JP2012197468A - Vapor deposition device and vapor deposition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vapor deposition device and a vapor deposition method allowing highly precise vapor deposition and a continuous operation over a long time.SOLUTION: The vapor deposition device is constituted to form a vapor deposition film of a film formation pattern defined by a vapor deposition mask 2 on a substrate 4 by depositing on the substrate 4, a film forming material evaporated from an evaporation source 1 via a mask opening of the vapor deposition mask 2 in a film formation chamber 30, and the vapor deposition device includes a mask holder 6 having a dispersion limiting part having a limiting opening 5 for limiting a dispersion direction of an evaporated particle evaporated from the evaporation source 1, and attached with the vapor deposition mask 2, and includes a load lock chamber 32 for making the mask holder 6 attached with the vapor deposition mask 2 communicate with the film formation chamber 30, a standby chamber 33 for making the mask holder 6 communicate with the load lock chamber 32, and an exchange chamber 31 having a take-out chamber 34 for taking out the mask holder 6 to the outside of the device.

Description

  The present invention relates to a vapor deposition apparatus and a vapor deposition method for forming a vapor deposition film having a film formation pattern using a vapor deposition mask on a substrate.

  In recent years, organic EL display devices using organic electroluminescence elements have attracted attention as display devices that replace CRTs and LCDs.

  This organic EL display device has a structure in which an electrode layer and a plurality of organic light emitting layers are laminated on a substrate, and further a sealing layer is formed on the substrate. Corners and high contrast can be realized.

  Such an organic EL device is generally manufactured by a vacuum vapor deposition method, in which a substrate and a vapor deposition mask are aligned and closely adhered in a vacuum chamber, and a vapor deposition film having a desired film formation pattern is formed on the substrate by the vapor deposition mask. Is formed.

  Further, in the manufacture of such an organic EL device, the vapor deposition mask for obtaining a desired film formation pattern is enlarged with an increase in the size of the substrate. For this increase in size, tension was applied to the vapor deposition mask. Since it must be manufactured by welding and fixing to the mask frame in the state, it is not easy to manufacture a large evaporation mask, and if this tension is not sufficient, the mask will be distorted and the center of the mask will be distorted. The degree of adhesion of the substrate is reduced, and the mask frame becomes large in order to take these into consideration, and the increase in thickness and weight becomes remarkable.

  As described above, it is required to increase the size of the vapor deposition mask as the substrate size increases. However, it is difficult to increase the size of the high-definition mask. Has produced.

  For example, as shown in Japanese Translation of PCT International Publication No. 2010-511784, etc., the substrate and the vapor deposition mask are separated from each other, and the organic light emitting layer is formed with high accuracy by an opening that generates vapor particles having directivity from the evaporation source. However, the evaporation source and the opening for generating directivity have an integrated structure, and the integrated structure is heated to a high temperature to generate evaporated particles from the opening. Therefore, radiation heat from the evaporation source is received by the vapor deposition mask, and it is impossible to prevent a decrease in position accuracy of the film formation pattern due to thermal expansion of the vapor deposition mask.

  Furthermore, since the distance between the evaporation source and the vapor deposition mask is close, there is a problem in that a large amount of material adheres to the vapor deposition mask during film formation and must be frequently replaced.

Special table 2010-511784 gazette

  The present invention solves these various problems, and does not increase the size of the vapor deposition mask to the same size as the substrate is enlarged. Evaporation film with a deposition pattern can be deposited using a deposition mask, and the structure can be simply and efficiently deposited by moving it in a separated state, and the limiting opening can be used as an evaporation source even in the separated state. By providing it between the vapor deposition mask, it is possible to limit the scattering direction of the evaporated particles and prevent the evaporated particles from passing through the evaporation port at the adjacent or remote positions so as not to overlap the film formation patterns. The mask holder has an evaporation mask attached to a mask holder with a scattering restriction provided with an opening, and this mask holder not only serves as a scattering restriction but also suppresses the incidence of radiant heat from the evaporation source. Highly accurate vapor deposition is possible despite the structure in which the substrate and vapor deposition mask are moved relative to each other in a separated state, and the mask holder provided with the vapor deposition mask can be replaced by arranging the exchange chambers in parallel, enabling long-term continuous operation. It is an object of the present invention to provide a possible vapor deposition apparatus and vapor deposition method.

  The gist of the present invention will be described with reference to the accompanying drawings.

  In the film forming chamber 30, the film forming material evaporated from the evaporation source 1 is deposited on the substrate 4 through the mask opening of the vapor deposition mask 2, and a vapor deposition film having a film formation pattern defined by the vapor deposition mask 2 is formed. An evaporation apparatus configured to be formed on a substrate 4, wherein the evaporation source 1 is evaporated between the evaporation source 1 and the substrate 4 disposed opposite to the evaporation source 1. A mask holder 6 having a scattering restriction portion provided with a restriction opening 5 for restricting the scattering direction of the evaporated particles of the film material is disposed, and the vapor deposition mask disposed in a separated state from the substrate 4 in the mask holder 6 2, and the substrate 4 is configured to be relatively movable with respect to the mask holder 6 and the evaporation source 1 to which the deposition mask 2 is attached while being kept apart from the deposition mask. The mask 2 is attached. A load lock chamber 32 through which the scroll holder 6 can come and go with the film forming chamber 30, a standby chamber 33 through which the mask holder 6 provided with the vapor deposition mask 2 can come and go with the load lock chamber 32, and the vapor deposition mask 2 outside the apparatus. The deposition apparatus includes an exchange chamber 31 having an extraction chamber 34 from which the attached mask holder 6 can be taken out.

