CN103394490A - Device and method for cleaning organic electro luminescence (EL) mask - Google Patents
Device and method for cleaning organic electro luminescence (EL) mask Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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Abstract
The objective of the invention is to perform cleaning of removing the evaporation material attached to an organic EL mask without any contact with a substrate. The solution of the invention uses a mask cleaning device to remove the evaporation material (20) attached to an organic EL mask (2) formed with a plurality of opening parts (4). A laser oscillated from a laser light source (15) performs scanning to the surface of the organic EL mask (2) in Y direction by means of a galvano-mirror (16), and the mask board (2) is moved in X direction by a mobile part (14), so as to perform scanning to the entire surface of the mask (2). Airflow (30) is formed by an air blowing part (17) and an air sucking part (18) above the organic EL mask (2). Laser scanning is used to smash the evaporation material (20) into dissociation resultant (21) flying upwards and carried and removed by the air flow (30) so as to perform cleaning.
Description
It is the dividing an application for the Chinese patent application of " organic EL with mask cleaning device and method, OLED display and manufacturing installation thereof " that 200910174768.X, the applying date be on September 17th, 2009, denomination of invention that the application of this division is based on application number.
Technical field
The present invention relates to utilize Ear Mucosa Treated by He Ne Laser Irradiation to carry out organic EL organic EL mask cleaning device of the cleaning of mask, manufacturing installation, OLED display and organic EL mask clean method of OLED display.
Background technology
Organic EL(Electro Luminescence) display, the image display device low as the power consumption that does not need backlight, that light weight is slim is widely adopted.Its structure is, stacked organic EL thin layer on the glass substrate of the transparency, and organic EL thin layer is the structure that luminescent layer is sandwiched with anode layer and cathode layer.As luminescent layer, majority is that the organic material evaporation is formed film on glass substrate, the Region Segmentation of each pixel that forms display is become the organic material of three parts, evaporation RGB three looks.Therefore,, in 3 zones of each pixel, adopt the organic EL that has formed a plurality of peristomes to carry out evaporation with mask (shadowing mask) for the organic material different colours (organic look material material) evaporation.Should stagger with respect to each pel spacing with mask by organic EL on one side, on one side evaporation evaporation material of all kinds, like this, the evaporation operation of luminescent layer is completed.
While carrying out the evaporation operation, organic material not only is attached on glass substrate, also is attached to organic EL with on mask.Organic EL does not just use with mask in an evaporation operation, but Reusability, so while carrying out next evaporation operation, if evaporation material is attached to organic EL with on mask, evaporation material can be attached on new glass substrate.In addition, be formed on the marginal portion of organic EL with a plurality of peristomes on mask, also evaporation organic material, like this, make the area portions ground of peristome or inaccessible fully.The entire area of peristome from needless to say,, even partly inaccessible and make aperture area change, just make and adopts this organic EL significantly to reduce with the time vapor deposition accuracy of mask during by obturation, in addition, is not durable.Therefore, (preferably after an evaporation operation is completed) cleaned with mask organic EL termly, and evaporation material is removed.
Organic EL is with the cleaning of mask, is mainly the wet-cleaning mode that adopts surfactant etc.Wet-cleaning is the mode that organic EL is cleaned with the mask feed fluid.But cleaned organic EL mask is the metallic plate as thin as a wafer of a micron utmost point (tens of microns left and right), during wet-cleaning,, due to hydraulic action, can cause to organic EL the large damages such as distortion, distortion with mask.In addition, while with the liquid of surfactant etc., carrying out wet-cleaning, need the liquid feed mechanism and process use after the discharge opeing processing mechanism of liquid (discharge opeing), so mechanism is complicated, in addition, discharge opeing also causes environmental pollution.
On the other hand, patent documentation 1 discloses as the cleaning that does not adopt the wet-cleaning liquid, has adopted the technology with the cleaning (laser cleaning) of mask irradiation laser to organic EL.With Ear Mucosa Treated by He Ne Laser Irradiation organic EL of metal material with mask on, make peeling force act on organic EL with between mask and organic material.In the technology of patent documentation 1, utilize this peeling force, get rid of organic material from organic EL with mask, clean.
Patent documentation 1: TOHKEMY 2006-169573 communique
Summary of the invention
In the technology of patent documentation 1, organic EL is shone laser with mask, the organic material that adheres to is peeled off.But,, in order to prevent in the groove that cleans or the pollution of atmosphere, make the organic material after peeling off not break away from organic EL mask.For this reason,, in order to remove the organic material after peeling off, adopt sticking film.This film has and shifts this and peel off the adhesion strength of rear organic material, shines laser under with the state on mask film being sticked on organic EL, and the evaporation material under peeling off is transferred on film.Then, the film that has shifted organic material is stripped down with mask from organic EL, completed thus cleaning process.
As previously mentioned, organic EL mask is metallic plate as thin as a wafer,, even atomic little power effect thereon, also can cause the damage of distortion, distortion etc.And in recent years, along with the large picture of OLED display, organic EL also increases with the size of mask, must be very careful with the processing of mask to large and as thin as a wafer organic EL.In the technology of patent documentation 1, from organic EL,, with on mask during stripping film, resist adhesion strength ground and peel off, so excessive masterpiece is used in organic EL with on mask.As a result, organic EL is caused very large damage with mask.
That is, in patent documentation 1, although be to utilize laser that organic material is stripped down with mask from organic EL,, in order to remove the organic material after peeling off, film is contacted with mask with organic EL, result, be not to complete cleaning with contactless state.In addition, as film, although be the material (PETG) that adopts laser to see through,, even adopt the film with permeability, laser also produces decay.Therefore, can not give enough energy with mask to organic EL, can not bring into play high cleaning effect.In addition, carry out the stickup of film and peel off needing special mechanism, exist the problem that mechanism is complicated and cause device to maximize.Especially, if when organic EL mask was large-scale size, the size of film was also large-scale, therefore, the maximization problem complicated, device of mechanism is more serious.
, the objective of the invention is for this reason, substrate, with the Entirely contactless state, is removed the evaporation thing when being attached to the cleaning that organic EL removes with the evaporation thing of mask carrying out.
In order to solve above-mentioned problem, organic EL mask cleaning device of technical solution of the present invention 1, be used for removal and be attached to organic EL with the evaporation material on mask, it is characterized in that, has laser light mechanism and removal mechanism; Above-mentioned laser light mechanism, to the surface irradiation laser of above-mentioned organic EL with mask, makes the free product that above-mentioned evaporation material fragmentation is produced disperse upward; Above-mentioned removal mechanism is formed on leaves the position of above-mentioned organic EL with the surface of mask, is used for removing above-mentioned free product.
