JP2007007724A - Laser beam machining apparatus, its machining method, and mechanism and method for collecting debris - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the amount of debris deposited on a work by efficiently removing scattered materials generated from a work when the work is pattern-machined by allowing the work to be irradiated with laser beams. <P>SOLUTION: When performing the pattern-machining of a transparent conductive film deposited on a multi-layered film on a substrate by using laser beams, a debris collecting means 22 having an eddy generating mechanism for generating an eddy air current B by allowing gases C1, C2, C3, C4 to flow in a vicinity of a laser irradiation unit of the transparent conductive film is used. The debris collecting means 22 is brought close to the substrate, machined and scattered materials before and after the deposition on the substrate which are generated by laser beam irradiation are involved in the eddy air current, collected together with the gases in a vicinity of the laser beam irradiation unit, and discharged outside. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laser processing apparatus and a laser processing method for patterning a transparent conductive film used for a transparent electrode on a multilayer thin film such as an FPD (flat panel display), and in particular, a laser beam is applied to the surface of an object to be processed. The present invention relates to a laser processing apparatus, a processing method, a debris recovery mechanism, and a recovery method for removing and recovering processing debris generated during laser processing by irradiation, ablation, thermal melting, or a combined action thereof. Is.

  Transparent conductive films are currently employed as transparent electrodes for multilayer substrates such as flat displays and solar cells. Further, it is widely used as a transparent electrode in the field of electronic paper, which is being developed as a future display device, and its application is expanding. And the competition for higher definition and lower cost of displays has become more intense in recent years, and a transparent conductive film with higher quality and higher productivity is required even at the manufacturing site.

  Such a transparent conductive film is usually patterned into a desired shape by photolithography. For example, a transparent conductive film made of ITO (Indium Tin Oxides) film or ZnO (zinc oxide) film is vacuum-deposited on a substrate such as glass, plastic, or silicon wafer, and a resist layer is formed thereon, The resist layer is exposed by irradiating light through a photomask having a predetermined pattern. Then, the photomask pattern is transferred to the resist layer by development and post-baking, the portion of the transparent conductive film that is not covered with the resist is removed by wet etching, and finally the residual resist layer is removed to remove the desired resist layer. A transparent conductive film pattern is obtained.

  However, the above-described photolithography process requires a large apparatus such as a coater / developer, which is problematic in terms of capital investment and footprint. Further, since a large amount of chemical solution such as a developer is used, there is a problem in terms of environmental conservation. Therefore, Patent Document 1 discloses a technique of directly processing a transparent conductive film using laser light in order to omit the photolithography process and simplify the manufacturing process.

In processing using the laser disclosed in Patent Document 1, scattered objects adhere to the periphery of the processing region from the surface of the processing target that has been irradiated with the laser beam. This is generally called debris. If such debris adheres to the substrate, the desired processing quality and processing accuracy may not be obtained. As a method of reducing this debris,
(B) A method of suppressing the occurrence of debris itself.
(B) A method of removing the debris after the debris is deposited on the substrate.
(C) There are known methods for reducing the deposition of debris itself.

  In order to reduce the amount of debris generated in the item (a), it is known that it is effective to spray an assist gas together with the irradiation of the laser beam onto the workpiece. An inner nozzle and an outer nozzle are arranged around the outer peripheral surface of the laser processing head, assist gas is ejected from the inner nozzle toward the machining area, and the ejected assist gas is sucked by the outer nozzle to discharge debris. A technique (hereinafter referred to as technique 1) is disclosed in Patent Document 2. As a method of controlling the generation of debris itself, a method of preventing decomposition or re-adhesion with a predetermined atmospheric gas, or processing a workpiece under reduced pressure with a vacuum degree of about 10 Pa (10-2 Torr). Further, it is also known that the amount of debris that accumulates on the workpiece can be greatly reduced.

  In addition, as a method of removing the debris after deposition on the workpiece in the item (b), a laser machining head that outputs laser light toward the workpiece and a nozzle attached to the workpiece are provided. The laser beam output from the laser processing head is irradiated to the processing object through the gas introduction path of the nozzle together with the assist gas, and is processed from the annular gas suction hole provided on the outer peripheral side of the gas introduction path of the nozzle. Patent Document 3 discloses a laser processing method (hereinafter referred to as method 2) for sucking debris generated in the vicinity together with an assist gas.