  The vapor deposition apparatus according to claim 2, wherein the mask holder 6 includes a temperature control unit having a temperature control unit 9 </ b> C outside the film forming chamber 30.

  3. The temperature control unit and the temperature control unit 9C are configured to be detachable so that the mask holder 6 can freely move between the film forming chamber 30 and the exchange chamber 31. This relates to the vapor deposition apparatus.

  In the film forming chamber 30, the film forming material evaporated from the evaporation source 1 is deposited on the substrate 4 through the mask opening 3 of the vapor deposition mask 2, and the film formation pattern determined by the vapor deposition mask 2 is obtained. A vapor deposition apparatus configured such that a vapor deposition film is formed on a substrate 4, wherein the evaporation source 1 evaporates between the evaporation source 1 and the substrate 4 disposed in a state of facing the evaporation source 1. A mask holder 6 having a scattering restricting portion provided with a restricting opening 5 for restricting the scattering direction of the evaporated particles of the film forming material is disposed, and the mask holder 6 is disposed in a separated state from the substrate 4. The deposition mask 2 is attached, and the substrate 4 is configured to be relatively movable with respect to the mask holder 6 and the evaporation source 1 to which the deposition mask is attached while being kept apart from the deposition mask 2. The vapor deposition mask 2 is attached. Further, the load lock chamber 32 through which the mask holder 6 can communicate with the film forming chamber 30, the standby chamber 33 through which the mask holder 6 provided with the vapor deposition mask 2 can communicate with the load lock chamber 32, the vapor deposition mask 2 and the The present invention relates to a vapor deposition apparatus including an exchange chamber 31 having a cleaning chamber 37 for cleaning the mask holder 6.

  5. The vapor deposition apparatus according to claim 4, wherein the cleaning chamber 37 includes a liquid tank 38 in which a cleaning liquid is stored.

  6. The vapor deposition apparatus according to claim 5, wherein the exchange chamber 31 includes a rinse chamber 40 having a liquid tank 41 in which a rinse liquid is stored.

  7. The vapor deposition apparatus according to claim 5, wherein cleaning or rinsing of at least one of the vapor deposition mask 2 or the mask holder 6 is performed using ultrasonic waves in combination. 7. It is.

  The liquid amount or the temperature of at least one of the cleaning liquid and the rinsing liquid is controlled by a solution control mechanism provided outside the cleaning room or the rinsing room. It concerns on the vapor deposition apparatus of description.

  9. The vapor deposition apparatus according to claim 4, further comprising a drying mechanism that dries at least one of the vapor deposition mask 2 and the mask holder 6 after cleaning. 10. .

  10. The vapor deposition apparatus according to claim 4, wherein the mask holder 6 includes a temperature control unit having a temperature control unit 9 </ b> C outside the film forming chamber 30. Is.

  11. The mask holder 6 is configured such that a temperature control unit and a temperature control unit 9C are detachable so that the film forming chamber 30 and the exchange chamber 31 can be moved freely. This relates to the vapor deposition apparatus.

  In the film forming chamber 30, the film forming material evaporated from the evaporation source 1 is deposited on the substrate 4 through the mask opening 3 of the vapor deposition mask 2, and the film formation pattern determined by the vapor deposition mask 2 is obtained. A vapor deposition apparatus configured such that a vapor deposition film is formed on a substrate 4, wherein the evaporation source 1 evaporates between the evaporation source 1 and the substrate 4 disposed in a state of facing the evaporation source 1. A mask holder 6 having a scattering restricting portion provided with a restricting opening 5 for restricting the scattering direction of the evaporated particles of the film forming material is disposed, and the mask holder 6 is disposed in a separated state from the substrate 4. The vapor deposition mask 2 is provided, and the substrate 4 is configured to be relatively movable with respect to the mask holder 6 and the evaporation source 1 provided with the vapor deposition mask 2 while maintaining a separated state from the vapor deposition mask 2. The vapor deposition mask 2 is attached. A load lock chamber 32 through which the mask holder 6 can go to and from the film formation chamber 30; a standby chamber 33 through which the mask holder 6 with the vapor deposition mask 2 attached to the load lock chamber 32; A replacement chamber 31 having a cleaning chamber 37 for cleaning the attached mask holder 6 and a material peeling / recovery chamber 43 for peeling and collecting the material attached to at least one of the deposition mask 2 or the mask holder 6; The present invention relates to a characteristic vapor deposition apparatus.

  13. The vapor deposition apparatus according to claim 12, wherein the material peeling mechanism of the material peeling recovery chamber 43 uses dry ice blasting.

  14. The vapor deposition apparatus according to claim 13, wherein the material peeling / recovery chamber 43 includes a clean air introduction mechanism and a clean air and carbon dioxide exhaust mechanism.

  The mask suction plate 47 is attached to the substrate 4 side of the vapor deposition mask 2 when the material adhering to the vapor deposition mask 2 is peeled off using the dry ice blasting. This relates to the vapor deposition apparatus described in any one of the items.

  16. The vapor deposition apparatus according to claim 15, wherein the mask suction plate 47 is one of a magnet plate, an electromagnet plate, and an electrostatic plate.