EL mask cleaning device organic according to this, make and will be attached to that organic EL is broken with the evaporation material on mask and free product that generate disperses upward, leave the removal mechanism of organic EL with the position of mask surface with being located at, the product that will dissociate is got rid of, so, do not make the organic EL of the contact masks such as solid, liquid, just can clean.Therefore, be non-contact cleaning completely, can not damage organic EL mask.
Organic EL mask cleaning device of technical solution of the present invention 2, in organic EL of technical scheme 1 record uses mask cleaning device, it is characterized in that, above-mentioned removal mechanism is that the air stream that forms air stream forms mechanism, and this air stream transports and remove the above-mentioned free product that disperses.
EL mask cleaning device organic according to this, available being formed on left the air stream of organic EL with the position of mask surface, and the free product that will disperse is removed.
Organic EL mask cleaning device of technical solution of the present invention 3, in organic EL of technical scheme 2 records uses mask cleaning device, it is characterized in that, above-mentioned air stream is formed in and leaves the air stream of above-mentioned organic EL with the laminar condition of the position of mask surface, has the air-flow with mask surface along above-mentioned organic EL.
EL mask cleaning device organic according to this, air stream are to leave the air stream of organic EL with the laminar condition of mask surface, and, be along the air-flow of organic EL with the surface of mask.Formed the air stream of laminar condition above with mask at organic EL, the free product that disperses is transported by air stream, and, leaving the position formation air stream of organic EL with the surface of mask, so, at organic EL, with the tight upper area of mask, do not produce turbulent flow.Like this, organic EL that can again not fly back is with on mask, thereby free product can not be attached to organic EL again with on mask, can obtain high cleaning effect.
Organic EL mask cleaning device of technical solution of the present invention 4, be in organic EL of technical scheme 2 or 3 records uses mask cleaning device, it is characterized in that, has and make the laser scanning mechanism of the above-mentioned organic EL of above-mentioned laser scanning with the surface of mask.
EL mask cleaning device organic according to this, make laser scanning, can clean with the presumptive area of mask organic EL.The scope of laser scanning, can be whole that organic EL uses mask, also can be contracted in part zone.
Organic EL mask cleaning device of technical solution of the present invention 5, be in organic EL of technical scheme 2 or 3 records uses mask cleaning device, it is characterized in that, has the relative moving mechanism that above-mentioned organic EL is relatively moved with mask and above-mentioned laser light mechanism.
EL mask cleaning device organic according to this, make organic EL relatively move with mask and laser light mechanism, can clean with the presumptive area of mask organic EL.Relative moving mechanism can make organic EL move with the either party in mask and laser light mechanism or both sides, as long as organic EL is relatively moved with mask and laser light mechanism.
Organic EL mask cleaning device of technical solution of the present invention 6, be in organic EL of technical scheme 4 or 5 records uses mask cleaning device, it is characterized in that, has several above-mentioned organic EL is shone respectively the laser light mechanism of laser with the zones of different of mask.
EL mask cleaning device organic according to this, by several laser light mechanism, cut zone, carry out the cleaning of organic EL with mask, so, can clean rapidly.
Organic EL mask cleaning device of technical solution of the present invention 7, in organic EL of technical scheme 3 records uses mask cleaning device, it is characterized in that, above-mentioned air stream forms mechanism and has and attract mechanism, this attraction mechanism to be located at from above-mentioned organic EL to leave position for the required interval of the above-mentioned air stream that forms laminar condition with mask.
EL mask cleaning device organic according to this, attract mechanism leaving the position of organic EL with mask, and along organic EL, with the surface of mask, attract, so, can leave the air stream of organic EL with the position formation laminar condition on the surface of mask.
Organic EL mask cleaning device of technical solution of the present invention 8, be in organic EL of technical scheme 7 records uses mask cleaning device, it is characterized in that, above-mentioned air stream forms mechanism and has to the wind pushing mechanism of above-mentioned attractor structure air-supply.
EL mask cleaning device organic according to this, will attract mechanism and wind pushing mechanism combination, can form the air stream of stable laminar condition.
Organic EL mask cleaning device of technical solution of the present invention 9, in organic EL of technical scheme 1 record uses mask cleaning device, it is characterized in that, have ascending air stream and form mechanism, this ascending air stream forms mechanism and forms ascending air stream to being formed on above-mentioned organic EL from the back side towards surface with a plurality of peristomes of mask.
EL mask cleaning device organic according to this, owing to from organic EL, with the back side of the peristome of mask, forming ascending air stream towards surface, so,, even free product falls towards peristome, also by ascending air stream, pushed up back, like this, can not adhere to around entering the back side.In addition, not only the energy of laser rises free product, and ascending air stream also makes free product rise, so, can be directed to removal mechanism to free product effectively, can carry out the cleaning of high cleaning degree.
Organic EL mask cleaning device of technical solution of the present invention 10, in organic EL of technical scheme 1 record uses mask cleaning device, it is characterized in that, have plasma cleaning mechanism, this plasma cleaning mechanism is located at the rear section side of above-mentioned laser light mechanism, and plasma cleaning is attached to above-mentioned organic EL with the free product on mask surface.
EL mask cleaning device organic according to this, further clean with plasma cleaning the organic EL mask that was cleaned by laser light mechanism, can obtain higher cleaning performance.Although can obtain wash degree more than 99% by laser light mechanism, the free product of denier can adhere again to organic EL with on mask sometimes.At this moment, by carrying out plasma cleaning, the more most of burning of free product (ashing) of adhering to, remaining becomes burning gases, and these burning gases rise by ascending air stream, is removed mechanism and removes, so, can be from organic EL with disposing effectively free product on mask.
The manufacturing installation of the OLED display of technical solution of the present invention 11, is characterized in that, adopts the organic EL mask after the organic EL that is put down in writing by any one in technical scheme 1 to 10 cleans with mask cleaning device, makes OLED display.In addition, the OLED display of technical solution of the present invention 12, is characterized in that, is to use the manufacturing installation of the OLED display of technical scheme 11 records to make.
Above-mentioned organic EL can be used for the manufacturing installation of OLED display with mask cleaning device.
