JP2005129299A - Organic el element manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL device manufacturing device with very excellent practicability capable of efficiently removing the dirt of a mask in a short time without depending on manual operation and without exposing a treatment chamber to the air. <P>SOLUTION: This organic EL device manufacturing device comprises one or a plurality of types of treatment chambers such as a preparation chamber, an ejection chamber, a pretreatment chamber, a film forming chamber, a mask stock chamber and a mask cleaning chamber, and a conveyance chamber conveying a substrate to the treatment chamber, and forms films of an organic EL material one by one on the substrate to manufacture the organic EL device. A cleaning mechanism cleaning the mask 1 provided on the substrate when forming the organic EL material films is provided in one of the treatment chambers. The cleaning mechanism comprises a holding part 2 holding the mask 1 and a nozzle body 4 provided facing the mask 1 held by the holding part 2 and injecting granular dry ice 3 on the mask 1 held by the holding part 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an organic EL element manufacturing apparatus.

  Conventionally, an organic EL element is manufactured by sequentially laminating a lower metal electrode, an organic EL thin film, and an upper transparent electrode on a glass substrate (for example, as disclosed in Japanese Patent Application No. 2003-137664 (Patent Document 1)). ) In an organic EL element manufacturing apparatus, a mask having a predetermined pattern is stacked on a substrate, and an organic EL material is deposited through the mask to form an organic EL thin film having a desired pattern on the substrate. ing.

  Of course, the organic EL material gradually adheres to and accumulates on this mask every time it is vapor-deposited, and when used several tens to several hundreds of times, the size of the opening is reduced and the shape of the opening is deformed. Since it becomes impossible to form a film in a desired pattern, this mask needs to be replaced.

  Specifically, in the case of an organic EL element manufacturing apparatus that does not have a mask stock chamber for stocking a replacement mask, replacement is performed according to the following procedure.

  1. The film formation chamber (deposition chamber) is returned from vacuum to atmospheric pressure.

  2. Unload the mask from the deposition chamber.

  3. Cleaning is performed by removing the organic EL material adhering to the mask with a solvent such as acetone or alcohol, and further washing with pure water (so-called wet cleaning).

  4). The cleaned mask (or a previously cleaned mask) is carried into the film formation chamber.

  5). The film formation chamber is evacuated.

  In this case, the apparatus cannot be used until the new mask is set after the mask is carried out, and the film formation chamber needs to be evacuated every time the mask is replaced. In addition, the film forming chamber and the mask are exposed to the atmosphere, and there is a problem that the film forming chamber and the mask are easily contaminated by moisture and oil in the air.

  On the other hand, in the case of an organic EL element manufacturing apparatus having a mask stock chamber for stocking a replacement mask as shown in FIG. 1, replacement is performed according to the following procedure.

  1. The mask is transferred from the film formation chamber to the mask stock chamber.

  2. A new mask is transferred from the mask stock chamber to the deposition chamber.

  In this case, it is not necessary to return the film forming chamber from the vacuum state to the atmospheric pressure (ie, it is not necessary to evacuate) just by replacing the dirty mask in the film forming chamber with an unclean mask in the mask stock chamber. In the mask stock chamber, a dirty mask with an organic EL material is accumulated. Therefore, when this dirty mask accumulates to some extent, cleaning is performed according to the following procedure.

  1. Return the mask stock chamber from vacuum to atmospheric pressure.

  2. Remove the mask from the mask stock room.

  3. Cleaning is performed by removing the organic EL material adhering to the mask with a solvent such as acetone or alcohol, and further washing with pure water.

  4). The cleaned mask (or a previously cleaned mask) is carried into the mask stock chamber.

  In other words, even when a mask stock chamber is provided, it is necessary to expose the mask stock chamber to the atmosphere each time cleaning is performed.

