TWI287586B - A cleaning apparatus and an evaporation machine using the same and a cleaning method thereof - Google Patents

A cleaning apparatus and an evaporation machine using the same and a cleaning method thereof Download PDF

Info

Publication number
TWI287586B
TWI287586B TW93129480A TW93129480A TWI287586B TW I287586 B TWI287586 B TW I287586B TW 93129480 A TW93129480 A TW 93129480A TW 93129480 A TW93129480 A TW 93129480A TW I287586 B TWI287586 B TW I287586B
Authority
TW
Taiwan
Prior art keywords
mask
cleaning
vacuum cleaner
ultrasonic
particles
Prior art date
Application number
TW93129480A
Other languages
Chinese (zh)
Other versions
TW200610833A (en
Inventor
Chung-Wen Ko
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW93129480A priority Critical patent/TWI287586B/en
Publication of TW200610833A publication Critical patent/TW200610833A/en
Application granted granted Critical
Publication of TWI287586B publication Critical patent/TWI287586B/en

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

An evaporation machine equipped with a cleaning apparatus is disclosed. The evaporation machine comprises an evaporation chamber, an ultrasonic cleaning chamber and a transferring device. The evaporation chamber may utilize at least one shadow mask to implement the evaporation process to a substrate. The transferring device is used to transfer the mask between the evaporation chamber and the ultrasonic cleaning chamber. A cleaning apparatus including an ultrasonic generator, an air blowing device and a vacuum cleaner is equipped in the ultrasonic cleaning chamber. The present invention also provides a cleaning method o f a shadow mask using the apparatus described above. The transferring device transfers the mask from the evaporation chamber to the ultrasonic cleaning chamber. Particles on the surface of the mask are vibrated and become easy to remove due to the seismic wave produced by the ultrasonic generator. At the same time, the vacuum cleaner collects the particles lifted by the air blowing device. When the shadow mask is cleaned, the transferring device transfers it into the evaporation chamber for the evaporating operation.

Description

!287586 九、發明說明: 【發明所屬之技術領域】 士發明係相關於一蒸鍍機台,特別是指結合一除塵裝置, 可對療鍍作業用的遮罩進行線上清潔的蒸鍍機台。 【先前技術】 現今,由於有機發光二極體(Organic Light Emitted ioje ’以下簡稱〇LED)顯示器所具有之高亮度、高反應速度、 f t低電-驅動、重餘、無視角差且^需背光源諸多優點, 二越來越X到人們的重視,而成為下—世代顯示器面板的發 常细鮮蒸鍍法選擇性地在朗絲表面分別形 成可赉出^、藍、綠三色光的發光薄膜層。 屏的主要作業方式,係將一表面已具有透明電極 二(一ιρ的玻璃基板送至蒸鐘室t,並在蒸鑛室内設有紅、藍、 機ί光材料源,每#進行其中—種顏色的薄膜層的 i ΐϊ ί t 顏色的材料蒸發,同時利用一具有開孔的 ^璃化後的材料通遮罩的開孔,附著成形於 電極層表面,並在此—顏色之薄膜層形成後, 軸’使遮罩的開孔位移動至下一顏色薄膜層 預疋$成的位置’以進行下—顏色的細層装鑛。 明-炻m / 玻輸反1 ’其表面已形成-透 用陰極®案加卫方法’在透明電極層11 Ϊ3?:ΐίΐ2 ’使遮罩2在遮蔽透明電極層u;,不! 直接摘到透明電極層11而使透明電極層11發生毀損。θ 遮罩2具有複數個開孔21,當遮罩2與隔離柱12緊密貼 1287586 = 月ί極層表面大部分區域被遮罩2所遮蔽,僅露出開 孔ζι、處的透明電極層η表面。 覃2 作業時,使有機發光材料源蒸發為汽態,通過遮 層卜” ’崎於透明電極層11表面,而碱第-薄膜 遮罩Ιίϋ薄膜層R的蒸錢作業後,約略下移遮罩2,使 2:將逆置9 ί 1於隔離柱12 ’並平行於玻璃基板1移動遮罩 成Γίί 2的移動至其開孔21位於第二薄膜層G預定形 玻璃美板1 h祕柱12緊密貼合,進行材料蒸鮮業,使 明電極層11表面,形成第二賴G後,再 作,形成第三薄膜層β,如第- Β圖所示。 過程環境中的細小塵粒粉屑,献材料蒸鍍 業中會沾附面的多餘材料,使得遮罩表面在蒸鑛作 參閱===第時成許 =題,請 i第二壓毀已形賴膜層。或是 範圍縮小,甚或微f 使仔預定形成的薄臈層 都會造成產品元全阻塞開孔21的情形。而這些 因此’微粒的清除,在基梦作蚩由 在習知的;:=中,^====環,而 將輕移岐賴纟外,以縣置人化學液 氣,尚祕彳相射賊縣鱗表面的水 行清潔,蒸鍍作業無法繼is在遮罩須離線進 只廼仃,造成瘵鍍機台的間置。因此, 1287586 ^務上在在在數批產品進行蒸鑛作業後,才對遮罩進行清潔作 業,但如此一來,遮罩表面所附著的微粒極有可能在蒸鍍日^已 對產品造成破壞,嚴重影響了蒸鍍品質的穩定度。 而乾式清潔係在蒸鍍機台内,增設一電漿清潔室,以電漿 y遮罩表㈣行清料業H賴清潔對於鮮表面所附 =較大微粒清除能力不佳,若為了提高清潔能力,而以高功 率局溫度進行清潔,則可能對遮罩產生損害。 因此,如何透過蒸鍍機台與清潔方法的改良,而可有效 辦業魏,係為熟悉此 項技藝者所致力之方向。 【發明内容】 之蒸ίίϊΐϋίίίί供^除塵裝置及具有此除塵裝置 夕其了清潔之方法’可在紐機台内對欲清潔 產能。牛進仃線上清潔,蒸鍍機台不須閒置,而能充分運用機台 置之一,的在於提供一除塵裝置及具有此除塵裝 ,,鍍機台及以其進行清潔之方法,可以不傷害3 式,2清潔物件表面所沾附的微粒,確保產品之品質。 塞鐘i it 發明揭露—齡塵裝置,其可裝設於 而與蒸賴台相結合,於蒸鍍機台内利用 傳輸裝置之雜,對物件断料。 台,露-配置有前述除塵裝置之蒸鍍機 包括上蒸=示器之紐細製程中,可 至少—遮罩對已需使用的有機材料源,利用 傳輸裝置,例、ίί機璃基板進行蒸鍍作業。 及超音波清潔室之間專效之裝置,可在蒸鑛室 1287586 右室’ ΐ内部至少設有一前述之除塵裝置,其具 有超曰波產生态、一氣流吹出器以及一吸塵界。 μ 種清潔鮮之方法^於上述之蒸鍍機 甚至可當遮罩每次完成蒸 傳輸裝置將遮罩达入超音波清潔室中,進行清潔。 鹿牡2輸iiS罩送。入超音波清潔室_青潔時,利用除 叙衣n:: i產生續產生之震波將遮罩表面之微粒震 ^ 與遮罩表面之間的附著結構,使微粒易於鬆 動。n⑽之驗,會籠鮮表面微粒揚起, 亚以吸塵&騎揚起絲吸除,而達骑潔鮮之目的。於清 =成後’利用傳輸農置將遮罩送回蒸鍍室内,再次進行蒸鍍 作業。 在本务明之一貫施例中,本發明所揭露蒗系 適用於OLK)顯示器蒸鍍成膜製程中。 “、、又微口 ^發明之-實施例中’於除塵裝置内,氣流吹出器位於 超音波產生器之一側邊,吸塵器位於超音波產生器之另一侧 邊。清潔時’於遮罩上方持續移動除塵裝置,侧除塵裝置對 遮罩進行清潔。 並且,為了使微粒更有效的被清除,在本發明之一實施例 中,更使超音波產生器與氣流吹出器之間具有一第一夾角,並 使超,波產生器與吸塵器之間具有一第二炎角。藉由此二夾 角,氣流吹出器所吹出之氣流在流經遮罩後,帶著所揚起的微 粒,反射進入吸塵器中。 而氣流吹出器除可利用其本身具有之泵浦產生氣流外,在 本發明之-實補中,更可與—加壓紐管路連結,並藉由加 Μ氣體管路提供氣流吹出魏氣或潔淨乾敗氣或是其他不 影響此遮罩之氣體。 同樣的,吸塵器除可利用其本身具有之泵浦作動來吸入氣 1287586 流外,在本發明之一實施例中,更可與一負壓管路連結,藉其 吸力’將吸塵器所吸取之微粒排入負壓管路内。 此外,為了維持蒸鍍機台内部真空度,在本發明之一實施 例中超音波清潔室更可設置—閘門及—真空抽氣系統,當遮罩 送^超音波清潔室後,關閉閘門以進行清潔作業,並在清潔完 ^後,以真空抽氣系統將超音波清潔室内抽取至所需真空度 後’打開閘門,以傳輸裝置將遮罩送回蒸鍍室中。 、為使本發明之優點及精神能更進一步的被揭示,茲配合圖 式作一詳細說明如后。 【實施方式】 在本^明之實施例中,本發明揭露之除塵裝置及具有此除 塵裝置之蒸鍍機台,係使用於一有機發光二極體顯示器之蒗鍍 成膜製程中,以為實施之說明。 …、 5月參閱第三圖,其係為本發明所揭露之具有此除塵裝 清潔室42及一傳輸裝置43。 超曰波 在蒸鍍室41中,利用遮罩2進行蒸鍍作業。 傳輸裝置43設於一真空腔室431中,此真空腔室431兩 侧分別與蒸鍍室41及超音波清潔室42連接。 、一在每次蒸鍍作業中,因環境的細微塵粒或因有機發光 的污染,於遮罩2表面可能會逐漸沾附有微粒。 如圖所示,在本實施射,每讀遮罩2完成蒸鑛 後、,即利用傳輸裝置43將遮罩2從蒸鍍室41中取出,送入^ 音波清潔室42巾進行清潔,並於清潔完成後,再次將遮&287 发明 发明 发明 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 287 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明. [Prior Art] Today, the organic light-emitting diode (Organic Light Emitted ioje' hereinafter referred to as 〇LED) display has high brightness, high reaction speed, low power, low power, no difference in viewing angle, and backlight Many advantages of the source, two more and more people to pay attention to, and become the next-generation display panel of the hair often fresh vapor deposition method selectively on the surface of the Langshi can be formed to emit light of ^, blue, green Film layer. The main operation mode of the screen is to send a glass substrate with a transparent electrode 2 (one ιρ) to the steaming chamber t, and a red, blue, and mechanical material source is provided in the steaming chamber, and each # is carried out. The color of the film layer of the i ΐϊ ί ̄ color material evaporates, while using a perforated glass material through the opening of the mask, attached to the surface of the electrode layer, and here - the color of the film layer After formation, the axis 'move the opening position of the mask to the position where the next color film layer is pre-made' to perform the lower-color fine layer loading. Ming-炻m / glass inversion 1 'the surface has been Forming-transparent cathode® case-protecting method 'In the transparent electrode layer 11 Ϊ3?: ΐίΐ2', the mask 2 is shielded from the transparent electrode layer u;, no! directly picking up the transparent electrode layer 11 and causing the transparent electrode layer 11 to be damaged The θ mask 2 has a plurality of openings 21, and when the mask 2 is closely attached to the spacer 12, 1287586 = month, most of the surface of the pole layer is covered by the mask 2, and only the transparent electrode layer at the opening 露出ι is exposed. η surface. 