Organic EL mask clean method of technical solution of the present invention 13, remove with the evaporation material on mask being attached to organic EL, it is characterized in that,, to the surface irradiation laser of above-mentioned organic EL with mask, make the free product that above-mentioned evaporation material fragmentation is produced disperse upward; Remove with the above-mentioned free product that the air stream of air will disperse.
Organic EL mask clean method of technical solution of the present invention 14, in organic EL of technical scheme 13 records uses the mask clean method, it is characterized in that, above-mentioned air stream is formed in and leaves the air stream of above-mentioned organic EL with the laminar condition of the position of mask surface, has the air-flow with the surface of mask along above-mentioned EL.
Organic EL mask clean method of technical solution of the present invention 15, in organic EL of technical scheme 13 records uses the mask clean method, it is characterized in that, when removing with above-mentioned air stream when shining the above-mentioned free product that above-mentioned laser produces,, to being formed on above-mentioned organic EL with a plurality of peristomes on mask, form ascending air stream from the back side towards surface.
The present invention, utilize the Ear Mucosa Treated by He Ne Laser Irradiation of laser light mechanism, make and will be attached to that organic EL is broken with the evaporation material on mask and free product that generate disperses upward, leave the removal mechanism of organic EL with the position of mask surface with being located at, the product that will dissociate is removed, so, can complete to the Entirely contactless formula cleaning of organic EL with mask.Therefore, can not damage organic EL cleans with mask ground.
In addition, form mechanism by air stream and form air stream, and air stream is laminar condition, capture with the air stream of laminar condition the free product that disperses with mask from organic EL, organic EL mask thereby the product that should dissociate can not fly back again, can prevent adhering to once again of free product, obtain high cleaning degree.In addition, do not need film labelling machine, mechanism for stripping etc., can realize the simplification of mechanism, the miniaturization of device.
In addition, owing to having formed ascending air stream, form mechanism, so,, even free product falls with the peristome of mask towards organic EL, can not be attached to the surface of organic EL with mask yet.At this moment, not only the energy of laser rises free product, and ascending air stream also makes free product rise, so, can make free product greatly increase, can effectively it be directed to removal mechanism.
Description of drawings
Fig. 1 means the stereogram of the general structure of cleaning device.
Fig. 2 means the profile of the general structure of cleaning device.
Fig. 3 is the plane of organic EL with mask.
Fig. 4 is profile and the enlarged drawing of organic EL with mask.
Fig. 5 is the figure of the state of explanation air stream trap debris.
Fig. 6 means the stereogram of general structure of the cleaning device of modified example 1.
Fig. 7 means the stereogram of general structure of the cleaning device of modified example 2.
Fig. 8 means the stereogram of general structure of the cleaning device of modified example 3.
Fig. 9 means the profile of general structure of the cleaning device of modified example 4.
Figure 10 is the stereogram that ascending air stream forms device.
To be explanation form the figure of the state of ascending air stream on mask to Figure 11 at organic EL.
Figure 12 means the profile of general structure of the plasma washing equipment of modified example 5.
The specific embodiment
Below, illustrate referring to the drawings embodiments of the present invention.Fig. 1 and Fig. 2 are the general structural map of organic EL of the present invention with mask cleaning device 1.Organic EL of the present invention, with mask cleaning device 1, has organic EL mask 2, base 11, carries platform 12, clamping section 13, moving part 14, LASER Light Source 15, current mirror (ガ Le バ ノ ミ ラ ー) 16, air supplying part 17 and attraction section 18.Organic EL is as thin as a wafer metallic plates with mask 2, is used for forming figure in the localized area of the organic material evaporation as luminescent layer on the glass substrate (not shown) that forms OLED display.In recent years, along with the large picture of OLED display, organic EL also maximizes with the size of mask 2 very much.Organic EL of following use is as thin as a wafer and large-scale size with mask 2.
As shown in Fig. 3 and Fig. 4 (a), at organic EL, with the periphery of mask 2, reinforced bulkhead 3 is installed.For evaporation is on the glass substrate that forms OLED display accurately evaporation material, organic EL is to adopt micron-sized metallic plate as thin as a wafer with the thickness of mask 2.Due to organic EL with the thickness of mask 2 as thin as a wafer, so,, even evaporation disperses with large angle with the organic material on mask 2 at organic EL, do not produce shade (shadow) in the evaporation zone yet, can guarantee the uniformity of thickness.Because organic EL is as thin as a wafer and large-scale metallic plate with mask 2,, so it is plane that monomer whose can not keep, in order to make it, have conformality, reinforced bulkhead 3 has been installed.In addition, also can adopt reinforced bulkhead 3 method in addition, as long as make organic EL have conformality with mask 2.
Organic EL with mask 2 be with metal as material, formed the mask plate (shadowing mask) of regularly arranged a plurality of peristomes 4.Organic EL can adopt various metals with mask 2, but is the alloy that adopts cobalt and nickel here.Organic EL is with mask 2, and in the evaporation coating device (not shown) of the organic material of evaporation luminescent layer, the state that connects airtight with the glass substrate with forming OLED display, from vapor deposition source evaporation organic material (below be called evaporation material).As the evaporation material of luminescent layer, can adopt various materials, for example, can adopt aluminium complex (oxine aluminium: metal-organic complex Alq) etc.In addition, also can use the organic compound (can be metallic, can be also metal-free) beyond metal-organic complex as evaporation material.From the evaporation material of vapor deposition source evaporation, from organic EL with the formation of mask 2 the part evaporation of peristome 4 to above-mentioned glass substrate.Like this, can be the evaporation material evaporation as luminescent layer to the zone corresponding with pixel on glass substrate.
Although can with organic EL with mask 2 the evaporation material evaporation of predetermined pattern to glass substrate,, when evaporation, evaporation material also is attached on organic EL use mask 2.Be attached on glass substrate with the evaporation material on mask 2 in next evaporation operation or make the reasons such as the aperture area of peristome 4 changes owing to being attached to organic EL, so, carry out the cleaning of organic EL with mask 2, get rid of evaporation material.
Organic EL is arranged on base 11 with mask cleaning device 1, and organic EL carries and carrying on platform 12 with mask 2.Clamping section 13 is keeping the reinforced bulkhead 3 of organic EL with mask 2.Organic EL is being held in evaporation face (face of the vapor deposition source in evaporation coating device, the i.e. face that adheres to of evaporation material) mode up with mask 2.As shown in Figure 2, in the gap of carrying platform 12 and organic EL and be provided with between with mask 2 slight gap, clamping section 13 is keeping reinforced bulkhead 3.Clamping section 13 is keeping the reinforced bulkhead 3 of organic EL with 2 limits in opposite directions of mask 2.In addition, clamping part 13 also can keep 3 limits and even 4 limits of reinforced bulkhead 3.