  Therefore, conventionally, it is necessary to return the film formation chamber or the mask stock chamber to the atmospheric pressure in order to replace or clean the mask, and the film formation chamber, the mask stock chamber, or the mask is exposed to the air to form the film formation chamber or the like. At present, there are problems such as the degree of vacuum and exhaust efficiency being lowered, and the adhesion of dirt to the organic EL element.

  In addition, since wet cleaning is performed manually, there are many steps required for one operation, and there is a problem that the operation takes time and a problem of contamination when the chamber is released into the atmosphere.

  Furthermore, since the characteristics of the organic EL element greatly change due to slight dirt or a change in the degree of vacuum, there is always a demand for eliminating the influence of the atmosphere as much as possible in the organic EL element manufacturing apparatus.

Japanese Patent Application No. 2003-137664

  In the present invention, in view of the current situation as described above, it is necessary to expose a processing chamber or mask such as a film formation chamber or a mask stock chamber to the atmosphere every time the mask is replaced and cleaned. It is based on the knowledge that it is easily polluted, and it is an extremely practical organic material that can remove the dirt on the mask well in a short time without the need for human hands and exposing the processing chamber or mask to the atmosphere. It is an object to provide an EL element manufacturing apparatus.

  The gist of the present invention will be described with reference to the accompanying drawings.

  One or more types of processing chambers such as a preparation chamber, a take-out chamber, a pretreatment chamber, a film formation chamber, a mask stock chamber, a mask cleaning chamber, and the like, and a transfer chamber for transporting the substrate to this processing chamber An organic EL element manufacturing apparatus for manufacturing an organic EL element by sequentially forming an organic EL material, wherein a cleaning mechanism for cleaning the mask 1 provided on the substrate at the time of forming the organic EL material The cleaning mechanism is provided with a holding unit 2 for holding the mask 1 and a mask 1 held in the holding unit 2 so as to face the mask 1 held in the holding unit 2. And a nozzle body 4 for injecting 3.

  The cleaning mechanism is provided with a driving unit capable of moving the nozzle body 4 or the mask 1 in a direction substantially parallel to the mask 1 or the nozzle body 4 held by the holding unit 2. 1 relates to the organic EL element manufacturing apparatus according to 1.

  In addition, the cleaning mechanism is provided with one or a plurality of nozzle bodies 4 facing each other, and the mask 1 held by the holding portion 2 is interposed between the one or a plurality of nozzle bodies 4 provided in the facing state. The organic EL element manufacturing apparatus according to claim 1, wherein the cleaning mechanism is configured to be disposed.

  The organic EL element manufacturing apparatus according to claim 1, wherein the cleaning mechanism is provided in a mask cleaning chamber for cleaning the mask 1.

  The organic EL device manufacturing apparatus according to claim 1, wherein the cleaning mechanism is provided in a mask stock chamber in which a replacement mask 1 is stocked. is there.

  Since the present invention is configured as described above, the organic EL element manufacturing apparatus excellent in practicality can be well removed in a short time without manually contaminating the mask and exposing the processing chamber to the atmosphere. It becomes.

  According to the second aspect of the present invention, the organic EL element manufacturing apparatus is more practical and capable of spraying dry ice evenly over the entire surface of the mask and removing the contamination of the mask more reliably.

  Further, in the invention described in claim 3, it becomes an organic EL device manufacturing apparatus with more practicality that can simultaneously remove the contamination of the mask by spraying dry ice simultaneously on the front and back surfaces of the mask. .

  Further, in the inventions according to claims 4 and 5, the organic EL element manufacturing apparatus with excellent practicality can be realized more easily.

  Embodiments of the present invention that are considered to be suitable (how to best carry out the invention) will be briefly described with reference to the drawings, showing their effects.

  The mask 1 to which the organic EL material has adhered and deposited during film formation is transferred from the film formation chamber to the processing chamber provided with a cleaning mechanism through the transfer chamber, and the mask 1 is cleaned by this cleaning mechanism.

