JP2020008741A - Apparatus and method for manufacturing display panel - Google Patents

Abstract

To prevent the quality of a display panel from being reduced while reducing the number of processes or a manufacturing cost by patterning a thin film by laser processing.SOLUTION: An apparatus for manufacturing a display panel, capable of manufacturing the display panel obtained by laminating a plurality of thin films including an organic film on a substrate includes a thin film patterning device 200 for patterning a thin film in the state of storing a substrate 110 having the thin film in a vacuum chamber. The vacuum chamber 221 has a window pane 222 transmitting a laser beam; the thin film patterning device 200 arranged in the outside of the vacuum chamber 221 emits the laser beam LB toward the substrate 110 having the thin film through the window pane 222 to partially remove the thin film; and cover glass 225 transmitting the laser beam is arranged at a position separated from the substrate 110 having the thin film between the window pane 222 and the substrate 110 having the thin film in the vacuum chamber 221.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to an apparatus and a method for manufacturing a display panel in which a plurality of thin films including an organic film are stacked on a substrate, and more particularly to a technique for patterning a thin film.

In recent years, as a display panel used for a display device such as a television, an organic EL display panel in which a plurality of organic EL elements are arranged in a matrix on a substrate has been put to practical use.
In an organic EL display panel, generally, a light emitting layer of each organic EL element and an adjacent organic EL element are separated by a partition made of an insulating material. In an organic EL display panel for color display, the organic EL element is red. (R), green (G), and blue (B) (hereinafter, simply referred to as R, G, and B) form sub-pixels that emit light, and adjacent R, G, and B sub-pixels are combined. Unit pixels for color display are formed.

Each organic EL element is formed by laminating a plurality of thin films including an organic light emitting layer between a pair of electrodes. When driving, a voltage is applied between the pair of electrodes, and holes and electrons injected into the light emitting layer are applied. It emits light in association with the recombination.
Usually, the manufacturing process of such an organic EL display panel involves a process of patterning a specific thin film. In a conventional patterning method of a thin film, for example, after forming a patterned resist mask using a photolithography method on the thin film, an unnecessary portion of the thin film is removed by an etching method or the like. Patterning.

JP 2008-288074 A JP 2017-123342 A

  However, in the conventional patterning method as described above, the steps of forming a resist film, exposing the resist film with a photomask, developing the exposed resist film, removing unnecessary portions of the thin film by etching, and removing the resist after etching. Many steps such as a film removing step and a cleaning step after the removal are required, and it is extremely difficult to reduce the tact time and the manufacturing cost.

As another patterning method, a method of sublimating and removing unnecessary portions of a thin film by scanning with a laser beam has been proposed. According to such a method, it is possible to completely eliminate the steps of forming a mask by photolithography and cleaning.
However, in particular, the characteristics of an organic film including a light emitting layer used in an organic EL display panel are deteriorated by the influence of oxygen and moisture in the air. It is desirable that the thin film component sublimated by laser light irradiation and scattered in the closed space be reattached to the organic EL display panel and cause deterioration in quality. is there.

Such a problem exists not only in the manufacture of an organic EL display panel but also in the manufacture of another display panel formed by stacking a plurality of thin films including an organic film.
The present disclosure has been made in view of the above problems, and it is possible to reduce the number of steps, reduce the manufacturing cost, and display a thin film that can be patterned without deteriorating the characteristics of the organic film. It is an object of the present invention to provide a panel manufacturing apparatus and a manufacturing method.

  In order to achieve the above object, a display panel manufacturing apparatus according to an embodiment of the present disclosure is a display panel manufacturing apparatus that manufactures a display panel in which a plurality of thin films including an organic film are stacked over a substrate, A transparent window provided with a first transparent plate that transmits light, and a chamber for accommodating a substrate with a thin film on which at least one thin film is formed, and the transparent window and the substrate with a thin film in the chamber And a second transparent plate disposed at a position separated from the substrate with a thin film and transmitting the laser light; and a first transparent plate and the second transparent plate disposed outside the chamber. And a laser irradiation unit for emitting the laser beam toward the thin film-attached substrate via the thin film and partially removing the at least one thin film.