  14. The material peeling / recovery chamber 43 is provided with a suction mechanism for sucking the material peeled by the material peeling mechanism and a discharge mechanism for collecting the sucked material and discharging it to the outside of the exchange chamber. It concerns on the vapor deposition apparatus of any one of -16.

  18. The vapor deposition apparatus according to claim 12, wherein the mask holder 6 includes a temperature control unit having a temperature control unit 9 </ b> C outside the film forming chamber 30. Is.

  19. The vapor deposition according to claim 18, wherein the mask holder 6 is configured such that the temperature control unit and the temperature control unit 9C are detachable so as to freely move between the film forming chamber and the exchange chamber. It concerns the device.

  20. The vapor deposition apparatus according to claim 1, wherein the exchange chambers 31 are arranged side by side in a lateral direction perpendicular to the relative movement direction of the substrate 4 in the film formation chamber 30. It is related to.

  The mask holder (6) is characterized in that the restriction opening (5) is formed such that the opening area on the evaporation source (1) side is smaller than the opening area on the substrate (4) side. It concerns on the vapor deposition apparatus of any one of these.

  The deposition apparatus according to claim 1, wherein the film forming material is an organic material.

  23. A vapor deposition method comprising: forming a vapor deposition film having a film formation pattern defined by the vapor deposition mask 2 on the substrate 4 using the vapor deposition apparatus according to any one of claims 1 to 22. It is related to.

  Since the present invention is configured as described above, even if the deposition mask is not enlarged as the substrate is enlarged, the deposition mask can be widely used by relatively moving the substrate in a separated state even if the deposition mask is smaller than the substrate. Vapor deposition film can be deposited, and the structure can be simply and efficiently deposited by moving relative to each other in the separated state, and the limiting opening can be formed between the evaporation source and the vapor deposition mask even in the separated state. By limiting the direction in which the evaporated particles are scattered, it is possible to prevent the overlapping of the film formation patterns without passing the evaporated particles from the adjacent or distant evaporation ports. A deposition lock is provided in contact with a mask holder having a scattering restriction provided, and a load lock that allows the mask holder to which the deposition mask is attached to and from the deposition chamber. A replacement chamber having a chamber, a standby chamber in which the mask holder provided with the vapor deposition mask can come and go with the load lock chamber, and a take-out chamber capable of taking out the mask holder 6 provided with the vapor deposition mask 2 outside the apparatus. This makes it easy to load and unload the vapor deposition mask by allowing the mask holder with the vapor deposition mask to move between the load lock chamber, the standby chamber, and the removal chamber. The stop time is shortened, the operating rate of the vapor deposition apparatus is improved, and the vapor deposition apparatus and the vapor deposition method are capable of performing high-accuracy vapor deposition while being configured to relatively move the substrate and the vapor deposition mask in a separated state.

  Especially in the manufacture of organic EL devices, it can respond to the increase in size of the substrate, the organic light-emitting layer can be deposited with high accuracy, and the substrate, vapor deposition mask, and vapor deposition film can be prevented from being damaged by the mask contact, and the vapor deposition mask smaller than the substrate is highly accurate. It becomes the vapor deposition apparatus and vapor deposition method for organic EL device manufacture which can implement | achieve vapor deposition of this.

  Further, in the invention according to claim 2, the mask holder includes a temperature control unit having a temperature control unit outside the film forming chamber, so that the temperature of the mask holder can be kept constant, and the mask holder The thermal expansion of the attached deposition mask can be suppressed, and the film formation pattern can be deposited with high accuracy.

  Further, in the invention according to claim 3, for example, the mask holder has a temperature control mechanism by detachably configuring a medium transport path between the temperature control unit of the mask holder and the temperature control unit outside the film forming chamber. Even if it has, the film formation chamber and the load lock chamber can be freely moved.

  In the invention described in claim 4, the load chamber and the standby chamber are provided in the exchange chamber, and the cleaning chamber is provided in place of the take-out chamber, so that the mask holder provided with the vapor deposition mask can be removed from the exchange chamber. It can be cleaned in the exchange chamber.

  In the invention according to claim 5, the deposition mask and the mask holder can be cleaned in every detail by immersing and cleaning the deposition mask and the mask holder in the liquid tank in which the cleaning liquid is stored.

  In the invention according to claim 6, the cleaning liquid remaining in the vapor deposition mask and the mask holder can be removed by providing the rinse chamber in parallel with the cleaning chamber.

  In the invention of claim 7, the cleaning effect is enhanced by immersing the vapor deposition mask and the mask holder in the liquid tank in which the solution is stored and using ultrasonic waves together.

  In the invention according to claim 8, at least one of the cleaning liquid and the rinsing liquid is provided with a solution control mechanism outside the cleaning chamber, so that the liquid amount and temperature of the solution can be adjusted from the outside of the cleaning chamber or the rinsing chamber. Can be practical.

  Moreover, in invention of Claim 9, the time until it recycles a vapor deposition mask and a mask holder can be shortened by providing a drying mechanism.

  Moreover, in invention of Claim 10, 11, it is further excellent in practicality by setting it as the structure provided with the washing | cleaning chamber in the exchange chamber in the invention of Claim 2, 3.

  Further, in the invention described in claim 12, the material attached to the vapor deposition mask and the mask holder can be reused by providing the load lock chamber in the exchange chamber, and the material peeling / recovery chamber in the cleaning chamber. , Material use efficiency is improved.

  In the invention described in claim 13, by separating the film forming material adhering to the vapor deposition mask or the mask holder with dry ice blasting, decomposition of the material is suppressed, and the reuse rate of the film forming material is improved.

  Further, in the invention described in claim 14, the material peeling / recovery chamber is provided with a clean air introduction mechanism and a clean air and carbon dioxide exhaust mechanism so that the film deposition material attached to the vapor deposition mask or the mask holder is dry ice. When peeling by blasting, deterioration of the film forming material can be prevented, and further, the peeling effect can be maximized by managing the inside of the material peeling recovery chamber at an appropriate pressure.

  Further, in the invention described in claim 15, the vapor deposition mask is formed of a thin foil, and if the film-forming material attached by the dry ice blast according to claim 13 is peeled off, the vapor deposition mask may be damaged. By applying a mask suction plate to the back of the vapor deposition mask during dry ice blasting, damage to the vapor deposition mask is prevented.

  Further, in the invention described in claim 16, the adhesion between the vapor deposition mask and the back plate is improved by forming the mask suction plate applied to the back surface of the vapor deposition mask according to claim 15 with a magnet plate, an electromagnet plate or an electrostatic plate. In addition, damage to the vapor deposition mask can be further prevented.

  In the invention according to claim 17, the material peeling / recovery chamber is provided with a material suction mechanism so that the peeled material can be efficiently collected, and the sucked material is collected and the material peeling / recovery is collected. By providing a mechanism for discharging to the outside, the material can be taken out without opening the material peeling and collecting chamber to the atmosphere, and the operating rate of the peeling and collecting process is improved.

  Further, in the inventions according to claims 18 and 19, the invention according to claims 10 and 11 is further improved in practicality by adopting a configuration in which the material separation / recovery chamber is provided in the exchange chamber.

  Further, in the invention according to claim 20, the replacement chamber is arranged in parallel in the lateral direction perpendicular to the relative movement direction of the substrate with respect to the film formation chamber, so that the vapor deposition mask and the mask holder can be replaced efficiently and saved. Can be done in space.

  In the invention of claim 21, since the shape of the limiting opening of the mask holder is smaller than the opening area on the substrate side, the opening area on the evaporation source side is smaller than that of the film forming material evaporated from the evaporation source. More evaporation particles can be captured on the evaporation source side of the restriction opening, so that the film deposition material adhering to the side of the restriction opening can be reduced, and the film deposition material adhered after the mask holder is replaced It becomes easy to peel and collect.

  Further, in the invention described in claim 22, it becomes an organic material evaporation apparatus, and is further excellent in practicality.

  Further, in the invention described in claim 23, it is an excellent vapor deposition method that exhibits the above-mentioned actions and effects.

1 is a schematic explanatory diagram of a vapor deposition mechanism of Example 1. FIG. 2 is an explanatory top view of a film forming chamber and an exchange chamber of Example 1. FIG. It is a description side view of the exchange chamber of Example 2. 6 is an explanatory side view of an exchange chamber according to Embodiment 3. FIG. It is an explanatory side view of another example of composition of an exchange room of Example 3. It is an explanatory side view of the exchange room of Example 4. It is explanatory drawing of the moving mechanism of the dry ice injection part of Example 4. It is explanatory drawing of the mask adsorption | suction board of Example 4. FIG.

  An embodiment of the present invention which is considered to be suitable will be briefly described with reference to the drawings showing the operation of the present invention.

  In FIG. 1, the film-forming material evaporated from the evaporation source 1 passes through the restriction opening 5 of the mask holder 6 configured as a scattering restriction part, and onto the substrate 4 through the mask opening 3 of the vapor deposition mask 2. After deposition, a vapor deposition film having a film formation pattern defined by the vapor deposition mask 2 is formed on the substrate 4.

  At this time, the substrate 4 and the vapor deposition mask 2 are arranged in a separated state, and the substrate 4 is configured to be movable relative to the vapor deposition mask 2 and the evaporation source 1 while maintaining the separated state. Thus, by relatively moving the substrate 4, a deposition film having a deposition pattern defined by the deposition mask 2 is formed on the substrate 4 in a wider range than the deposition mask 2 itself.

  Further, a mask holder 6 having a scattering restriction portion provided with the restriction opening 5 for restricting the scattering direction of the evaporated particles of the film forming material evaporated from the evaporation source 1 between the vapor deposition mask 2 and the evaporation source 1. To prevent the deposition patterns from overlapping even if the vapor deposition mask 2 and the substrate 4 are in a separated state without allowing the vaporized particles from the vaporization openings 8 adjacent or separated by the restriction opening 5 to pass therethrough. is doing.

  In addition, for example, the vapor deposition mask 2 is further joined and attached to the mask holder 6 that constitutes the scattering restricting portion, and temperature control for holding the temperature of the vapor deposition mask 2 in at least one of the mask holder 6 or the vapor deposition mask 2. In the case where the mechanism 9 is provided, the incidence of heat from the evaporation source 1 is suppressed, the temperature rise of the mask holder 6 and the vapor deposition mask 2 is suppressed, and the vapor deposition mask 2 is separated from the substrate 4. By joining to the mask holder 6, the heat of the vapor deposition mask 2 is conducted to the mask holder 6 and the temperature holding function for holding the vapor deposition mask 2 at a constant temperature is improved.

  Therefore, the mask holder 6 having the scattering restriction portion also functions as a temperature holding function at the same time as the function of restricting the scattering direction of the evaporated particles, can suppress the temperature rise of the vapor deposition mask 2, and keep the vapor deposition mask 2 at a constant temperature. This also prevents distortion of the vapor deposition mask 2 due to heat.

  Accordingly, the substrate 4 is moved relative to the vapor deposition mask 2, the mask holder 6 provided with the vapor deposition mask 2 and the evaporation source 1 while keeping the separated state from the vapor deposition mask 2 in this relative movement direction. The vapor deposition film of the above-mentioned film formation pattern by the vapor deposition mask 2 is continued to form a vapor deposition film in a wide range even with the vapor deposition mask 2 smaller than the substrate 4, and the film formation pattern by incidence from the evaporation port 8 at the adjacent or remote position. Overlapping and distortion due to heat are sufficiently suppressed, and a vapor deposition apparatus capable of performing highly accurate vapor deposition is obtained.

  Further, the mask holder 6 provided with the vapor deposition mask 2 is provided with an exchange chamber having a load lock chamber that can come and go with the film formation chamber, so that the mask holder 6 can be exchanged without exposing the film formation chamber to the atmosphere. The insertion and removal of the mask 2 (mask holder 6) can be facilitated, the stop time of the film forming process accompanying the replacement of the mask holder 6 is shortened, and the operating rate of the vapor deposition apparatus is improved. For example, when a cleaning chamber is provided in the exchange chamber, the mask holder 6 can be cleaned without carrying the mask holder 6 out of the apparatus, and the mask holder 6 can be replaced and cleaned more efficiently. . Further, for example, when a material peeling / recovery chamber is provided in the exchange chamber, the material peeled off from the vapor deposition mask 2 and the mask holder 6 can be recovered and reused at the time of cleaning the material, and the material use efficiency is improved.

  A first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic explanatory diagram of a vapor deposition mechanism.

  In this embodiment, a film forming material (for example, an organic material for manufacturing an organic EL device) evaporated from the evaporation source 1 is deposited on the substrate 4 through the mask opening 3 of the vapor deposition mask 2, and this vapor deposition is performed. In a vapor deposition apparatus configured such that a vapor deposition film having a film formation pattern defined by a mask 2 is formed on a substrate 4, the substrate 4 and the vapor deposition mask 2 are disposed in a separated state, and the substrate 4 is disposed on the vapor deposition mask. 2. With respect to the mask holder 6 and the evaporation source 1 which are configured as a scattering restriction portion provided with a restriction opening, the evaporation source 1 is configured to be relatively movable while maintaining a separated state from the vapor deposition mask 2, and vapor deposition is performed by this relative movement. A vapor deposition film having a film formation pattern defined by the vapor deposition mask 2 is formed on the substrate 4 in a wider range than the mask 2.

  Further, a restriction opening 5 is provided between the vapor deposition mask 2 and the evaporation source 1 to limit the scattering direction of the evaporated particles of the film forming material evaporated from the evaporation ports 8 of the evaporation sources 1 arranged in parallel. By providing a mask holder 6 that constitutes a scattering restriction portion and restricting evaporation particles having a large scattering angle θ, the evaporation particles from the evaporation port portions 8 at adjacent or remote positions are prevented from passing therethrough.

  That is, as a configuration in which vapor deposition is performed with evaporated particles from the plurality of evaporation ports 8, vapor deposition can be performed on the substrate 4 having a large area, and from the evaporation ports 8 adjacent or separated by the restriction opening 5. Even if the vapor deposition mask 2 and the substrate 4 are separated from each other by preventing incidence, overlapping of the film formation patterns is prevented.

  In addition, each of the evaporation ports 8 arranged side by side in the horizontal direction is provided at the tip of the introduction portion 28 protruding from the horizontally long diffusion portion 27 of the evaporation source 1, and around the introduction portion 28 or between the introduction portions 28, A heat shut-off unit 19 that shuts off the heat of the evaporation source 1 is provided. Reference numeral 26 denotes an evaporated particle generating part (crucible).

  The heat blocking unit 19 may be anything that shields heat, but this embodiment employs a cooling plate, has a medium path for supplying a cooling medium, and the cooling medium takes away heat from the evaporation source 1. However, the heat shielding effect is enhanced by providing a heat exchange section that exchanges this heat through the medium.

  FIG. 2 is a top view of the film forming chamber 30 and the exchange chamber 31.

  The exchange chamber 31 is juxtaposed with the film formation chamber 30 provided with the above-described vapor deposition mechanism in the lateral direction orthogonal to the relative movement direction of the substrate 4, and the vapor deposition mask 2 and the mask to which the material after the vapor deposition adheres in the film formation chamber 30. By configuring the holder 6 to be exchangeable with a new or cleaned deposition mask 2 and the mask holder 6, a highly productive deposition apparatus capable of continuous operation for a long time is obtained.

  Specifically, the vapor deposition mask 2 and the mask holder 6 are used for film formation in the film formation chamber 30, and the material adheres to the vapor deposition mask 2 (and the mask holder 6) one after another and is deposited. In order not to affect the film pattern, and to prevent generation of dust due to peeling of the deposited film, it must be periodically replaced.

  In the second embodiment, as shown in FIG. 3, the replacement chamber 31 of the first embodiment includes a load lock chamber 32, a standby chamber 33, and a take-out chamber 34.

  The load lock chamber 32 is connected to the film formation chamber 30 (in the depth direction in FIG. 3), the standby chamber 33, and the take-out chamber 34 through gate valves. The standby chamber 33 is provided with a gate valve for carrying the vapor deposition mask 2 and the mask holder 6 from the outside, and the take-out chamber 34 is provided with a gate valve for carrying the vapor deposition mask 2 and the mask holder 6 outside the room. It is done.

  First, the vapor deposition mask 2 and the mask holder 6 to be exchanged after vapor deposition are moved to the load lock chamber 32 in the exchange chamber 31. At this time, when the mask holder 6 has a temperature control unit, the mask holder 6 has a temperature control unit (provided outside the room) so that the mask holder 6 can travel between the film forming chamber 30 and the load lock chamber 32. A medium transport path 35 between the external temperature controller 9C and the external temperature controller 9C is configured to be detachable. That is, when the mask holder 6 is moved from the film forming chamber 30 to the load lock chamber 32, the medium transport path 35 (the connection portion 36 of the mask holder 6 with the temperature control unit) is connected from the temperature control unit of the mask holder 6. It is configured to be removable. Note that a medium path or the like through which a refrigerant such as water flows can be used as the temperature control unit, and a heat exchange unit or the like that cools the refrigerant can be used as the temperature control unit 9C.

  The deposition material deposition vapor deposition mask 2 and the mask holder 6 that have moved to the load lock chamber 32 move from the load lock chamber 32 to the take-out chamber 34 and out of the exchange chamber 31 through the take-out port (unload gate valve) of the take-out chamber 34. Take it out. The new deposition mask 2 and mask holder 6 used for film formation, which are carried into the standby chamber 33 from the charging port (loading gate valve) of the standby chamber 33, are moved to the load lock chamber 32 and formed from the load lock chamber 32. It moves to the chamber 30 and is used in the film forming process.

  The deposition material deposition vapor deposition mask 2 and the mask holder 6 carried out of the exchange chamber 31 are cleaned in a separate cleaning chamber provided outside the deposition chamber to remove dirt such as deposited film deposition material and particles and contaminants. It is removed, carried into the standby chamber 33 again, and moved to the film forming chamber 30 via the load lock chamber 32.

  In the third embodiment, as shown in FIG. 4, the exchange chamber 31 of the first and second embodiments includes a load lock chamber 32, a standby chamber 33, and a cleaning chamber 37.

  As in the second embodiment, the vapor deposition mask 2 and the mask holder 6 to be exchanged after vapor deposition are moved to the load lock chamber 32 in the exchange chamber 31 and further moved to the cleaning chamber 37 provided in parallel with the load lock chamber 32 for cleaning. Is done. Further, the cleaned deposition mask 2 and mask holder 6 are moved to the standby chamber 33 via the load lock chamber 32 to prepare for the next film formation.

  The cleaning chamber 37 includes a liquid tank 38 in which the cleaning liquid is stored, and an external cleaning liquid control mechanism 39 that is provided outside the cleaning chamber and controls the amount and temperature of the cleaning liquid. Immerse in a bath and clean. At this time, the use of ultrasonic waves improves the cleaning effect.

  Further, in order to vaporize the residual cleaning liquid adhering to the vapor deposition mask 2 and the mask holder 6 after cleaning, it is more practical if the cleaning chamber 37 is provided with a drying mechanism.

  Further, when the rinsing process is performed after the deposition material deposition vapor deposition mask 2 and the mask holder 6 are cleaned, a rinsing chamber 40 is provided in parallel with the cleaning chamber 37 as shown in FIG. Reference numeral 41 denotes a liquid tank in which the rinsing liquid is stored, and 42 denotes an external rinsing liquid control mechanism that is provided outside the rinsing chamber and controls the amount and temperature of the rinsing liquid. After the cleaning, the deposition mask 2 and the mask holder 6 are rinsed with pure water in the rinsing chamber 40 after cleaning with an organic solvent in the cleaning chamber 37, for example. You may comprise so that it may prepare for a film | membrane. The cleaning chamber 37 and the rinsing chamber 40 are provided with a solution control mechanism, so that the temperature and amount of the cleaning liquid can be managed from the outside, and are excellent in practicality.

  Further, by providing the external solution control mechanism of the cleaning chamber 37 and the rinsing chamber 40 with a distillation mechanism, the solution after cleaning can be separated, the solution can be reused, and the amount used can be reduced.

  In the fourth embodiment, as shown in FIG. 6, the replacement chamber 31 of the first to third embodiments includes a load lock chamber 32, a material peeling / recovery chamber 43, a cleaning chamber 37, and a standby chamber 33. In Example 4, the material use efficiency is improved by peeling the film forming material from the vapor deposition mask 2 and the mask holder 6 to which the material after the film is attached, collecting the peeled material, and reusing it. The structure is improved.

  The vapor deposition mask 2 and the mask holder 6 to be exchanged with the film forming material exchanged will be referred to as a mask unit A, and the vapor deposition mask 2 and mask holder 6 to be used next will be referred to as a mask unit B. The unit A moves from the film forming chamber 30 to the load lock chamber 32, and moves from the load lock chamber 32 to the material peeling / recovery chamber 43. The mask unit B moves from the standby chamber 33 to the load lock chamber 32 and moves from the load lock chamber 32 to the film forming chamber 30. The mask unit A moved to the material peeling / recovery chamber 43 moves to the cleaning chamber 37 after the material peeling step. Alternatively, it may be moved to the load lock chamber 32, moved from the load lock chamber 32 to the standby chamber 33, and moved from the standby chamber 33 to the cleaning chamber 37. After cleaning, the mask unit A moves to the standby chamber 33 and is prepared for the next replacement.