In addition, have moving part 14 as travel mechanism in the bottom of carrying platform 12.Moving part 14 is to make to carry platform 12 in the travel mechanism that a direction moves, and can adopt the travel mechanism arbitrarily such as ball-screw, linear motor.Here, the moving direction of moving part 14 is directions Xs of Fig. 1, with the direction of this directions X quadrature be Y-direction.But moving part 14 also can move at directions X and Y-direction both direction.
Configuring the LASER Light Source 15 that sends predetermined wavelength laser on the top of base 11.LASER Light Source 15 sends the laser of organic EL with the wavelength of the metal material reaction of mask 2.When organic EL was the alloy of cobalt and nickel with mask 2, the wavelength region of sending this alloy reaction was near the laser 532nm.When organic EL uses other material of mask 2 employings, send the laser of this material reaction.The laser that sends from LASER Light Source 15 incides current mirror 16.Current mirror 16 be the laser of incident towards the organic EL mirror with mask 2 reflections, be the laser scanning mechanism that the angle of reflection of laser is changed at a high speed.For this reason, current mirror 16 has the drive division (not shown) that self is vibrated, and by the vibration of drive division, the angle of reflection of the laser of incident changes, and organic EL changes with the irradiation position in mask 2.When the angle of reflection of laser was changed towards Y-direction, laser scanned in Y-direction.Laser light mechanism consists of LASER Light Source 15 and current mirror 16,, by this laser light mechanism, carries out laser cleaning.Certainly, laser light mechanism also can adopt other optics arbitrarily.
The following describes the action in above-mentioned structure.Organic EL that the evaporation coating device that does not show from figure takes out is fixedly being kept by the clamping section 13 of carrying platform 12 with mask 2, is moved section 14 and moves at directions X.When organic EL is positioned at the bottom of current mirror 16 with the front position of the directions X of mask 2 while being about to be positioned at its underpart (or), from LASER Light Source 15, send laser.By the vibration at high speed of current mirror 16, laser scans with the surface of mask 2 organic EL in Y-direction.In the example of Fig. 1 and Fig. 2, in order to carry out the comprehensive cleaning of organic EL with mask 2, current mirror 16 makes the angle of reflection of laser change, and laser is scanned on straight line between the end of organic EL with the Y-direction of mask 2.Moving part 14 moves at directions X, so organic EL is with mask 2 in directions X and the scanning of Y-direction both direction quilt cover, like this, laser scans with the whole face of mask 2 organic EL.In addition, for the timing of the movement of the laser scanning that obtains Y-direction and directions X, 14 couples of organic EL of moving part with the movement of masks 2 preferably intermittently.
Organic EL is being held in the supine mode of evaporation with mask 2, and evaporation material 20 is and is attached on the evaporation face membranaceously.Shine laser with organic EL with the mode that the surface of mask 2 becomes focus.Laser has the wavelength (532nm) of organic EL with metal material (alloy of cobalt and the nickel) reaction of mask 2, and the irradiation by laser, apply thermal shock.Like this, crushing force acts on and is attached to organic EL with the evaporation material on mask 2, becomes free product and disperses towards top.Here, evaporation material, is attached to organic EL and is fractured into as having the powder of nominal particle size with the evaporation material on mask 2 when broken because of Ear Mucosa Treated by He Ne Laser Irradiation, and the while also produces gas.Therefore, not only contain small powder in free product, also contain gas.
Free product after fragmentation is the minimum powder of proportion, gas, so, be subject to the thermal shock of laser, disperse towards top rapidly.But, if the intensity of laser set excessively a little less than, evaporation material is broken or towards top, do not disperse.Therefore, the intensity of laser will be set becomes intensity evaporation material is broken, that free product is dispersed.On the other hand, if the intensity of laser is set too highly, organic EL is subject to excessive thermal shock with mask 2, may damage.For this reason, be preferably set to and make evaporation material 20 fragmentation and the needed minimum intensity of dispersing.For example, with the adhesive strength of the material production of the shape of mask 2, evaporation material 20 etc., set rightly the laser intensity that sends from LASER Light Source 15 according to organic EL.
The organic EL of Fig. 4 (b) expression enlarged drawing of the peristome 4 of mask 2.As shown in the drawing, organic EL adopts horn shape with the marginal portion 4E of the peristome 4 of mask 2 more.As previously mentioned, with part or all of the aperture area of the peristome 4 of mask 2 during by obturation, vapor deposition accuracy significantly worsens, and even can not use as organic EL.As shown in Figure 4 (b), the marginal portion 4E of peristome 4 is owing to being horn shape, so, become thinner position at as thin as a wafer organic EL in mask 2,, by thermal shock, act on higher crushing force.Therefore, the evaporation material 20 at this position is subject to very high crushing force, and in addition, the energy that disperses towards top also strengthens.Therefore, when marginal portion 4E shrank, the intensity of the laser that sends from LASER Light Source 15, needn't set De Taigao.
As shown in Figure 5,, by air supplying part 17 and attraction section 18, formed the air stream 30 of laminar condition, this air stream 30 flows with the surface of mask 2 along organic EL in the position of leaving organic EL use mask 2 predetermined spaces.For air stream 30 is formed laminar condition, blow from air-supply slit 17A with predetermined air quantity and wind speed, in addition, from attracting slit 18A, attract.For the air stream 30 that becomes laminar condition, air quantity and wind speed are set as required Min..In addition, not towards organic EL, with mask 2 or with organic EL, with the mode that mask 2 joins, to form air stream, but leaving to a certain extent the position of organic EL with mask 2, along organic EL, with the mode on the surface of mask 2, to form air stream.Formed a plurality of peristomes 4 at organic EL on mask 2, if air stream with organic EL with mask 2 collisions or contact, air stream just becomes turbulent condition, micronize and the dust that dispersed can adhere again on organic EL use mask 2.For this reason, form the air stream 30 of laminar condition.