  At this time, since the mask 1 can be cleaned by a cleaning mechanism provided in any of the processing chambers, it is not necessary to return the processing chambers such as the film forming chamber and the mask stock chamber to the atmospheric pressure as in the prior art. Cleaning can be performed simply by transporting the mask from the process chamber to the process chamber, and the process chamber such as the film formation chamber and the mask stock chamber and the mask 1 are not exposed to the atmosphere. Can be reliably prevented from being contaminated by oils and fats, moisture, etc.

  Therefore, the inside of the processing chamber is not exposed to the atmosphere, and can always be set to a suitable vacuum degree, and an organic EL element whose characteristics change sensitively depending on the degree of vacuum or adhering dirt can be manufactured with a certain quality and a high yield. become.

  Specifically, the dry ice 3 is sprayed onto the surface of the mask 1 by a cleaning mechanism that cleans the mask 1 by spraying (granular) dry ice 3 from the nozzle body 4 onto the mask 1. The dirt accumulated on the surface of the mask 1 due to the volume expansion when the ice 3 collides with the dirt accumulated on the mask 1 and comes into contact with the surface of the mask 1 and vaporizes at the interface between the dirt and the surface of the mask 1. The dirt adhering to the mask 1 can be easily and reliably removed in a clean atmosphere without human intervention.

  Further, unlike the wet cleaning, the cleaning is performed by the dry ice 3 that sublimates from the solid without passing through the liquid, so that the mask 1 can be cleaned without contaminating the processing chamber with moisture. In addition, there is no need for manual cleaning as in wet cleaning, and cleaning can be performed efficiently in a short time.

  Further, since the dry ice 3 is vaporized at the moment of contact with the mask 1, it does not exhibit the effect of scraping the surface of the member to be cleaned. Therefore, even if the dry ice 3 is sprayed to remove the dirt, the mask 1 is damaged. Will not occur.

  That is, as the mask 1, an extremely thin mask having a thickness of about several tens of μm is easily used. However, as described above, the dry ice 3 is vaporized at the moment when it adheres to the surface of the mask 1. It is possible to reliably clean without worrying about deformation or breakage of 1.

  Further, for example, a surface of the mask 1 is provided by providing the cleaning mechanism with a driving unit that can move the nozzle body 4 or the mask 1 in a direction substantially parallel to the mask 1 or the nozzle body 4 held by the holding unit 2. Thus, the dry ice 3 can be sprayed evenly, and the contamination of the mask 1 can be more reliably removed.

  Further, for example, by providing this cleaning mechanism in a mask stock chamber or the like in which a replacement mask 1 is stocked, the dirty mask 1 is unloaded from the film formation chamber and replaced with a new mask 1 immediately. Since the dirty mask 1 can be used and cleaned, only one spare mask 1 is provided for each film forming chamber in the mask stock chamber, so long as the mask 1 is not damaged. This mask 1 can be used by cleaning it alternately without needing to be exposed to the atmosphere, i.e., without exposing the mask stock chamber to the atmosphere. It can be done and is extremely workable.

  Therefore, the number of times of exhausting the mask stock chamber to the atmosphere can be extremely reduced, and the organic EL element can be manufactured with extremely high productivity without lowering the working efficiency.

  Further, for example, the cleaning mechanism is provided with one or a plurality of nozzle bodies 4 facing each other, and the mask 1 is held by the holding portion 2 between one or a plurality of nozzle bodies 4 provided in the facing state. The cleaning mechanism may be configured to be disposed in a wet state. In this case, the mask 1 can be cleaned more efficiently.

  Therefore, the present invention provides an organic EL element manufacturing apparatus that is excellent in practicality and can remove the contamination of the mask satisfactorily without the need for manpower and without exposing the processing chamber to the atmosphere.

  Specific embodiments of the present invention will be described with reference to the drawings.

  This embodiment includes one or a plurality of types of processing chambers such as a preparation chamber, a take-out chamber, a pretreatment chamber, a film formation chamber, a mask stock chamber, and a mask cleaning chamber, and a transfer chamber for transferring a substrate to the processing chamber. An organic EL element manufacturing apparatus for manufacturing an organic EL element by sequentially forming an organic EL material on a substrate, wherein the substrate is formed at the time of film formation in order to form the organic EL material in a predetermined pattern on the substrate. A cleaning mechanism for cleaning the mask 1 provided thereon is provided in any one of the processing chambers. The cleaning mechanism is in a state of being opposed to the holding unit 2 that holds the mask 1 and the mask 1 that is held by the holding unit 2. The nozzle body 4 is provided and sprays dry ice 3 onto the mask 1.

  Specifically, as shown in FIG. 2, a plurality of types of processing chambers are provided around the transfer chamber, and substrates (glass substrates) are sequentially fed into the processing chamber by a transfer body provided in the transfer chamber. A lower metal electrode, an organic EL thin film, and an upper transparent electrode are sequentially formed thereon.

  More specifically, in this embodiment, a preparation (removal) chamber, a pretreatment chamber, three film formation chambers, and a mask stock chamber are provided around the transfer chamber, and the cleaning mechanism is provided in this mask stock chamber. It is a thing. In addition, the cleaning mechanism is not provided in the mask stock chamber, but the cleaning mechanism may be provided independently in one processing chamber (that is, a mask cleaning chamber that performs only cleaning of the mask 1 is provided). good.

  That is, in this embodiment, the mask 1 is unloaded from the film formation chamber and replaced with the mask 1 in the mask stock chamber, and the mask is replaced in the organic EL element manufacturing apparatus having the conventional mask stock chamber. The replaced dirty mask 1 can be carried into the mask stock chamber and cleaned.

  Accordingly, it is a matter of course that the mask stock chamber for exchanging the mask 1 and the cleaning mechanism are integrated so that the mask 1 can be transported more easily and the mask 1 can be replaced and cleaned very efficiently. Since it is not necessary to newly provide the mask cleaning chamber, the space can be used effectively. If the mask cleaning mechanism cannot be accommodated in the mask stock chamber due to the size of the substrate or the like, a configuration in which a mask cleaning chamber is provided separately from the mask stock chamber may be employed.

  Furthermore, one mask 1 is normally required for film formation. For example, by storing one mask 1 for each film formation chamber in this mask stock chamber, the mask in this mask stock chamber is stored. 1 and the mask 1 in the film forming chamber can be used for a long period of time without having to be replaced with an external mask as long as the mask 1 is not damaged while being alternately cleaned. This mask 1 can be easily and cost-effectively cleaned and used for a long period of time without having to stop the apparatus or return the processing chamber from the vacuum state to atmospheric pressure. It becomes the composition.

  Further, the cleaning mechanism may be provided with a driving unit that can move the nozzle body 4 or the mask 1 in a direction substantially parallel to the mask 1 or the nozzle body 4 held by the holding unit 2.

  Specifically, in this embodiment, the nozzle body 4 is set to be movable in a direction parallel to the mask 1. Accordingly, the nozzle body 4 can spray the dry ice 3 evenly over the entire surface of the mask 1 to remove the contamination of the mask 1 more reliably.

  The nozzle body 4 may be a flexible nozzle that can freely set the spraying direction of the dry ice 3. In this case, the dry ice 3 can be sprayed uniformly over the entire surface of the mask 1, and the cleaning can be performed satisfactorily. be able to. In this embodiment, the nozzle body 4 is provided in a state of being opposed to the mask 1, and the nozzle body 4 is set to be movable. However, the mask 1 and the nozzle body 4 are set to be movable. In this case, the mask 1 can be cleaned more efficiently.

  In this embodiment, as shown in FIG. 3, one nozzle body 4 is provided to face the mask 1, but one or more nozzle bodies 4 are provided to face the cleaning mechanism. The cleaning mechanism may be configured such that the mask 1 held by the holding portion 2 is disposed between one or a plurality of nozzle bodies 4 provided in the opposed state, for example, two nozzle bodies. 4 is provided in an opposing state, dirt on the mask can be removed in a half time as compared with a configuration in which the dry ice 3 is sprayed on the front and back surfaces of the mask 1 with one nozzle body 4. improves.

  Each part will be specifically described. The mask 1 is a thin metal plate-like member on which a desired pattern is formed, and is fixed to the mask base 11. When the mask 1 is replaced, the mask is provided with a cleaning mechanism provided from the film forming chamber by a mask transport mechanism (transport mechanism of the transport chamber in FIG. 2) in a state where the mask table 11 is placed on the mask transport mechanism. It is transported into the stock chamber and delivered to the transport unit 7.

  As shown in FIG. 3, the cleaning mechanism includes a holding unit 2 that holds the mask 1 and a nozzle body 4 that is provided in a state of facing the holding unit 2, and sprays dry ice 3 from the nozzle body 4. By spraying on the mask 1, dirt adhered on the mask 1 is removed. The present embodiment employs a configuration in which the holding portion 2 is provided in the upper portion of the chamber 8 and the nozzle body 4 is provided in the lower portion. In addition, you may employ | adopt other structures, such as the structure which provided the nozzle body 4 in the upper part of the chamber 8, and provided the holding | maintenance part 2 in the lower part.

  The holding unit 2 includes a holding body 5 that holds the metal mask 1 and an upper fixture 6 that fixes the holding body 5 to the upper portion of the chamber 8. Specifically, a magnet 9 for holding the mask 1 is provided on the holding body 5, and a plate body 10 (for example, a quartz plate) that prevents the mask 1 from coming into direct contact with the magnet 9 is connected to the magnet 9 and the magnet 9. It is provided between the mask 1.

  That is, the mask 1 transported by the mask transport mechanism is attracted by the magnet 9 and supported so as to be pressed against the plate body 10 by the transport section 7 and held on the surface of the plate body 10 of the holding body 5. Is done.

  As the magnet 9, it is preferable to employ a magnet having a size substantially the same as that of the mask 1, and in this case, displacement and backlash of the mask 1 at the time of cleaning with the dry ice 3 can be more reliably prevented.

  Further, in the present embodiment, in order to reliably prevent the plate body 10 from dropping, the end of the plate body 10 is fitted into a fitting groove 5 a formed in the opening of the holding body 5, The magnet 9 is provided between the inner bottom portion of the holding body 5. Note that the magnet 9 and the plate body 10 may be simply provided in a stacked state on the holding body 5 and fixed to the holding body 5 by an appropriate means.

  The nozzle body 4 is set so as to be movable in a direction parallel to the mask 1 held by the holding unit 2 by the driving unit. Specifically, the nozzle body 4 is configured to be attached to a nozzle fixing portion 12 that is movably provided on a known XY stage driving mechanism 13. That is, the nozzle body 4 is configured to spray the dry ice 3 evenly over the entire surface of the mask 1 so as to remove the contamination of the mask 1 more reliably. In the figure, reference numeral 14 denotes a lower fixture for fixing the XY stage drive mechanism 13 to the lower part of the chamber 8, 15 denotes a power cable connected to a drive source (not shown) of the XY stage drive mechanism 13. This is a tube provided with a dry ice supply cable connected to a dry ice supply source (not shown).

  In addition, the cleaning mechanism of the present embodiment is configured to include a capturing mechanism that can reliably suck out and exhaust the dirt so that the dirt does not remain in the chamber 8 when removing the dirt attached to the mask 1. Yes.

This trapping mechanism includes a suction port 20 provided in communication with an exhaust passage 21 connected to a vacuum pump 22, and an N ₂ purge mechanism that creates an air flow toward the suction port 20 and guides dirt to the suction port 20. The suction port 20 is provided so as to surround the periphery of the XY stage driving mechanism 13. In the figure, reference numeral 16 is a gate valve, and 17 is a shutter.