  Furthermore, as a method for reducing the accumulation of debris as described in (c) above, a fluid delivery device for ejecting gas is provided on the surface in the vicinity of the processing region, and a suction duct for suctioning fluid is installed on the opposite side to disperse the processing. Patent Document 4 discloses a method (hereinafter referred to as Method 3) in which an object or debris is blown away from a processing region and gas is ejected and simultaneously sucked and removed.

  The configuration disclosed in Patent Document 4 will be described with reference to FIG. The glass substrate shown in FIG. 8 is a glass substrate installed in a part of a manufacturing process for manufacturing a predetermined product by performing various film forming processes and patterning on the glass substrate 4 through a series of processing steps by a plurality of processing machines. 4 is a laser processing apparatus which stamps a production number on 4. This laser processing apparatus is compatible with a processing table 7 for positioning a marking area for marking a manufacturing number by moving in two directions parallel to the plane of the glass substrate 4 mounted, and a type of the glass substrate 4 mounted. The laser irradiation device 2 for marking the manufactured number in the marking region 8, the fluid delivery device 11 having the blow nozzle 12 for injecting fluid to the marking region 8 of the glass substrate 4 placed on the processing table 7, and the marking region 8. An exhaust device 10 having a suction duct 9 for sucking fluid is provided. When the glass substrate 4 is processed by the laser beam 3 emitted from the laser control device 1 through the objective lens 5 of the laser irradiation device 2, the laser beam 3 is irradiated to the black matrix 6 in the marking region 8. The generated processing scattered matter (foreign matter, debris) 13 is removed.

  However, even if the assist gas is blown from the inner nozzle to the processing area as in Method 1, the debris diffuses and reattaches, and even if the suction force of the outer nozzle is increased, it cannot be sufficiently removed. Further, even if the atmospheric fluid is sucked by the annular gas suction hole as in the method 2, there is a problem that it is not possible to collect all the debris diffused in all directions. Similarly, even if the debris is blown away on the surface in the vicinity of the processing area as in method 3 and all the debris cannot be sucked when trying to suck and discharge, the remaining debris is scattered along the flow. The same result. In this case, it is difficult to remove and collect debris even if the suction force is increased.

JP 2004-153171 A JP-A-9-192870 JP 2004-337947 A Japanese Patent Laid-Open No. 10-99978

  The present invention has been made in order to solve the above-mentioned problems, and efficiently removes processing scattered matter generated from a processing target when a pattern processing is performed by irradiating the processing target with laser light. The purpose is to reduce debris adhering to the surface.

  In the present invention, when pattern processing of a transparent conductive film formed on a multilayer film on a substrate is performed using laser light, a vortex is generated by flowing a gas in the vicinity of the laser irradiation portion of the transparent conductive film. The debris collecting means having a vortex generating mechanism is used, the debris collecting means is brought close to the substrate, and the processing scattered matter before and after depositing on the substrate generated by the laser irradiation is entrained in the vortex air flow and laser. It is characterized in that the gas is collected together with the gas in the vicinity of the irradiation unit and exhausted to the outside.

  According to the above configuration, the processing scattered matter generated by the laser irradiation is collected in the eddy current along with the gas in the vicinity of the laser irradiation portion, and thus the processing scattered matter is collected near the center of the irradiation area of the laser beam by the eddy current. The processing scattered matter can be efficiently collected while suppressing the scattering to the surface.

  In the above-mentioned invention, the debris collection means includes a vortex air exhaust section provided with a transmission hole which is an optical path of a laser beam and a vortex air flow path communicating with the exhaust hole, and a vortex forming section disposed to face the substrate. Consists of. The vortex forming portion includes a vortex forming plate in which a radial vortex forming groove corresponding to the rotation direction of the vortex airflow and communicating with the transmission hole is formed on a surface of the vortex forming portion facing the substrate. The gas is introduced into the vortex forming groove of the vortex forming plate, and the gas that flows through the vortex forming groove to form the vortex airflow is exhausted from the exhaust hole to the outside through the perforation hole of the vortex airflow exhaust part. The configuration.

  According to the above configuration, since the radial vortex forming groove corresponding to the rotational direction of the vortex airflow and communicating with the transmission hole is formed on the surface of the vortex forming portion facing the processing target substrate, the vortex forming portion is introduced into the vortex forming portion. The generated gas flows along the vortex forming groove, thereby generating a vortex flow. Then, since the processing scattered matter is entrained in the vortex and exhausted upward through the transmission hole, the processing scattered matter is collected near the center of the laser light irradiation area, and the processing scattered matter is suppressed while suppressing scattering to the surroundings. It can be recovered efficiently.

