CN111243992A - RG long LED lamp bead processing equipment and method - Google Patents

RG long LED lamp bead processing equipment and method Download PDF

Info

Publication number
CN111243992A
CN111243992A CN202010050398.5A CN202010050398A CN111243992A CN 111243992 A CN111243992 A CN 111243992A CN 202010050398 A CN202010050398 A CN 202010050398A CN 111243992 A CN111243992 A CN 111243992A
Authority
CN
China
Prior art keywords
cylinder
upper template
fixedly arranged
led lamp
workbench
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010050398.5A
Other languages
Chinese (zh)
Other versions
CN111243992B (en
Inventor
蒋金凤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Huaxin Weitian Photoelectric Co ltd
Original Assignee
Shenzhen Huaxin Weitian Photoelectric Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Huaxin Weitian Photoelectric Co ltd filed Critical Shenzhen Huaxin Weitian Photoelectric Co ltd
Priority to CN202010050398.5A priority Critical patent/CN111243992B/en
Publication of CN111243992A publication Critical patent/CN111243992A/en
Application granted granted Critical
Publication of CN111243992B publication Critical patent/CN111243992B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses RG long body LED lamp bead processing equipment and method, which comprises a workbench, wherein the workbench is of a circular ring structure, four stilts are fixedly arranged at equal intervals along the circumferential direction under the workbench, an installation plate is fixedly arranged under the workbench through a connecting rod, a first air cylinder is fixedly arranged on the installation plate, a lower template is fixedly arranged on a piston rod of the first air cylinder, and the lower template is matched with an inner ring of the workbench. Has the advantages that: can utilize infrared distance measuring sensor, first pressure sensor and second pressure sensor cooperation PLC controller to carry out automatic control to can guarantee that tensile distance and the pressure of pushing down are the same at every turn, make to expand brilliant quality the same, can fix the wafer membrane automatically moreover, need not artifical fixed, degree of mechanization is high, thereby can improve machining efficiency and productivity.

