KR101793538B1 - 오버레이 오차를 결정하는 장치 및 방법 - Google Patents

오버레이 오차를 결정하는 장치 및 방법 Download PDF

Info

Publication number
KR101793538B1
KR101793538B1 KR1020137004038A KR20137004038A KR101793538B1 KR 101793538 B1 KR101793538 B1 KR 101793538B1 KR 1020137004038 A KR1020137004038 A KR 1020137004038A KR 20137004038 A KR20137004038 A KR 20137004038A KR 101793538 B1 KR101793538 B1 KR 101793538B1
Authority
KR
South Korea
Prior art keywords
model
overlay error
target
asymmetry
asymmetric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020137004038A
Other languages
English (en)
Korean (ko)
Other versions
KR20130100988A (ko
Inventor
마우리츠 반 데르 샤르
아리에 덴 보에프
안드레아스 푹스
마틴 쿠간스
카우스투베 바타차리야
미하엘 쿠비스
스티븐 모건
Original Assignee
에이에스엠엘 네델란즈 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20130100988A publication Critical patent/KR20130100988A/ko
Application granted granted Critical
Publication of KR101793538B1 publication Critical patent/KR101793538B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G22/00—Cultivation of specific crops or plants not otherwise provided for
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01H—NEW PLANTS OR NON-TRANSGENIC PROCESSES FOR OBTAINING THEM; PLANT REPRODUCTION BY TISSUE CULTURE TECHNIQUES
    • A01H1/00—Processes for modifying genotypes ; Plants characterised by associated natural traits
    • A01H1/06—Processes for producing mutations, e.g. treatment with chemicals or with radiation
    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12N—MICROORGANISMS OR ENZYMES; COMPOSITIONS THEREOF; PROPAGATING, PRESERVING, OR MAINTAINING MICROORGANISMS; MUTATION OR GENETIC ENGINEERING; CULTURE MEDIA
    • C12N15/00—Mutation or genetic engineering; DNA or RNA concerning genetic engineering, vectors, e.g. plasmids, or their isolation, preparation or purification; Use of hosts therefor
    • C12N15/09—Recombinant DNA-technology
    • C12N15/63—Introduction of foreign genetic material using vectors; Vectors; Use of hosts therefor; Regulation of expression
    • C12N15/79—Vectors or expression systems specially adapted for eukaryotic hosts
    • C12N15/82—Vectors or expression systems specially adapted for eukaryotic hosts for plant cells, e.g. plant artificial chromosomes (PACs)
    • C12N15/8201—Methods for introducing genetic material into plant cells, e.g. DNA, RNA, stable or transient incorporation, tissue culture methods adapted for transformation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/53—Automatic registration or positioning of originals with respect to each other or the photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/706831—Recipe selection or optimisation, e.g. select or optimise recipe parameters such as wavelength, polarisation or illumination modes

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Genetics & Genomics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Biotechnology (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Molecular Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Zoology (AREA)
  • Wood Science & Technology (AREA)
  • General Engineering & Computer Science (AREA)
  • Botany (AREA)
  • Environmental Sciences (AREA)
  • Plant Pathology (AREA)
  • Microbiology (AREA)
  • Biophysics (AREA)
  • Cell Biology (AREA)
  • Biochemistry (AREA)
  • Developmental Biology & Embryology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Breeding Of Plants And Reproduction By Means Of Culturing (AREA)
  • Micro-Organisms Or Cultivation Processes Thereof (AREA)
KR1020137004038A 2010-07-19 2011-07-12 오버레이 오차를 결정하는 장치 및 방법 Active KR101793538B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36553810P 2010-07-19 2010-07-19
US61/365,538 2010-07-19
PCT/EP2011/061822 WO2012010458A1 (en) 2010-07-19 2011-07-12 Method and apparatus for determining an overlay error

Publications (2)

Publication Number Publication Date
KR20130100988A KR20130100988A (ko) 2013-09-12
KR101793538B1 true KR101793538B1 (ko) 2017-11-03

Family

ID=44628354

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137004038A Active KR101793538B1 (ko) 2010-07-19 2011-07-12 오버레이 오차를 결정하는 장치 및 방법

Country Status (8)

Country Link
US (2) US8908147B2 (enExample)
JP (1) JP6008851B2 (enExample)
KR (1) KR101793538B1 (enExample)
CN (1) CN103003754B (enExample)
IL (2) IL223965A (enExample)
NL (1) NL2007088A (enExample)
TW (1) TWI430333B (enExample)
WO (1) WO2012010458A1 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2004094A (en) 2009-02-11 2010-08-12 Asml Netherlands Bv Inspection apparatus, lithographic apparatus, lithographic processing cell and inspection method.
NL2005162A (en) * 2009-07-31 2011-02-02 Asml Netherlands Bv Methods and scatterometers, lithographic systems, and lithographic processing cells.
JP6008851B2 (ja) * 2010-07-19 2016-10-19 エーエスエムエル ネザーランズ ビー．ブイ． オーバレイ誤差を決定する方法及び装置
NL2009294A (en) 2011-08-30 2013-03-04 Asml Netherlands Bv Method and apparatus for determining an overlay error.
US9163935B2 (en) 2011-12-12 2015-10-20 Asml Netherlands B.V. Device manufacturing method and associated lithographic apparatus, inspection apparatus, and lithographic processing cell
NL2010259A (en) 2012-04-12 2013-10-16 Asml Holding Nv Position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method, optical element.
US8817273B2 (en) * 2012-04-24 2014-08-26 Nanometrics Incorporated Dark field diffraction based overlay
NL2010717A (en) 2012-05-21 2013-11-25 Asml Netherlands Bv Determining a structural parameter and correcting an asymmetry property.
NL2010734A (en) 2012-05-29 2013-12-02 Asml Netherlands Bv Metrology method and apparatus, substrate, lithographic system and device manufacturing method.
JP5975785B2 (ja) * 2012-08-14 2016-08-23 株式会社アドテックエンジニアリング 描画装置、露光描画装置、プログラム及び描画方法
US9518936B2 (en) 2012-11-30 2016-12-13 Asml Netherlands B.V. Method and apparatus for determining lithographic quality of a structure
NL2011683A (en) * 2012-12-13 2014-06-16 Asml Netherlands Bv Method of calibrating a lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product.
US9909982B2 (en) 2013-03-08 2018-03-06 Kla-Tencor Corporation Pupil plane calibration for scatterometry overlay measurement
WO2014138522A1 (en) * 2013-03-08 2014-09-12 Kla-Tencor Corporation Pupil plane calibration for scatterometry overlay measurement
KR101855243B1 (ko) * 2013-08-07 2018-05-04 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법
JP6007171B2 (ja) * 2013-12-26 2016-10-12 東京エレクトロン株式会社 基板処理システム、基板搬送方法、プログラム及びコンピュータ記憶媒体
WO2015193904A1 (en) * 2014-06-19 2015-12-23 Nova Measuring Instruments Ltd. Test structure design for metrology measurements in patterned samples
CN111338187A (zh) * 2014-08-29 2020-06-26 Asml荷兰有限公司 度量方法、目标和衬底
TWI703651B (zh) * 2014-10-03 2020-09-01 美商克萊譚克公司 驗證度量目標及其設計
WO2016078862A1 (en) 2014-11-21 2016-05-26 Asml Netherlands B.V. Metrology method and apparatus
CN112698551B (zh) * 2014-11-25 2024-04-23 科磊股份有限公司 分析及利用景观
KR102294349B1 (ko) * 2014-11-26 2021-08-26 에이에스엠엘 네델란즈 비.브이. 계측 방법, 컴퓨터 제품 및 시스템
WO2016096310A1 (en) 2014-12-15 2016-06-23 Asml Holding N.V. Method and apparatuses for optical pupil symmetrization
CN107111245B (zh) * 2014-12-19 2019-10-18 Asml荷兰有限公司 测量非对称性的方法、检查设备、光刻系统及器件制造方法
JP6510658B2 (ja) 2015-02-04 2019-05-08 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジの方法及び装置、コンピュータプログラム、並びにリソグラフィシステム
WO2016124345A1 (en) * 2015-02-04 2016-08-11 Asml Netherlands B.V. Metrology method, metrology apparatus and device manufacturing method
JP6524256B2 (ja) 2015-04-21 2019-06-05 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジ方法及び装置、コンピュータプログラム、並びにリソグラフィシステム
TWI755987B (zh) 2015-05-19 2022-02-21 美商克萊譚克公司 具有用於疊對測量之形貌相位控制之光學系統
IL256196B (en) * 2015-06-17 2022-07-01 Asml Netherlands Bv Recipe selection based on inter-recipe consistency
US9779202B2 (en) 2015-06-22 2017-10-03 Kla-Tencor Corporation Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements
CN108369382B (zh) * 2015-10-08 2021-02-05 Asml荷兰有限公司 控制光刻设备的方法和器件制造方法、用于光刻设备的控制系统及光刻设备
CN108369387B (zh) * 2015-12-17 2020-11-03 Asml荷兰有限公司 使用非对称亚分辨率特征改善测量的光刻过程的光学量测术
CN109073980B (zh) 2015-12-17 2021-06-18 Asml荷兰有限公司 量测设备的调节或基于已测量目标的特性而由量测设备进行的测量
US10615084B2 (en) * 2016-03-01 2020-04-07 Asml Netherlands B.V. Method and apparatus to determine a patterning process parameter, associated with a change in a physical configuration, using measured pixel optical characteristic values
IL262114B2 (en) * 2016-04-22 2023-04-01 Asml Netherlands Bv Determining the stack difference and correcting with the help of the stack difference
CN107329373B (zh) * 2016-04-29 2019-01-18 上海微电子装备（集团）股份有限公司 一种套刻误差测量装置及方法
US10394132B2 (en) 2016-05-17 2019-08-27 Asml Netherlands B.V. Metrology robustness based on through-wavelength similarity
US10578982B2 (en) 2016-08-17 2020-03-03 Asml Netherlands B.V. Substrate measurement recipe design of, or for, a target including a latent image
IL265585B (en) * 2016-09-27 2022-09-01 Asml Netherlands Bv Metrology recipe selection
US10983005B2 (en) 2016-12-15 2021-04-20 Taiwan Semiconductor Manufacturing Co., Ltd. Spectroscopic overlay metrology
US10732516B2 (en) * 2017-03-01 2020-08-04 Kla Tencor Corporation Process robust overlay metrology based on optical scatterometry
EP3422103A1 (en) * 2017-06-26 2019-01-02 ASML Netherlands B.V. Method of determining a performance parameter of a process
EP3422105A1 (en) * 2017-06-30 2019-01-02 ASML Netherlands B.V. Metrology parameter determination and metrology recipe selection
US10401738B2 (en) * 2017-08-02 2019-09-03 Kla-Tencor Corporation Overlay metrology using multiple parameter configurations
JP6942555B2 (ja) 2017-08-03 2021-09-29 東京エレクトロン株式会社 基板処理方法、コンピュータ記憶媒体及び基板処理システム
EP3457211A1 (en) 2017-09-13 2019-03-20 ASML Netherlands B.V. A method of aligning a pair of complementary diffraction patterns and associated metrology method and apparatus
TW201923332A (zh) * 2017-10-10 2019-06-16 荷蘭商Ａｓｍｌ荷蘭公司 度量衡方法和設備、電腦程式及微影系統
US11483981B1 (en) * 2018-05-14 2022-11-01 Crop One Holdings, Inc. Systems and methods for providing a low energy use farm
WO2019236084A1 (en) * 2018-06-07 2019-12-12 Kla-Tencor Corporation Overlay measurement using phase and amplitude modeling
EP3650940A1 (en) * 2018-11-09 2020-05-13 ASML Netherlands B.V. A method in the manufacturing process of a device, a non-transitory computer-readable medium and a system configured to perform the method
EP3770682A1 (en) * 2019-07-25 2021-01-27 ASML Netherlands B.V. Method and system for determining information about a target structure
EP4338009A4 (en) * 2021-10-21 2025-06-04 KLA Corporation INDUCED SHIFTS FOR IMPROVED OVERHEATING ERROR METROLOGY
CN118859632B (zh) * 2023-04-19 2025-09-26 长鑫存储技术有限公司 套刻误差补偿方法
KR102655300B1 (ko) * 2023-08-11 2024-04-05 (주)오로스 테크놀로지 오버레이 계측 장치의 보정 방법 및 오버레이 계측 장치의 보정 시스템
US20250284205A1 (en) * 2024-03-11 2025-09-11 Kla Corporation Robust and accurate overlay target design for cmp

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5877036A (en) 1996-02-29 1999-03-02 Nec Corporation Overlay measuring method using correlation function
US20030212525A1 (en) 2002-01-31 2003-11-13 Joerg Bischoff Overlay measurements using periodic gratings
JP2008042202A (ja) 2006-08-08 2008-02-21 Asml Netherlands Bv 角度分解分光リソグラフィの特徴付けのための方法および装置
US20090168062A1 (en) * 2007-10-25 2009-07-02 Asml Netherlands B.V. Inspection Method and Apparatus, Lithographic Apparatus, Lithographic Processing Cell, and Device Manufacturing Method to Measure a Property of a Substrate

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0400246A1 (en) * 1989-05-31 1990-12-05 Plant Genetic Systems, N.V. Prevention of Bt resistance development
US5963329A (en) * 1997-10-31 1999-10-05 International Business Machines Corporation Method and apparatus for measuring the profile of small repeating lines
US6064486A (en) * 1998-05-21 2000-05-16 Leland Stanford Junior University Systems, methods and computer program products for detecting the position of a new alignment mark on a substrate based on fitting to sample alignment signals
WO2002065545A2 (en) * 2001-02-12 2002-08-22 Sensys Instruments Corporation Overlay alignment metrology using diffraction gratings
JP2004529330A (ja) * 2001-03-02 2004-09-24 アクセント オプティカル テクノロジーズ，インク． スキャタロメトリを使用するライン・プロファイルの非対称測定
US6486956B2 (en) * 2001-03-23 2002-11-26 Micron Technology, Inc. Reducing asymmetrically deposited film induced registration error
US6928628B2 (en) * 2002-06-05 2005-08-09 Kla-Tencor Technologies Corporation Use of overlay diagnostics for enhanced automatic process control
EP1512112A4 (en) * 2002-06-05 2006-11-02 Kla Tencor Tech Corp USE OF OVERLAY DIAGNOSIS FOR ADVANCED AUTOMATIC PROCESS CONTROL
JP4095391B2 (ja) * 2002-09-24 2008-06-04 キヤノン株式会社 位置検出方法
DE602004029089D1 (de) * 2003-10-02 2010-10-21 Monsanto Technology Llc Stapeln von merkmalen zur verbesserung von nutzpflanzen in transgenen pflanzen
JP4734261B2 (ja) * 2004-02-18 2011-07-27 ケーエルエー−テンカー コーポレイション 連続変化するオフセットマークと、オーバレイ決定方法
TWI233637B (en) * 2004-03-17 2005-06-01 Promos Technologies Inc Method of correcting lithography process and method of forming overlay mark
US7791727B2 (en) * 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7619737B2 (en) * 2007-01-22 2009-11-17 Asml Netherlands B.V Method of measurement, an inspection apparatus and a lithographic apparatus
US20090300980A1 (en) * 2008-05-02 2009-12-10 Dow Agrosciences Llc Corn with transgenic insect protection traits utilized in combination with drought tolerance and/or reduced inputs particularly fertilizer
CN101566800B (zh) * 2009-02-27 2011-05-11 上海微电子装备有限公司 一种用于光刻设备的对准系统和对准方法
NL2004656A (en) * 2009-05-12 2010-11-15 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method.
NL2004815A (en) * 2009-06-17 2010-12-20 Asml Netherlands Bv Method of overlay measurement, lithographic apparatus, inspection apparatus, processing apparatus and lithographic processing cell.
JP6008851B2 (ja) * 2010-07-19 2016-10-19 エーエスエムエル ネザーランズ ビー．ブイ． オーバレイ誤差を決定する方法及び装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5877036A (en) 1996-02-29 1999-03-02 Nec Corporation Overlay measuring method using correlation function
US20030212525A1 (en) 2002-01-31 2003-11-13 Joerg Bischoff Overlay measurements using periodic gratings
JP2008042202A (ja) 2006-08-08 2008-02-21 Asml Netherlands Bv 角度分解分光リソグラフィの特徴付けのための方法および装置
US20090168062A1 (en) * 2007-10-25 2009-07-02 Asml Netherlands B.V. Inspection Method and Apparatus, Lithographic Apparatus, Lithographic Processing Cell, and Device Manufacturing Method to Measure a Property of a Substrate

Also Published As

Publication number Publication date
JP2013535819A (ja) 2013-09-12
JP6008851B2 (ja) 2016-10-19
CN103003754A (zh) 2013-03-27
KR20130100988A (ko) 2013-09-12
IL247621B (en) 2018-12-31
US20120013881A1 (en) 2012-01-19
IL223965A (en) 2016-09-29
US20130125257A1 (en) 2013-05-16
US8908147B2 (en) 2014-12-09
CN103003754B (zh) 2015-03-11
TW201209886A (en) 2012-03-01
WO2012010458A1 (en) 2012-01-26
NL2007088A (en) 2012-01-23
TWI430333B (zh) 2014-03-11

Similar Documents

Publication Publication Date Title
KR101793538B1 (ko) 오버레이 오차를 결정하는 장치 및 방법
KR101457030B1 (ko) 오버레이 오차를 결정하는 장치 및 방법
US7460237B1 (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US10591283B2 (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
KR101850407B1 (ko) 구조체의 관심 파라미터 값의 재구성의 품질을 평가하는 방법, 검사 장치 및 컴퓨터 프로그램 제품
KR101765814B1 (ko) 검사 방법 및 장치, 및 대응하는 리소그래피 장치
NL2011000A (en) Inspection method and apparatus, lithographic system and device manufacturing method.
US9163935B2 (en) Device manufacturing method and associated lithographic apparatus, inspection apparatus, and lithographic processing cell
US9360768B2 (en) Inspection method and apparatus
KR101887924B1 (ko) 검사 방법 및 장치, 및 리소그래피 장치
US8233155B2 (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20130218

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20160406

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20160920

Patent event code: PE09021S01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20170405

Patent event code: PE09021S02D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20171019

PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20171030

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20171031

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20201023

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20211022

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20221020

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20231017

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20241017

Start annual number: 8

End annual number: 8