  Further, a display panel manufacturing method according to another aspect of the present disclosure is a display panel manufacturing method in which a plurality of thin films including an organic film are stacked on a substrate, wherein the first transparent plate that transmits laser light is provided. A substrate housing step of housing a thin-film-equipped substrate on which at least one layer of thin film is formed in a chamber having a transparent window mounted thereon, with the main surface on the side on which the thin film is formed facing the transparent window. And an atmosphere adjusting step of adjusting the atmosphere in the chamber to an atmosphere of a vacuum or an inert gas, and directing a laser beam from outside the chamber to the processing surface of the substrate with the thin film through the transparent window. Injecting, including a thin film removing step of partially removing the thin film, in the chamber, between the transparent window and the substrate with a thin film, at a position separated from the substrate with a thin film, the Leh Wherein the second transparent plate which transmits over light is disposed.

  According to the display panel manufacturing apparatus and the manufacturing method according to an embodiment of the present disclosure, the number of steps is small, the manufacturing cost can be reduced, and the thin film can be patterned without deteriorating the characteristics of the organic film. .

1 is a schematic diagram illustrating a configuration of a thin film patterning device according to an embodiment of the present disclosure. FIG. 2 is a perspective view when the thin film patterning apparatus of FIG. 1 is cut along a plane passing through a line PP. It is a block diagram showing the whole composition of an organic EL display. It is the schematic plan view which expanded a part of image display surface of the organic EL display panel in an organic EL display device. FIG. 5 is a schematic sectional view taken along line AA of FIG. 4. 3A to 3D are partial cross-sectional views schematically showing a part of a process of manufacturing an organic EL element. FIGS. 7A to 7C are partial cross-sectional views schematically showing the manufacturing process of the organic EL device following FIG. (A)-(c) is the fragmentary sectional view which shows typically the manufacturing process of the organic EL element following FIG. 5 is a flowchart illustrating a manufacturing process of an organic EL display panel. FIG. 3 is a partial cross-sectional view schematically illustrating a part of the manufacturing process of the organic EL element, for explaining the process leading to one embodiment of the present disclosure. FIG. 11 is a schematic view of a thin film patterning apparatus assumed when the manufacturing process of FIG. 10 is performed. (A), (b) is a figure for demonstrating the conventional thin film patterning method. FIG. 13 is an enlarged schematic cross-sectional view illustrating a main part of FIG.

<< Background of one embodiment of the present disclosure >>
The organic EL display panel has a laminated structure in which a pixel electrode, an organic layer (including a light-emitting layer), and a common electrode are sequentially provided on a substrate. The common electrode is often formed over the entire image display area on the substrate.
In particular, in a top emission type organic EL display panel, since a material having light transmittance is used for a common electrode, the resistance value is high, and a power supply unit (not shown) arranged on a peripheral portion of the substrate is used. There is a concern that the voltage drop varies depending on the distance from the device to the individual organic EL elements, thereby causing variations in luminance within the screen.

In order to suppress such variations in luminance, an auxiliary electrode made of a conductive material such as a metal is provided on a substrate, and the auxiliary electrode and the common electrode are electrically connected to each other to reduce a voltage drop at the common electrode. The configuration to suppress is adopted.
FIGS. 10A to 10D are schematic cross-sectional views schematically showing a part of the manufacturing process of the organic EL display panel in the mode in which the auxiliary electrode is formed in the same layer as the pixel electrode.

As shown in FIG. 10A, a pixel electrode 713 is formed for each organic EL element on a substrate 711, an auxiliary electrode 731 extending in the Y-axis direction is formed, and a pixel electrode 713 partitioned by a partition 714 is formed. A light emitting layer 715 is stacked above.
Then, a common electron transport layer 716 is formed (FIG. 10B). Thereafter, a step of removing the electron transporting layer 716 on the auxiliary electrode 731 and forming a contact opening for connection to the upper layer common electrode is performed. As described above, the photolithography method and the etching method are combined. According to the patterning, increase in task time and manufacturing cost is unavoidable. Therefore, the inventors of the present application scan a laser beam to sublimate and remove the electron transport layer 716 on the auxiliary electrode 731 (hereinafter, referred to as a method). , "Laser patterning method") (see FIG. 10 (c)).

If the common electrode 717 is stacked after forming the contact opening, the common electrode 717 and the auxiliary electrode 731 are in direct contact with each other, so that a voltage drop in the common electrode 717 is largely suppressed, and the occurrence of luminance unevenness or the like is prevented. (FIG. 10D).
By the way, it is known that the characteristics of various organic materials forming an organic EL display panel are deteriorated by the influence of oxygen and moisture in the atmosphere, and the above laser patterning method is performed in a vacuum atmosphere. Is desirable.

