TWI429013B - 基板之高速對準裝置 - Google Patents

基板之高速對準裝置 Download PDF

Info

Publication number
TWI429013B
TWI429013B TW095111132A TW95111132A TWI429013B TW I429013 B TWI429013 B TW I429013B TW 095111132 A TW095111132 A TW 095111132A TW 95111132 A TW95111132 A TW 95111132A TW I429013 B TWI429013 B TW I429013B
Authority
TW
Taiwan
Prior art keywords
substrate
collet
alignment
frame
sensing
Prior art date
Application number
TW095111132A
Other languages
English (en)
Chinese (zh)
Other versions
TW200703542A (en
Inventor
傑羅笛拉毛拉
馬丁荷西
脫迪波多雷
烏利西吉爾基督
Original Assignee
布魯克斯自動機械公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 布魯克斯自動機械公司 filed Critical 布魯克斯自動機械公司
Publication of TW200703542A publication Critical patent/TW200703542A/zh
Application granted granted Critical
Publication of TWI429013B publication Critical patent/TWI429013B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37608—Center and diameter of hole, wafer, object
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095111132A 2005-03-30 2006-03-30 基板之高速對準裝置 TWI429013B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/093,479 US7891936B2 (en) 2005-03-30 2005-03-30 High speed substrate aligner apparatus

Publications (2)

Publication Number Publication Date
TW200703542A TW200703542A (en) 2007-01-16
TWI429013B true TWI429013B (zh) 2014-03-01

Family

ID=37054057

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111132A TWI429013B (zh) 2005-03-30 2006-03-30 基板之高速對準裝置

Country Status (7)

Country Link
US (2) US7891936B2 (https=)
EP (1) EP1866958B1 (https=)
JP (2) JP5820559B2 (https=)
KR (1) KR101366754B1 (https=)
CN (2) CN101379604B (https=)
TW (1) TWI429013B (https=)
WO (1) WO2006105156A2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7891936B2 (en) 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
JP2008103544A (ja) * 2006-10-19 2008-05-01 Yaskawa Electric Corp アライナー装置
CN103192463A (zh) * 2012-01-05 2013-07-10 沈阳新松机器人自动化股份有限公司 透光夹持式预对准机
US9548231B2 (en) * 2013-06-05 2017-01-17 Persimmon Technologies, Corp. Robot and adaptive placement system and method
US9062968B2 (en) 2013-07-23 2015-06-23 Avago Technologies General Ip (Singapore) Pte. Ltd. PCB loading apparatus for measuring thickness of printed circuit board stack
US20150090295A1 (en) * 2013-09-28 2015-04-02 Applied Materials, Inc. Apparatus and methods for a mask inverter
JP6420852B2 (ja) * 2015-01-28 2018-11-07 堺ディスプレイプロダクト株式会社 反転装置、及び液晶表示パネルの製造方法
KR102587203B1 (ko) 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
KR102576705B1 (ko) * 2018-08-30 2023-09-08 삼성전자주식회사 기판 본딩 장치 및 기판의 본딩 방법
US12002696B2 (en) * 2020-06-30 2024-06-04 Brooks Automation Us, Llc Substrate mapping apparatus and method therefor
KR102501318B1 (ko) * 2022-04-07 2023-02-16 양희찬 웨이퍼 이동암

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915564A (en) 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US5102280A (en) * 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
US5264787A (en) * 1991-08-30 1993-11-23 Hughes Aircraft Company Rigid-flex circuits with raised features as IC test probes
JPH06151566A (ja) * 1992-11-04 1994-05-31 Matsushita Electric Ind Co Ltd オリフラ位置検出装置およびオリフラ位置合わせ装置
US5491618A (en) 1993-08-20 1996-02-13 Lights Of America, Inc. Light fixture
JPH07260455A (ja) * 1994-03-23 1995-10-13 Kokusai Electric Co Ltd 基板位置決め方法及び装置
US5568969A (en) 1996-03-22 1996-10-29 Yu; Jack Convertible light assembly
JP3439607B2 (ja) 1996-09-04 2003-08-25 東京エレクトロン株式会社 ノッチ整列装置
US6126381A (en) * 1997-04-01 2000-10-03 Kensington Laboratories, Inc. Unitary specimen prealigner and continuously rotatable four link robot arm mechanism
US6126380A (en) * 1997-08-04 2000-10-03 Creative Design Corporation Robot having a centering and flat finding means
US6530732B1 (en) 1997-08-12 2003-03-11 Brooks Automation, Inc. Single substrate load lock with offset cool module and buffer chamber
US6309163B1 (en) * 1997-10-30 2001-10-30 Applied Materials, Inc. Wafer positioning device with storage capability
US6439740B1 (en) 1997-12-01 2002-08-27 Technical Consumer Products, Inc. Lighting fixture having a screw lock lamp support
JP2000021956A (ja) * 1998-07-02 2000-01-21 Mecs Corp ノッチ合わせ機
JP2000068357A (ja) * 1998-08-25 2000-03-03 Kobe Steel Ltd ウェーハ切欠部位置検出装置及びウェーハ特性測定装置
IL128087A (en) * 1999-01-17 2002-04-21 Nova Measuring Instr Ltd Buffer station for a wafer handling system
US6212961B1 (en) * 1999-02-11 2001-04-10 Nova Measuring Instruments Ltd. Buffer system for a wafer handling system
US6275742B1 (en) 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
US6357996B2 (en) * 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner
EP1139390A1 (en) * 2000-03-28 2001-10-04 Infineon Technologies AG Semiconductor wafer pod
US6468022B1 (en) 2000-07-05 2002-10-22 Integrated Dynamics Engineering, Inc. Edge-gripping pre-aligner
KR100885082B1 (ko) 2000-09-01 2009-02-25 어사이스트 테크놀로지스, 인코포레이티드 버퍼링 성능을 가진 에지 그립 얼라이너
US6435807B1 (en) * 2000-12-14 2002-08-20 Genmark Automation Integrated edge gripper
US6494589B1 (en) 2001-08-31 2002-12-17 Shing Jy Shyu Ceiling fan having one or more changeable lamp devices
US20030053904A1 (en) * 2001-09-14 2003-03-20 Naofumi Kirihata Wafer aligner
JP2003163258A (ja) * 2001-09-14 2003-06-06 Assist Japan Kk ウェハのアライナー装置
CA2476389A1 (en) 2002-03-22 2003-10-09 Electro Scientific Industries, Inc. Test probe alignment apparatus
JP3956350B2 (ja) * 2002-03-25 2007-08-08 東京エレクトロン株式会社 位置決め機能を有する基板処理装置及び位置決め機能を有する基板処理方法
US6669159B1 (en) 2003-01-07 2003-12-30 Dong Guan Bright Yin Huey Lighting Co., Ltd. Ceiling fixture
JP2004259845A (ja) * 2003-02-25 2004-09-16 Nikon Corp パラメータ調整方法、物体搬送方法、露光装置、及びプログラム
JP4277092B2 (ja) * 2003-03-28 2009-06-10 アシストテクノロジーズジャパンホールディングス株式会社 ウェハのアライナー装置
KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
US7596425B2 (en) * 2003-06-13 2009-09-29 Dainippon Screen Mfg. Co., Ltd. Substrate detecting apparatus and method, substrate transporting apparatus and method, and substrate processing apparatus and method
US7019817B2 (en) * 2003-07-14 2006-03-28 Kawasaki Jukogyo Kabuishiki Kaisha Edge-holding aligner
KR100547936B1 (ko) 2003-08-07 2006-01-31 삼성전자주식회사 불순물 용출 장치
US20050099817A1 (en) 2003-11-10 2005-05-12 Lin Kuo K. Ceiling fixture
US20060007176A1 (en) 2004-07-06 2006-01-12 Chung-Yi Shen Input method and control module defined with an initial position and moving directions and electronic product thereof
KR100657789B1 (ko) 2004-07-15 2006-12-14 삼성전자주식회사 유전막의 누설 전류 특성을 검사하는 방법 및 이를수행하기 위한 장치
US9099506B2 (en) 2005-03-30 2015-08-04 Brooks Automation, Inc. Transfer chamber between workstations
US7891936B2 (en) 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
US8545165B2 (en) 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus

Also Published As

Publication number Publication date
EP1866958A2 (en) 2007-12-19
US8403619B2 (en) 2013-03-26
EP1866958A4 (en) 2010-04-21
US7891936B2 (en) 2011-02-22
EP1866958B1 (en) 2014-06-25
CN101379604A (zh) 2009-03-04
WO2006105156A3 (en) 2008-10-30
CN102024735A (zh) 2011-04-20
US20120045300A1 (en) 2012-02-23
KR101366754B1 (ko) 2014-02-24
WO2006105156A2 (en) 2006-10-05
JP5820559B2 (ja) 2015-11-24
TW200703542A (en) 2007-01-16
US20060245846A1 (en) 2006-11-02
WO2006105156A8 (en) 2007-11-29
CN102024735B (zh) 2012-12-26
KR20070119058A (ko) 2007-12-18
JP2008538258A (ja) 2008-10-16
JP5976612B2 (ja) 2016-08-23
CN101379604B (zh) 2010-12-15
JP2014013925A (ja) 2014-01-23

Similar Documents

Publication Publication Date Title
US8403619B2 (en) High speed substrate aligner apparatus
US11508597B2 (en) High speed substrate aligner apparatus
JP5259907B2 (ja) 加工ツール、加工物を位置合わせする方法、及び加工物を次々に加工する方法
WO2007088927A1 (ja) 基板交換装置及び基板処理装置並びに基板検査装置
JP2008538258A5 (https=)
JP2001093960A (ja) 処理装置用ウエファ位置決め装置
JPH05206251A (ja) オリエンテイションフラット位置合わせ装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees