TWI426964B - Organic EL display cleaning device, organic EL display manufacturing device, organic EL display and organic EL mask cleaning method - Google Patents

Description

Mask cleaning device for organic EL, manufacturing device for organic EL display, organic EL display, and mask cleaning method for organic EL

The present invention relates to a clean mask for a clean organic EL, a device for manufacturing an organic EL (Electro Luminescence) display, an organic EL display, and an organic EL for performing an organic EL mask by laser irradiation. Use a mask to clean the method.

An organic EL (Electro Luminescence) display is a low-power, thin and light image display device that does not require a backlight, and is widely used. In the structure, an organic EL thin film layer is laminated on a transparent glass substrate, and the organic EL thin film layer has a structure in which a light emitting layer is sandwiched between an anode layer and a cathode layer. The light-emitting layer is widely used by depositing an organic material on a glass substrate to form a thin film, and the respective pixel regions constituting the display are divided into three to vapor-deposit three colors of RGB (red, green, blue). organic material. Therefore, in order to deposit an organic material (organic pigment material) of a different color in three regions of each pixel, vapor deposition is performed using an organic EL mask (image mask) in which a large number of openings are formed. The organic EL is patterned by disposing each of the masks, and the vapor deposition process of the light-emitting layer is completed by vapor-depositing the vapor-deposited materials of the respective colors.

When the vapor deposition process is performed, the organic material adheres not only to the glass substrate but also to the organic EL mask. The organic EL mask is not used only in one vapor deposition process, but is reused. When the next vapor deposition process is performed, if a vapor deposition material adheres to the organic EL mask, the vapor deposition material adheres to the vapor deposition material. The top of the new glass substrate. Further, the organic material is also vapor-deposited on the edge portion of the opening portion formed in the organic EL mask, so that the area of the opening portion is partially or completely blocked. Needless to say, when the entire opening portion is clogged, the opening area changes even when it is partially blocked, and the vapor deposition accuracy in the case of using the organic EL mask is remarkably lowered, and it becomes unusable. Therefore, the vapor deposition material is removed by periodically cleaning the organic EL mask after completing one vapor deposition process.

As the cleaning of the organic EL mask, wet cleaning using a surfactant or the like is mainly performed. The wet cleaning system cleans the liquid supplied to the organic EL mask. However, the mask for the organic EL to be cleaned is an ultra-thin metal plate of a micron order (several tens of micrometers), and when wet and clean, the organic EL mask is distorted or deformed based on the liquid pressure. The big damage. In addition, when wet cleaning is performed using a chemical solution such as a surfactant, a chemical supply mechanism and a liquid discharge processing mechanism for processing the used chemical liquid (discharge) are required, and the mechanism is complicated, and liquid discharge is also generated. Environmental pollution problems.

On the other hand, in the case of cleaning without using a wet clean liquid, Patent Document 1 discloses a technique of irradiating a laser for a mask for organic EL to perform clean (laser clean). A mask for the organic EL is irradiated with a laser to cause a peeling force between the organic EL mask and the organic material. According to the technique of Patent Document 1, the organic material is removed from the organic EL mask by the peeling force to perform cleaning.

[Previous Technical Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-169573

In the technique of Patent Document 1, although the organic EL mask is irradiated with a laser and the adhered organic material is peeled off, in order to prevent contamination in the clean tank or the atmosphere, the organic material after peeling is not required from the organic EL. Separate with a mask. Therefore, in order to remove the organic material after peeling, an adhesive film is used. In order to transfer the peeled organic material to the adhesive, the film is irradiated with a laser and the peeled vapor deposition material is transferred to the film while the film is adhered to the organic EL mask. Then, the cleaning process is completed by peeling off the film on which the organic material is transferred from the mask for the organic EL.

As described above, the mask for organic EL is an extremely thin metal plate, and even if it is a very small force, it may be damaged by deformation or deformation. In addition, with the large screen of the organic EL display in recent years, the size of the mask for the organic EL is also large, and the processing of the large and extremely thin mask for the organic EL needs to be extremely fine. In the technique of Patent Document 1, the peeling of the film of the mask for organic EL is performed so as to be peeled off against the adhesive force, and excessive force acts on the mask for the organic EL. As a result, the organic EL mask was given a great damage.

In the case of Patent Document 1, the organic material is peeled off from the organic EL mask by laser irradiation. However, in order to remove the peeled organic material, the film is brought into contact with the organic EL mask, and as a result, it is not non-contact. Way to complete the cleansing. Further, as a film, a material that can be transmitted through a laser (polyethylene terephthalate) is used, but even if a transparent film is used, the laser is attenuated. Therefore, it is not possible to give sufficient energy to the mask for organic EL, and it is impossible to exhibit a high cleansing effect. Further, there is a need for a dedicated mechanism for adhering and peeling a film, which has a problem that the mechanism is complicated and the device is enlarged. In particular, when the mask for organic EL is large in size, the size of the film is also increased, and the problem of complication of the mechanism and enlargement of the device becomes more remarkable.

Therefore, an object of the present invention is to remove the vapor-deposited material in a completely non-contact state when the vapor-deposited material adhering to the organic EL mask is removed.

In order to solve the above problems, the mask cleaning apparatus for an organic EL according to the first aspect of the present invention is a mask cleaning apparatus for organic EL for removing a vapor deposition material adhering to a mask for an organic EL. A laser device that irradiates the surface of the organic EL mask with laser light, scatters the vapor-deposited material to cause a free product to scatter upward, and is formed by the organic EL mask. The means for removing the aforementioned free product is removed from the position where the surface is separated.

According to the mask cleaning apparatus for the organic EL, the vapor deposition material adhering to the mask for the organic EL is pulverized into a free product, which is scattered upward, and is provided on the surface of the mask for the organic EL. The removal means at a separate position is used to remove the free product, and the mask for the organic EL can be cleaned without contacting a solid or a liquid.

A mask cleaning apparatus for an organic EL according to the invention of claim 2, wherein the removal means is formed by the aforementioned removal means. A gas flow forming means for removing the gas stream which is removed by the product.

According to the mask cleaning apparatus for organic EL, the scattered free product can be removed by the air current formed at a position separated by the surface of the organic EL mask.