FIG. 11 is a schematic diagram showing a configuration example of a patterning apparatus 800 that can be assumed in this case.
As shown in the figure, the patterning device 800 includes a laser processing device 810 and a vacuum chamber 820 having a window glass 821 mounted at a position facing the laser processing device 810. The laser processing device 810 includes a laser head (not shown) that emits a laser beam, and is configured to scan the laser beam by moving the laser head in the X-axis direction and the Y-axis direction in the drawing.

  In the vacuum chamber 820, the intermediate product 710 of the organic EL display panel formed up to the electron transport layer 716 on the substrate 711 is carried into the vacuum chamber 820, and the pressure is reduced by a vacuum pump (not shown) to a vacuum atmosphere. Laser light LB is irradiated from the laser processing device 810 through the window glass 821 to sublimate and remove the electron transport layer 716 on the auxiliary electrode 731.

However, it has been found that in such a patterning apparatus 800, the processing accuracy is deteriorated, and the finished organic EL display panel may be varied in durability and luminous efficiency of each organic EL element.
That is, the resin material forming the electron transport layer 716 is sublimated and scattered into the vacuum chamber 820 by the irradiation of the laser light, and the scattered matter (debris) D contacts the window glass 821 and solidifies. Since it adheres and lowers the transmittance of the laser beam LB of the window glass 821, the processing accuracy deteriorates, and in the worst case, the processing becomes impossible.

In addition, debris that has not been attached to the window glass 821 eventually falls and attaches to the surface of the electron transport layer 716. When such foreign matter remains on the electron transport layer 716, a defect occurs in the common electrode 717 and the sealing layer which are subsequently laminated, and moisture penetrates from the outside, thereby deteriorating the light emission characteristics of the organic EL element and causing darkness. Spots may be generated.
In order to solve such a problem, Patent Document 1 discloses the following patterning method.

FIGS. 12A and 12B are diagrams schematically illustrating a patterning method disclosed in Patent Document 1. FIG.
First, as shown in FIG. 12A, in a vacuum atmosphere in a vacuum chamber 830, a transparent substrate 720 made of glass or the like is brought into close contact with an intermediate product 710 of an organic EL display panel to form a combined substrate 730. Then, after being taken out of the vacuum chamber 830, as shown in FIG. 12B, patterning is performed by irradiating a laser beam LB with a laser processing device 810 in the air.

FIG. 13 is a partially enlarged cross-sectional view of the intermediate product 710 of the organic EL display panel showing a state in which the electron transport layer 716 on the auxiliary electrode 731 is removed by the laser light LB. Patent Literature 1 states that all the debris D sublimated by the laser beam LB adheres to the transparent substrate 720 and does not adhere to other organic EL elements or the auxiliary electrode 731.
However, according to the method described in Patent Document 1, the step of forming the combination substrate 730 in the vacuum chamber 830, the step of unloading the combination substrate 730 from the vacuum chamber 830, and after patterning, the transparent substrate 720 is pulled from the intermediate product 710. An extra step of peeling is required. In particular, in the step of peeling the transparent substrate 720, there is a possibility that the partition 714 will be damaged and the quality will be degraded.

In addition, the cross section of the space S surrounded by the auxiliary electrode 731, the partition 714, and the transparent substrate 720 is actually a minute space having a width of about 40 μm and a height of about 1 μm. It cannot be said that there is no danger that S will be filled and will not necessarily completely adhere to the transparent substrate 720 and re-adhere to the auxiliary electrode 731.
Patent Document 2 discloses a process having almost the same contents, and has the same problem as Patent Document 1.

Therefore, the inventors of the present application have adopted a laser patterning method for patterning a thin film, while reducing the man-hours and manufacturing costs, and eliminating as much as possible the adverse effects of debris generated during patterning. As a result of earnest research, the present disclosure has been made to achieve one embodiment of the present disclosure in order to enable production of a high-quality organic EL display panel.
<< Summary of one embodiment of the present disclosure >>
One embodiment of the present disclosure is a display panel manufacturing apparatus that manufactures a display panel in which a plurality of thin films including an organic film are stacked above a substrate, and includes a first transparent plate that transmits a laser beam. A chamber having a window and accommodating a substrate with a thin film on which at least one layer of a thin film is formed; and a space between the transparent window and the substrate with a thin film in the chamber, being separated from the substrate with a thin film. And a second transparent plate that transmits the laser light, and is disposed outside the chamber, and passes the laser light to the substrate with the thin film via the first transparent plate and the second transparent plate. A laser irradiation unit that emits light toward the laser beam and partially removes the at least one thin film.