Description

RG long LED lamp bead processing equipment and method
Technical Field
The invention relates to the field of LED lamp bead processing equipment, in particular to RG long LED lamp bead processing equipment and method.
Background
The LED wafer forms the crystalline grain of array after the scribing, and the crystalline grain of array is attached on the blue membrane, and the crystalline grain arrangement on the blue membrane is very inseparable, is unfavorable for the operation of subsequent handling, consequently can add a crystal expansion process to handle the crystalline grain array usually in LED production course of working, and the crystal expansion process specifically is: and (3) adopting a crystal expansion machine to expand the film of the blue film with the crystal grains attached after scribing, so that the distance between the adjacent crystal grains is expanded.
The stretching of a wafer film and the pressing of an upper template need to be manually controlled by the conventional wafer expanding machine, the stretching distance and the pressing pressure are difficult to ensure by manual control to be the same each time, so that the quality of expanded crystals at each time is uneven, the conventional wafer expanding machine needs to manually fix the wafer film, the mechanical degree is low, the processing efficiency is low, and the productivity is influenced.
At present, in order to adapt to the development of technology and the automation of production, more automation is only realized in the aspect of product delivery, for example, patent CN109368271A discloses a wafer expanding ring rotating automatic loading and unloading device, which comprises a wafer expanding ring material box, a wafer expanding ring jacking device, a rotating carrier, a wafer expanding ring identification device and a device bottom plate; the crystal expansion ring material box comprises a guide column and a material box bottom plate, wherein a round hole is formed in the material box bottom plate, and the guide column is installed on the material box bottom plate; the crystal expansion ring jacking device comprises a jacking motor, a jacking screw rod and a jacking base plate, wherein the jacking motor drives the jacking base plate to move upwards; the rotating carrier comprises a carrier substrate and a rotating middle shaft, the rotating middle shaft penetrates through a carrier guide sleeve, the carrier guide sleeve is connected with the equipment bottom plate, the rotating middle shaft penetrates through the equipment bottom plate, the carrier substrate is arranged at the upper end of the rotating middle shaft, and a circular hole is formed in the carrier substrate; the wafer expanding ring material box is arranged on the carrier base plate, and a round hole on the material box bottom plate is opposite to a round hole on the carrier base plate; the driving unit drives the carrier base plate to rotate, so that the wafer expanding ring material box rotates to a wafer expanding ring jacking device station. The automatic feeding of the crystal expansion inner ring and the crystal expansion outer ring and the automatic discharging of finished products finished by crystal expansion are realized. But only in terms of feeding and not in terms of product inspection, so that inspection still requires manual handling, which may result in inefficiency due to manual inspection and possible human negligence.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
The invention aims to provide processing equipment and a processing method of an RG long LED lamp bead, and aims to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
according to one aspect of the invention, the processing equipment for the RG long LED lamp bead comprises a workbench, wherein the workbench is of a circular structure, four stilts are fixedly arranged at equal intervals along the circumferential direction under the workbench, an installation plate is fixedly arranged under the workbench through a connecting rod, a first air cylinder is fixedly arranged on the installation plate, a lower template is fixedly arranged on a piston rod of the first air cylinder and matched with an inner ring of the workbench, an infrared distance measuring sensor is fixedly arranged on the outer wall of one side of the upper end of the first air cylinder, four support rods are fixedly arranged on the workbench along the circumferential direction, a top plate is fixedly arranged on each support rod, a first installation groove is formed in the middle of the lower surface of the top plate, four second installation grooves are formed in the lower surface of the top plate along the circumferential direction at equal intervals, a second air cylinder is fixedly arranged in the first installation groove, the second mounting groove is internally and fixedly provided with a third cylinder, a first pressure sensor is fixedly arranged below a piston rod of the second cylinder, an upper template is fixedly arranged below the first pressure sensor, a heating device is arranged in the upper template, four limiting rods are fixedly arranged on the upper template along the circumferential direction, four through holes matched with the limiting rods are formed in the top plate, limiting sliding sleeves are fixedly arranged in the through holes, the limiting sliding sleeves are respectively sleeved on the outer walls of the corresponding limiting rods in a sliding manner, a second pressure sensor is fixedly arranged below the third cylinder, a pressing ring is fixedly arranged below the second pressure sensor, the second pressure sensors are fixedly connected with the pressing ring, the inner diameter of the pressing ring is slightly larger than the outer diameter of the lower template and the upper template, and a connecting plate is fixedly arranged on the outer wall of one side of the workbench, the connecting plate is kept away from one of workstation is served and is fixed and be equipped with the damping bearing, the damping bearing internal fixation is equipped with the pivot, the fixed touch screen that is equipped with in the pivot, the fixed PLC controller that is equipped with under the connecting plate, first cylinder the second cylinder the solenoid valve of third cylinder all with PLC controller electric connection, first pressure sensor the second pressure sensor infrared distance measuring sensor with the touch screen all with PLC controller electric connection.