  The film deposition material attached to the vapor deposition mask 2 and the mask holder 6 in the material peeling / recovery chamber 43 is peeled off using dry ice blasting. Dry ice blasting is exfoliated by kinetic energy by spraying dry ice pellets at high speed, thermal shock due to low temperature, and sublimation energy when dry ice enters between the base material and vaporizes rapidly. Compared with dry cleaning methods such as ozone and laser, there is an advantage that the organic material is not easily decomposed. Therefore, there are various methods for peeling the organic material from the base material. However, dry ice blasting is preferable when the attached organic material is peeled and used again as a film forming material.

  Further, the evaporation mask 2 and the mask holder 6 irradiate dry ice from the evaporation source side because many evaporation particles adhere to the surface on the evaporation source side. Furthermore, the shape of the limiting opening 5 of the mask holder 6 is formed such that the opening area on the evaporation source 1 side is smaller than the opening area on the substrate 4 side, so that the film is formed on the surface of the mask holder 6 on the evaporation source 1 side. Since a large amount of material is attached, most of the deposited film forming material can be easily peeled off. Further, in order to irradiate the entire surface of the mask unit that is long in the transverse direction perpendicular to the relative movement direction of the substrate 4 with dry ice, as shown in FIG. Is a moving mechanism. Reference numeral 45 is a dry ice generating unit, and 46 is an injection unit moving mechanism. Further, since the vapor deposition mask 2 has a thin foil shape, it may be damaged when dry ice blasting. Therefore, as shown in FIG. 8, a mask suction plate 47 made of a magnet plate, an electromagnet plate or an electrostatic plate is used. Is provided so that it can be attached to the vapor deposition mask 2 and is in close contact with the vapor deposition mask during dry ice blasting so that the vapor deposition mask is not damaged.

  Further, the film forming material separated from the vapor deposition mask 2 and the mask holder 6 is recovered by the material recovery mechanism 17. The material recovery mechanism 17 is arranged at the lower part of the mask holder 6 so that the peeled material falls and fits in the material recovery mechanism 17. Furthermore, although dry ice blasting is performed in clean air, in order to enhance the material recovery function, a clean air introduction mechanism is provided in the upper part of the material peeling and recovery chamber 43, and an exhaust mechanism is provided in the lower part of the material recovery mechanism 17. . This is because the clean air is introduced from the upper part of the material peeling / recovery chamber 43 and the carbon dioxide vaporized by the clean air and the dry ice is exhausted by the exhaust mechanism provided in the material recovery mechanism 17. By keeping the pressure of 43 constant and allowing the gas flow to pass through the material recovery mechanism 17, the film-deposited material scattered in the material separation / recovery chamber 43 can also be captured.

  Further, the material recovery mechanism 17 is configured to be detachable from the material separation / recovery chamber 43, so that the recovered material can be taken out of the exchange chamber without opening the material separation / recovery chamber 43 to the atmosphere.

  The subsequent cleaning process in the cleaning chamber 37 is performed for the purpose of removing film forming materials, particles, and contaminants that could not be removed in the material peeling process, and a wet process using a cleaning liquid is suitable as in the above-described cleaning method. ing. Further, since the deposition mask 2 and the mask holder 6 to which the film forming material is adhered are subjected to the liquid cleaning after the material peeling process, the material adhering to the deposition mask 2 and the mask holder 6 before the cleaning is a small amount, so it is dissolved in the cleaning liquid. Since less material is used, the cleaning liquid replenishment / replacement cycle becomes longer, resulting in a vapor deposition apparatus with less environmental impact.

  In addition, this invention is not restricted to Examples 1-4, The concrete structure of each component can be designed suitably.

DESCRIPTION OF SYMBOLS 1 Evaporation source 2 Deposition mask 3 Mask opening part 4 Substrate 5 Restriction opening part 6 Mask holder 9 Temperature control mechanism 9C Temperature control part
30 Deposition chamber
31 Exchange room
32 Load lock room
33 Waiting room
34 Removal room
37 Cleaning room
38 Liquid tank
40 Rinse room
41 Liquid tank
43 Material peeling collection chamber
47 Mask suction plate

Claims (23)