  In the above invention, an annular groove communicating with the vortex forming groove is provided on the outer peripheral side of the surface of the vortex forming plate facing the substrate, and gas is introduced from a gas supply hole formed in the annular groove. Thus, the gas is supplied to the vortex forming groove to generate the same air flow in the annular groove as the direction of the vortex air flow.

  According to the above configuration, an annular groove is provided on the outer peripheral side of the vortex forming plate as a pre-stage portion for flowing the gas into the vortex forming plate, and the introduced gas is introduced by introducing the gas into the annular groove. A vortex with less turbulence is formed by creating an air flow that is rectified and matched to the direction of rotation of the vortex and supplying the air flow to the vortex forming groove.

  Further, in the above-mentioned invention, a gas introduction part for introducing gas into the gas supply hole formed in the annular groove is provided, and the gas introduction part is associated with the arrangement of the vortex formation groove, It is set as the structure which inclines in the windward side of the rotation direction of the vortex | airflow which should be generated with respect to the straight line which connects the gas supply hole of a center and an annular groove.

  According to the above configuration, with respect to the annular groove provided on the outer peripheral side of the vortex forming plate, the gas is supplied at a predetermined angle corresponding to the arrangement of the vortex forming groove from the gas supply hole, that is, the direction of the vortex forming groove. In the introduced annular groove, a rectified annular flow in a direction corresponding to the direction of the vortex forming groove can be generated.

  In the above-described invention, the groove width on the annular groove side in the vortex forming groove formed on the vortex forming plate is configured to be larger than the groove width on the transmission hole side by a predetermined ratio.

  According to the above configuration, the flow rate of the gas discharged from the vortex forming groove can be accelerated by providing an opening ratio in the groove width of the vortex forming groove, and the gas is collected in the central portion of the vortex forming plate. Thus, it is possible to make it easy for the processing scattered matter to be caught in the vortex.

  In the above-described invention, a space for forming an annular airflow is provided between the perforation hole of the vortex air exhaust section and the vortex forming groove of the vortex forming plate.

  According to the said structure, an airflow can be produced in fixed space and a vortex with few disturbances is formed.

  Moreover, in the above-mentioned invention, it is set as the structure by which a curved surface shape or a taper shape is formed in the wall surface near the opening part of the said permeation hole connected with the space which produces | generates the said cyclic | annular airflow.

  According to the said structure, since the air resistance of the opening part of a vortex formation plate reduces, a debris can be discharged | emitted smoothly.

According to the debris collection mechanism and the collection method of the present invention, it is possible to efficiently collect the processing scattered matter generated when patterning the transparent conductive film on the workpiece.
Therefore, according to the laser processing apparatus and the laser processing method using the debris recovery mechanism and the recovery method, the processing scattered matter generated from the processing target when the laser beam is irradiated is efficiently removed. Debris adhering to an object can be reduced, and the accuracy and quality of pattern processing can be improved.

  An embodiment of the present invention will be described below with reference to FIGS. 1 is an overall configuration diagram showing an embodiment of the laser processing apparatus of the present invention, FIG. 2 is a perspective view of a debris collection mechanism used in the laser processing apparatus of the present invention, and FIG. 3 is a debris used in the laser processing apparatus of the present invention. 4 is a bottom view of the base portion of the recovery mechanism, FIG. 4 is a bottom view of the base portion for explaining a vortex generation method of the debris recovery mechanism used in the laser processing apparatus of the present invention, and FIG. 5 is a debris used in the laser processing apparatus of the present invention. FIG. 6 is a plan view of a vortex forming plate of a debris collection device used in the laser processing apparatus of the present invention, and FIG. 7 is a diagram of FIG. 6A, illustrating a method for generating a concentric air flow by concentric grooves of the collection device. FIG.

  In the present invention, when a transparent conductive film is formed on a multilayer film formed on a glass substrate, which is an object to be processed, the surface of the transparent conductive film is irradiated with laser light to ablate, heat melt, or a composite action thereof. The present invention provides a laser processing apparatus, a laser processing method, a debris recovery mechanism and a recovery method for removing and recovering processing scattered matter (debris) generated during processing. In the following description, the scattered matter before and after deposition generated during laser processing is generically called debris.