Further, heating device includes the electrical heating piece, the cope match-plate pattern is hollow box structure, the quantity of electrical heating piece is two and fixes respectively the both sides inner wall of cope match-plate pattern, one of cope match-plate pattern serves and is equipped with the oil filler hole just threaded connection has sealed lid on the oil filler hole, be equipped with the conduction oil in the cope match-plate pattern, the fixed temperature sensor that is equipped with of cope match-plate pattern bottom inner wall, temperature sensor with the electrical heating piece all with PLC controller electric connection.
Furthermore, a floating ball liquid level meter is arranged in the upper template; and a pressure sensing panel is arranged on the upper template (14), the pressure sensing panel can automatically identify the position of the crystal grain according to the sensed pressure and display the position in the touch screen (23), and the display is a display in a coordinate system, so that the position can be automatically defined and the expansion is detected to be qualified.
Furthermore, the outer surfaces of the upper wall and the side wall of the upper template are both fixedly provided with heat insulation layers, and the heat insulation layers are made of rock wool materials.
Furthermore, a fillet is machined in the circumferential direction of the upper end of the lower template.
Furthermore, a rubber ring is fixedly arranged below the compression ring.
Furthermore, an emergency stop button is fixedly arranged on the middle part of the connecting plate and electrically connected with the PLC.
Further, threaded holes are formed in the lower ends of the foot posts, lead screws are connected in the threaded holes in a threaded mode, nuts are fixedly welded on the outer walls of the lower ends of the lead screws, a chassis is fixedly arranged below the lead screws, and an anti-skidding rubber pad is fixedly arranged below the chassis.
Further, the touch screen automatically judges whether the expanded crystal meets the requirements or not according to the displayed crystal grain position, and automatically alarms and displays on the touch screen when the expanded crystal does not meet the requirements.
According to another aspect of the invention, a method used by processing equipment of an RG long LED lamp bead is provided, which comprises the following steps:
horizontal adjustment, namely rotating the screw rod through a nut to adjust the workbench to a horizontal state;
switching on a power supply: connecting a power supply to the PLC;
inputting parameters: inputting the pressure value of the upper template to the wafer film, the pressure value of the pressure ring to the wafer film, the heating temperature of the heat conducting oil and the rising height of the lower template through the touch screen;
heating at a temperature: the PLC controller electric heating block works to heat the heat conducting oil in the upper template, and after the temperature detected by the temperature sensor reaches the preset temperature for heating the heat conducting oil, the PLC controller reduces the power of the electric heating block to carry out heat preservation.
Feeding: placing a wafer film to be subjected to wafer expansion on a lower template;
starting crystal expansion: starting a crystal expansion program through a touch screen, automatically controlling devices such as a first cylinder, a second cylinder and a third cylinder to work by a PLC (programmable logic controller) to automatically expand crystals, and after the crystal expansion is finished, controlling the first cylinder, the second cylinder and the third cylinder to recover and reset by the PLC;
blanking: and taking down the wafer film after crystal expansion.
Further, the specific process of the crystal expansion comprises: the PLC controller firstly controls the third cylinder to simultaneously extend at the same speed to press the compression ring on the wafer film, when the second pressure sensor reaches the preset pressure value of the compression ring on the wafer film, the PLC controller controls the third cylinder to stop extending, at the moment, the compression ring can fix the edge of the wafer film, then the PLC controller controls the extension of the first cylinder to stretch the wafer film on the upper template, when the distance between the infrared distance measuring sensor and the lower template reaches the preset height of the lower template, the PLC controller controls the first cylinder to stop extending, then the second cylinder is controlled to extend to drive the upper template to press downwards, when the pressure value detected by the first pressure sensor reaches the preset pressure value of the upper template on the wafer film, the PLC controller controls the second cylinder to stop extending, the wafer film is subjected to hot-pressing and shaping, and crystal expansion is completed.
Compared with the prior art, the invention has the following beneficial effects: can utilize infrared distance measuring sensor, first pressure sensor and second pressure sensor cooperation PLC controller to carry out automatic control to can guarantee that tensile distance and the pressure of pushing down are the same at every turn, make to expand brilliant quality the same, can fix the wafer membrane automatically moreover, need not artifical fixed, degree of mechanization is high, thereby can improve machining efficiency and productivity. In addition, the pressure sensing panel is arranged on the upper template, the pressure sensing panel can automatically mark the position of the crystal grain according to the sensed pressure and display the position in the touch screen, and the display is in a coordinate system, so that the position can be automatically defined and the detection result shows that the expansion is qualified; the touch screen automatically judges whether the expanded crystal meets the requirements or not according to the displayed crystal grain position, does not meet the requirements, and automatically alarms and displays on the touch screen successfully, so that the problems that in the prior art, the detection still needs manual processing because the automation is only realized in the feeding aspect and the automation is not realized in the product detection aspect, the efficiency is low probably caused by the manual detection, and the human negligence probably exists are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of processing equipment for an RG long body LED lamp bead according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of processing equipment for an RG long body LED lamp bead according to an embodiment of the present invention during crystal expansion;
fig. 3 is a schematic structural diagram of a workbench in processing equipment for an RG long body LED lamp bead according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a top plate in processing equipment for an RG long body LED lamp bead according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a middle and lower template of processing equipment for an RG long body LED lamp bead according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a pressure ring in an RG long body LED lamp bead processing device according to an embodiment of the present invention;
fig. 7 is a sectional view of a pedestal in an RG long body LED lamp bead processing device according to an embodiment of the present invention;
fig. 8 is a sectional view of an upper template in an RG long body LED lamp bead processing device according to an embodiment of the present invention;
fig. 9 is a flowchart of a method for using processing equipment for an RG long body LED lamp bead according to an embodiment of the present invention.
Reference numerals:
1. a work table; 2. a socle; 3. mounting a plate; 4. a first cylinder; 5. a lower template; 6. an infrared ranging sensor; 7. a support bar; 8. a top plate; 9. a first mounting groove; 10. a second mounting groove; 11. a second cylinder; 12. a third cylinder; 13. a first pressure sensor; 14. mounting a template; 15. a limiting rod; 16. perforating; 17. a limiting sliding sleeve; 18. a second pressure sensor; 19. pressing a ring; 20. a connecting plate; 21. a damping bearing; 22. a rotating shaft; 23. a touch screen; 24. a PLC controller; 25. an electrical heating block; 26. an oil filler; 27. a sealing cover; 28. a temperature sensor; 29. a floating ball liquid level meter; 30. a heat-insulating layer; 31. rounding off; 32. a rubber ring; 33. an emergency stop button; 34. a threaded hole; 35. a screw rod; 36. a nut; 37. a chassis; 38. an anti-skid rubber pad; 39. a wafer film.
Detailed Description
The invention is further described with reference to the following drawings and detailed description:
according to an aspect of the embodiment of the invention, the processing equipment of the RG long LED lamp bead is provided:
the first embodiment is as follows:
referring to fig. 1 to 8, an RG long body LED lamp bead processing apparatus and method according to an embodiment of the present invention includes a workbench 1, the workbench 1 is a circular structure, four legs 2 are fixedly disposed at equal intervals along a circumferential direction under the workbench 1, an installation plate 3 is fixedly disposed under the workbench 1 through a connection rod, a first cylinder 4 is fixedly disposed on the installation plate 3, a lower template 5 is fixedly disposed on a piston rod of the first cylinder 4, the lower template 5 is matched with an inner ring of the workbench 1, an infrared distance measuring sensor 6 is fixedly disposed on an outer wall of one side of an upper end of the first cylinder 4, four support rods 7 are fixedly disposed along the circumferential direction on the workbench 1, a top plate 8 is fixedly disposed on the support rods 7, a first installation groove 9 is disposed in a middle portion of a lower surface of the top plate 8, four second installation grooves 10 are disposed at equal intervals along the circumferential direction on a lower surface of the top plate 8, a second cylinder 11 is fixedly arranged in the first mounting groove 9, third cylinders 12 are fixedly arranged in the second mounting groove 10, a first pressure sensor 13 is fixedly arranged below a piston rod of the second cylinder 11, an upper template 14 is fixedly arranged below the first pressure sensor 13, a heating device is arranged in the upper template 14, four limiting rods 15 are fixedly arranged on the upper template 14 along the circumferential direction, four through holes 16 matched with the limiting rods 15 are formed in the top plate 8, limiting sliding sleeves 17 are fixedly arranged in the through holes 16, the limiting sliding sleeves 17 are respectively sleeved on the outer walls of the corresponding limiting rods 15 in a sliding manner, second pressure sensors 18 are fixedly arranged below the third cylinders 12, pressing rings 19 are fixedly arranged below the second pressure sensors 18, and the second pressure sensors 18 are fixedly connected with the pressing rings 19, the internal diameter of clamping ring 19 slightly is greater than lower bolster 5 with the external diameter of cope match-plate pattern 14, the fixed connecting plate 20 that is equipped with of 1 one side outer wall of workstation, connecting plate 20 is kept away from 1 of workstation serves and fixes and is equipped with damping bearing 21, damping bearing 21 internal fixation is equipped with pivot 22, the fixed touch-control screen 23 that is equipped with in the pivot 22, connecting plate 20 is the fixed PLC controller 24 that is equipped with down, first cylinder 4 second cylinder 11 the solenoid valve of third cylinder 12 all with 24 electric connection of PLC controller, first pressure sensor 13 second pressure sensor 18 infrared distance measuring sensor 6 with touch-control screen 23 all with 24 electric connection of PLC controller.