覃2 During operation, the source of organic luminescent material is evaporated to a vapor state, The layer "" is on the surface of the transparent electrode layer 11, and after the evaporation operation of the alkali-film mask Ιίϋ film layer R, the mask 2 is moved down slightly, so that 2: will be reversed by 9 ί 1 on the spacer 12' Parallel to the glass substrate 1 to move the mask into Γίί 2 to the opening 21 of the second film layer G, the predetermined shape of the glass plate 1 h the column 12 is closely adhered to the material evaporation industry, so that the bright electrode layer 11 After the surface is formed, the second film G is formed, and the third film layer β is formed, as shown in the first section. The fine dust particles in the process environment, the excess material which will adhere to the surface in the evaporation industry. In order to make the surface of the mask in the steaming mine, see the === the first time to become the title, please i the second crush has been formed on the film layer. Or the range is reduced, or even the micro-f to make the formation of the thin layer of the layer will cause The product element completely blocks the opening of the opening 21. And these are therefore 'particle removals' in the base dream by the conventional;:=, ^==== ring, and will be lightly moved to the outside, to The county has a chemical liquid gas, and the water is cleaned on the surface of the scales of the thief county. The evaporation operation cannot be followed by the mask. Therefore, 1287586 is cleaning the mask after performing steaming operations on several batches of products, but as a result, the particles attached to the surface of the mask are highly likely to be vapor deposited. Day ^ has caused damage to the product, which seriously affected the stability of the evaporation quality. The dry cleaning system in the evaporation machine station, adding a plasma cleaning room, with plasma y mask table (four) line clearing industry H Lai Cleaning for fresh surfaces = large particle removal ability is not good, if you clean the high power temperature to improve the cleaning ability, it may damage the mask. Therefore, how to pass the evaporation machine and the cleaning method Improvement, but can effectively run Wei, is the direction of the people who are familiar with this skill. SUMMARY OF THE INVENTION The dedusting device and the method for cleaning the dust removing device can be used to clean the production capacity in the new machine table. The cattle are cleaned on the line, the evaporation machine does not need to be idle, and one of the machine sets can be fully utilized. It is provided with a dust removal device and has the dust removal device, the plating machine and the method for cleaning it. Injury 3, 2 cleaning particles on the surface of the object to ensure the quality of the product. The plug-in i it invention discloses a dust-collecting device which can be installed in combination with a steaming table, and uses a conveying device in the vapor-plating machine to cut off the object. The table, the dew-distributing device equipped with the foregoing dust removing device comprises a top steaming process, which can at least cover the source of the organic material that has been used, and uses a transport device, for example, a glass substrate. Evaporation work. And a special device between the ultrasonic cleaning chambers, at least one of the aforementioned dust removing devices can be arranged in the right chamber of the steaming chamber 1287586, which has a super-wave generating state, an air blowing device and a dust collecting boundary. μ cleaning method ^ The above-mentioned vapor deposition machine can even clean the mask by inserting the mask into the ultrasonic cleaning chamber each time the mask is completed. Lumu 2 loses the iiS cover to send. When entering the Ultrasonic Clean Room _ Qing Jie, use the shock wave generated by the n:: i to generate the impact of the particles on the surface of the mask and the surface of the mask to make the particles easy to loose. The test of n(10) will raise the surface particles of the cage, and the purpose of vacuuming & riding up the silk to absorb, and riding the purpose of cleaning. After Yu Qing = Cheng, the mask is returned to the vapor deposition chamber by the transfer farm, and the vapor deposition operation is performed again. In the consistent application of the present invention, the present invention is applicable to the OLK) display vapor deposition film forming process. ",, and micro-portion - in the embodiment - in the dust removal device, the airflow blower is located on one side of the ultrasonic generator, and the vacuum cleaner is located on the other side of the ultrasonic generator. The dust removing device is continuously moved upward, and the side dust removing device cleans the mask. Further, in order to make the particles more effectively removed, in an embodiment of the present invention, there is a first between the ultrasonic generator and the airflow blower. An angle between the wave generator and the vacuum cleaner has a second inflammatory angle. By the two angles, the airflow blown by the airflow blower flows through the mask, and the reflected particles are reflected. In addition to the pump-generating airflow, the airflow blower can be connected to the pressurization line and provided by the twisted gas line. The air stream blows Wei gas or clean dry gas or other gas that does not affect the mask. Similarly, the vacuum cleaner can use its own pumping action to inhale the air 1287586, in an embodiment of the invention, more Connected to a negative pressure pipeline, by which the particles sucked by the vacuum cleaner are discharged into the negative pressure pipeline. Further, in order to maintain the vacuum inside the vapor deposition machine, in one embodiment of the present invention, the ultrasonic cleaning chamber is further It can be set up—the gate and the vacuum pumping system. When the mask is sent to the ultrasonic cleaning room, the gate is closed for cleaning operation, and after cleaning, the ultrasonic cleaning chamber is pumped to the required vacuum cleaning system. After the degree of vacuum, the gate is opened and the mask is returned to the vapor deposition chamber by the transport device. In order to further disclose the advantages and spirit of the present invention, a detailed description will be given with reference to the following figures. In the embodiment of the present invention, the dust removing device disclosed in the present invention and the vapor deposition machine having the dust removing device are used in a ruthenium plating film forming process of an organic light emitting diode display ... Referring to the third drawing in May, the present invention discloses the dust-removing cleaning chamber 42 and a conveying device 43. The super-wave is used in the vapor deposition chamber 41 to perform a vapor deposition operation using the mask 2. 4 3 is disposed in a vacuum chamber 431, and the two sides of the vacuum chamber 431 are respectively connected to the vapor deposition chamber 41 and the ultrasonic cleaning chamber 42. One in each evaporation operation, due to the environment of fine dust particles or organic The luminescent pollution may gradually adhere to the surface of the mask 2. As shown in the figure, after the mask 2 is finished in the present embodiment, the mask 2 is evaporated from the mask by the transport device 43. The chamber 41 is taken out, sent to the sound cleaning room 42 for cleaning, and after the cleaning is completed, the mask will be again &

從超音波清潔室42中取出,送回蒸鍍室41中繼續進行蒸鍍 業。 “、、X F 而在此特別說明的是,本蒸鍍機台内部空間更可增設其 腔室’例如基板卸載室、金屬電極蒸鑛室、基板前處理室'、封 I287586 行作置於各腔室之間傳遞基板進 重點故知之技術,非為本發明之 3例中’係以不破壞蒸鑛機台内 鮰參閱第四A圖及第四β圖,Η孫炎楚二 :;广波清潔室42示意圖及側視圖:其; :、:=「真空抽氣⑷23、-加:氣二路二 哭42^fif犯1/設有一超音波產生器4211、一氣流吹出 = 塵器f3。氣流吹出器4212位於超音波產 位於和立、’兩者間具有―第—夾角吸塵器4213 位於^波,生器備之右侧邊,兩者間具有一第二夾角A2。 由加與加壓氣體管路424相連通,藉 則祕吹出器4212一氮氣。吸塵器4213 ^5 4213 ,發明揭露之清潔遮罩之方法,係可於本實施例,實施如 下、。當欲對遮罩2進行清潔時,傳輸裝置43將遮罩2送入超 曰波>月森至41,為了維持悉鑛機台内部真空度,關閉閘門 422 ’使超音波清潔室41與蒸鑛機台其他腔室隔絕後,進行清 潔作業。 、、進行清潔時,除塵裝置421於遮罩2上方來回移動以進行 ✓月春。在除塵裝置421於遮罩2上方以X方向來回移動的同 時,超,波產生器4211所產生之震波,可震動遮罩2表面之 微粒’並減弱了微粒3與遮罩2表面兩者之間的附著結構,使 得微粒3更更容易鬆動而被移除。同時,藉由加壓氣°體管路 10 1287586 i /ϊ提供的氮氣’氣流吹出11㈣以第-夾角A1將氣體吹 二巧2表面’將遮罩2表面已鬆動之微粒3揚起吹除,並挟 π者^揚_微粒3 ’經由群2表面的反射,進人以第二央 角Α2設置的吸塵器4213中,將微粒3排入負壓管路425中, 完成對遮罩2的清潔。 、 在完成清潔後,以真空抽氣系統423將超音波清潔室42 =取,需真妓後’打開間門422,以傳輸裝置㈣遮 罩2达回瘵鍍室41中,進行下一次的蒸鍍作業。 立、隹實施例中,本發明之具有_裝置之蒸賴台及以 方法,更可使用複數個傳輸裝置及複數個遮罩來 五圖,其係為本發明之第二實施例,與第一實施 ί係利用第一傳輸裝置43a及第二傳輸裝置 ί2a於驗室41完成蒸鑛作業後,_第-傳輸裝置ia $ /第ΙΪ罩從蒸鍍室41 *取出,送人超音波清潔室42中進 乂了、:,以第二傳輸裝置伽將第二遮罩2b送入蔽鍍室 mi 於超音波清潔室43進行清潔的同時, —遮罩%及第二遮罩2b _蒸鍍作1 @ = 分發揮療鍍機台之產能。 綜觀以上所述,本發明確實具有下列優點: ^將遮罩的清潔過&對条鑛機台產出的影響降至 青潔過程,係ί 一線上清潔過程,不須將遮罩取 出?^鍍機:口外,亦不須破壞蒸鏡機台内部的真空度, 6 清潔’甚至可如第二實施例所述’利用複數個遮I同時】 上清潔及蒸鍍作業,而發揮蒸鍍機台最大之產铲。 ν’ 2二_多種手段同時對遮罩進行清潔,^保遮罩的潔 >r及療鐘品質的穩定度。本發明在同時_超音波將微粒震動 1287586 後,以氣流將其吹除,並同時以吸塵器將其抽離,可在不 遮罩的環彡兄下’有效除去附著於遮罩上較大的微粒。更因 清潔遮罩對蒸鍍機台產能的影響降到最低,而不須在進行數批 產品的蒸鍍後才進行清潔,可依需要調整清潔的頻率, 蒸鍍品質的穩定。 ’、 以上所述係利用不同之實施例詳細說明本發明,其並非用 以限制本發明之實施範圍,並且熟習該項技藝者皆能明瞭, 當作些微的修改仍不脫離於本發明之精神及範圍。 【圖式簡單說明】 ^一A圖及第一B圖,係為遮罩蒸鍍過程之示意圖。 圖及第二謂,麵當遮罩表面_有微粒日,之示 弟二圖係為本發明之第—實施例示意圖。 一 義騎三圖獅實酬巾超音波清潔 室之 第五圖係為本發明之第二實施例示意圖。 【主要元件符號說明】 1玻璃基板 2遮罩 3微粒 11透明電極層 12隔離柱 21開孔 41蒸鍍室 42超音波清潔室 43傳輸裝置 421除塵裝置 4211超音波產生器 4212氣流吹出器 ® 4213吸塵器 Αι第一夾角 A2第二夾角 2a第一遮罩 2b第二遮罩 43a第一傳輸裝置 43b弟一傳輸裝置 ♦ R第一薄膜層 12 1287586 422閘門 G第二薄膜層 423真空抽氣系統 B第三薄膜層 424加摩氣體管路 425負壓管路 431真空腔室The ultrasonic cleaning chamber 42 is taken out and sent back to the vapor deposition chamber 41 to continue the vapor deposition process. ",, XF, and specifically stated here, the internal space of the vapor deposition machine can be further added with its chamber 'such as substrate unloading chamber, metal electrode distillation chamber, substrate pretreatment chamber', and sealing I287586 The technique of transferring the substrate between the chambers into the key knowledge is not in the 3 cases of the invention, so as not to damage the inside of the steaming machine. Referring to the fourth A map and the fourth β map, Yan Sunyan Chu 2: Guangbo cleaning Room 42 schematic and side view: its; :,: = "vacuum pumping (4) 23, - plus: gas two road two cry 42 ^ fif committed 1 / with an ultrasonic generator 4211, a gas flow = dust collector f3. The blower 4212 is located at the opposite side of the ultrasonic generation, and has a "first" angle cleaner 4213 located on the right side of the generator, and a second angle A2 between the two. The pipeline 424 is connected to each other, and the method of cleaning the mask is disclosed in the present embodiment by using a vacuum cleaner 4213^5 4213. The method for cleaning the mask can be implemented as follows. , the transmission device 43 sends the mask 2 to the super-chopper> Yuesen to 41, in order to maintain the mining machine The vacuum degree is closed, and the gate 422' is closed to isolate the ultrasonic cleaning chamber 41 from the other chambers of the distillation machine, and the cleaning operation is performed. When the cleaning is performed, the dust removing device 421 moves back and forth over the mask 2 to perform the month of the month. While the dust removing device 421 moves back and forth in the X direction above the mask 2, the shock wave generated by the ultrasonic wave generator 4211 vibrates the particles on the surface of the mask 2 and weakens both the surface of the particle 3 and the mask 2. The attachment structure between the particles makes the particles 3 more easily loosened and removed. At the same time, the gas is blown out by the nitrogen gas flow provided by the pressurized gas line 10 1287586 i /ϊ, and the gas is blown at the first angle A1. The surface of the mask 2 is raised and blown off by the particles 3 which have been loosened on the surface of the mask 2, and the particles ' ^ _ _ particles 3 ′ are reflected by the surface of the group 2 into the vacuum cleaner 4213 provided with the second central corner Α 2 The particles 3 are discharged into the negative pressure line 425 to complete the cleaning of the mask 2. After the cleaning is completed, the ultrasonic cleaning chamber 42 is taken by the vacuum pumping system 423, and the door 422 is opened after the real opening is required. , with the transmission device (4) mask 2 up to the 瘵 plating chamber 41, proceed to the next The vapor deposition operation of the present invention. In the embodiment, the steaming table and the method of the invention having the device, the method of using the plurality of transmission devices and the plurality of masks, the fifth embodiment of the present invention In the second embodiment, after the first transfer device 43a and the second transfer device ί2a are used in the laboratory 41 to complete the steaming operation, the _th transfer device ia $ / the second cover is taken out from the vapor deposition chamber 41 * , the person is sent to the ultrasonic cleaning room 42 to enter,: the second transmission device 2b is sent to the shielding chamber mi to clean the ultrasonic cleaning chamber 43 by the second transmission device, while the mask is % and the first Two masks 2b _ evaporation as 1 @ = points to play the capacity of the therapeutic plating machine. Looking at the above, the present invention does have the following advantages: ^The cleaning of the mask is reduced to the cleaning process, and the cleaning process is performed on the line, without removing the mask? ^Plating machine: outside the mouth, it is not necessary to destroy the vacuum inside the steaming machine table, 6 cleaning 'can even use the multiple cleaning and evaporation operations as described in the second embodiment, and play the evaporation The largest production line of the machine. ν' 2 2 _ a variety of means to clean the mask at the same time, ^ clean the mask > r and the stability of the quality of the clock. The invention simultaneously shakes the particles 1287586 at the same time, and then blows them off by airflow, and simultaneously pulls them away by the vacuum cleaner, and can effectively remove the larger attached to the mask under the unshielded ring 彡 brother. particle. Moreover, the effect of the cleaning mask on the productivity of the evaporation machine is minimized, and it is not necessary to perform cleaning after several batches of products are evaporated. The frequency of cleaning can be adjusted as needed, and the evaporation quality is stable. The above description of the present invention is not to be construed as limiting the scope of the present invention, and it is obvious to those skilled in the art that the modifications may be made without departing from the spirit of the invention. And scope. [Simple description of the diagram] ^A diagram and the first diagram B are schematic diagrams of the mask evaporation process. The figure and the second preface, when the surface of the mask _ has a particle day, the second diagram of the second embodiment is a schematic view of the first embodiment of the present invention. The fifth figure of the present invention is a schematic view of the second embodiment of the present invention. [Description of main components] 1 glass substrate 2 mask 3 particles 11 transparent electrode layer 12 isolation column 21 opening 41 evaporation chamber 42 ultrasonic cleaning chamber 43 transmission device 421 dust removal device 4211 ultrasonic generator 4212 airflow blower® 4213 Vacuum cleaner 第一ι first angle A2 second angle 2a first mask 2b second mask 43a first transmission device 43b-one transmission device ♦ R first film layer 12 1287586 422 gate G second film layer 423 vacuum pumping system B Third film layer 424 plus gas line 425 negative pressure line 431 vacuum chamber

1313

Claims (1)

12875細 r ‘ ….; I l i . j-jeuai^ 十、申請專利範圍·· L 一種除塵裝置,係適用於一蒸鍍機台中,包括·· 一超音波產生器; 一氣流吹出器;以及 一吸塵器; 其中該超音波產生器係產生震波將—物件表面之微粒震動並 使該微粒鬆動,同時該氣流吹出器吹出氣流將該微粒揚起,並以 該吸塵器將該微粒吸除。 2. 如申請專利範圍第1項所述之除塵裝置’其中該氣流吹出器位於 該超音波產生器之-側,該吸塵器位於該超音波產生器之另一側。 3. 如申請專利範圍第!項所述之除塵裝置,其中該超音波產生 器、該氣流吹出器以及該吸塵器可於該物件上方移動進行清潔。 4. 如申請專利範圍第1項所述之除塵裝置,其中該超音波產生器與 該,流吹出器之間具有—第—夾角,並在該超音波產生器與該吸 塵③之間具有―第二夾角;藉由前述之二夾角,使該氣流吹出器 所吹出之氣流流經該物件後,反射進入該吸塵器中。 5·如申請專利範圍第1項所述之除塵裝置,其中該氣流吹出器更可 與一加壓氣體管路連結。 6·如申請專利範圍第5項所述之除塵裝置,其中該加壓氣體管路可 提供該氣騎itj H —潔淨乾触氣。 申明專利範圍第5項所述之除塵裝置’其中該加壓氣體管路可 提供該氣流吹出器一氮氣。 " 14 1287586 8·如申明專利範圍第丨項所述之除塵裝置,其中該吸塵器更可與一 負壓官路連結,將該吸塵器所吸取之微粒,排入該負壓管路内。 9·如申明專利範圍第1項所述之除塵裝置,其中該蒸鑛機台係用於 有機發光二極體顯示器蒸鍍製程中,該物件係為一用於蒸鑛作業 用之遮罩。 10·—種蒸鍍機台,係包括: 一蒸錄室,肋遮罩對—基板進行級作f; 一超音波清潔室,其内部設有—超音波產生器、—氣流吹出 器以及一吸塵器;以及 -傳輪I置,用以在該蒸齡及該超音波清之間,傳遞 該遮罩; 當該倾裝置將該遮罩送入該超音波清潔室進行清潔時,該‘ 超音波產生器產生之震波將該遮單表面之微粒震動並使該微粒鬆 動’同時該氣流吹出II吹域流將該微粒揚起,並以該吸塵器將 該微粒吸除,而達到清潔該遮罩之目的。 η.如申請專利範圍第H)項所述之蒸鍍機台,其中該氣流吹出器位# 於該超音波產生器之-侧,該吸塵器位於該超音波產生器之另一 侧。 12.如申請專利範圍第1〇項所述之蒸錢機台,其中該超音波產生 器、該氣流吹出器以及該吸塵器可於該遮罩上方移動進行清潔。 13·如申請專利範圍第1〇項所述之蒸鍍機台,其中該超音波月產生器 15 1287586 與該氣流吹出器之間具有一第一夾角,並在該超音波產生器與該 吸塵器之間具有一第二夹角;藉由前述之二夾角,使該氣流吹出 器所吹出之氣流流經該遮罩後,反射進入該吸塵器中。 14·如申請專利範圍第1〇項所述之蒸鍍機台,其中該氣流吹出器更 可與一加壓氣體管路連結。 15·如申請專利範圍第13項所述之紐機台,其中該加壓氣體管路 可表:供該氣流吹出器一潔淨乾燥空氣。 16·如申1專利13項所述之蒸鍍機台,其巾該加壓氣體管路 可提供該氣流吹出器一氮氣。 17. 如申料利範圍㈣項所述之蒸鍍機卜其中該吸塵器更可與 -負壓管路連結,將該吸塵器所吸取之微粒,排入該負壓管路内。 18. 如申請專利範圍第10項所述之蒸鍍機台,其中該超音波清潔室 ^具有-閘π及-真空抽氣系統,可在不影響該蒸鍍機台内部腔 至之真空度下,對該遮罩進行清潔作業。 ㈣申請料翻第1G撕叙驗勤,該驗機台係適用於 有機發光二極體顯示器之蒸鍍成臈製程中。 種清潔遮罩之方法’係可在—蒸職台内對—蒸綱之遮罩 進行線上清潔其包括下列步驟: 利用-傳輸裝置將-遮罩由—蒸齡取出, 潔室; 送入一超音波清 之微粒並使該微 以-超音波產生ϋ產生震波震_遮罩表面 1287586 粒鬆動; , 以一氣流吹出器吹出氣流將該微粒揚起; 以一吸塵器將所揚起之微粒吸除; 完成清潔後,以該傳輸裝置將該遮罩送至該蒸鍍室内。 21. 如申請專利範圍第20項所述之清潔遮罩之方法,係每當以該遮 . 罩進行蒸鍍作業後,即以該清潔方法對該遮罩進行清潔。 22. 如申請專利範圍第20項所述之清潔遮罩之方法,其中在將遮罩 送入該超音波清潔室時之步驟,係在不破壞該蒸鍍機台内部之真 0 空度下進行。12875 细 r ' ....; I li . j-jeuai^ X. Patent application scope · L A dust removal device is suitable for use in an evaporation machine, including an ultrasonic generator; an air flow blower; a vacuum cleaner; wherein the ultrasonic generator generates a seismic wave to vibrate and scatter the particles on the surface of the object, and the airflow blower blows the airflow to lift the particle, and the particulate is sucked by the vacuum cleaner. 2. The dust removing device of claim 1, wherein the airflow blower is located on a side of the ultrasonic generator, the vacuum cleaner being located on the other side of the ultrasonic generator. 3. If you apply for a patent scope! The dust removing device of the item, wherein the ultrasonic generator, the air flow blower, and the vacuum cleaner are movable over the object for cleaning. 4. The dust removing device of claim 1, wherein the ultrasonic generator and the flow blower have a first angle and a "between" the ultrasonic generator and the vacuum cleaner 3 The second angle; by the aforementioned two angles, the airflow blown by the airflow blower flows through the object and is reflected into the vacuum cleaner. 5. The dust removal device of claim 1, wherein the air flow blower is further connectable to a pressurized gas line. 6. The dust removal device of claim 5, wherein the pressurized gas line provides the gas rider. The dust removing device of claim 5, wherein the pressurized gas line provides the gas streamer a nitrogen gas. The dust removing device according to the invention of claim 2, wherein the vacuum cleaner is further connected to a negative pressure official road, and the particulates sucked by the vacuum cleaner are discharged into the negative pressure pipeline. 9. The dust removing device of claim 1, wherein the steaming machine station is used in an organic light emitting diode display evaporation process, and the object is a mask for steaming operation. 10·—a type of evaporation machine, comprising: a steaming chamber, the rib mask is used to perform the leveling of the substrate; an ultrasonic cleaning room, which is provided with an ultrasonic generator, an airflow blower and a a vacuum cleaner; and a transmission wheel I for transmitting the mask between the steaming age and the ultrasonic cleaning; when the tilting device sends the mask into the ultrasonic cleaning room for cleaning, the 'super The seismic wave generated by the sound wave generator vibrates the particles on the surface of the mask and loosens the particles. At the same time, the air flow blows out the flow field of the blown field to lift the particles, and the particles are sucked up by the vacuum cleaner to clean the mask. The purpose. η. The vapor deposition station of claim H, wherein the airflow blower is located on the side of the ultrasonic generator, the vacuum cleaner being located on the other side of the ultrasonic generator. 12. The steaming machine of claim 1, wherein the ultrasonic generator, the airflow blower, and the vacuum cleaner are movable over the mask for cleaning. 13. The vapor deposition machine of claim 1, wherein the ultrasonic moon generator 15 1287586 has a first angle with the airflow blower, and the ultrasonic generator and the vacuum cleaner There is a second angle between the two; the airflow blown by the airflow blower flows through the mask and is reflected into the vacuum cleaner by the aforementioned two angles. 14. The vapor deposition station of claim 1, wherein the air flow blower is further connectable to a pressurized gas line. 15. The new machine set according to claim 13, wherein the pressurized gas line can be used to provide a clean and dry air to the air flow blower. The vapor deposition machine of claim 13, wherein the pressurized gas line provides a nitrogen gas to the gas flow blower. 17. The vapor deposition machine according to item (4) of claim 2, wherein the vacuum cleaner is further connected to the negative pressure pipeline, and the particulates sucked by the vacuum cleaner are discharged into the negative pressure pipeline. 18. The vapor deposition machine according to claim 10, wherein the ultrasonic cleaning chamber has a -gate π and a vacuum pumping system, which can affect the vacuum of the interior of the vapor deposition machine Next, clean the mask. (4) Applying for the first 1G tear-off inspection, the inspection machine is suitable for the evaporation process of the organic light-emitting diode display. The method of cleaning the mask can be performed on the line in the steaming station. The cleaning step comprises the following steps: using the -transporting device to remove the mask from the steaming age, cleaning the room; feeding one Ultrasonic clear particles and the micro-sound waves are generated to generate shock waves _ hood surface 1287586 loose;; an air blower blows out the airflow to lift the particles; a vacuum cleaner sucks the raised particles After the cleaning is completed, the mask is sent to the evaporation chamber by the transport device. 21. The method of cleaning a mask according to claim 20, wherein the mask is cleaned by the cleaning method after the vapor deposition operation is performed by the mask. 22. The method of cleaning a mask according to claim 20, wherein the step of feeding the mask into the ultrasonic cleaning chamber is performed without destroying the true zero of the interior of the vapor deposition machine. get on. 1717
TW93129480A 2004-09-29 2004-09-29 A cleaning apparatus and an evaporation machine using the same and a cleaning method thereof TWI287586B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93129480A TWI287586B (en) 2004-09-29 2004-09-29 A cleaning apparatus and an evaporation machine using the same and a cleaning method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93129480A TWI287586B (en) 2004-09-29 2004-09-29 A cleaning apparatus and an evaporation machine using the same and a cleaning method thereof

Publications (2)

Publication Number Publication Date
TW200610833A TW200610833A (en) 2006-04-01
TWI287586B true TWI287586B (en) 2007-10-01

Family

ID=39201699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93129480A TWI287586B (en) 2004-09-29 2004-09-29 A cleaning apparatus and an evaporation machine using the same and a cleaning method thereof

Country Status (1)

Country Link
TW (1) TWI287586B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426964B (en) * 2008-09-17 2014-02-21 Hitachi High Tech Corp Organic EL display cleaning device, organic EL display manufacturing device, organic EL display and organic EL mask cleaning method
TWI484053B (en) * 2013-07-08 2015-05-11 Everdisplay Optronics Shanghai Ltd Apparatus for removing organic compounds or stains from mask

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426964B (en) * 2008-09-17 2014-02-21 Hitachi High Tech Corp Organic EL display cleaning device, organic EL display manufacturing device, organic EL display and organic EL mask cleaning method
TWI484053B (en) * 2013-07-08 2015-05-11 Everdisplay Optronics Shanghai Ltd Apparatus for removing organic compounds or stains from mask

Also Published As

Publication number Publication date
TW200610833A (en) 2006-04-01

Similar Documents

Publication Publication Date Title
US9636718B2 (en) Mask cleaning apparatus and mask cleaning method
KR920003878B1 (en) Surface treatment method of semiconductor substrate
TWI426964B (en) Organic EL display cleaning device, organic EL display manufacturing device, organic EL display and organic EL mask cleaning method
JP2011042856A (en) Film deposition device and film deposition method
JPH04271808A (en) Method and machine for removing dust
KR20170120225A (en) Laser etching apparatus and method of laser etching using the same
CN107020285A (en) A kind of ultrasonic cleaning equipment and base plate processing system
JP2003080144A (en) Coating film forming apparatus
TWI290737B (en) Apparatus and method for treating a panel
TWI287586B (en) A cleaning apparatus and an evaporation machine using the same and a cleaning method thereof
JP2003321117A (en) Equipment and robot hand for retaining flat panel by pressure zone between flat panel and retaining equipment
TW200831204A (en) Ultrasonic cleaning apparatus by using resonance
KR20110128998A (en) The cleanning system for an organic electroluminescence element
TWI522589B (en) Drying apparatus and drying method
TW201321543A (en) Cleaning module and cleaning method for substrates and/or substrate carriers
JP3117650B2 (en) Dust removal device for transferred products
JP2012197468A (en) Vapor deposition device and vapor deposition method
JP4932897B2 (en) Nozzle, dry cleaner and dry cleaner system
JP2010153088A (en) Mask cleaning device for organic el, manufacturing device of organic el display, organic el display, and mask cleaning method for organic el
TW471008B (en) Substrate transport device
CN1600454A (en) Dust-extraction unit, desk of coating device by vaporization and method for cleaning shade
KR100931475B1 (en) Particle removal device
JP6036742B2 (en) Dust collecting jig, substrate processing apparatus, and particle collecting method.
TW402527B (en) Carrying and dust-removal device for substrates
JPH0766165A (en) Cleaning equipment