TWI429735B - 結構化研磨物件、其製造方法及於晶圓平坦化中之用途 - Google Patents

結構化研磨物件、其製造方法及於晶圓平坦化中之用途 Download PDF

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Publication number
TWI429735B
TWI429735B TW098126988A TW98126988A TWI429735B TW I429735 B TWI429735 B TW I429735B TW 098126988 A TW098126988 A TW 098126988A TW 98126988 A TW98126988 A TW 98126988A TW I429735 B TWI429735 B TW I429735B
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TW
Taiwan
Prior art keywords
abrasive
acrylate
meth
abrasive article
structured
Prior art date
Application number
TW098126988A
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English (en)
Chinese (zh)
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TW201012908A (en
Inventor
威廉 戴爾 喬瑟夫
吉米 瑞 二世 拜倫
茱莉 優 奎恩
約翰 詹姆士 蓋葛莉亞迪
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３Ｍ新設資產公司
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Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201012908A publication Critical patent/TW201012908A/zh
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Publication of TWI429735B publication Critical patent/TWI429735B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW098126988A 2008-08-28 2009-08-11 結構化研磨物件、其製造方法及於晶圓平坦化中之用途 TWI429735B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28

Publications (2)

Publication Number Publication Date
TW201012908A TW201012908A (en) 2010-04-01
TWI429735B true TWI429735B (zh) 2014-03-11

Family

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Family Applications (1)

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TW098126988A TWI429735B (zh) 2008-08-28 2009-08-11 結構化研磨物件、其製造方法及於晶圓平坦化中之用途

Country Status (7)

Country Link
US (1) US8251774B2 (https=)
EP (1) EP2327088B1 (https=)
JP (1) JP5351967B2 (https=)
KR (1) KR101602001B1 (https=)
CN (1) CN102138203B (https=)
TW (1) TWI429735B (https=)
WO (1) WO2010025003A2 (https=)

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Also Published As

Publication number Publication date
EP2327088A4 (en) 2017-06-14
EP2327088A2 (en) 2011-06-01
KR20110055686A (ko) 2011-05-25
CN102138203A (zh) 2011-07-27
TW201012908A (en) 2010-04-01
US20100056024A1 (en) 2010-03-04
JP5351967B2 (ja) 2013-11-27
WO2010025003A2 (en) 2010-03-04
EP2327088B1 (en) 2019-01-09
WO2010025003A3 (en) 2010-04-22
CN102138203B (zh) 2015-02-04
JP2012501252A (ja) 2012-01-19
KR101602001B1 (ko) 2016-03-17
US8251774B2 (en) 2012-08-28

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