Through the scheme of the invention, the infrared distance measuring sensor 6, the first pressure sensor 13 and the second pressure sensor 18 can be used for being matched with the PLC 24 for automatic control, so that the stretching distance and the pressing pressure can be ensured to be the same each time, the quality of the expanded crystal is the same, the wafer film 39 can be automatically fixed, manual fixation is not needed, the degree of mechanization is high, and the processing efficiency and the capacity can be improved.
Example two:
referring to fig. 8, for the heating device, the heating device includes two electric heating blocks 25, the upper mold plate 14 is a hollow box structure, the two electric heating blocks 25 are respectively fixed on inner walls of two sides of the upper mold plate 14, an oil filling port 26 is arranged at one end of the upper mold plate 14, a sealing cover 27 is in threaded connection with the oil filling port 26, heat conducting oil is arranged in the upper mold plate 14, a temperature sensor 28 is fixedly arranged on an inner wall of the bottom end of the upper mold plate 14, and the temperature sensor 28 and the electric heating blocks 25 are both electrically connected with the PLC controller 24.
Through the scheme of the invention, the heat conduction oil in the upper template 14 can be heated by the electric heating block 25. A pressure sensing panel is arranged on the upper template 14, and the pressure sensing panel can automatically mark a position according to the sensed pressure and display the position in the touch screen 23, wherein the display is a display in a coordinate system, so that the position can be automatically defined and the expansion is detected to be qualified.
Example three:
referring to fig. 8, for the upper die plate 14, a float level gauge 29 is installed in the upper die plate 14; for the upper template 14, the outer surfaces of the upper wall and the side wall of the upper template 14 are both fixedly provided with the insulating layer 30, and the insulating layer 30 is made of rock wool material.
Through the scheme of the invention, the liquid level of the heat conduction oil in the upper template 14 can be observed through the floating ball liquid level meter 29, and the heat loss of the heat conduction oil in the upper template 14 can be reduced through the heat insulation layer 3O.
Example four:
referring to fig. 5 and 6, for the lower template 5, a rounded corner 31 is formed in the circumferential direction of the upper end of the lower template 5; for the pressing ring 19, a rubber ring 32 is fixedly arranged below the pressing ring 19.
Through the scheme of the invention, the fillet 31 can prevent the edge angle at the upper end of the lower template 5 from cutting the wafer film 39, and the rubber ring 32 can increase the friction coefficient of the lower surface of the pressing ring 19, so that the fixing effect on the wafer film 39 can be increased.
Example five:
referring to fig. 1 and 7, for the connection plate 20, an emergency stop button 33 is fixedly disposed on the middle portion of the connection plate 20, and the emergency stop button 33 is electrically connected to the PLC controller 24; for the socle 2, threaded holes 34 are formed in the lower end of the socle 2, a screw rod 35 is connected to the inner side of each threaded hole 34 in a threaded mode, a nut 36 is fixedly welded to the outer wall of the lower end of the screw rod 35, a chassis 37 is fixedly arranged below the screw rod 35, and an anti-skid rubber pad 38 is fixedly arranged below the chassis 37.
Through the scheme of the invention, when the emergency stop button 33 is pressed in case of failure, the equipment can be immediately stopped to reduce damage, and the height and the levelness of the workbench 1 can be adjusted by rotating the screw rod 35 through the nut 36.
According to another aspect of the embodiment of the invention, a method for using processing equipment of an RG long LED lamp bead is provided, which comprises the following steps:
horizontal adjustment, namely rotating the screw rod through a nut to adjust the workbench to a horizontal state;
switching on a power supply: connecting a power supply to the PLC;
inputting parameters: inputting the pressure value of the upper template to the wafer film, the pressure value of the pressure ring to the wafer film, the heating temperature of the heat conducting oil and the rising height of the lower template through the touch screen;
heating at a temperature: the PLC controller electric heating block works to heat the heat conducting oil in the upper template, and after the temperature detected by the temperature sensor reaches the preset temperature for heating the heat conducting oil, the PLC controller reduces the power of the electric heating block to carry out heat preservation.
Feeding: placing a wafer film to be subjected to wafer expansion on a lower template;
starting crystal expansion: starting a crystal expansion program through a touch screen, automatically controlling devices such as a first cylinder, a second cylinder and a third cylinder to work by a PLC (programmable logic controller) to automatically expand crystals, and after the crystal expansion is finished, controlling the first cylinder, the second cylinder and the third cylinder to recover and reset by the PLC;
blanking: and taking down the wafer film after crystal expansion.