  A laser processing apparatus used in the present invention includes a laser light source and an optical system that optically projects a laser beam emitted from the laser light source onto a processing surface of the processing object in a predetermined pattern, and is transparent on the processing object. A debris recovery mechanism with an exhaust hole opened in close proximity to the conductive film is installed, and laser light is irradiated from one side of the debris recovery mechanism, and the gas atmosphere near the laser light irradiation surface of the transparent conductive film is debris recovery mechanism. It is the structure which exhausts from this exhaust hole. When the laser beam is irradiated using the laser processing apparatus according to the present invention, the laser beam irradiation surface of the transparent conductive film can be in a reduced pressure atmosphere with a simple configuration. The sublimation pressure at the time of separation becomes higher, and the irradiation energy required for processing can be reduced. Further, the gas ejected to the surface in the vicinity of the processing region including the debris detached from the resin layer by the laser light irradiation can be efficiently removed through the exhaust hole of the debris collection mechanism.

  Hereinafter, an embodiment of the laser processing apparatus of the present invention will be described with reference to FIG. FIG. 1 shows a schematic laser optical system and a debris collection apparatus according to the present invention. In FIG. 1, portions corresponding to those in FIG.

  In the laser processing apparatus 20 shown in FIG. 1, reference numeral 1 denotes a laser control apparatus having a laser light source, and the laser light 3 emitted from the laser light source of the laser control apparatus 1 is shaped into a predetermined shape and dimension via a beam shaper 14. After that, a predetermined patterning shape is obtained by the mask or the variable aperture 15. The laser beam 3 having a predetermined patterning shape passes through the projection lens 16 and is irradiated onto the transparent conductive film 27 through the upper transmission window 19 and the transmission hole 21 of the debris collection means 22.

  That is, the laser beam 3 recovers the debris 13 generated when patterning the transparent conductive film 27 on the multilayer film formed on the surface of the glass substrate 4, which is an object to be processed placed on the stage 18. The debris collection means 22 having Then, the transparent conductive film 27 formed on the surface of the substrate 4 is irradiated through the upper transmission window 19 formed in the upper part of the housing 23 of the debris collection means 22 and the transmission hole 21 formed in the bottom of the housing 23. Is done. The housing 23 of the debris collection means 22 is provided with an exhaust pump 24 and four pipes that constitute the air flow introduction portions 25a to 25d. In FIG. 1, only the transparent conductive film 27 is shown in the multilayer film laminated on the substrate 4, but is not limited to the example of FIG. 1, and the multilayer film includes other resin layers, metal layers, and the like. Of course, you may leave.

As the laser light source of the laser control device 1, for example, an excimer laser is used. There are a plurality of types of excimer lasers with different laser media, and XeF (351 nm), XeCl (308 nm), KrF (248 nm), ArF (193 nm), and F ₂ (157 nm) exist from the longer wavelength. However, the laser is not limited to an excimer laser, and may be a solid laser, a CO ₂ laser, or the like.

  The beam shaper 14 shapes the laser light 3 from the laser light source, equalizes the beam intensity, and outputs it. The mask or variable aperture 15 has a predetermined pattern shape, and passes the laser light 3 shaped by the beam shaper 14 to process it into a beam having a predetermined pattern. As the mask or variable aperture 15, for example, a perforated mask formed of a metal material, a photomask formed of a transparent glass material or a metal thin film, a dielectric mask formed of a dielectric material, or the like is used. The projection lens 16 projects the laser light 3 that has passed through the pattern of the mask or variable aperture 15 onto the processing surface of the substrate 4 that is the processing target on the stage 18 at a predetermined magnification.

  The stage 18 is arranged so that the laser light 3 projected from the projection lens 16 is focused on the processed surface of the substrate 4. This stage 18 is an XY stage that can be moved and positioned along a plane perpendicular to the optical axis of the laser beam 3 so that the laser beam 3 can scan the processing surface of the substrate 4 that is the processing target. It has a configuration such as a three-axis stage.

  FIG. 2 is a perspective view of the debris collection means 22 having a debris collection mechanism. The housing 23 of the debris collection means 22 includes a substantially disc-shaped vortex forming base 23a disposed opposite to the object to be processed, and a cylindrical gas outlet 23b erected at a substantially central position of the vortex forming base 23a. The chamber 23c has a substantially cubic shape placed on the gas outlet 23b, and these are made of aluminum or stainless steel. The vortex forming base 23a functions as a vortex forming section, and the gas outlet section 23b and the chamber 23c function as a vortex air exhaust section.

  In the upper part of the chamber 23c, an upper transmission window 19 through which the laser beam 3 is transmitted is formed, for example, made of quartz in the case of a KrF laser or calcium fluoride in the case of an ArF laser, and is formed on one side plate of the chamber 23c. Is provided with an exhaust hole 32. An exhaust duct (not shown) is fitted into the exhaust hole 32, and the collected debris 13 is exhausted in the direction of arrow A using the exhaust pump 24 shown in FIG.