A mask cleaning apparatus for an organic EL according to the invention of claim 2, wherein the airflow is formed from the organic EL mask. The flow of the laminar flow at a position where the surface of the cover is separated, and has a flow along the surface of the aforementioned EL mask.

According to the mask cleaning apparatus for organic EL, the airflow becomes a laminar flow state separated from the surface of the organic EL mask, and flows along the surface of the organic EL mask. By forming a gas stream in a laminar flow state above the mask for the organic EL, the scattered free product is transported by the airflow, and the airflow is formed at a position separated from the surface of the organic EL mask, and the mask for the organic EL is used. The area directly above does not cause turbulence. As a result, the mask for the organic EL is not returned again, and the free product does not adhere to the mask for the organic EL again, and an extremely high cleaning effect can be obtained.

The mask cleaning apparatus for an organic EL according to the invention of claim 4, wherein the mask cleaning apparatus for organic EL according to claim 2 or 3, wherein the laser scanning apparatus is provided The laser scanning means for the surface of the mask for organic EL.

According to this mask cleaning apparatus for organic EL, by scanning the laser, it is possible to clean a specific region of the mask for the organic EL. The scanning range of the laser may be comprehensive to the mask of the organic EL, or may be limited to a part of the area.

A mask cleaning apparatus for an organic EL according to the invention of claim 5, wherein the mask for cleaning the organic EL is provided in the mask for cleaning the organic EL according to the second aspect of the invention. A relative moving means for moving relative to the aforementioned laser means.

According to the mask cleaning apparatus for organic EL, by moving the organic EL mask and the laser means relatively, it is possible to clean a specific region of the organic EL mask. The relative movement means may be such that the organic EL mask and the laser means can be relatively moved, and one or both of the organic EL mask and the laser means can be moved.

A mask cleaning apparatus for an organic EL according to claim 4, wherein the mask for cleaning the organic EL according to the fourth or fifth aspect of the invention is used in the mask for the organic EL. The different regions are respectively irradiated with lasers, and there are a plurality of the aforementioned laser means.

According to the mask cleaning apparatus for organic EL, the organic EL mask can be cleaned by dividing the area by a plurality of laser means, and cleaning can be performed at high speed.

The mask cleaning apparatus for an organic EL according to the invention of claim 3, wherein the airflow forming means is provided from the organic The EL mask separates only the attraction means provided at the position of the interval necessary for forming the aforementioned air current in the laminar flow state.

According to the mask cleaning apparatus for the organic EL, the suction means is attached to the surface of the mask for the organic EL, and is attracted to the surface of the mask for the organic EL, so that the surface can be removed from the surface of the mask for the organic EL. The separated position forms a flow in a laminar flow state.

A mask cleaning apparatus for an organic EL according to claim 7 of the invention, wherein the airflow forming means includes: toward the suction means The means of sending air to the wind.

According to the mask cleaning apparatus for organic EL, by combining the suction means and the air blowing means, it is possible to travel the flow in a stable laminar flow state.

A mask cleaning apparatus for an organic EL according to claim 9 of the present invention, which is characterized in that: The opening portion of the cover forms an ascending airflow forming means for forming an ascending airflow from the back surface toward the surface.

According to the mask cleaning apparatus for organic EL, an upward flow is formed from the back surface of the opening of the organic EL mask toward the surface, and even if the free product is directed toward the opening, it is pushed back by the ascending airflow, and the volume is not rolled. Attached to the back. In addition, not only the energy of the laser, but also the free product is raised by the ascending air current, and the free product can be reliably guided to the removal means, and the extremely high degree of cleanliness can be cleaned.

The mask cleaning apparatus for an organic EL according to claim 10, wherein the mask cleaning apparatus for an organic EL according to claim 1 is provided on the rear side of the laser device. A plasma cleaning means for plasma-cleaning the free product adhering to the surface of the organic EL mask.

According to the mask cleaning apparatus for organic EL, the organic EL mask which has been washed by the laser means is further plasma-cleaned, and a higher washing effect can be obtained. Although the degree of cleaning of 99% or more can be obtained by the laser method, there is also a case where a very small amount of free product reattaches to the mask for the organic EL. Even in this case, by performing plasma cleaning, most of the re-attached free products are burned (ashed), and the rest become combustion gases, which are raised by the ascending airflow, and are removed by By removing the means, the free product can be reliably cleaned from the mask for the organic EL.

The apparatus for manufacturing an organic EL display according to claim 11 of the present invention is characterized in that it is used in the first, second, third, fourth, fifth, sixth, seventh, eighth, ninth or tenth aspect of the patent application. The organic EL is manufactured by using a mask for an organic EL that is cleaned by a mask cleaning device to produce an organic EL display. The organic EL display of claim 12 of the present invention is characterized in that it is manufactured by the apparatus for manufacturing an organic EL display according to claim 11.

The mask cleaning apparatus for organic EL described above can be applied to a manufacturing apparatus of an organic EL display.

The method for cleaning a mask for an organic EL according to the thirteenth aspect of the invention, which is a method for cleaning a mask for an organic EL for removing a vapor deposition material adhering to a mask for an organic EL, characterized in that the organic The EL irradiates the laser beam with the surface of the mask, and the free product generated by pulverizing the vapor deposition material is scattered upward, and the scattered free product is removed by the air flow.

The method of cleaning a mask for an organic EL according to claim 13 of the invention, wherein the airflow is formed from the organic EL mask. The flow of the laminar flow at a position where the surface of the cover is separated, and has a flow along the surface of the aforementioned EL mask.

The method for cleaning a mask for an organic EL according to claim 13 of the invention, wherein the illuminating the laser is removed by the airflow. In the case of the above-mentioned free product, the upstream portion is formed in the opening portion of the organic EL mask, and an ascending air current is formed from the back surface toward the surface.

In the present invention, the vapor deposition material adhering to the mask for the organic EL is pulverized by laser irradiation using a laser device to be a free-form material, and is scattered upward, and is provided for use in the organic EL. The removal of the surface of the mask is removed to remove the free product, and the mask for the organic EL can be cleaned in a completely non-contact manner. Therefore, it is possible to clean without causing damage to the organic EL mask.

Further, the air flow is formed by the air flow forming means, and the air flow is formed into a laminar flow state, and the free product scattered from the organic EL mask is captured by the laminar air flow, and is not returned to the organic EL. The mask prevents the re-adhesion of the free product and provides high cleanliness. Further, the film sticking mechanism or the peeling mechanism is not required, and the mechanism can be simplified and the size of the device can be reduced.

Further, the rising gas flow forming means is formed so that the free generated product does not adhere to the surface of the organic EL mask even if it is directed toward the opening of the organic EL mask. At this time, not only the energy of the laser, but also the free product is raised by the ascending air current, and the free product can be greatly increased, and the removal means can be surely guided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are schematic configuration diagrams of a mask cleaning device 1 for an organic EL according to the present invention. The mask cleaning apparatus 1 for an organic EL of the present invention includes an organic EL mask 2, a susceptor 11, a mounting table 12, a chuck portion 13, a moving portion 14, a laser light source 15, a current mirror 16, and a blower. The portion 17 and the suction portion 18 are roughly configured. The organic EL mask 2 is attached to a glass substrate (not shown) constituting an organic EL display, and an organic material which is a light-emitting layer is deposited on a limited region to form an extremely thin metal plate to be used for patterning. With the large screen of the organic EL display in recent years, the size of the mask 2 for organic EL has also become very large. The mask 2 for organic EL used below is an extremely thin and large size.

As shown in FIG. 3 and FIG. 4(a), the reinforcing frame 3 is attached to the outer periphery of the organic EL mask 2. In order to deposit the vapor deposition material with high precision in the glass substrate constituting the organic EL display, the thickness of the organic EL mask 2 is a micron-thick metal plate. When the thickness of the organic EL mask 2 is extremely thin, even if the organic material deposited on the organic EL mask 2 has a large angle and is scattered, no shadow is formed in the vapor deposition region, and the film thickness is ensured. Uniformity. The organic EL mask 2 is an extremely thin and large metal plate, and cannot be maintained in a planar shape by a single body, and the reinforcing frame 3 is attached in order to maintain its shape retaining property. Further, if the shape retaining property of the organic EL mask 2 can be maintained, a method other than the reinforcing frame 3 can be used.

The organic EL mask 2 is made of a metal material, and is formed with a mask (image mask) of a plurality of openings 4 that are regularly arranged. For the organic EL mask 2, various metals can be used, and an alloy of cobalt and nickel is used here. In the vapor deposition device (not shown) of the organic material for vapor-depositing the light-emitting layer, the organic EL mask 2 is adhered to the glass substrate constituting the organic display, and the organic material is vapor-deposited from the vapor deposition source ( Hereinafter, it is called a vapor deposition material). As the vapor deposition material of the light-emitting layer, various materials can be used. For example, an organic metal complex such as tris-aluminum (Alq) can be used. Further, an organic compound other than the organic metal complex (which may be a metal-containing or metal-free material) may be used as the vapor deposition material. The vapor deposition material evaporated from the vapor deposition source is deposited on the glass substrate from the portion of the organic EL mask 2 where the opening 4 is formed. Thereby, it is possible to vapor-deposit a vapor deposition material as a light-emitting layer in a region corresponding to a pixel on the glass substrate.

The vapor deposition material of a specific pattern can be deposited on the glass substrate by using the organic EL mask 2, but the vapor deposition material adheres to the organic EL mask 2 at the time of vapor deposition. The vapor deposition material adhering to the organic EL mask 2 is adhered to the glass substrate in the next vapor deposition process, or the opening area of the opening 4 is changed, and the organic EL mask 2 is cleaned. The removal of the vapor deposition material is performed.

The organic EL mask cleaning device 1 is provided on the susceptor 11, and the organic EL mask 2 is mounted on the mounting table 12, and the chuck portion 13 holds the reinforcing frame 3 of the organic EL mask 2. The organic EL mask 2 is held such that the vapor deposition surface (the surface facing the vapor deposition source in the vapor deposition device, that is, the surface on which the vapor deposition material adheres) faces upward. As shown in FIG. 2, a small space is provided between the mounting table 12 and the organic EL mask 2, and the chuck portion 13 holds the reinforcing frame 3. The chuck portion 13 is a reinforcing frame 3 that holds the opposite sides of the mask 2 for organic EL. Further, the chuck portion 13 may be one or three sides of the reinforcing frame 3 .

Further, a moving portion 14 as a moving means is provided at a lower portion of the mounting table 12. The moving unit 14 is a moving means for moving the mounting table 12 in one direction, and any moving means such as a ball screw mechanism or a linear motor means can be used. Here, the moving direction of the moving portion 14 is referred to as the X direction of the first drawing, and the direction orthogonal to the X direction is referred to as the Y direction. However, the moving unit 14 may be configured to be movable in two directions in the X direction and the Y direction.

A laser light source 15 that oscillates a laser of a specific wavelength is disposed on the upper portion of the susceptor 11. The laser light source 15 is a laser that oscillates a wavelength at which the metal material of the mask 2 for organic EL is reflected. In the case where the organic EL mask 2 is an alloy of cobalt and nickel, a laser having a wavelength range of 532 nm in which the alloy reacts is oscillated. When the other material is used for the mask 2 for organic EL, a laser that oscillates the material is reflected. The laser oscillated from the laser source 15 is incident on the current mirror 16. The current mirror 16 is a laser scanning means for reflecting the incident laser beam toward the organic EL mask 2, and is a laser scanning means for changing the reflection angle of the laser at a high speed. Therefore, the current mirror 16 is provided with a driving portion (not shown) that vibrates itself, and the reflection angle of the incident laser beam is changed by the vibration of the driving portion, and the irradiation position in the organic EL mask 2 is changed. By changing the reflection angle of the laser toward the Y direction, the laser scans in the Y direction. The laser light source 15 and the current mirror 16 constitute a laser means, and the laser is washed by the laser means. Of course, any other optical component can be used by the laser means.