Preferably, the specific process of the crystal expansion comprises the following steps: the PLC controller firstly controls the third cylinder to simultaneously extend at the same speed to press the compression ring on the wafer film, when the second pressure sensor reaches the preset pressure value of the compression ring on the wafer film, the PLC controller controls the third cylinder to stop extending, at the moment, the compression ring can fix the edge of the wafer film, then the PLC controller controls the extension of the first cylinder to stretch the wafer film on the upper template, when the distance between the infrared distance measuring sensor and the lower template reaches the preset height of the lower template, the PLC controller controls the first cylinder to stop extending, then the second cylinder is controlled to extend to drive the upper template to press downwards, when the pressure value detected by the first pressure sensor reaches the preset pressure value of the upper template on the wafer film, the PLC controller controls the second cylinder to stop extending, the wafer film is subjected to hot-pressing and shaping, and crystal expansion is completed.
For the convenience of understanding the technical solutions of the present invention, the following detailed description will be made on the working principle or the operation mode of the present invention in the practical process.
In practical application, the infrared distance measuring sensor 6, the first pressure sensor 13 and the second pressure sensor 18 are matched with the PLC 24 to automatically control, so that the stretching distance and the pressing pressure are ensured to be the same each time, the crystal expansion quality is the same, the wafer film 39 can be automatically fixed without manual fixation, the degree of mechanization is high, the processing efficiency and the capacity can be improved, the electric heating block 25 can heat the heat conduction oil in the upper template 14, the liquid level of the heat conduction oil in the upper template 14 is observed through the floating ball liquid level meter 29, the heat preservation layer 30 can reduce the loss of heat conduction oil in the upper template 14, the fillet 31 can prevent the edge angle at the upper end of the lower template 5 from cutting the wafer film 39, the rubber ring 32 can increase the friction coefficient of the lower surface of the pressure ring 19, and the fixing effect of the wafer film 39 can be increased, pressing the emergency stop button 33 in case of malfunction can immediately stop the apparatus to reduce damage, and the height and levelness of the table 1 can be adjusted by rotating the lead screw 35 through the nut 36.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. The utility model provides a processing equipment of long body LED lamp pearl of RG, a serial communication port, including workstation (1), workstation (1) is ring circle structure, workstation (1) is down along the equidistant fixed socle (2) that are equipped with quantity for four of circumferencial direction, workstation (1) is fixed through the connecting rod down and is equipped with mounting panel (3), the fixed first cylinder (4) that is equipped with on mounting panel (3), fixed be equipped with on the piston rod of first cylinder (4) lower bolster (5) just lower bolster (5) with the inner ring phase-match of workstation (1), first cylinder (4) upper end one side outer wall is fixed and is equipped with infrared distance measuring sensor (6).
2. The processing equipment of the RG long LED lamp bead according to claim 1, characterized in that the workbench (1) is fixedly provided with four support rods (7) along the circumferential direction, a top plate (8) is fixedly arranged on the support rods (7), a first mounting groove (9) is formed in the middle of the lower surface of the top plate (8), four second mounting grooves (10) are formed in the lower surface of the top plate (8) along the circumferential direction at equal intervals, a second cylinder (11) is fixedly arranged in the first mounting groove (9), a third cylinder (12) is fixedly arranged in each second mounting groove (10), and a first pressure sensor (13) is fixedly arranged below the piston rod of the second cylinder (11);
the first pressure sensor (13) is fixedly provided with an upper template (14) below, a heating device is arranged in the upper template (14), the upper template (14) is fixedly provided with four limiting rods (15) in quantity along the circumferential direction, the top plate (8) is provided with four through holes (16) matched with the limiting rods (15), the through holes (16) are internally and fixedly provided with limiting sliding sleeves (17), the limiting sliding sleeves (17) are respectively sleeved on the outer walls of the corresponding limiting rods (15) in a sliding manner, the third cylinder (12) is fixedly provided with a second pressure sensor (18) below, the second pressure sensor (18) is fixedly provided with a pressing ring (19) below, the second pressure sensor (18) is fixedly connected with the pressing ring (19), and the inner diameter of the pressing ring (19) is slightly larger than the outer diameter of the lower template (5) and the upper template (14), the outer wall of one side of the workbench (1) is fixedly provided with a connecting plate (20), one end, far away from the workbench (1), of the connecting plate (20) is fixedly provided with a damping bearing (21), a rotating shaft (22) is fixedly arranged in the damping bearing (21), a touch screen (23) is fixedly arranged on the rotating shaft (22), a PLC (programmable logic controller) controller (24) is fixedly arranged below the connecting plate (20), electromagnetic valves of the first cylinder (4), the second cylinder (11) and the third cylinder (12) are electrically connected with the PLC controller (24), and the first pressure sensor (13), the second pressure sensor (18), the infrared distance measuring sensor (6) and the touch screen (23) are electrically connected with the PLC controller (24);