Because being formed on, air stream 30 leaves the organic EL position with mask 2, so, clip calm regional 31 between air stream 30 and organic EL are with mask 2.Calm regional 31, be zone windless condition, that there is no air-flow basically, be the zone different from the air stream 30 of the laminar condition with air-flow.That is, air stream 30 has formed the zone with air-flow, and calm regional 31 have formed the zone that there is no air-flow.Although micronize and the free product 21 that dispersed be by calm regional 31,, because this zone does not have air-flow, so, on the not impact of direct of travel of free product 21.Therefore, free product 21 by calm regional 31, enter air stream 30, captured and transport by the air-flow of air stream 30.As previously mentioned, because free product 21 is atomic little powder, gas, so, can be captured by the air stream 30 of laminar condition effectively, be attracted section 18 and be recovered.In other words, air stream 30 is the stream that transports that transports free product 21.
Due to air stream 30 be laminar condition and formed in its underpart calm regional 31, so, do not become turbulent flow with organic EL with the zone that connect airtight on the surface of mask 2.Therefore, can not fly back organic EL with mask 2 from organic EL with the free product 21 that mask 2 disperses.At this moment, air stream 30 and organic EL are made as required minimal interval with the interval between mask 2.Because if this interval is excessive, micronize and the dust that disperses towards top can not arrive the height and position of air stream 30, can not reclaim.Like this, from organic EL, with the free product 21 of once getting rid of on mask 2, can not adhere again to organic EL with on mask 2, bring into play high cleaning effect.Air stream 30 and organic EL are with the interval between mask 2, such as can use according to organic EL the decisions such as material of mask 2 with the area of the peristome 4 of mask 2, the density of peristome 4, organic EL.
As mentioned above, with laser, with organic EL evaporation material 20 fragmentations with mask 2, it is dispersed upward as free product 21, with air stream 30, transport and remove the product 21 that dissociates, so, can realize the cleaning of Entirely contactless formula.Like this, do not damage organic EL with mask 2, can obtain cleaning effect.In addition, due to air stream 30, form laminar condition with the position of mask 2 leaving organic EL,, so free product 21 can not fly back organic EL with mask 2, can again not adhere to, by attraction section 18, reclaimed.Therefore,, to organic EL not injury of mask 2, can clean effectively.And, owing to not using film labelling machine etc., so, can realize the simplification of mechanism and the miniaturization of device.This organic EL, with the mask cleaning device 1 high cleaning performance of performance,, with the cleaning degree more than 99%, almost can fully clean organic EL mask 2.
In the above-described embodiment, as the removal mechanism of removing the free product 21 that disperses with mask 2 from organic EL, the air stream 30 of employing laminar condition is removed, and still, also can not adopt this air stream 30.For example, also can, from leaving the directive effect attraction of organic EL with mask 2, attract the free product 21 that disperses by laser scanning towards orthogonal direction.But, at this moment, the mobile turbulent condition that becomes of air stream, free product 21 likely adheres again to organic EL with on mask 2.And, due to organic EL is acted on attractions with mask 2, so organic EL produces distortions, distortion with mask 2.But, if when organic EL has with mask 2 thickness that is not attracted the power degree of injury etc.,, as removal mechanism, also can adopt from leaving the mechanism of organic EL with the directive effect attraction of mask 2.
In aforesaid present embodiment, by organic EL is cleaned with the whole surface irradiation laser of mask 2, still, in the time only need to cleaning (zone is cleaned) with the presumptive area of mask 2 to organic EL, to this regions contract ground scan laser.At this moment, the either party in the angle of reflection scope of the moving range of moving part 14 and current mirror 16 or both sides' contraction are entered a part.In addition, when carrying out the zone cleaning, the scope of air stream 30, also as long as can cover as the zone of cleaning object, needn't use the zone of whole of mask 2 to form air stream 30 at the organic EL of covering.
In the above-described embodiment, moving part 14 moves with mask 2 organic EL at directions X, and current mirror 16 makes laser scan in Y-direction, carries out like this zone and cleans.Moving part 14 and current mirror 16 can be controlled automatically,, by this mode, can automatically carry out the cleaning of organic EL with mask 2.In addition, also can automatically clean with other mode.For example, also can form fixing state to organic EL with mask 2, make current mirror 16 in the both direction vibration, make laser in directions X and the scanning of Y-direction both direction.
But when with current mirror 16, making the mode of laser scanning, let us not go into the question now with the center of mask 2 for organic EL, and in end, laser incides organic EL with mask 2 with large angle.At this moment, in center and the end of organic EL with mask 2, wash degree produces some differences sometimes.In addition, because organic EL is large-scale metallic plates with mask 2, so the scanning of Y-direction needs the time to a certain degree.For this reason, also can be without the scanning of laser, but organic EL is relatively moved with mask 2 and LASER Light Source 15, carry out zone and clean.
For example, current mirror 16 is used as fixing speculum, moving part 14 is moved at directions X and Y-direction both direction.Although the irradiation position of laser does not change,, by the movement of moving part 14, organic EL uses mask 2 in the both direction displacement, so the laser of mirror reflects and organic EL relatively move with mask 2.The laser of mirror reflects uses any part of mask 2 all towards orthogonal direction incident at organic EL.Therefore, can not produce the problem that causes the difference of wash degree because of the difference of incidence angle.At this moment, although laser light mechanism formed by LASER Light Source 15 and speculum,, make the orientation of oscillation of LASER Light Source 15 and organic EL with mask 2 quadratures by not adopting speculum, make laser light mechanism be formed by LASER Light Source 15.In addition, at this moment, relative moving mechanism consists of moving part 14.
While carrying out the zone cleaning with relatively moving, moving part 14 makes organic EL move with mask 2, with the laser scanning that irradiation position is changed, compares, and cleaning speed is low.Therefore, while carrying out the zone cleaning with relatively moving, the large as far as possible laser spot of preferred use.
In addition, while carrying out the zone cleaning with relatively moving, also can with carrying the lift-launch platform 12 fixing (that is, moving part 14 be not set) of organic EL with mask 2, above-mentioned speculum be moved at both direction.So also can carry out zone cleans.In addition, also above-mentioned speculum and LASER Light Source 15 can be constituted whole unit, this unit is moved at both direction.
Below, with reference to Fig. 6, modified example 1 is described.This modified example 1 is that organic EL is divided into mask 2 example that some zones are cleaned.In Fig. 6, LASER Light Source 15 is configured in 2 positions (as the 1st LASER Light Source 15a, the 2nd LASER Light Source 15b), current mirror 16 also is configured in 2 positions (as the 1st current mirror 16a, the 2nd current mirror 16b).Organic EL is divided into 2 zones (being divided into the 1st regional 2a and the 2nd regional 2b) with mask 2.The 1st regional 2a, by the laser that sends from the 1st LASER Light Source 15a, by the 1st current mirror 16a scanning, cleans.The 2nd regional 2b, by the laser that sends from the 2nd LASER Light Source 15b, by the 2nd current mirror 16b scanning, cleans.All adhered to identical evaporation material 20 on the 1st regional 2a and the 2nd regional 2b, so the 1st LASER Light Source 15a and the 2nd LASER Light Source 15b send the laser of identical wavelength.
As shown in Figure 6, organic EL is divided into 2 zones with mask 2, share and cleaning by the laser of the laser of the 1st LASER Light Source 15a and the 2nd LASER Light Source 15b respectively, can clean simultaneously 2 zones, and, because each zone is organic EL half zone with mask 2, so, (approximately shortening half) cleaning time can significantly be shortened.Like this, can greatly improve the production efficiency of organic EL with mask 2.The configuration number of units of LASER Light Source 15 and current mirror 16 is increased, can more shorten cleaning time.
Below, with Fig. 7, modified example 2 is described.In modified example 1, be that organic EL is divided into 2 zones with mask 2 at directions X, and in modified example 2, be to be divided into 2 zones in Y-direction.At this moment, the 1st LASER Light Source 15a and the 2nd LASER Light Source 15b are arranged side by side in Y-direction, in addition, with the 1st current mirror 16a and the 2nd current mirror 16b in Y-direction and row arrangement.Laser from the 1st LASER Light Source 15a sends, carry out the scanning of the 1st regional 2a.Laser from the 2nd LASER Light Source 15b sends, carry out the scanning of the 2nd regional 2b.As previously mentioned, while with laser scanning, cleaning, from aspects such as wash degree, sweep speeds, consider, sweep length is preferably short as far as possible.In modified example 2, owing to being divided into 2 zones in Y-direction, so sweep length is half in Fig. 1 example.Therefore, the incidence angle in the time of can reducing laser and incide each regional Y-direction end, can reduce the difference of wash degree.In addition, also can significantly reduce sweep time.Therefore, can carry out high speed and the high cleaning of wash degree.
Below, with Fig. 8, modified example 3 is described.In this modified example 3, as shown in Figure 8, adopted prism 19, with prism 19, the laser that sends from a LASER Light Source 15 is cut apart.Prism 19 is beam splitters that the reflection of the part of incident light, a part are seen through, and is to have formed the optical element of the functional membrane of bringing into play this function with the angle of 45 degree with respect to incidence angle.While adopting this prism 19, owing to can not carrying out the scanning of laser, so, moving part 14 is moved at directions X and Y-direction, carry out zone and clean.In modified example 3, organic EL is divided into 2 zones with mask 2, adopt and to be cleaned by 2 laser of prism 19 branches, so, cleaning time can be shortened approximately half.
As previously mentioned, while with relatively moving of moving part 14, cleaning, aspect cleaning speed, although than low with the cleaning of laser scanning,, can towards with the direction incident laser of organic EL with mask 2 quadratures, so, be favourable aspect wash degree.Therefore, configure several prisms 19, several laser with mask 2 quadratures with organic EL are set, like this, can carry out at short notice the high cleaning of wash degree.At this moment, preferably larger from the spot diameter of LASER Light Source 15 laser out.In addition,, even do not adopt prism 19, for example configure several LASER Light Sources 15, towards with organic EL, with the direction of mask 2 quadratures, shining several laser, also be fine.
Below, modified example 4 is described.This modified example 4 is to form the example of ascending air stream with the rear side of mask 2 from organic EL.As previously mentioned, to organic EL, with mask 2 irradiation laser, free product 21 is dispersed, with air stream 30, the free product 21 that disperses is approximately fully got rid of.But, because free product 21 is the minimum powder of proportion, gas, though can bring into play approximately 100% clearance,, the free product 21 of minute quantity is not removed by air stream 30, and the possibility that falls is arranged, and sometimes can not bring into play 100% clearance.
Especially, be to carry out the superfine metallic plate that causes processing due to organic EL with mask 2, so while shining high-intensity laser, large percussion is used on mask 2 at organic EL, likely injury.For this reason, the oscillation intensity of LASER Light Source 15 is set not too highly, so, can not give very strong energy to organic EL with mask 2, sometimes disperse less than the position of air stream 30.That is, the setting intensity of LASER Light Source 15, be adjusted to can be with evaporation material 20 broken the and required irreducible minimum intensity to the position of air stream 30 of dispersing.Therefore, although the free product 21 that disperses nearly all arrives the position of air stream 30, a few part does not arrive the position of air stream 30 and falls.Especially as shown in Figure 4 (b), horn-like due to marginal portion 4E is formed, so, having formed inclined-plane, the free product 21 the when evaporation material 20 that is attached to this marginal portion 4E is broken has the tendency of the position that does not arrive air stream 30.
The free product 21 that does not arrive air stream 30 falls with mask 2 towards organic EL, adheres again to organic EL with on mask 2.At this moment, not only organic EL has adhered to free product 21 again with the surface of mask 2 face of vapor deposition source (during the evaporation towards), and (opposing face on surface) also adhered to free product 21 again overleaf.As shown in Figure 3, at organic EL, formed a plurality of peristomes 4 on mask 2, and the size of the free product 21 of the aperture ratio of peristome 4 is much bigger, so free product 21 falls from peristome 4.Then, the free product 21 that falls from peristome 4, around entering to the back side of organic EL with mask 2, is attached to the back side of organic EL with mask 2 again.When organic EL is evaporation with the back side of mask 2 and the face that connects airtight of glass substrate, if free product 21 is attached on the back side, during the evaporation of new glass substrate, the free product 21 that is attached on the back side is transferred on glass substrate, and glass substrate is stained.
For this reason, Fig. 9 and ascending air stream formation device 40 shown in Figure 10 are set.As shown in Figure 9 and Figure 10, ascending air stream forms device 40 and has framework 41, air supply section 42, a plurality of air squit hole 43 and clamping section 44.In addition, dot air squit hole 43.Framework 41 is for inside being formed the casing in the space of locking, having formed air supply section 42 in side.In addition, a plurality of small air squit holes 43 have been formed in the above.Air supply section 42 is supply units of using to framework 41 air supplies, flows into the inside of framework 41 from the air of these air supply section 42 supplies, from forming superincumbent a plurality of air squit hole 43, towards top, sprays.Equalization and configured dispersedly each air squit hole 43 on framework 41, so, formed on framework 41 towards above ascending air stream.
