the expanded sheet 10 by forming the adhesive surface of the expanded sheet 10 with an ultraviolet ray or a thermosetting adhesive and curing it after dividing the semiconductor substrate. It is done.

  Further, in this embodiment, the surface side of the scribe groove 3 of the strip-shaped wafer 4 is attached to the expanded sheet 10, but the side opposite to the surface of the scribe groove 3 of the strip-shaped wafer 4 may be attached to the expanded sheet 10. Division is possible. However, since the cleavage force at the time of expansion in the expanded sheet 10 is generated from the surface side of the expanded sheet 10, it is more preferable that the surface side of the scribe groove 3 is attached to the expanded sheet 10.

  The present invention is applied to a method and an apparatus for dividing a compound semiconductor substrate such as a light emitting diode, and is particularly useful for a semiconductor substrate such as a light emitting diode having a cut surface having a predetermined shape and size.

The top view which showed the state which affixed the strip-shaped wafer of the compound semiconductor substrate on the expanded sheet for demonstrating embodiment of this invention (A)-(c) is a front view which shows the process explaining the division | segmentation method and manufacturing apparatus of the compound semiconductor substrate which concern on embodiment of this invention. Plan view of strip-shaped wafer in conventional semiconductor substrate dividing method The front view which shows the state at the time of the division | segmentation in the conventional semiconductor substrate division | segmentation method

Explanation of symbols

2 Element 3 Scribe groove, scratch 4 Strip wafer 10 Expanded sheet 11 Sheet fixing holder 12 Sheet expansion plate 13 Sheet expansion roller

Claims (4)

Forming a dividing line comprising grooves or scratches on a semiconductor substrate;
A step of attaching the semiconductor substrate to the adhesive surface of the expanded tape,
A method for dividing a semiconductor substrate, wherein the semiconductor substrate is cleaved and separated by the dividing line by extending the expanded tape in a direction substantially perpendicular to the dividing line. In the step of attaching the semiconductor substrate to the adhesive surface of the expanded tape,
2. The method for dividing a semiconductor substrate according to claim 1, wherein a surface side of the semiconductor substrate on which the dividing line is formed is attached to an adhesive surface of an expanded tape. A semiconductor substrate on which a dividing line consisting of grooves or scratches is formed;
An expanded tape having an adhesive surface and attaching the semiconductor substrate to the adhesive surface;
A fixing part for fixing both ends of the expanded tape;
A roller portion having at least two rollers disposed substantially parallel to the dividing line across the semiconductor substrate;
The semiconductor is characterized in that the expandable tape is extended by pressing the roller portion from the side opposite to the side to which the semiconductor substrate is adhered, so that the expanded substrate is expanded and the semiconductor substrate is cleaved and separated by the dividing line. Substrate dividing device. 4. The semiconductor substrate dividing apparatus according to claim 3, wherein a surface side of the semiconductor substrate on which the dividing line is formed is attached to an adhesive surface of the expanded tape.

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