  Further, gas introducing portions 27a and 27b for introducing a gas for floating the debris collecting means 22 are formed on the other side surface of the chamber 23c. A vortex forming mechanism is installed in the gas outlet 23b and the vortex forming base 23a below the chamber 23c, and the debris 13 is collected in a spiral shape as indicated by an arrow B at the center of the vortex forming base 23a. To do. As shown in FIG. 2, gas introducing portions 25a, 25b, 25c, and 25d are disposed at positions obtained by dividing the circumference of the vortex forming base 23a into four equal parts, and the gas introducing portions 25a, 25b, and 25c are arranged. , 25d are supplied from the directions of arrows C1, C2, C3, C4, respectively, and the gas is introduced into the vortex forming base 23a.

  The gas introduced from the gas introduction part is a so-called assist gas, and includes CDA (clean dry air), an inert gas such as helium and neon, and nitrogen. As described above, when the assist gas is supplied to the vicinity of the laser light irradiation surface in the vortex forming base 23a, generation of debris can be suppressed.

  FIG. 3 shows a vortex forming mechanism formed on the lower surface of a substantially disk-shaped vortex forming base 23a constituting the casing 23 of the debris collection means 22. As shown in FIG. FIG. 3 is a view of the vortex forming base 23a as viewed from below. A transmission hole 21 for transmitting the laser beam 3 is formed in the center of the disk of the vortex forming base 23a. A vortex forming plate 38 that forms the vortex shown in FIG. 6 is concentrically arranged around the transmission hole 21.

  As shown in FIGS. 6 and 7, the vortex forming plate 38 has an inner diameter 38 a having the same diameter as that of the transmission hole 21 in a central portion of a metal such as aluminum formed in a substantially disk shape. Further, a vortex forming space 36 of a substantially hexagonal groove (or a substantially circular groove) is formed so as to surround the inner diameter 38 a, that is, between the transmission hole 21 and the vortex forming groove 35. The vortex forming space 36 functions as a space for forming a vortex airflow (annular airflow) as will be described later with reference to FIG. 4, and the gas supplied from each vortex forming groove 35 to the vortex forming space 36 is vortex formed. The gas colliding with the wall surface (see FIG. 7) of the working plate 38 flows along the wall surface of the vortex forming plate 38 to generate an annular air flow. By sucking the annular airflow upward by the exhaust pump 24 shown in FIG. 1, a vortex with less turbulence is formed.

  Six radial grooves 38b having a groove width W2 (see FIG. 6) are formed from the inner peripheral side to the outer peripheral side along the hexagonal sides of the vortex forming space 36 described above. Each of the radial grooves 38b functions as a vortex forming groove 35 for collecting the debris 13 generated by the irradiation of the laser beam 3 on the inner diameter 38a at the center at a high speed.

  The vortex forming groove 35 is drawn on a connection point between a concentric circular groove 37 concentric with a transmission hole 21 described later and the central axis of the vortex forming groove 35 on the surface of the vortex forming plate 38 facing the substrate 4. The tangent line has a predetermined angle φ 1 and communicates with the transmission hole 21 through the vortex forming space 36. The size of the angle φ1 is determined by the direction of the gas flowing through the concentric groove 37 (the direction of rotation of the vortex airflow). For example, when the gas flows in the counterclockwise direction in the concentric circular groove 37 in FIG. 3, the angle φ1 formed by the vortex forming groove 35 and the tangent line is located on the leeward side, and the vortex so that the angle φ1 at this time becomes an acute angle. A forming groove 35 is formed. On the other hand, the angle (180-φ1) formed by the windward vortex forming groove 35 and the tangent is an obtuse angle.

  Regarding the radial grooves 38b constituting the vortex forming groove 35 shown in FIG. 6, the debris 13 scattered from the machining surface is rapidly collected in the vortex forming space 36, and therefore the discharge portion 38f for discharging the gas on the vortex forming space 36 side is provided. The groove width W2 of the supply part 38e that supplies the gas on the outer peripheral side of the disk with respect to the groove width W1 is increased to an opening ratio of a predetermined ratio. For example, it is preferable to select the ratio of the groove width W1 near the discharge unit 38f and the groove width W2 near the supply unit 38e to an opening ratio of W1: W2 = 1: 1.5 to 2.5. In this way, by providing an appropriate opening ratio between the discharge portion side and the supply portion side of the vortex forming groove 35 provided in the vortex forming plate 38, the rectified gas is supplied from the concentric circular groove 37 to the vortex forming plate. It is possible to improve the flow velocity of the gas flowing into the vortex formation space 36 when entering the vortex 38 and to easily entrain the debris 13 in the vortex.