Clamping section 44 is be used to the parts that keep organic EL with mask 2, be configured in regularly framework 41 above.Organic EL is being kept by clamping section 44 in evaporation face (during evaporation towards the face of vapor deposition source, the face that evaporation material 20 adheres to) mode up with mask 2.In addition, because clamping section 44 is L fonts, so,, with mask 2 and between above framework 41, be provided with very little interval at organic EL.In addition, also can adopt any structure, if at organic EL with mask 2 and the structure of fixing between above framework 41 with having slight gap.
As previously mentioned, while carrying out laser cleaning, even when not arriving the free product of the part of air stream 30 and falling and towards peristome 4, fall, by the ascending air stream UF that is formed on peristome 4, the free product that falls is pushed up go back to top again, so free product can be around entering the back side 2R of organic EL with mask 2.Therefore, free product can not adhere again on the 2R of the back side.
Ascending air stream UF makes free product basically not adhere again to back side 2R, in addition, has also brought into play the boost motor function of the free product rising of dispersing while making laser cleaning.Be attached to organic EL with the evaporation material 20 on mask 2 by laser fracturing, become free product and disperse upward, owing to having formed ascending air stream UF, free product is subject to the air-flow of ascending air stream UF and more toward eminence, rises.That is, be not only by dispersing that laser causes, but by the complementary effect of dispersing of causing of laser and ascending air stream UF, free product rise higher.
As previously mentioned, for fear of excessive percussion at organic EL with on mask 2 and injury, the intensity of the laser that LASER Light Source 15 sends is set not too highly.Therefore, can not apply enough impacts to free dispersing of product, when the energy that only depends on this impact disperses free product, disperse less than very high position.But, forming ascending air stream UF from organic EL with the below of mask 2, this ascending air stream UF, as boost motor, further rises free product toward top.Therefore,, even set the oscillation intensity of LASER Light Source 15 not too high,, by the boosting of ascending air stream UF, also can make free product rise to the position of air stream 30.
Ascending air stream forms device 40, with low-down air quantity, forms ascending air stream UF.Originally free product is the minimum powder of proportion, gas etc., so even be set as low-down air quantity, free product also can flow UF by ascending air and rise toward eminence.On the other hand, due to framework 41 with organic EL with having separated very little interval between mask 2, so organic EL becomes the state that directly bears ascending air stream UF with the back side 2R of mask 2.With mask 2, are metallic plates of Bao Erda due to organic EL, so if set the air quantity of ascending air stream UF too highly, organic EL can produce distortion, deflection with mask 2, to organic EL with mask 2 injuries.Consider from this point, preferably ascending air stream UF is set as low air quantity.
The air quantity of ascending air stream UF, be set as the air quantity that pushes back from peristome 4 with the free product that the peristome 4 of mask 2 falls towards organic EL at least.In addition, in the time of need to making ascending air stream UF have the function of the free product rising of boosting, be set as larger air quantity.At this moment air quantity, change according to the laser generation intensity of LASER Light Source 15, when the oscillation intensity of laser is large, ascending air is flowed the air quantity of UF and set littlely, and oscillation intensity hour, flow ascending air the air quantity of UF and set greatly.But, flow the air quantity inhibition of UF to ascending air for not damaging the air quantity of organic EL with mask 2 degree.
Therefore, while carrying out laser cleaning, form device 40 by ascending air stream and always from organic EL, with the back side 2R of mask 2, towards surperficial 2S, form ascending air stream, like this, the free product that falls can not be attached to back side 2R.In addition, always form ascending air stream when laser cleaning, like this, the rising of the free product of ascending air stream boosting, free product disperses toward higher top.Like this, available air stream 30 is from organic EL, with the free product that mask 2 disperses, removing effectively, and available high wash degree cleans organic EL mask 2.
Below, with Figure 12, modified example 5 is described.Carry out laser cleaning with organic EL with mask cleaning device, can fully clean, and if form ascending air stream UF, cleannes are better.But,, even if like this, sometimes still there is the free product 21 of minute quantity to remove not fall, again be attached to organic EL with on mask 2.In addition, owing at organic EL, with the peristome 4 of mask 2, forming ascending air stream UF, so,, even free product adheres to, neither be attached to back side 2R, but be attached to surperficial 2S.The plasma washing equipment 50 of Figure 12, be to consider in the cleaning of with organic EL, carrying out with mask cleaning device the situation that has the free product of minute quantity to adhere to, and organic EL is again cleaned and arranges with the surperficial 2S of mask 2.For this reason, plasma washing equipment 50 is configured in the position that the organic EL after being cleaned with mask cleaning device by organic EL is cleaned with mask 2, namely is configured in the rear section side (downstream side) of organic EL with mask cleaning device.
Minute quantity be attached to organic EL with the free product 21 on mask 2, almost all burnings (ashing) and gasifying under the effect of plasma 34, a part becomes burning gases and swims with mask 2 from organic EL.The burning gases that swim fall with mask 2 towards organic EL, may be from peristome 4 around entering the back side 2R with mask 2 to organic EL.
For this reason, at organic EL, with the bottom of mask 2, ascending air stream formation device 40 is set, from organic EL, with the back side 2R of mask 2, towards surperficial 2S, forms ascending air stream UF.Like this, the burning gases that drop to peristome 4 are pushed up back by ascending air stream UF, and burning gases can be around entering to back side 2R.In addition, burning gases rise and are transported and remove by air stream 30 by ascending air stream UF.Therefore, burning gases also are not adhered to the surperficial 2S of organic EL with mask 2, can obtain roughly wash degree completely.
As mentioned above, organic EL is combined with mask cleaning device and plasma washing equipment 50,, as organic EL mask cleaning device, can bring into play higher cleaning performance.In addition, the above has illustrated that having ascending air stream at plasma washing equipment 50 and organic EL on mask cleaning device forms the example of device 40, but, ascending air stream forms device 40 and also can be located on 2 either party in device, also can be located on 2 devices, also can not be arranged on any device.
The free product 21 that disperses in laser cleaning is transported and removes by air stream 30, and in plasma cleaning, burning gases are transported and remove by air stream 30.Therefore, although do not form ascending air stream UF, can not obtain high cleaning performance yet,, have respectively ascending air stream and form device 40 on 2 device, can prevent towards organic EL with the back side 2R of mask 2 around entering, can obtain higher cleaning performance.
