TWI437267B - A projection optical system, an exposure apparatus, and a device manufacturing method - Google Patents

A projection optical system, an exposure apparatus, and a device manufacturing method Download PDF

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Publication number
TWI437267B
TWI437267B TW099128858A TW99128858A TWI437267B TW I437267 B TWI437267 B TW I437267B TW 099128858 A TW099128858 A TW 099128858A TW 99128858 A TW99128858 A TW 99128858A TW I437267 B TWI437267 B TW I437267B
Authority
TW
Taiwan
Prior art keywords
optical system
magnification
mirror
lens
projection optical
Prior art date
Application number
TW099128858A
Other languages
English (en)
Chinese (zh)
Other versions
TW201118419A (en
Inventor
深見清司
Original Assignee
佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW201118419A publication Critical patent/TW201118419A/zh
Application granted granted Critical
Publication of TWI437267B publication Critical patent/TWI437267B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW099128858A 2009-10-06 2010-08-27 A projection optical system, an exposure apparatus, and a device manufacturing method TWI437267B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009232865A JP5595001B2 (ja) 2009-10-06 2009-10-06 投影光学系、露光装置及びデバイス製造方法

Publications (2)

Publication Number Publication Date
TW201118419A TW201118419A (en) 2011-06-01
TWI437267B true TWI437267B (zh) 2014-05-11

Family

ID=43886431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099128858A TWI437267B (zh) 2009-10-06 2010-08-27 A projection optical system, an exposure apparatus, and a device manufacturing method

Country Status (4)

Country Link
JP (1) JP5595001B2 (https=)
KR (1) KR101476871B1 (https=)
CN (1) CN102033315B (https=)
TW (1) TWI437267B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825339B (zh) * 2019-09-04 2023-12-11 日商佳能股份有限公司 曝光裝置，及物品的製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012205096B3 (de) 2012-03-29 2013-08-29 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage mit mindestens einem Manipulator
US9250509B2 (en) * 2012-06-04 2016-02-02 Applied Materials, Inc. Optical projection array exposure system
JP6041541B2 (ja) * 2012-06-04 2016-12-07 キヤノン株式会社 露光装置及びデバイス製造方法
JP6410406B2 (ja) * 2012-11-16 2018-10-24 キヤノン株式会社 投影光学系、露光装置および物品の製造方法
JP6386896B2 (ja) * 2014-12-02 2018-09-05 キヤノン株式会社 投影光学系、露光装置、および、デバイス製造方法
JP6896404B2 (ja) * 2016-11-30 2021-06-30 キヤノン株式会社 露光装置及び物品の製造方法
JP7005364B2 (ja) * 2018-01-29 2022-01-21 キヤノン株式会社 投影光学系、露光装置、物品の製造方法及び調整方法
JP2023004358A (ja) * 2021-06-25 2023-01-17 キヤノン株式会社 投影光学系、露光装置、および物品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235620A (ja) * 1985-08-09 1987-02-16 Canon Inc 光学倍率補正装置
JP3445021B2 (ja) * 1995-04-28 2003-09-08 キヤノン株式会社 光学装置
JP3884098B2 (ja) * 1996-03-22 2007-02-21 株式会社東芝 露光装置および露光方法
JP2002329651A (ja) * 2001-04-27 2002-11-15 Nikon Corp 露光装置、露光装置の製造方法、及びマイクロデバイスの製造方法
JP3465793B2 (ja) * 2002-10-24 2003-11-10 株式会社ニコン 投影露光装置及び投影露光方法
JP4195674B2 (ja) * 2004-03-31 2008-12-10 株式会社オーク製作所 投影光学系および投影露光装置
JP2006337528A (ja) * 2005-05-31 2006-12-14 Fujifilm Holdings Corp 画像露光装置
JP5118407B2 (ja) * 2007-07-31 2013-01-16 キヤノン株式会社 光学系、露光装置及びデバイス製造方法
JP2009098467A (ja) * 2007-10-18 2009-05-07 Adtec Engineeng Co Ltd 露光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825339B (zh) * 2019-09-04 2023-12-11 日商佳能股份有限公司 曝光裝置，及物品的製造方法

Also Published As

Publication number Publication date
TW201118419A (en) 2011-06-01
JP5595001B2 (ja) 2014-09-24
CN102033315B (zh) 2012-12-12
KR20110037857A (ko) 2011-04-13
KR101476871B1 (ko) 2014-12-26
JP2011082311A (ja) 2011-04-21
CN102033315A (zh) 2011-04-27

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