  Further, in order to efficiently recover the debris 13 collected in the central vortex forming space 36 of the vortex forming plate 38, the inner diameter 38 a in the vicinity of the opening of the transmission hole 21, that is, the wall surface portion where the transmission hole 21 is connected to the vortex formation space 36. Then, an R shape (curved portion) or a tapered shape 38d as shown in FIG. 7 is formed. By doing so, the air resistance at the opening of the vortex forming plate 38 is reduced, so that debris can be discharged smoothly.

  By the way, if the vortex forming space 36 provided on the inner peripheral side of the vortex forming plate 38 is too wide, vortex formation does not occur. In order to generate an appropriate annular air flow in the turbulent air flow with little turbulence, that is, the vortex forming space 36, the diameter R2 of the vortex forming space 36 should be at least about 1.5 times the diameter R1 of the transmission hole 21. I confirmed that it was appropriate. The vortex forming space 36 is connected to the transmission hole 21 of the vortex forming base 23a through a screw hole (not shown) formed in the vicinity of the outer periphery of the convex portion left in a substantially triangular shape of the vortex forming plate 38, for example. Mounted concentrically. Of course, the vortex forming plate 38 may be integrally formed with the vortex forming base 23a.

  Further, as shown in FIG. 3, a concentric groove 37 communicating with the vortex forming groove 35 is formed around the vortex forming plate 38 fixed to the vortex forming base 23a in order to form a vortex with less disturbance. Are formed, and four gas supply holes 34 communicating with the gas introducing portions 25a, 25b, 25c, and 25d are formed at four equal positions of the concentric grooves 37. In this way, gas is supplied by providing a concentric (annular) groove concentrically with the permeation hole 21 on the outer peripheral side of the vortex forming plate 38 in the previous stage where the gas flows into the vortex forming plate 38 at the bottom of the vortex generating mechanism. The flow of the gas introduced through the hole 34 is rectified, and an air flow is created in the direction of rotation of the vortex, that is, in accordance with the vortex forming groove 35 provided in the vortex forming plate 38. By supplying the groove 35 for use, a vortex with less turbulence is formed in the vortex forming space 36. In this example, four gas supply holes 34 are provided, but the present invention is not limited to this.

  Around the concentric circular groove 37, a plurality of floating grooves 33 for floating the debris collection means 22 from the object to be processed are added. The debris collection means 22 is levitated by flowing a gas from a gas blowing hole (not shown) into the levitation groove 33. As a result, the unevenness of the irradiation surface of the substrate 4 that is the object to be processed can be absorbed, and the distance from the irradiation surface of the debris collection means 22 can always be kept at 50 to 100 μm or less. It is easy to collect.

  Here, for the purpose of maximizing the debris recovery capability by forming a vortex with as little disturbance as possible and collecting the debris 13 in the center, as shown in FIG. A certain angle φ2 is provided at the gas introduction portions 25a, 25b, 25c, and 25d with respect to the gas supply hole 34 to be supplied (ideally 90 degrees). That is, with respect to the straight line connecting the center of the transmission hole 21 and each gas supply hole 34a, 34b, 34c, 34d, the central axis of each base introduction portion 25a, 25b, 25c, 25d is the direction of each vortex forming groove 35, respectively. In other words, they are arranged with an angle φ2 corresponding to the direction of the air flow to be generated in the concentric circular grooves 37. For example, when a counterclockwise air flow is generated in the concentric groove 37 in FIG. 5, the gas flowing through the concentric groove 37 is smoothly taken into the vortex forming groove 35 with less resistance. When the airflow in the counterclockwise direction is generated in the groove 37, the gas introduction portions 25a, 25b, 25c, and 25d are installed at an angle φ2 on the windward side. By doing so, a counterclockwise rectified circular flow corresponding to the direction of each vortex forming groove 35 is created in the concentric circular groove 37, and an efficient vortex flow can be formed. it can.