  Therefore, when the mask 1 held by the holding unit 2 is cleaned by this capturing mechanism, the dirt removed from the mask 1 can be surely sucked and exhausted, and the inside of the chamber 8 is removed from the mask 1. It is possible to reliably prevent contamination by the removed dirt.

The cleaning mechanism of this embodiment is provided with an O ₃ purge mechanism 18. That is, the O ₃ purge mechanism 18 by purging O ₃ into the chamber 8, the O ₃ having an effect allowed to ashing organic material is a configuration capable of reliably removing organic stains in the chamber 8.

  The usage method of this organic EL element manufacturing apparatus is demonstrated below.

  A substrate (glass substrate) is carried into the transfer chamber through the preparation chamber. This substrate is sequentially carried into each processing chamber, and processing is performed for each processing chamber.

  Specifically, the substrate is cleaned (cleaning with oxygen plasma) in the pretreatment chamber, and the lower metal electrode, the organic EL thin film, and the upper transparent electrode are sequentially formed while the substrate is sequentially carried into the three film formation chambers.

  In the film formation chamber, a mask 1 for forming the organic EL material in a predetermined pattern is provided, and film formation is performed in a state where the mask 1 is laminated on the substrate.

  When organic dirt is deposited by using this mask 1 several tens to several hundreds of times, the mask 1 is unloaded from the film forming chamber and loaded into the mask stock chamber.

  At this time, the uncontaminated mask 1 stocked in the mask stock chamber is carried out and carried into the film forming chamber, and the dirty mask 1 carried into the mask stock chamber is cleaned by the mask cleaning mechanism.

Specifically, while the N ₂ purge mechanism 19 purges N ₂ , the dry ice 3 sprayed from the nozzle body 4 is sprayed onto the surface of the mask 1 to adhere and deposit on the surface of the mask 1 (organic matter contamination). This mask 1 is cleaned by removing. The cleaned mask 1 is stocked in the mask stock chamber as it is.

  Therefore, it is not necessary to interrupt the production every time the mask is replaced, and it is not necessary to take out the mask 1 stocked in the mask stock chamber as long as the mask 1 is not damaged. The mask 1 can be used by cleaning it alternately without being exposed, and can be used without having to be replaced for a long time as long as the mask 1 is not damaged.

  Since the present embodiment is configured as described above, the mask 1 to which the organic EL material has adhered and deposited during film formation is transferred from the film formation chamber to the processing chamber provided with the cleaning mechanism through the transfer chamber. When cleaning is performed, the mask 1 can be cleaned by a cleaning mechanism provided in any of the processing chambers, so that it is not necessary to return the processing chambers such as the film forming chamber and the mask stock chamber to atmospheric pressure as in the conventional case. Cleaning can be performed simply by transporting the mask from the film chamber to the processing chamber, and the processing chamber such as the film forming chamber and the mask stock chamber and the mask 1 are not exposed to the atmosphere. It can be surely prevented from being contaminated by oils and moisture in the atmosphere.

  Therefore, the inside of the processing chamber is not exposed to the atmosphere and can always be set to a suitable vacuum state, and an organic EL element whose characteristics change sensitively depending on the degree of vacuum or adhering dirt can be manufactured with a certain quality and high yield. become.

  Specifically, the dry ice 3 is sprayed onto the mask 1 by spraying the dry ice 3 onto the surface of the mask 1 by a cleaning mechanism that cleans the mask 1 by spraying the dry ice 3 from the nozzle body 4 onto the mask 1. The dirt accumulated on the surface of the mask 1 can be removed by volume expansion when it collides with the dirt accumulated on the surface 1 and contacts the surface of the mask 1 and vaporizes at the interface between the dirt and the surface of the mask 1. The dirt attached to the mask 1 can be easily and reliably removed in a vacuum atmosphere without human intervention.