The air blowing unit 17 is a blowing means, and the suction unit 18 is a suction means. The suction unit 18 includes a collection unit 18B, and impurities (a free product to be described later) that are mixed in the suction air are collected in the collection unit 18B. Thus, for example, a filter (not shown) is used to separate air from impurities. The air blowing slit 17A of the air blowing portion 17 and the suction slit 18A of the suction portion 18 are disposed to face each other, and the air blowing slit 17A and the suction slit 18A are disposed at the same height. The air blow from the air blowing slit 17A is along the surface of the organic EL mask 2, and the suction by the suction slit 18A is along the surface of the organic EL mask 2.

Explain the actions in the above construction. The organic EL mask 2, which has been taken out from the vapor deposition device, is fixedly held by the chuck portion 13 of the mounting table 12, and is moved in the X direction by the moving portion 14. When the front end position of the organic EL mask 2 in the X direction is located at the lower portion of the current mirror 16 (or its front end), the laser light is oscillated from the laser light source 15. By the high-speed vibration of the current mirror 16, the laser is scanned in the Y direction on the surface of the organic EL mask 2. In the example of FIG. 1 and FIG. 2, it is assumed that the organic EL mask 2 is completely cleaned, and the current mirror 16 changes the reflection angle of the laser to scan the organic EL mask 2 on the line. The moving portion 14 is moved in the X direction between the ends in the Y direction, and the organic EL mask 2 is scanned in two directions in the X direction and the Y direction, and the laser is scanned in the organic EL mask 2 Comprehensive. Further, in order to obtain the timing of the scanning of the laser in the Y direction and the movement in the X direction, the movement of the organic EL mask 2 by the moving portion 14 is preferably intermittent.

The organic EL mask 2 is held such that the vapor deposition surface faces upward, and the vapor deposition material 20 is in a film shape and adheres to the vapor deposition surface. The laser beam is irradiated so that the surface of the organic EL mask 2 becomes a focus. Further, the laser system has a wavelength (532 nm) at which a metal material (an alloy of cobalt and nickel) of the organic EL mask 2 is reacted, and is subjected to thermal shock by being irradiated with a laser. As a result, the pulverizing force acts on the vapor deposition material adhering to the organic EL mask 2, and becomes a free product and scatters upward. When the vapor deposition material is pulverized by the laser irradiation, the vapor deposition material adhering to the organic EL mask 2 is pulverized into a powder having a fine particle diameter, and a gas is also generated. Therefore, the free product is not only a fine powder but also a gas.

The pulverized free product is a powder or gas having a very small specific gravity, and is scattered upward by using a thermal shock of a laser. However, if the intensity of the laser is set to be excessively weak, the vapor deposition material does not pulverize and there is a possibility that it does not scatter upward. Therefore, the intensity of the laser is set to an intensity capable of pulverizing the vapor deposition material to cause the free product to scatter. On the other hand, if the intensity of the laser is set too high, excessive thermal shock is applied to the organic EL mask 2, which may cause damage. Therefore, in order to pulverize and scatter the vapor deposition material 20, it is preferable to set the minimum necessary strength. For example, the intensity of the laser oscillated by the laser light source 15 is set to be optimum according to the shape of the mask 2 for the organic EL or the adhesion strength of the material of the vapor deposition material 20.

Fig. 4(b) is an enlarged view showing the opening portion 4 of the mask 2 for organic EL. As shown in the figure, the edge portion 4E of the opening portion 4 of the mask 2 for organic EL has been pushed and removed. As described above, the opening area of the opening 4 of the mask 2 for organic EL is partially or completely blocked, and the vapor deposition accuracy is remarkably deteriorated, so that it cannot be used. As shown in Fig. 4(b), the edge portion 4E of the opening portion 4 has a push-pull shape, and even a thinner organic EL mask 2 has a thinner portion, and is thermally shocked. It has a higher pulverizing effect. Therefore, the vapor deposition material 20 at this portion has a very high pulverizing force, and the energy of scattering upward becomes also strong. Therefore, when the edge portion 4E is limited, the intensity of the laser oscillated by the laser light source 15 does not need to be set too high.

As shown in FIG. 5, the airflow 30 in the laminar flow state formed by the air blowing portion 17 and the suction portion 18 is formed, and the air flow 30 is formed at a position separated from the organic EL mask 2 by a certain interval, and The flow along the surface of the mask 2 for organic EL. In order to make the airflow 30 into a laminar flow state, air is blown by the air blowing slit 17A at a specific air volume and wind speed, and suction is performed from the suction slit 18A. In order to create the laminar flow 30, the air volume and the wind speed are set to the minimum necessary. In addition, the airflow is not formed so as to face the organic EL mask 2 or the organic EL mask 2, but is separated from the organic EL mask 2 to some extent and along the organic EL mask 2 The surface to form the airflow. In the organic EL mask 2, a large number of openings 4 are formed, and when the airflow is impacted or contacted with the organic EL mask 2, the airflow is in a turbulent state, and the dust that has been atomized and scattered is again adhered to the organic EL mask 2. Thus, a gas stream 30 in a laminar flow state is formed.

The airflow 30 is formed at a position separated from the organic EL mask 2, and a windless region 31 exists between the airflow 30 and the organic EL mask 2. Further, the wind-free region 31 is a region that is substantially in a windless state and does not flow, and is a region different from the airflow 30 having a laminar flow state. That is, the airflow 30 forms a region having a flow, and the windless region 31 forms a region where there is no flow. Although the particulate matter generated and scattered free product 21 passes through the windless region 31, this region does not flow and does not affect the traveling direction of the free product 21. Therefore, the free product 21 enters the airflow 30 through the windless region 31, is captured by the flow of the airflow 30, and is transported. As described above, the free product 21 is a very minute powder or gas, and is reliably captured by the laminar flow 30, and is collected toward the suction portion 18. In other words, the air flow 30 serves as a transport flow for transporting the free product 21.

Further, the airflow 30 is in a laminar flow state, and the windless region 31 is formed in the lower portion thereof, and the region of the surface of the mask 2 for the organic EL is not turbulent. Therefore, the free product 21 scattered from the organic EL mask 2 does not return to the organic EL mask 2. At this time, a minimum interval between the airflow 30 and the organic EL mask 2 is required. When the interval is excessively separated, the dust that is atomized and scattered upward cannot reach the height position of the airflow 30, and cannot be recovered. As a result, the free product 21 once removed from the organic EL mask 2 does not adhere to the organic EL mask 2 again, and an extremely high cleaning effect can be exhibited. The distance between the airflow 30 and the organic EL mask 2 can be determined, for example, depending on the area of the opening 4 of the organic EL mask 2, the density of the opening 4, the material of the organic EL mask 2, and the like.