the heating device comprises two electric heating blocks (25), the upper template (14) is of a hollow box structure, the number of the electric heating blocks (25) is two, the two electric heating blocks are respectively fixed on the inner walls of the two sides of the upper template (14), one end of the upper template (14) is provided with an oil filling port (26), the oil filling port (26) is in threaded connection with a sealing cover (27), heat conducting oil is arranged in the upper template (14), the inner wall of the bottom end of the upper template (14) is fixedly provided with a temperature sensor (28), and the temperature sensor (28) and the electric heating blocks (25) are both electrically connected with the PLC (24); a floating ball liquid level meter (29) is arranged in the upper template (14); and a pressure sensing panel is arranged on the upper template (14), the pressure sensing panel can automatically mark a position according to the sensed pressure and display the position in a touch screen (23), and the display is a display in a coordinate system, so that the position can be automatically defined and the expansion is detected to be qualified.
3. The device and the method for processing the RG long LED lamp beads according to claim 2, wherein the outer surfaces of the upper wall and the side wall of the upper template (14) are both fixedly provided with an insulating layer (30), and the insulating layer (30) is made of rock wool material.
4. The processing equipment of an RG long body LED lamp pearl according to claim 2, characterized in that, the circumferencial direction processing of lower bolster (5) upper end has fillet (31).
5. The processing equipment of long body LED lamp pearl of RG according to claim 4, characterized in that, fixed rubber ring (32) that is equipped with under the clamping ring (19).
6. The processing equipment of long body LED lamp pearl of RG according to claim 5, characterized in that, fixed emergency stop button (33) that is equipped with on the connecting plate (20) middle part, emergency stop button (33) with PLC controller (24) electric connection.
7. The processing equipment of an RG long body LED lamp pearl according to claim 6, characterized in that threaded holes (34) are opened at the lower end of the foot posts (2), a lead screw (35) is connected with the threaded holes (34) in a threaded manner, a nut (36) is fixedly welded on the outer wall of the lower end of the lead screw (35), a chassis (37) is fixedly arranged under the lead screw (35), and an anti-skid rubber pad (38) is fixedly arranged under the chassis (37).
8. A method for use with an RG long body LED lamp bead processing apparatus, for use with the RG long body LED lamp bead processing apparatus of claim 7, comprising the steps of:
horizontal adjustment, namely rotating the screw rod through a nut to adjust the workbench to a horizontal state;
switching on a power supply: connecting a power supply to the PLC;
inputting parameters: inputting the pressure value of the upper template to the wafer film, the pressure value of the pressure ring to the wafer film, the heating temperature of the heat conducting oil and the rising height of the lower template through the touch screen;
heating at a temperature: the PLC controller electric heating block works to heat the heat conducting oil in the upper template, and after the temperature detected by the temperature sensor reaches the preset temperature for heating the heat conducting oil, the PLC controller reduces the power of the electric heating block to carry out heat preservation.
Feeding: placing a wafer film to be subjected to wafer expansion on a lower template;
starting crystal expansion: starting a crystal expansion program through a touch screen, automatically controlling devices such as a first cylinder, a second cylinder and a third cylinder to work by a PLC (programmable logic controller) to automatically expand crystals, and after the crystal expansion is finished, controlling the first cylinder, the second cylinder and the third cylinder to recover and reset by the PLC;
blanking: and taking down the wafer film after crystal expansion.
9. The method of the RG long LED lamp bead according to claim 8, characterized in that the specific flow of the above-mentioned crystal expansion is: the PLC controller firstly controls the third cylinder to simultaneously extend at the same speed to press the compression ring on the wafer film, when the second pressure sensor reaches the preset pressure value of the compression ring on the wafer film, the PLC controller controls the third cylinder to stop extending, at the moment, the compression ring can fix the edge of the wafer film, then the PLC controller controls the extension of the first cylinder to stretch the wafer film on the upper template, when the distance between the infrared distance measuring sensor and the lower template reaches the preset height of the lower template, the PLC controller controls the first cylinder to stop extending, then the second cylinder is controlled to extend to drive the upper template to press downwards, when the pressure value detected by the first pressure sensor reaches the preset pressure value of the upper template on the wafer film, the PLC controller controls the second cylinder to stop extending, the wafer film is subjected to hot-pressing and shaping, and crystal expansion is completed.
CN202010050398.5A 2020-01-14 2020-01-14 RG long LED lamp bead processing equipment and method Active CN111243992B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010050398.5A CN111243992B (en) 2020-01-14 2020-01-14 RG long LED lamp bead processing equipment and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010050398.5A CN111243992B (en) 2020-01-14 2020-01-14 RG long LED lamp bead processing equipment and method

Publications (2)

Publication Number Publication Date
CN111243992A true CN111243992A (en) 2020-06-05
CN111243992B CN111243992B (en) 2020-12-18

Family

ID=70868739

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010050398.5A Active CN111243992B (en) 2020-01-14 2020-01-14 RG long LED lamp bead processing equipment and method

Country Status (1)

Country Link
CN (1) CN111243992B (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311044A (en) * 2004-04-21 2005-11-04 Matsushita Electric Ind Co Ltd Method and device for dividing semiconductor substrate
CN107749404A (en) * 2017-11-18 2018-03-02 清远韶兴新能源科技有限公司 Brilliant machine is expanded in a kind of LED productions
CN207097786U (en) * 2017-07-26 2018-03-13 安徽三安光电有限公司 It is full-automatic to expand film machine
CN108010873A (en) * 2017-12-29 2018-05-08 无锡固电半导体股份有限公司 A kind of wafer expands brilliant machine automatically
CN108110096A (en) * 2018-02-10 2018-06-01 清远韶兴新能源科技有限公司 A kind of new expansion crystalline substance machine of LED production equipments
CN207953963U (en) * 2018-01-04 2018-10-12 济宁名家电子科技有限公司 A kind of process equipment of RG long bodies LED lamp bead
CN109368271A (en) * 2018-09-30 2019-02-22 苏州展德自动化设备有限公司 Expand the rotational automatic loading and unloading equipment of brilliant ring
CN109712917A (en) * 2018-12-29 2019-05-03 苏州矽微电子科技有限公司 A kind of wafer expansion is brilliant to shift method for adhering film and its mechanism
CN208903977U (en) * 2018-09-30 2019-05-24 惠州市鑫永诚光电科技有限公司 A kind of brilliant machine of expansion

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311044A (en) * 2004-04-21 2005-11-04 Matsushita Electric Ind Co Ltd Method and device for dividing semiconductor substrate
CN207097786U (en) * 2017-07-26 2018-03-13 安徽三安光电有限公司 It is full-automatic to expand film machine
CN107749404A (en) * 2017-11-18 2018-03-02 清远韶兴新能源科技有限公司 Brilliant machine is expanded in a kind of LED productions
CN108010873A (en) * 2017-12-29 2018-05-08 无锡固电半导体股份有限公司 A kind of wafer expands brilliant machine automatically
CN207953963U (en) * 2018-01-04 2018-10-12 济宁名家电子科技有限公司 A kind of process equipment of RG long bodies LED lamp bead
CN108110096A (en) * 2018-02-10 2018-06-01 清远韶兴新能源科技有限公司 A kind of new expansion crystalline substance machine of LED production equipments
CN109368271A (en) * 2018-09-30 2019-02-22 苏州展德自动化设备有限公司 Expand the rotational automatic loading and unloading equipment of brilliant ring
CN208903977U (en) * 2018-09-30 2019-05-24 惠州市鑫永诚光电科技有限公司 A kind of brilliant machine of expansion
CN109712917A (en) * 2018-12-29 2019-05-03 苏州矽微电子科技有限公司 A kind of wafer expansion is brilliant to shift method for adhering film and its mechanism

Also Published As

Publication number Publication date
CN111243992B (en) 2020-12-18

Similar Documents

Publication Publication Date Title
CN102981289B (en) Pressure device
CN202766272U (en) Filling and capping device
CN108994242B (en) Shrapnel riveting equipment in airtight detection equipment
CN111243992B (en) RG long LED lamp bead processing equipment and method
CN204666124U (en) Integrated board plate surface evenness pick-up unit
CN203582432U (en) Cap screwing machine
CN207343700U (en) A kind of squeeze riveter
CN108010873B (en) Automatic wafer expanding machine
CN206217315U (en) A kind of temperature control bubble chamber film machine
CN212275172U (en) Detection apparatus for wrapping bag
CN112849936A (en) Pneumatic element detection device
CN206840695U (en) A kind of automatic plastic steel composite pipe hemmer
CN205818536U (en) A kind of processing equipment of ripple core combination board
CN211783266U (en) Surface smoothness detection device for metal material production
CN211696646U (en) VIP short-term test elevating gear
CN206870411U (en) A kind of cold press for external wall insulation
CN206223367U (en) Air tightness test frock
CN211194921U (en) Tectorial membrane vacuum chamber with even heating structure
CN109866974B (en) Packaging device for product packaging
CN218906029U (en) Temperature control structure and flat vulcanizing machine
CN205952672U (en) Optical lens piece placer
CN112461664A (en) Display panel test fixture and test method thereof
CN217899439U (en) Automatic change and control test platform
CN106002185B (en) The apparatus and method that flexible die is installed in a kind of laser flexible loading
CN219121909U (en) Plastic product detection device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant