TWI430333B - 決定疊對誤差之方法及裝置 - Google Patents
決定疊對誤差之方法及裝置 Download PDFInfo
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- TWI430333B TWI430333B TW100125341A TW100125341A TWI430333B TW I430333 B TWI430333 B TW I430333B TW 100125341 A TW100125341 A TW 100125341A TW 100125341 A TW100125341 A TW 100125341A TW I430333 B TWI430333 B TW I430333B
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- Prior art keywords
- model
- asymmetry
- model structure
- target
- error
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Links
- 238000000034 method Methods 0.000 title claims description 63
- 239000000758 substrate Substances 0.000 claims description 86
- 230000005855 radiation Effects 0.000 claims description 76
- 238000001459 lithography Methods 0.000 claims description 40
- 238000005259 measurement Methods 0.000 claims description 36
- 230000003287 optical effect Effects 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000005286 illumination Methods 0.000 claims description 14
- 210000001747 pupil Anatomy 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000001939 inductive effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 23
- 238000001228 spectrum Methods 0.000 description 21
- 230000006870 function Effects 0.000 description 14
- 238000004364 calculation method Methods 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 12
- 238000001514 detection method Methods 0.000 description 10
- 238000009472 formulation Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 238000011161 development Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000004590 computer program Methods 0.000 description 6
- 238000007667 floating Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000006399 behavior Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 238000004611 spectroscopical analysis Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000004422 calculation algorithm Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G22/00—Cultivation of specific crops or plants not otherwise provided for
-
- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01H—NEW PLANTS OR NON-TRANSGENIC PROCESSES FOR OBTAINING THEM; PLANT REPRODUCTION BY TISSUE CULTURE TECHNIQUES
- A01H1/00—Processes for modifying genotypes ; Plants characterised by associated natural traits
- A01H1/06—Processes for producing mutations, e.g. treatment with chemicals or with radiation
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12N—MICROORGANISMS OR ENZYMES; COMPOSITIONS THEREOF; PROPAGATING, PRESERVING, OR MAINTAINING MICROORGANISMS; MUTATION OR GENETIC ENGINEERING; CULTURE MEDIA
- C12N15/00—Mutation or genetic engineering; DNA or RNA concerning genetic engineering, vectors, e.g. plasmids, or their isolation, preparation or purification; Use of hosts therefor
- C12N15/09—Recombinant DNA-technology
- C12N15/63—Introduction of foreign genetic material using vectors; Vectors; Use of hosts therefor; Regulation of expression
- C12N15/79—Vectors or expression systems specially adapted for eukaryotic hosts
- C12N15/82—Vectors or expression systems specially adapted for eukaryotic hosts for plant cells, e.g. plant artificial chromosomes (PACs)
- C12N15/8201—Methods for introducing genetic material into plant cells, e.g. DNA, RNA, stable or transient incorporation, tissue culture methods adapted for transformation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/53—Automatic registration or positioning of originals with respect to each other or the photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70681—Metrology strategies
- G03F7/706831—Recipe selection or optimisation, e.g. select or optimise recipe parameters such as wavelength, polarisation or illumination modes
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Genetics & Genomics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Biotechnology (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Molecular Biology (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Zoology (AREA)
- Wood Science & Technology (AREA)
- General Engineering & Computer Science (AREA)
- Botany (AREA)
- Environmental Sciences (AREA)
- Plant Pathology (AREA)
- Microbiology (AREA)
- Biophysics (AREA)
- Cell Biology (AREA)
- Biochemistry (AREA)
- Developmental Biology & Embryology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Breeding Of Plants And Reproduction By Means Of Culturing (AREA)
- Micro-Organisms Or Cultivation Processes Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36553810P | 2010-07-19 | 2010-07-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201209886A TW201209886A (en) | 2012-03-01 |
| TWI430333B true TWI430333B (zh) | 2014-03-11 |
Family
ID=44628354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100125341A TWI430333B (zh) | 2010-07-19 | 2011-07-18 | 決定疊對誤差之方法及裝置 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8908147B2 (enExample) |
| JP (1) | JP6008851B2 (enExample) |
| KR (1) | KR101793538B1 (enExample) |
| CN (1) | CN103003754B (enExample) |
| IL (2) | IL223965A (enExample) |
| NL (1) | NL2007088A (enExample) |
| TW (1) | TWI430333B (enExample) |
| WO (1) | WO2012010458A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI703651B (zh) * | 2014-10-03 | 2020-09-01 | 美商克萊譚克公司 | 驗證度量目標及其設計 |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2004094A (en) | 2009-02-11 | 2010-08-12 | Asml Netherlands Bv | Inspection apparatus, lithographic apparatus, lithographic processing cell and inspection method. |
| NL2005162A (en) * | 2009-07-31 | 2011-02-02 | Asml Netherlands Bv | Methods and scatterometers, lithographic systems, and lithographic processing cells. |
| JP6008851B2 (ja) * | 2010-07-19 | 2016-10-19 | エーエスエムエル ネザーランズ ビー．ブイ． | オーバレイ誤差を決定する方法及び装置 |
| NL2009294A (en) | 2011-08-30 | 2013-03-04 | Asml Netherlands Bv | Method and apparatus for determining an overlay error. |
| US9163935B2 (en) | 2011-12-12 | 2015-10-20 | Asml Netherlands B.V. | Device manufacturing method and associated lithographic apparatus, inspection apparatus, and lithographic processing cell |
| NL2010259A (en) | 2012-04-12 | 2013-10-16 | Asml Holding Nv | Position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method, optical element. |
| US8817273B2 (en) * | 2012-04-24 | 2014-08-26 | Nanometrics Incorporated | Dark field diffraction based overlay |
| NL2010717A (en) | 2012-05-21 | 2013-11-25 | Asml Netherlands Bv | Determining a structural parameter and correcting an asymmetry property. |
| NL2010734A (en) | 2012-05-29 | 2013-12-02 | Asml Netherlands Bv | Metrology method and apparatus, substrate, lithographic system and device manufacturing method. |
| JP5975785B2 (ja) * | 2012-08-14 | 2016-08-23 | 株式会社アドテックエンジニアリング | 描画装置、露光描画装置、プログラム及び描画方法 |
| US9518936B2 (en) | 2012-11-30 | 2016-12-13 | Asml Netherlands B.V. | Method and apparatus for determining lithographic quality of a structure |
| NL2011683A (en) * | 2012-12-13 | 2014-06-16 | Asml Netherlands Bv | Method of calibrating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product. |
| US9909982B2 (en) | 2013-03-08 | 2018-03-06 | Kla-Tencor Corporation | Pupil plane calibration for scatterometry overlay measurement |
| WO2014138522A1 (en) * | 2013-03-08 | 2014-09-12 | Kla-Tencor Corporation | Pupil plane calibration for scatterometry overlay measurement |
| KR101855243B1 (ko) * | 2013-08-07 | 2018-05-04 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법 |
| JP6007171B2 (ja) * | 2013-12-26 | 2016-10-12 | 東京エレクトロン株式会社 | 基板処理システム、基板搬送方法、プログラム及びコンピュータ記憶媒体 |
| WO2015193904A1 (en) * | 2014-06-19 | 2015-12-23 | Nova Measuring Instruments Ltd. | Test structure design for metrology measurements in patterned samples |
| CN111338187A (zh) * | 2014-08-29 | 2020-06-26 | Asml荷兰有限公司 | 度量方法、目标和衬底 |
| WO2016078862A1 (en) | 2014-11-21 | 2016-05-26 | Asml Netherlands B.V. | Metrology method and apparatus |
| CN112698551B (zh) * | 2014-11-25 | 2024-04-23 | 科磊股份有限公司 | 分析及利用景观 |
| KR102294349B1 (ko) * | 2014-11-26 | 2021-08-26 | 에이에스엠엘 네델란즈 비.브이. | 계측 방법, 컴퓨터 제품 및 시스템 |
| WO2016096310A1 (en) | 2014-12-15 | 2016-06-23 | Asml Holding N.V. | Method and apparatuses for optical pupil symmetrization |
| CN107111245B (zh) * | 2014-12-19 | 2019-10-18 | Asml荷兰有限公司 | 测量非对称性的方法、检查设备、光刻系统及器件制造方法 |
| JP6510658B2 (ja) | 2015-02-04 | 2019-05-08 | エーエスエムエル ネザーランズ ビー．ブイ． | メトロロジの方法及び装置、コンピュータプログラム、並びにリソグラフィシステム |
| WO2016124345A1 (en) * | 2015-02-04 | 2016-08-11 | Asml Netherlands B.V. | Metrology method, metrology apparatus and device manufacturing method |
| JP6524256B2 (ja) | 2015-04-21 | 2019-06-05 | エーエスエムエル ネザーランズ ビー．ブイ． | メトロロジ方法及び装置、コンピュータプログラム、並びにリソグラフィシステム |
| TWI755987B (zh) | 2015-05-19 | 2022-02-21 | 美商克萊譚克公司 | 具有用於疊對測量之形貌相位控制之光學系統 |
| IL256196B (en) * | 2015-06-17 | 2022-07-01 | Asml Netherlands Bv | Recipe selection based on inter-recipe consistency |
| US9779202B2 (en) | 2015-06-22 | 2017-10-03 | Kla-Tencor Corporation | Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements |
| CN108369382B (zh) * | 2015-10-08 | 2021-02-05 | Asml荷兰有限公司 | 控制光刻设备的方法和器件制造方法、用于光刻设备的控制系统及光刻设备 |
| CN108369387B (zh) * | 2015-12-17 | 2020-11-03 | Asml荷兰有限公司 | 使用非对称亚分辨率特征改善测量的光刻过程的光学量测术 |
| CN109073980B (zh) | 2015-12-17 | 2021-06-18 | Asml荷兰有限公司 | 量测设备的调节或基于已测量目标的特性而由量测设备进行的测量 |
| US10615084B2 (en) * | 2016-03-01 | 2020-04-07 | Asml Netherlands B.V. | Method and apparatus to determine a patterning process parameter, associated with a change in a physical configuration, using measured pixel optical characteristic values |
| IL262114B2 (en) * | 2016-04-22 | 2023-04-01 | Asml Netherlands Bv | Determining the stack difference and correcting with the help of the stack difference |
| CN107329373B (zh) * | 2016-04-29 | 2019-01-18 | 上海微电子装备（集团）股份有限公司 | 一种套刻误差测量装置及方法 |
| US10394132B2 (en) | 2016-05-17 | 2019-08-27 | Asml Netherlands B.V. | Metrology robustness based on through-wavelength similarity |
| US10578982B2 (en) | 2016-08-17 | 2020-03-03 | Asml Netherlands B.V. | Substrate measurement recipe design of, or for, a target including a latent image |
| IL265585B (en) * | 2016-09-27 | 2022-09-01 | Asml Netherlands Bv | Metrology recipe selection |
| US10983005B2 (en) | 2016-12-15 | 2021-04-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Spectroscopic overlay metrology |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| EP3422103A1 (en) * | 2017-06-26 | 2019-01-02 | ASML Netherlands B.V. | Method of determining a performance parameter of a process |
| EP3422105A1 (en) * | 2017-06-30 | 2019-01-02 | ASML Netherlands B.V. | Metrology parameter determination and metrology recipe selection |
| US10401738B2 (en) * | 2017-08-02 | 2019-09-03 | Kla-Tencor Corporation | Overlay metrology using multiple parameter configurations |
| JP6942555B2 (ja) | 2017-08-03 | 2021-09-29 | 東京エレクトロン株式会社 | 基板処理方法、コンピュータ記憶媒体及び基板処理システム |
| EP3457211A1 (en) | 2017-09-13 | 2019-03-20 | ASML Netherlands B.V. | A method of aligning a pair of complementary diffraction patterns and associated metrology method and apparatus |