The current mirror 16 scans the laser beam in the Y direction of the organic EL mask 2, and the scanning speed of the laser is extremely high. Therefore, the gas flow 30 in a laminar flow state is widely formed in advance over the mask 2 for the organic EL. Even if the scanning speed of the laser is extremely high, the airflow 30 is always formed at the upper position, and the scattered free product 21 is reliably captured and transported by the flow of the airflow 30. Here, the entire organic EL mask 2 is subjected to laser scanning, and the air flow 30 is formed to cover the entire range of the organic EL mask 2 . Therefore, the gap length between the air blowing slit 17A of the air blowing portion 17 and the suction slit 18A of the suction portion 18 is longer than the length of the organic EL mask 2 in the Y direction. Thereby, there is no remaining free product 21 which is recovered and recovered.

By the above, the vapor deposition material 20 of the organic EL mask 2 is pulverized by the laser, and the free product 21 is scattered upward, and the free product 21 is transported by the air current 30 to be removed. Clean by completely non-contact. Thereby, the organic EL mask 2 is not damaged and a clean effect is obtained. Further, the airflow 30 is brought into a laminar flow at a position separated from the organic EL mask 2, and the free-generating material 21 does not return to the organic EL mask 2, and can be recovered by the suction portion 18 without being attached. Therefore, it is possible to simplify the mechanism and reduce the size of the device without causing damage to the organic EL mask 2 and reliably cleaning it without using a film bonding mechanism or the like. The organic EL mask cleaning device 1 can exhibit an extremely high cleaning effect, and the organic EL mask 2 can be almost completely cleaned with a cleanliness of 99% or more.

In the above-described embodiment, the airflow 30 in the laminar flow state is used as the means for removing the free-generating material 21 scattered from the organic EL mask 2, but the airflow 30 may not be used. For example, the attraction force is generated in the direction in which the organic EL mask 2 is separated, and the scattered free product 21 may be attracted to the orthogonal direction by the laser scanning. However, in this case, the flow of the air becomes a turbulent state, and the free product 21 may be attached to the mask 2 for organic EL. The attraction is also applied to the mask 2 for the organic EL, and the mask 2 for the organic EL is distorted or deformed. However, even if the mask 2 for organic EL is not damaged due to the attraction force, it may be a removal means, and the attraction force may be separated from the direction in which the organic EL mask 2 is separated. By.

In addition, in the above-described embodiment, the organic EL mask 2 is irradiated with a laser to clean the surface of the organic EL mask 2 (the area is cleaned). The situation is limited to this area to scan the laser. At this time, one or both of the range of movement of the moving portion 14 and the range of the reflection angle of the current mirror 16 are reduced to a part. Further, in the case where the area is cleaned, the range of the airflow 30 is also an area which can cover the object to be cleaned, and it is not necessary to form the airflow 30 in the entire area covering the mask 2 for the organic EL.

In the above-described embodiment, the organic EL mask 2 is moved in the X direction by the moving portion 14, and the current mirror 16 scans the laser in the Y direction to perform region cleaning. The moving portion 14 and the current mirror 16 can be automatically controlled, and by this means, the cleaning of the organic EL mask 2 can be automatically performed. In addition, it can be cleaned automatically even by other methods. For example, in a state in which the organic EL mask 2 is fixed, the current mirror 16 is vibrated in two directions, and the laser is scanned in two directions of the X direction and the Y direction.

However, in the case of the laser scanning by the current mirror 16, the laser beam is incident on the organic EL mask 2 at a large angle in the end portion regardless of the center of the organic EL mask 2. At this time, there are some differences in the degree of cleansing at the center and the end of the mask 2 for organic EL. Further, the organic EL mask 2 is a large metal plate, and it takes a certain amount of time for the laser scanning in the Y direction. Therefore, the organic EL mask 2 and the laser light source 15 are relatively moved to perform area cleaning without laser scanning.

For example, the current mirror 16 is used as a fixed mirror, and the moving portion 14 is moved in two directions of the X direction and the Y direction. Although the irradiation position of the laser beam is not changed, the organic EL mask 2 is displaced in two directions by the movement of the moving portion 14, and the laser beam reflected by the mirror and the organic EL mask 2 are relatively moved. . The laser beam reflected by the mirror is incident on the organic EL mask 2 in any direction in the orthogonal direction. Therefore, there is no problem of the difference in the degree of washing caused by the difference in the injection angle. In this case, the laser means is constituted by the laser light source 15 and the mirror, but the mirror is not used, and the direction of oscillation of the laser light source 15 is the orthogonal direction of the mask 2 for the organic EL. The shooting means is constituted by the laser light source 15. Further, in this case, the relative moving means is constituted by the moving portion 14.

In the case where the area is cleaned by the relative movement, the organic EL mask 2 is moved by the moving unit 14, and the cleaning speed becomes higher than that of the laser scanning which can change the irradiation position at a high speed. Low speed. Therefore, in the case of washing by the relatively moving area, it is preferable that the spot of the laser is used as large as possible.

Further, in the cleaning by the relatively moving region, the mounting table 12 on which the organic EL mask 2 is mounted is fixed (that is, the moving portion 14 is not provided), and the mirror can be moved in two directions. . Thereby, the area can also be washed. Further, the mirror and the laser light source 15 are integrally formed as a unit, and the unit may be moved in two directions.

Next, a modification 1 will be described with reference to Fig. 6 . In the first modification, the organic EL mask 2 is divided into a plurality of regions to be cleaned. In the sixth diagram, the laser light source 15 is disposed at two places (the first laser light source 15a and the second laser light source 15b), and the current mirror 16 is also disposed at two places (the first current mirror 16a, The second current mirror 16b). The organic EL mask 2 is divided into two regions (which are divided into the first region 2a and the second region 2b), and the first region 2a is a laser that is oscillated from the first laser light source 15a. The current mirror 16a is scanned for cleaning, and the second region 2b is scanned by the second current mirror 16b to be cleaned by the second current mirror 16b. The vapor deposition material 20 adheres to the first region 2a and the second region 2b in the same manner, and both the first laser light source 15a and the second laser light source 15b oscillate a laser beam of the same wavelength.

As shown in Fig. 6, the organic EL mask 2 is divided into two regions, and the laser beam of the first laser light source 15a and the laser of the second laser light source 15b share the individual regions for cleaning. Two areas are cleaned, and each area becomes a half of the organic EL mask 2, and the cleaning time can be greatly shortened (about half). Thereby, the production efficiency of the organic EL display can be greatly improved. By increasing the number of the laser light source 15 and the current mirror 16, the cleaning time can be further shortened.

Next, a modification 2 will be described using FIG. In the first modification, the organic EL mask 2 is divided into two regions in the X direction. However, in the second modification, the mask 2 is divided into two regions in the Y direction. In this case, the first laser light source 15a and the second laser light source 15b are arranged in parallel in the Y direction, and the first current mirror 16a and the second current mirror 16b are arranged in parallel in the Y direction. The laser oscillated by the first laser light source 15a performs scanning of the first region 2a, and the laser oscillated by the second laser light source 15b performs scanning of the second region 2b. As described above, by the cleaning of the laser scanning, the scanning width is preferably as narrow as possible from the viewpoints of the degree of cleaning or the scanning speed. In the second modification, the area is divided into two regions in the Y direction, and the scan width is half as compared with the example of the first figure. Therefore, the incident angle when the laser beam enters the end portion of each region in the Y direction can be made small, and the difference in the degree of cleaning can be reduced. In addition, the scanning time can be greatly reduced. Therefore, it is possible to perform high-speed and high-cleanness cleaning.

Next, a modification 3 will be described using FIG. In the third modification, as shown in FIG. 8, the laser oscillated from one laser light source 15 is divided by 稜鏡19 using 稜鏡19. The 稜鏡19 system reflects a part of the incident light, and a part of the beam splitter that transmits the function, and the functional film that performs the function is an optical element formed at an angle of incidence of 45 degrees. In the case where the crucible 19 is used, the scanning of the laser is not possible, and the moving portion 14 is moved in the X direction and the Y direction to perform the area cleaning. In the third modification, the organic EL mask 2 is divided into two regions, and the two lasers branched by the crucible 19 are used for cleaning, and the cleaning time can be shortened to approximately half.

As described above, the cleaning speed by the movement of the moving portion 14 is lower than the cleaning speed by the laser scanning, but the organic EL mask 2 can be injected in the orthogonal direction. Lasers are more advantageous in terms of cleanliness. Therefore, by arranging the plural 19 and providing a plurality of lasers orthogonal to the organic EL mask 2, it is possible to perform cleaning with a high degree of cleaning in a short time. At this time, the diameter of the spot of the laser from the laser light source 15 is preferably larger. Further, even if the cymbal 19 is not used, for example, a plurality of laser light sources 15 are disposed, and a plurality of laser beams may be irradiated in a direction orthogonal to the mask 2 for the organic EL.

Next, a modification 4 will be described. This modification 4 is an example in which an ascending air current is formed from the back side of the organic EL mask 2 . As described above, the organic EL mask 2 is irradiated with a laser to cause the free product 21 to scatter, and the scattered free product 21 is almost completely removed by the air current 30. However, the free product 21 is a powder or a gas having a very small specific gravity, and although it can exhibit a removal rate of almost 100%, a very small amount of the free product 21 is not removed by the gas stream 30 and may fall, and it is impossible to completely 100%. The case of the removal rate.

In particular, the mask 2 for an organic EL is a metal plate that requires extremely careful handling. When an excessively high-intensity laser is irradiated, a large impact acts on the mask 2 for the organic EL, which causes damage. Therefore, the oscillation intensity of the laser light source 15 cannot be set too high, and the organic EL mask 2 cannot be given too much energy, and there is a case where it cannot be scattered to the position of the airflow 30. That is, the set intensity of the laser light source 15 is adjusted to be the minimum necessary intensity to pulverize the vapor deposition material 20 to be scattered to the position of the air current 30. Therefore, although the scattered free product 21 almost reaches the position of the airflow 30, there is a case where a very small portion cannot reach the airflow 30 and fall. In particular, as shown in Fig. 4(b), the edge portion 4E is formed in a push-and-pull relationship, and a bevel is formed, and the vapor-deposited material 20 adhered to the edge portion 4E is pulverized, and the free product 21 is pulverized. There is a tendency that the position of the airflow 30 cannot be reached.

The free product 21 that does not reach the airflow 30 falls toward the organic EL mask 2 and is again adhered to the organic EL mask 2. At this time, not only the surface of the mask 2 for organic EL (the surface facing the vapor deposition source during vapor deposition), but also the free product 21 adheres to the back surface (opposite surface of the surface). As shown in FIG. 3, a plurality of openings 4 are formed in the organic EL mask 2, and the aperture of the opening 4 is much larger than the size of the free product 21, and the free product 21 falls from the opening 4. In addition, the free product 21 of the falling opening portion 4 is wound around the back surface of the organic EL mask 2 and adhered to the back surface of the organic EL mask 2 again. The back surface of the organic EL mask 2 is attached to the surface of the glass substrate during vapor deposition, and when the free product 21 is adhered to the back surface, the free product 21 adhering to the back surface is transferred during vapor deposition of the new glass substrate. It is printed on a glass substrate to stain the glass substrate.

Therefore, the ascending airflow forming device 40 as shown in Figs. 9 and 10 is provided. As shown in FIGS. 9 and 10, the updraft forming device 40 is configured such that the frame 41 and the air supply unit 42 and the plurality of air ejection holes 43 and the chuck portion 44 are roughly configured. Further, the air ejection holes 43 are indicated by broken lines. The frame 41 is a casing that forms a space that is internally closed, and an air supply portion 42 is formed on the side surface. Further, a plurality of air ejection holes 43 are formed on the upper surface. The air supply unit 42 supplies the air supply unit to the frame 41, whereby the air supplied from the air supply unit 42 flows into the inside of the frame 41, and is ejected upward from a plurality of air ejection holes 43 formed in the upper surface. Each of the air ejection holes 43 is evenly and evenly distributed on the upper surface of the frame 41, and an upwardly rising airflow is formed on the upper surface of the frame 41.

The chuck portion 44 is a member that holds the mask 2 for the organic EL, and is fixedly disposed on the upper surface of the frame 41. The organic EL mask 2 is held by the chucking head 44 so that the vapor deposition surface (the surface facing the vapor deposition source in the vapor deposition device, that is, the surface on which the vapor deposition material 20 adheres) faces upward. Further, the clip head portion 44 is formed in an L shape, and a slight space is provided between the organic EL mask 2 and the upper surface of the frame 41. In addition, any structure can be adopted as long as it can maintain a slight space between the organic EL mask 2 and the upper surface of the frame 41.

According to the above-described updraft forming device 40, the organic EL mask 2 is often formed with an ascending airflow between the laser cleaning using the laser device. Therefore, air is supplied to the frame 41 from the air supply unit 42, and an ascending air current is often formed on the entire upper surface of the frame 41. UF of Fig. 11 shows the ascending air current formed in the opening portion 4 of the mask 2 for organic EL. In the region immediately below the mask 2 for the organic EL, the ascending airflow UF is formed by the ascending airflow forming device 40, and the ascending airflow UF is formed from the rear surface 2R toward the surface 2S in the opening 4 of the organic EL mask 2.

As described above, when the laser cleaning is performed, even if a part of the free product that has not reached the air current 30 falls and falls toward the opening portion 4, the free flow of the falling is generated by the ascending air current UF formed in the opening portion 4. In the relationship that the object is pushed back upward, the free product is not caught in the back surface 2R of the mask 2 for organic EL. Therefore, the free product does not adhere to the back surface 2R again.

The updraft UF is basically formed so as not to cause the free product to adhere to the back surface 2R again, and also functions to assist the rise of the free product which is scattered during the laser cleaning. The vapor deposition material 20 adhering to the mask 2 for organic EL is pulverized by the laser, and the free product is scattered upward. By forming the ascending air current UF, the flow of the upward flow UF is caused, and the free product is more likely to rise upward. That is, not only by the scattering of the laser, but also by the synergistic effect of the scattering of the laser and the updraft UF, the free product rises further.

As described above, in order to prevent damage caused by excessive impact on the organic EL mask 2, the laser intensity oscillated by the laser light source 15 cannot be set too high. Therefore, in order to prevent the scattering of the free-generating material from being able to give a sufficient impact, it is impossible to fly to a position that is too high in the case where the free-generating material is scattered by the energy of the impact. However, an ascending airflow UF is formed from the lower surface of the organic EL mask 2, and the ascending airflow UF is assisted to cause the free-generating material to rise further upward. Therefore, even if the oscillation intensity of the laser light source 15 is not set high, the free-generating material can be sufficiently raised to the position of the airflow 30 by the assistance of the upward airflow UF.

The ascending airflow forming device 40 forms the ascending airflow UF in a very low air volume. The free product is a powder or a gas having a very low specific gravity. Even if it is set to a very low air volume, the free product can be raised high by the upward flow rate UF. On the other hand, the frame 41 is separated from the organic EL mask 2 by a slight interval, and the back surface 2R of the organic EL mask 2 is in a state of directly receiving the updraft UF. The organic EL mask 2 is an extremely thin and large metal plate. If the air volume of the updraft UF is set too high, the organic EL mask 2 is distorted or deformed, and the organic EL mask 2 is caused. The flaw of injury. From this point of view, it is preferable that the updraft UF is set to a low air volume.

The updraft UF is set to at least the amount of air that is pushed back from the opening 4 by the free product that has fallen toward the opening 4 of the organic EL mask 2 . In addition, when the updraft UF is functioned to assist the rise of the free product, a larger air volume is set. The air volume at this time is changed according to the oscillation intensity of the laser light of the laser light source 15. When the oscillation intensity of the laser is large, the air volume of the upward airflow UF is set smaller, and when the oscillation intensity is small, The air volume of the updraft UF is set larger. However, it is necessary to suppress the updating current UF from being an amount of air that does not cause damage to the organic EL mask 2.

Therefore, when the laser is cleaned, the ascending air current is often formed from the back surface 2R of the organic EL mask 2 toward the surface 2S by the ascending airflow forming device 40, and the fallen free product does not adhere to the back surface 2R again. In addition, when the rising airflow is washed by the laser, it is often formed, and the ascending airflow assists the rise of the free product, and the free product is scattered upward upward. As a result, the free-generating material scattered from the organic EL mask 2 can be reliably removed by the air current 30, and the organic EL mask 2 can be cleaned with an extremely high degree of cleanliness.

Next, a modification 5 will be described using FIG. Laser cleaning by using a mask cleaning device for organic EL is almost completely cleaned, and if the updraft UF is formed, the cleanliness can be made more complete. However, even in this case, the extremely small free product 21 is not removed and adheres again to the mask 2 for organic EL. In addition, the upward flow UF is formed in the opening 4 of the organic EL mask 2, and even if the free product adheres, it adheres to the surface 2S instead of adhering to the back surface 2R. In the case of the plasma cleaning apparatus 50 of Fig. 12, it is considered that the surface of the organic EL mask 2 is cleaned again when a small amount of free products are adhered by the cleaning of the organic EL mask cleaning device. Setter. Therefore, the plasma cleaning device 50 is disposed at a position where the organic EL mask 2 is cleaned by the cleaning of the organic EL mask cleaning device, that is, the rear side of the organic EL mask cleaning device ( Downstream side).

The plasma cleaning device 50 includes the cavity 51, the upper electrode 52, and the lower electrode 53, and the other organic EL mask cleaning device is provided with the same reference numerals, and is not different from the above. The cavity 51 is provided with an upper electrode 52 on its upper portion. Further, an air ejection hole 43 is provided in the base 11. In the plasma cleaning device 50, in order to plasma-clean the organic EL mask 2, a plasma reactive gas (for example, an inert gas such as argon) is used by any gas supply means (not shown). It is supplied between the upper electrode 52 and the lower electrode 53 (in FIG. 12, directly below the upper electrode 52). Then, by applying a high frequency voltage to the lower electrode 53, the plasma reactive gas is plasmatized to generate a plasma 34. By irradiating the plasma 34 to the organic EL mask 2, the free product 21 on the surface of the organic EL mask 2 is removed and washed.

A small amount of the free product 21 adhering to the mask 2 for organic EL is gasified by almost burning (ashing) the plasma 34, and a part of it becomes a combustion gas and is released from the mask 2 for organic EL. The free combustion gas falls into the organic EL mask 2, and is wound around the back surface 2R of the organic EL mask 2 from the opening 4.

Therefore, the updraft forming device 40 is provided in the lower portion of the organic EL mask 2, and the ascending airflow UF is formed from the back surface 2R of the organic EL mask 2 toward the surface 2S. Thereby, the updraft UF pushes back the combustion gas that has fallen into the opening 4, and does not cause the combustion gas to be caught in the back surface 2R. Moreover, the combustion gas rises by the ascending airflow UF, and is removed by the airflow 30 being carried. Therefore, the combustion gas does not adhere to the surface 2S of the organic EL mask 2, and almost complete cleanliness can be obtained.

By combining the organic EL mask cleaning device and the plasma cleaning device 50 as a mask cleaning device for organic EL, a higher cleaning effect can be exhibited. Further, although the plasma cleaning device 50 and the organic EL mask cleaning device are provided with the ascending airflow forming device 40, the ascending airflow forming device 40 may be provided in either of the two devices, or may be provided. It is also possible to set neither of the two devices to any device.

In the laser cleaning, the scattered free product 21 is removed by the airflow 30, and in the plasma cleaning, the combustion gas is removed by the airflow 30. Therefore, even if the ascending airflow UF is not formed, a high cleaning effect can be obtained. However, since each of the two devices is provided with the ascending airflow forming device 40, it is possible to prevent the entrapment of the back surface 2R of the organic EL mask 2, thereby obtaining Higher washing effect.

Further, in the example of Fig. 12, the updraft forming device 40 is configured to form the ascending airflow UF by the airflow ejected from the air ejecting holes 43 arranged in the upper surface of the frame 41, but is not limited thereto. It can also be done by other means. For example, when the lower portion on the back surface 2R side of the organic EL mask is in a positive pressure state, the upper portion on the surface 2S side is in a negative pressure state, and the fallen free product does not get caught on the back surface 2R side of the organic EL mask 2 .

1. . . Clean device

2. . . Organic EL mask

11. . . Pedestal

12. . . Equipped with workbench

13. . . Clip head

14. . . Mobile department

15. . . Laser source

16. . . Current mirror

17. . . Air supply department

18. . . Attraction

20. . . Evaporating substance

twenty one. . . Free product

30. . . airflow

40. . . Updraft forming device

Fig. 1 is a perspective view showing a schematic configuration of a cleaning device.

Fig. 2 is a cross-sectional view showing a schematic configuration of a cleaning device.

Fig. 3 is a plan view of a mask for an organic EL.

Fig. 4 is a cross-sectional view and an enlarged view of a mask for an organic EL.

Figure 5 is a diagram showing the state of the airflow capturing dust.

Fig. 6 is a perspective view showing a schematic configuration of a cleaning device of Modification 1.

Fig. 7 is a perspective view showing a schematic configuration of a cleaning device of a second modification.

Fig. 8 is a perspective view showing a schematic configuration of a cleaning device according to a third modification.

Fig. 9 is a cross-sectional view showing a schematic configuration of a cleaning device of a fourth modification.

Figure 10 is a perspective view of the ascending airflow forming device.

Fig. 11 is a view showing a state in which an ascending air current is formed in a mask for an organic EL.

Fig. 12 is a cross-sectional view showing a schematic configuration of a plasma cleaning apparatus according to a fifth modification.

1. . . Clean device

2. . . Organic EL mask

11. . . Pedestal

12. . . Equipped with workbench

13. . . Clip head

14. . . Mobile department

15. . . Laser source

16. . . Current mirror

17. . . Air supply department

18. . . Attraction

20. . . Evaporating substance

Claims (8)

A mask cleaning apparatus for organic EL (Electro Luminescence), which is an organic EL mask cleaning apparatus for removing a vapor deposition material adhering to a mask for an organic EL, and is characterized in that: a laser device in which the EL irradiates the laser beam with the surface of the mask to cause the free product generated by the pulverization of the vapor deposition material to scatter upward; and the air flow forming means for forming and removing the scattered product which has been scattered and removed The air flow is a flow in a laminar flow formed at a position separated from the surface of the organic EL mask, and has a flow along a surface of the organic EL mask. The mask cleaning apparatus for an organic EL according to the first aspect of the invention, comprising: a laser scanning means for scanning the surface of the organic EL mask by the laser light. The mask cleaning apparatus for an organic EL according to the first aspect of the invention, wherein the mask for cleaning the organic EL is moved relative to the laser device. The mask cleaning apparatus for organic EL according to the second aspect of the invention, wherein the laser beam is irradiated to different regions of the organic EL mask, and a plurality of the laser devices are provided. The mask cleaning apparatus for an organic EL according to the first aspect of the invention, wherein the airflow forming means is provided to separate only the airflow from the organic EL mask to form a laminar flow state. The attraction means set at the position of the interval. The mask cleaning apparatus for an organic EL according to the fifth aspect of the invention, wherein the airflow forming means includes a blowing means for blowing air toward the suction means. An apparatus for manufacturing an organic EL display, which is characterized in that an organic EL mask which is cleaned by a mask cleaning apparatus for organic EL described in the first, second, third, fourth, fifth or sixth aspect of the patent application is used. A cover to manufacture an organic EL display. A mask cleaning method for an organic EL, which is a mask cleaning method for an organic EL for removing a vapor deposition material adhering to a mask for an organic EL, characterized in that the surface of the organic EL mask is irradiated with laser light. The free product generated by the pulverization of the vapor deposition material is scattered upward, and the scattered free product is removed by the air flow; the air flow is formed at a position separated from the surface of the organic EL mask. The flow in the laminar flow state and having a flow along the surface of the aforementioned EL mask.