  The vortex generation method in the above configuration will be described with reference to FIG. FIG. 4 shows the bottom surface of the vortex forming base 23a similar to FIG. The gas supplied from the four gas supply holes 34 bored in the concentric grooves 37 formed on the outer periphery of the vortex forming plate 38 is indicated by arrows B1, B2, B3, and B4 along the concentric grooves 37. Thus, a counterclockwise annular airflow is generated. This annular airflow is indicated by arrows D1, D2, D3, D4, D5, and D6 from the supply portion 38e on the side where the gas in the radial groove 38b formed radially from the transmission hole 21 is supplied to the discharge portion 38f on the transmission hole 21 side. The airflow shown is generated and discharged, and circular airflows indicated by counterclockwise arrows E1, E2, E3, and E4 are generated in the circumferential portion of the vortex forming space 36. Then, by causing the exhaust pump 24 to act on the atmosphere of the circular airflow represented by the arrows E1, E2, E3, and E4, the spiral or spiral updraft is generated in the gas outlet 23b and the chamber. The generated gas that has risen in the permeation hole 21 is exhausted to the outside through the exhaust hole 32.

  As described above, according to the debris collection mechanism and the debris collection method of the present invention, it is possible to efficiently collect the processing scattered matter generated when patterning the transparent conductive film on the workpiece. Therefore, according to the laser processing apparatus and the laser processing method using the debris recovery mechanism and the recovery method, the processing scattered matter generated from the processing target when the laser beam is irradiated is efficiently removed. Debris adhering to an object can be reduced, and patterning accuracy and quality can be improved. In this way, high-quality patterning of the transparent conductive film by laser is possible, and it can be removed without leaving debris by a new process replacing the photolithography process.

  Further, in the above invention, by concentrating the concentric grooves 37 and the air flow of the supply gas, the flow of the gas flowing into the vortex forming plate 38 can be rectified to form a vortex gas with less turbulence.

  In the above invention, the vortex-forming radial upper groove 38b is added to the vortex-forming plate 38 to give a predetermined opening ratio, thereby improving the flow rate of the gas entering the vortex-forming space and facilitating the debris to be caught in the vortex. be able to.

  In the above invention, the vortex forming plate 38 is provided with the vortex forming space 36 having a diameter of, for example, 1.5 times or less the diameter of the transmission hole 21, so that a vortex with less disturbance can be formed.

  Further, in the above invention, an R shape or a tapered shape 38d is added to the inner diameter 38a provided in the vortex forming space 36, and the debris caught in the vortex is discharged from the exhaust permeation hole 21, thereby opening the vortex forming space 36 at the opening. The air resistance of the vortex can be reduced and recovered.

  Further, in the above invention, the debris collects in the transmission hole 21 at the center of the laser light irradiation area due to the vortex air current, so that it is possible to suppress scattering of the debris around the laser light irradiation portion. Furthermore, even if debris remains in the laser irradiation part, the debris is collected in the transmission hole 21 at the center of the irradiation area, so that the debris can be irradiated with overlapping laser light, and the debris can be completely removed. .

It is a whole block diagram which shows the example of 1 form of the laser processing apparatus of this invention. It is a perspective view of the debris collection | recovery mechanism used for the laser processing apparatus of this invention. It is a bottom view of the base part of the debris collection | recovery mechanism used for the laser processing apparatus of this invention. It is a bottom view of the base part for demonstrating the spiral generation method of the debris collection | recovery mechanism used for the laser processing apparatus of this invention. It is a top view for demonstrating the generation method of the concentric airflow by the concentric groove | channel of the debris collection | recovery mechanism used for the laser processing apparatus of this invention. It is a top view of the vortex formation plate of the debris collection | recovery mechanism used for the laser processing apparatus of this invention. It is an AA cross-sectional arrow view of FIG. It is a schematic block diagram which shows one example of the conventional laser processing apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Laser control apparatus, 2 ... Laser irradiation apparatus, 3 ... Laser beam, 4 ... Substrate, 5 ... Objective lens, 6 ... Black matrix, 7 ... Processing table, 8 ... Marking area, 9 ... Suction duct, 10 ... Exhaust device, 11 ... Gas delivery device, 12 ... Blow nozzle, 13 ... Debris (processed scattered matter), 14 ... -Beam shaper, 15 ... Mask or variable aperture, 16 ... Projection lens, 18 ... Stage, 19 ... Upper transmission window, 20 ... Laser processing device, 21 ... Transmission hole, 22 ... debris collection means, 23 ... casing, 23a ... vortex forming base, 23b ... gas outlet, 23c ... chamber, 24 ... exhaust pump, 25a-25d, 27a , 17b ... Gas introduction part, 27 ... Transparent conductive film, 3 ... Exhaust holes, 33 ... Floating grooves, 34 ... Gas supply holes, 35 ... Vortex forming grooves, 36 ... Vortex forming spaces, 37 ... Concentric circular grooves, 38, ...・ Vortex forming plate, 38a ... inner diameter, 38b ... radial groove, 38d ... R shape or taper part, 38e ... supply part, 38f ... discharge part