In addition, in the example of Figure 12, ascending air stream forms device 40 and forms ascending air stream UF by the air stream that is provided in a plurality of air squit holes 43 ejections above framework 41, but is not limited thereto, and also can adopt other mode to form.For example, organic EL is formed barotropic state with the back side 2R side lower part of mask, surperficial 2S upper lateral part is formed negative pressure state, like this, the free product that falls just can be around entering the back side 2R side with mask 2 to organic EL.
Claims (5)
1. an organic EL mask cleaning device, be used for removal and be attached to organic EL with the evaporation material on mask, it is characterized in that having:
Laser light mechanism, to above-mentioned organic EL with the evaporation face of mask with this evaporation surface irradiation laser that up mode configures, make above-mentioned evaporation material is broken and free product that produce disperses upward;
Air stream forms mechanism, is leaving the position formation air stream of above-mentioned organic EL with the surface of mask, and this air stream is to transport free product along this surperficial mode; And
The 2nd air stream forms mechanism,, from the rear side of organic EL with mask,, via being arranged at the peristome of this organic EL with mask,, towards being formed at above-mentioned organic EL with the surface of mask and the calm zone between above-mentioned air stream, forms ascending air stream.
2. organic EL mask cleaning device as claimed in claim 1, it is characterized in that, above-mentioned air stream forms mechanism and has attraction mechanism, and this attraction mechanism is located at from above-mentioned organic EL and leaves position for the required interval of the above-mentioned air stream that forms laminar condition with mask.
3. organic EL mask cleaning device as claimed in claim 2, is characterized in that, above-mentioned air stream forms mechanism to have to the wind pushing mechanism of above-mentioned attractor structure air-supply.
4. organic EL mask cleaning device as claimed in claim 1, it is characterized in that, have plasma cleaning mechanism, this plasma cleaning mechanism is located at the rear section side of above-mentioned laser light mechanism, and plasma cleaning is attached to the lip-deep free product of above-mentioned organic EL with mask.
5. organic EL mask clean method, remove with the evaporation material on mask being attached to organic EL, it is characterized in that,
, with the configuration that faces up of the evaporation of mask,, on one side to this evaporation surface irradiation laser, make above-mentioned organic EL with relatively moving between mask and laser on one side above-mentioned organic EL, thereby with above-mentioned evaporation material fragmentation;
Ascending air stream is flowed via opening with the rear side of mask from above-mentioned organic EL, thereby make the above-mentioned evaporation material that is broken increase;
Form along this surperficial air stream with the position on the surface of mask leaving above-mentioned organic EL, the free product that above-mentioned ascending air stream is acted on is to transport with the mode on the surface of mask along organic EL.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008237312A JP5164761B2 (en) | 2008-09-17 | 2008-09-17 | Organic EL mask cleaning apparatus, organic EL display manufacturing apparatus, and organic EL mask cleaning method |
| JP2008-237312 | 2008-09-17 | ||
| JP2008-262791 | 2008-10-09 | ||
| JP2008262791A JP2010092761A (en) | 2008-10-09 | 2008-10-09 | Mask cleaning device for organic el, manufacturing device of organic el-display, organic el-display, and mask cleaning method for organic el |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910174768A Division CN101677122A (en) | 2008-09-17 | 2009-09-17 | Mask cleaning device and method for organic EL, organic EL display and manufaturing device thereof |
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| Publication Number | Publication Date |
|---|---|
| CN103394490A true CN103394490A (en) | 2013-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013103326681A Pending CN103394490A (en) | 2008-09-17 | 2009-09-17 | Device and method for cleaning organic electro luminescence (EL) mask |
| CN200910174768A Pending CN101677122A (en) | 2008-09-17 | 2009-09-17 | Mask cleaning device and method for organic EL, organic EL display and manufaturing device thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910174768A Pending CN101677122A (en) | 2008-09-17 | 2009-09-17 | Mask cleaning device and method for organic EL, organic EL display and manufaturing device thereof |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101089188B1 (en) |
| CN (2) | CN103394490A (en) |
| TW (1) | TWI426964B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152846A (en) * | 2014-02-21 | 2014-11-19 | 唐军 | Mask plate cleaning system |
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| CN106311681B (en) * | 2015-06-18 | 2019-10-29 | 上海和辉光电有限公司 | Mask plate foreign matter sweep-out method and mask plate foreign body eliminating apparatus |
| CN107755360A (en) * | 2016-08-19 | 2018-03-06 | 合肥欣奕华智能机器有限公司 | A kind of mask plate cleaning device and mask plate purging system |
| CN110730694B (en) * | 2017-04-25 | 2022-07-22 | 三菱电机株式会社 | Laser cleaning device and laser cleaning method |
| KR101984647B1 (en) | 2017-07-06 | 2019-06-03 | 삼성중공업 주식회사 | Laser cleaning device having a function of checking cleaning quality and method thereof |
| KR20190008644A (en) | 2017-07-17 | 2019-01-25 | 삼성중공업 주식회사 | Laser cleaning device having a function of checking cleaning quality and method thereof |
| KR102272649B1 (en) | 2017-07-17 | 2021-07-02 | 삼성중공업 주식회사 | Laser cleaning device having a function of checking cleaning quality and method thereof |
| KR102128776B1 (en) | 2017-07-26 | 2020-07-01 | 삼성중공업 주식회사 | Laser cleaning device having a function of checking cleaning quality and method thereof |
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| JP7308677B2 (en) * | 2019-07-10 | 2023-07-14 | キヤノントッキ株式会社 | Film forming apparatus, film forming method, and electronic device manufacturing method |
| EP3932572A1 (en) * | 2020-07-03 | 2022-01-05 | Ewald Dörken Ag | Method for treating surfaces |
| CN113458609A (en) * | 2021-05-27 | 2021-10-01 | 上海传芯半导体有限公司 | Processing method for regenerating mask light-transmitting substrate and manufacturing method for mask substrate |
| CN114150272B (en) * | 2021-12-03 | 2022-08-23 | 江苏威森美微电子有限公司 | Self-cleaning device of evaporation table for semiconductor processing |
| CN116899985B (en) * | 2023-09-14 | 2023-12-15 | 浙江森尼克半导体有限公司 | Lead frame flash removing method and device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101677122A (en) | 2010-03-24 |
| KR101089188B1 (en) | 2011-12-02 |
| TWI426964B (en) | 2014-02-21 |
| TW201021928A (en) | 2010-06-16 |
| KR20100032334A (en) | 2010-03-25 |
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