  In the film forming chamber, the film forming material evaporated from the evaporation source is deposited on the substrate through the mask opening of the vapor deposition mask, and a vapor deposition film having a film formation pattern defined by the vapor deposition mask is formed on the substrate. An evaporation apparatus configured to limit a scattering direction of evaporation particles of the film forming material evaporated from the evaporation source between the evaporation source and the substrate disposed in a state of being opposed to the evaporation source. A mask holder having a scattering restricting portion provided with a restricting opening is provided, the vapor deposition mask arranged in a separated state from the substrate is attached to the mask holder, and the vapor deposition mask is attached to the substrate. The mask holder and the evaporation source are configured to be movable relative to each other while being kept apart from the vapor deposition mask, and the mask holder to which the vapor deposition mask is attached can come and go to the film formation chamber. A lock chamber, a standby chamber in which the mask holder provided with the vapor deposition mask can come and go with the load lock chamber, and an exchange chamber having an extraction chamber capable of taking out the mask holder provided with the vapor deposition mask outside the apparatus. The vapor deposition apparatus characterized by the above-mentioned.   The vapor deposition apparatus according to claim 2, wherein the mask holder includes a temperature control unit having a temperature control unit outside the film forming chamber.   The vapor deposition apparatus according to claim 2, wherein the mask holder is configured such that the temperature control unit and the temperature control unit are detachable so as to freely move between the film forming chamber and the exchange chamber.   In the film forming chamber, the film forming material evaporated from the evaporation source is deposited on the substrate through the mask opening of the vapor deposition mask, and a vapor deposition film having a film formation pattern defined by the vapor deposition mask is formed on the substrate. An evaporation apparatus configured to limit a scattering direction of evaporation particles of the film forming material evaporated from the evaporation source between the evaporation source and the substrate disposed in a state of being opposed to the evaporation source. A mask holder having a scattering restricting portion provided with a restricting opening is provided, the vapor deposition mask arranged in a separated state from the substrate is attached to the mask holder, and the vapor deposition mask is attached to the substrate. The mask holder and the evaporation source are configured to be movable relative to each other while being kept apart from the vapor deposition mask, and the mask holder to which the vapor deposition mask is attached can come and go to the film formation chamber. Vapor deposition characterized by comprising: a lock chamber, a standby chamber in which the mask holder provided with the vapor deposition mask can come and go with the load lock chamber, and an exchange chamber having a cleaning chamber for washing the vapor deposition mask and the mask holder. apparatus.   The vapor deposition apparatus according to claim 4, wherein the cleaning chamber includes a liquid tank in which a cleaning liquid is stored.   The vapor deposition apparatus according to claim 5, wherein the exchange chamber includes a rinse chamber having a liquid tank in which a rinse liquid is stored.   The vapor deposition apparatus according to any one of claims 5 and 6, wherein at least one of the vapor deposition mask and the mask holder is cleaned or rinsed using ultrasonic waves in combination.   The liquid amount or the temperature of at least one of the cleaning liquid or the rinsing liquid is configured to be controlled by a solution control mechanism provided outside the cleaning chamber or outside the rinsing chamber. Vapor deposition equipment.   The vapor deposition apparatus according to claim 4, further comprising a drying mechanism that dries at least one of the vapor deposition mask and the mask holder after cleaning.   The vapor deposition apparatus according to claim 4, wherein the mask holder includes a temperature control unit having a temperature control unit outside the film formation chamber.   The vapor deposition apparatus according to claim 10, wherein the mask holder is configured such that the temperature control unit and the temperature control unit are detachable so as to freely move between the film formation chamber and the exchange chamber.   In the film forming chamber, the film forming material evaporated from the evaporation source is deposited on the substrate through the mask opening of the vapor deposition mask, and a vapor deposition film having a film formation pattern defined by the vapor deposition mask is formed on the substrate. An evaporation apparatus configured to limit a scattering direction of evaporation particles of the film forming material evaporated from the evaporation source between the evaporation source and the substrate disposed in a state of being opposed to the evaporation source. A mask holder having a scattering restricting portion provided with a restricting opening is provided, the vapor deposition mask arranged in a separated state from the substrate is attached to the mask holder, and the vapor deposition mask is attached to the substrate. The mask holder and the evaporation source are configured to be movable relative to each other while being kept apart from the vapor deposition mask, and the mask holder to which the vapor deposition mask is attached can come and go to the film formation chamber. At least one of a lock chamber, a standby chamber in which the mask holder provided with the vapor deposition mask can come and go with the load lock chamber, a cleaning chamber for cleaning the mask holder provided with the vapor deposition mask, and the vapor deposition mask or the mask holder A vapor deposition apparatus comprising an exchange chamber having a material peeling / recovery chamber for peeling and collecting a material adhered to the substrate.   The vapor deposition apparatus according to claim 12, wherein the material peeling mechanism in the material peeling / recovery chamber uses dry ice blasting.   14. The vapor deposition apparatus according to claim 13, wherein the material peeling and recovery chamber includes a clean air introduction mechanism and a clean air and carbon dioxide exhaust mechanism.   The mask suction plate is attached to the substrate side of the vapor deposition mask when the material adhering to the vapor deposition mask is peeled off using the dry ice blasting. Vapor deposition equipment.   The vapor deposition apparatus according to claim 15, wherein the mask adsorption plate is any one of a magnet plate, an electromagnet plate, and an electrostatic plate.   The said material peeling collection | recovery chamber is equipped with the suction mechanism which attracts | sucks the material peeled with the said material peeling mechanism, and the discharge mechanism which collects the sucked material and discharges it out of an exchange chamber, It is characterized by the above-mentioned. The vapor deposition apparatus of any one of Claims.   The vapor deposition apparatus according to claim 12, wherein the mask holder includes a temperature control unit having a temperature control unit outside the film forming chamber.   19. The vapor deposition apparatus according to claim 18, wherein the mask holder is configured such that the temperature control unit and the temperature control unit are detachable so as to freely move between the film forming chamber and the exchange chamber.   20. The vapor deposition apparatus according to claim 1, wherein the exchange chambers are arranged side by side in a lateral direction orthogonal to a relative movement direction of the substrate in the film formation chamber.   21. The mask holder according to any one of claims 1 to 20, wherein the restriction opening has a shape in which the opening area on the evaporation source side is smaller than the opening area on the substrate side. The vapor deposition apparatus of description.   The vapor deposition apparatus according to claim 1, wherein the film forming material is an organic material.   23. A vapor deposition method using the vapor deposition apparatus according to any one of claims 1 to 22, wherein a vapor deposition film having a film formation pattern defined by the vapor deposition mask is formed on the substrate.

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