Claims (12)

In a laser processing apparatus that performs pattern processing of a transparent conductive film formed on a multilayer film on a substrate using laser light,
Comprising debris collection means having a vortex generating mechanism for generating a vortex airflow by flowing a gas in the vicinity of the laser irradiation portion of the transparent conductive film;
The debris collecting means is disposed in the vicinity of the substrate, and the processing scattered matter before and after deposition on the substrate generated by laser irradiation is collected in the vortex and collected together with the gas and exhausted to the outside. The laser processing apparatus characterized by the above-mentioned. The debris collection means comprises a vortex air exhaust section provided with a transmission hole which is a flow path of a vortex air flow communicating with the exhaust hole as well as an optical path of the laser beam, and a vortex forming section disposed to face the substrate,
The vortex forming portion includes a vortex forming plate in which a radial vortex forming groove corresponding to the rotation direction of the vortex airflow and communicating with the transmission hole is formed on a surface of the vortex forming portion facing the substrate. And
A gas is introduced into the vortex forming groove of the vortex forming plate, and the gas that flows through the vortex forming groove to form a vortex airflow is passed outside the exhaust hole through the transmission hole of the vortex air exhaust portion. The laser processing apparatus according to claim 1, wherein exhaust is performed. The vortex-forming groove is formed so that an angle corresponding to a leeward side of the vortex airflow is an acute angle among angles formed by the vortex-forming groove with respect to a tangent of a concentric circle with the transmission hole. 2. The laser processing apparatus according to 2. An annular groove communicating with the vortex forming groove is provided on the outer peripheral side of the surface of the vortex forming plate facing the substrate,
A gas is introduced from a gas supply hole formed in the annular groove, the gas is supplied to the vortex forming groove, and an air flow that is the same as the direction of rotation of the vortex air flow is generated in the annular groove. The laser processing apparatus according to claim 2. A gas introduction part for introducing gas into the gas supply hole formed in the annular groove;
The gas introduction portion is associated with the arrangement of the vortex forming grooves and is inclined to the windward side in the rotational direction of the vortex air flow to be generated with respect to a straight line connecting the center of the transmission hole and the gas supply hole of the annular groove. The laser processing apparatus according to claim 4, wherein the laser processing apparatus is installed. The groove width on the annular groove side in the groove for vortex formation formed on the vortex forming plate is increased at a predetermined ratio with respect to the groove width on the transmission hole side. Laser processing equipment. When the groove width on the annular groove side in the vortex forming groove formed on the vortex forming plate is defined as W1, and the groove width on the transmission hole side is defined as W2,
W1: W2 = 1: 1.5-2.5
The laser processing apparatus according to claim 6, wherein: The laser processing apparatus according to claim 2, wherein a space for generating an annular airflow is provided between the transmission hole of the vortex air exhaust unit and the vortex forming groove of the vortex forming plate. The laser processing apparatus according to claim 8, wherein a curved surface shape or a tapered shape is formed on a wall surface in the vicinity of the opening portion of the transmission hole connected to the space forming the annular airflow. In a laser processing method for performing pattern processing of a transparent conductive film formed on a multilayer film on a substrate using laser light,
The debris collection means having a vortex generating mechanism for generating a vortex air current by flowing a gas in the vicinity of the laser irradiation portion of the transparent conductive film is brought close to the substrate and deposited before the deposition on the substrate generated by the laser irradiation. The laser processing method is characterized in that the processed scattered matter after being entrained in the vortex is collected together with the gas and exhausted to the outside. In the debris collection mechanism that removes processing scattered matter generated by laser irradiation at the time of pattern processing of the transparent conductive film formed on the multilayer film on the substrate using laser light,
The vortex generator has a vortex generator that generates a vortex airflow by allowing a gas to flow in the vicinity of the laser irradiation portion of the transparent conductive film, and the vortex generator that is disposed in proximity to the substrate causes A debris collection mechanism characterized in that processing scattered matter before and after deposition is caught in the vortex, collected together with the gas, and exhausted to the outside. In a debris collection method for removing processing scattered matter generated by laser irradiation when patterning a transparent conductive film formed on a multilayer film on a substrate using laser light,
There is a vortex generating part that generates a vortex air current by flowing a gas in the vicinity of the laser irradiation part of the transparent conductive film, the vortex generating part is brought close to the substrate, and is deposited on the substrate generated by laser irradiation. A debris collection method characterized in that the processing scattered matter before and after depositing is entrained in the vortex and collected together with the gas and exhausted to the outside.

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