  Further, unlike the wet cleaning, the cleaning is performed by the dry ice 3 that sublimates from the solid without passing through the liquid, so that the mask 1 can be cleaned without contaminating the processing chamber with moisture. In addition, there is no need for manual cleaning as in wet cleaning, and cleaning can be performed efficiently in a short time.

  Further, since the dry ice 3 is vaporized at the moment of contact with the mask 1, unlike the shot material used for other blast cleaning, the dry ice 3 does not exhibit the action of scraping the surface of the member to be cleaned. Even if the dirt is removed, the mask 1 is not damaged.

  That is, as the mask 1, an extremely thin mask having a thickness of about several tens of μm is easily used. However, as described above, the dry ice 3 is vaporized at the moment when it adheres to the surface of the mask 1. It is possible to reliably clean without worrying about deformation or breakage of 1.

  Further, by setting the nozzle body 4 so as to be movable in a direction parallel to the mask 1, the nozzle body 4 sprays the dry ice 3 evenly over the entire surface of the mask 1 to more reliably remove the contamination of the mask 1. Can be removed.

  Further, the apparatus can be used immediately after the dirty mask 1 is carried out of the film forming chamber and replaced with a new mask 1, and the dirty mask 1 can be cleaned. Therefore, a spare mask 1 is placed in the mask stock chamber. It is not necessary to take out the mask 1 as long as the mask 1 is damaged or the like only by providing one for each film forming chamber, that is, it is not necessary to expose the mask stock chamber to the atmosphere. As long as the mask 1 is not damaged, it can be used without replacement for a long period of time, and the workability is extremely excellent.

  Therefore, the number of times of exhausting the mask stock chamber to the atmosphere can be extremely reduced, and the organic EL element can be manufactured with extremely high productivity without lowering the working efficiency.

  Therefore, the present embodiment is an organic EL element manufacturing apparatus that is excellent in practicality, and can remove the contamination of the mask satisfactorily without manually and exposing the processing chamber to the atmosphere.

It is a schematic explanatory drawing of a prior art example. It is a schematic explanatory drawing of a present Example. It is a schematic explanatory drawing of the cleaning mechanism of a present Example.

Explanation of symbols

1 Mask 2 Holding Unit 3 Dry Ice 4 Nozzle Body

Claims (5)

  One or more types of processing chambers such as a preparation chamber, a take-out chamber, a pretreatment chamber, a film formation chamber, a mask stock chamber, a mask cleaning chamber, and the like, and a transfer chamber for transporting the substrate to this processing chamber An organic EL element manufacturing apparatus for sequentially manufacturing organic EL materials to manufacture organic EL elements, wherein any one of the processing chambers has a cleaning mechanism for cleaning a mask provided on the substrate when the organic EL material is formed The cleaning mechanism includes: a holding unit that holds a mask; and a nozzle body that is provided in a state of being opposed to the mask held by the holding unit and that sprays granular dry ice onto the mask held by the holding unit. An organic EL element manufacturing apparatus comprising:   2. The organic EL element manufacturing according to claim 1, wherein the cleaning mechanism is provided with a drive unit capable of moving the nozzle body or mask in a direction substantially parallel to the mask or nozzle body held by the holding unit. apparatus.   One or a plurality of nozzle bodies are provided in the cleaning mechanism so as to face each other, and the mask held by the holding portion is disposed between one or a plurality of nozzle bodies provided in the facing state. The organic EL element manufacturing apparatus according to claim 1, wherein the cleaning mechanism is configured.   The organic EL element manufacturing apparatus according to claim 1, wherein the cleaning mechanism is provided in a mask cleaning chamber for cleaning the mask.   The organic EL element manufacturing apparatus according to any one of claims 1 to 3, wherein the cleaning mechanism is provided in a mask stock chamber in which a replacement mask is stocked.

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