| TW201923332A (zh) * | 2017-10-10 | 2019-06-16 | 荷蘭商Ａｓｍｌ荷蘭公司 | 度量衡方法和設備、電腦程式及微影系統 |
| US11483981B1 (en) * | 2018-05-14 | 2022-11-01 | Crop One Holdings, Inc. | Systems and methods for providing a low energy use farm |
| WO2019236084A1 (en) * | 2018-06-07 | 2019-12-12 | Kla-Tencor Corporation | Overlay measurement using phase and amplitude modeling |
| EP3650940A1 (en) * | 2018-11-09 | 2020-05-13 | ASML Netherlands B.V. | A method in the manufacturing process of a device, a non-transitory computer-readable medium and a system configured to perform the method |
| EP3770682A1 (en) * | 2019-07-25 | 2021-01-27 | ASML Netherlands B.V. | Method and system for determining information about a target structure |
| EP4338009A4 (en) * | 2021-10-21 | 2025-06-04 | KLA Corporation | INDUCED SHIFTS FOR IMPROVED OVERHEATING ERROR METROLOGY |
| CN118859632B (zh) * | 2023-04-19 | 2025-09-26 | 长鑫存储技术有限公司 | 套刻误差补偿方法 |
| KR102655300B1 (ko) * | 2023-08-11 | 2024-04-05 | (주)오로스 테크놀로지 | 오버레이 계측 장치의 보정 방법 및 오버레이 계측 장치의 보정 시스템 |
| US20250284205A1 (en) * | 2024-03-11 | 2025-09-11 | Kla Corporation | Robust and accurate overlay target design for cmp |
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| EP0400246A1 (en) * | 1989-05-31 | 1990-12-05 | Plant Genetic Systems, N.V. | Prevention of Bt resistance development |
| JP2842362B2 (ja) * | 1996-02-29 | 1999-01-06 | 日本電気株式会社 | 重ね合わせ測定方法 |
| US5963329A (en) * | 1997-10-31 | 1999-10-05 | International Business Machines Corporation | Method and apparatus for measuring the profile of small repeating lines |
| US6064486A (en) * | 1998-05-21 | 2000-05-16 | Leland Stanford Junior University | Systems, methods and computer program products for detecting the position of a new alignment mark on a substrate based on fitting to sample alignment signals |
| WO2002065545A2 (en) * | 2001-02-12 | 2002-08-22 | Sensys Instruments Corporation | Overlay alignment metrology using diffraction gratings |
| JP2004529330A (ja) * | 2001-03-02 | 2004-09-24 | アクセント オプティカル テクノロジーズ，インク． | スキャタロメトリを使用するライン・プロファイルの非対称測定 |
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-
2011
- 2011-07-12 JP JP2013520058A patent/JP6008851B2/ja active Active
- 2011-07-12 WO PCT/EP2011/061822 patent/WO2012010458A1/en not_active Ceased
- 2011-07-12 NL NL2007088A patent/NL2007088A/en not_active Application Discontinuation
- 2011-07-12 CN CN201180035218.5A patent/CN103003754B/zh active Active
- 2011-07-12 KR KR1020137004038A patent/KR101793538B1/ko active Active
- 2011-07-13 US US13/181,932 patent/US8908147B2/en active Active
- 2011-07-18 TW TW100125341A patent/TWI430333B/zh active
- 2011-07-19 US US13/811,101 patent/US20130125257A1/en not_active Abandoned
-
2012
- 2012-12-27 IL IL223965A patent/IL223965A/en active IP Right Grant
-
2016
- 2016-09-04 IL IL247621A patent/IL247621B/en active IP Right Grant
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI703651B (zh) * | 2014-10-03 | 2020-09-01 | 美商克萊譚克公司 | 驗證度量目標及其設計 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013535819A (ja) | 2013-09-12 |
| JP6008851B2 (ja) | 2016-10-19 |
| KR101793538B1 (ko) | 2017-11-03 |
| CN103003754A (zh) | 2013-03-27 |
| KR20130100988A (ko) | 2013-09-12 |
| IL247621B (en) | 2018-12-31 |
| US20120013881A1 (en) | 2012-01-19 |
| IL223965A (en) | 2016-09-29 |
| US20130125257A1 (en) | 2013-05-16 |
| US8908147B2 (en) | 2014-12-09 |
| CN103003754B (zh) | 2015-03-11 |
| TW201209886A (en) | 2012-03-01 |
| WO2012010458A1 (en) | 2012-01-26 |
| NL2007088A (en) | 2012-01-23 |
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