  As described above, since the second transparent plate is interposed between the first transparent plate disposed in the transparent window of the chamber and the substrate with the thin film, the second transparent plate is scattered even if the components of the thin film are scattered by the laser light irradiation. Since it contacts and solidifies and adheres to the plate first, debris can be prevented as much as possible from re-adhering to the substrate with the thin film or adhering to the transparent window. As a result, the quality of the display panel can be kept good while the number of steps is significantly reduced as compared with the conventional method.

In another aspect of the present disclosure, the apparatus further includes an atmosphere adjustment unit that adjusts the atmosphere in the chamber to a vacuum or an atmosphere of an inert gas.
According to this aspect, the thin film can be patterned in an environment in which the characteristics of the display panel are not further deteriorated.
Further, in another aspect of the present disclosure, the second transparent plate is provided so as to be exchangeable.

According to this aspect, it is easy to replace the second transparent plate to which debris has adhered, and maintenance of the manufacturing apparatus is greatly simplified.
Further, in another aspect of the present disclosure, when viewed in a plan view, all portions to be laser-processed of the substrate with a thin film are included in a range where the transparent regions of the first transparent plate and the second transparent plate overlap. The size, shape, and positional relationship of the first transparent plate and the second transparent plate are set so that the first transparent plate and the second transparent plate are arranged in the same manner.

According to this aspect, the entire processing area of the substrate with the thin film can be laser-processed, and the second transparent plate always exists immediately above the laser-processed portion of the substrate with the thin film, and the scattered material can be collected without leakage. Becomes possible.
In another aspect of the present disclosure, the first transparent plate and the second transparent plate are both parallel to a main surface of the substrate with a thin film, and the laser light is applied to a main surface of the first transparent plate. Incident vertically.

According to this aspect, the laser beam emitted from the laser irradiation unit is refracted when transmitted through the first transparent plate and the second transparent plate, so that the course of the laser beam does not shift, and the processing accuracy is improved.
In another aspect of the present disclosure, the distance between the second transparent plate and the substrate with a thin film is such that the material of the thin film sublimated and scattered by the irradiation of the laser light contacts the second transparent plate and solidifies. The distance is set within a range that does not adhere again to the substrate.

According to this aspect, the scattered matter of the thin film can be efficiently attached to the second transparent plate, and the scattered matter can be prevented from being attached to other unnecessary portions.
In another aspect of the present disclosure, the thin film formed above the substrate is an organic film stacked on a metal auxiliary electrode, and the laser irradiation unit has a predetermined pattern, The organic film on the auxiliary electrode is removed by scanning with a laser beam.

According to this aspect, the organic film on the auxiliary electrode can be reliably removed, and the electrical contact with the electrode film formed later can be improved.
In another aspect of the present disclosure, at least the first transparent plate of the first transparent plate and the second transparent plate is made of quartz glass.
Quartz glass has good transparency of laser light and excellent durability, so that high processing accuracy can be maintained for a long time.

  Another embodiment of the present disclosure is a method for manufacturing a display panel in which a plurality of thin films including an organic film are stacked on a substrate, the method including a transparent window provided with a first transparent plate that transmits laser light. A substrate storage step of storing a substrate with a thin film on which at least one layer of thin film is formed in a chamber with the main surface on the side on which the thin film is formed facing the transparent window; An atmosphere adjusting step of adjusting to an atmosphere of a vacuum or an inert gas, and injecting a laser beam from the outside of the chamber through the transparent window toward a processing surface of the substrate with a thin film, and partially exposing the thin film. A thin film removing step of removing the laser light at a position in the chamber between the transparent window and the thin film-attached substrate and apart from the thin film-attached substrate. Board is arranged It has been.

With the manufacturing method according to the above aspect, it is possible to manufacture a high-quality display panel while greatly reducing the number of steps as compared with the conventional method.
Embodiment
Hereinafter, an apparatus and a method for manufacturing an organic EL display panel according to an embodiment of the present disclosure will be described with reference to the drawings. In addition, each drawing includes a schematic diagram for convenience of explanation, and the scale of each member and the ratio of length and width may be different from the actual one.

1. Configuration of Thin Film Patterning Apparatus 200 FIG. 1 is a schematic diagram illustrating a configuration of a thin film patterning apparatus 200 according to an embodiment of the present disclosure. FIG. 2 is a perspective view when the thin film patterning apparatus 200 is cut along a plane passing through the line PP of FIG.
As shown in FIG. 1, the thin film patterning apparatus 200 scans a laser beam to remove an unnecessary portion of the thin film formed on the substrate 11 (laser irradiation unit) 210, and a thin film to be processed is formed. Section 220 for accommodating a substrate 110 (an intermediate product of the organic EL display panel 10; hereinafter, referred to as a “substrate with a thin film”) 110, and a port 230 for carrying in a substrate for carrying the substrate 110 with a thin film into the chamber section 220 And a vacuum pump 240 for reducing the pressure in the chamber 220 to a vacuum state.

  As shown in the perspective view of FIG. 2, the laser processing apparatus 210 includes a laser head unit 211 having a laser light source and an optical system for converging laser light therein, and the laser head unit 211 is moved in a direction parallel to the Y axis. A horizontal gantry 212 slidably held, a pair of legs 213 for holding the horizontal gantry 212 at both ends in the longitudinal direction, and a pair of guide rails 214 arranged below each leg 213 and extending in the X-axis direction. Etc.

As the laser light source in the laser head unit 211, for example, a YAG laser is used. However, the laser light source is not limited to this as long as it can generate laser light in a wavelength region absorbed by a thin film to be processed.
In addition, for example, a linear motor 2111 is incorporated as a drive source inside the housing of the laser head unit 211, and by controlling the drive source, the laser head unit 211 moves along the guide groove 2121 of the horizontal gantry 212. To move in the Y-axis direction.

Each leg 213 is provided with, for example, a servo motor 2131 as a drive source. The pair of legs 213 is synchronized with each other via a known drive mechanism such as a screw feed mechanism or a wire drive mechanism to guide the legs. It can move in the X direction along the guide groove 2141 of the rail 214.
A control unit (not shown) controls the output of the laser light source of the laser head unit 211 and controls the driving of the linear motor 2111 and the servo motor 2131 so that the laser light emitted from the laser head unit 211 can be used to control the thin film substrate 110. The laser processing can be performed by scanning the processing target position.

Returning to FIG. 1, the vacuum chamber 221 of the chamber section 220 has an opening on the upper surface, and a plate-like window glass (first transparent plate) 222 is provided in the opening with a sealing member (not shown) or the like. It is mounted airtight.
At the bottom of the vacuum chamber 221, a table 223 whose upper surface is parallel to the main surface of the window glass 222 is installed, and the substrate with a thin film 110 is placed on the table 223 with its processing surface facing upward. The window glass 222 and the substrate with thin film 110 are maintained in parallel.

  A flat cover glass (second transparent plate) 225 is arranged between the window glass 222 and the table 223 on which the thin film-attached substrate 110 is placed, and at a position separated from the thin film-attached substrate 110 by a predetermined distance. You. The cover glass 225 is placed on holding plates 224 provided at four locations on the inner surface of the vacuum chamber 221 such that the main surface thereof is parallel to the main surface of the window glass 222.

  As a result, the window glass 222, the cover glass 225, and the thin-film-attached substrate 110 are all parallel to each other, so that the laser light LB is emitted from the laser head unit 211 perpendicularly to the main surface of the window glass 222, so that the laser light LB is Therefore, there is no possibility that the optical axis of the window glass 222 and the cover glass 225 will be deflected during transmission and shifted, and the target position of the thin film to be processed can be accurately irradiated with the laser beam.

  In addition, as a material of the window glass 222 and the cover glass 225, it is desirable to use quartz glass which has a wide wavelength range of transmitted laser light and excellent durability. It is desirable that the window glass 222 and the cover glass 225 have a sufficient thickness (rigidity) so that the central portion is not bent by its own weight. In particular, since the window glass 222 receives an atmospheric pressure from the outside due to the reduced pressure in the vacuum chamber 221, the window glass 222 needs to be thicker than the cover glass 225 to maintain the flatness.

  When viewed in a plan view (that is, when viewed from the laser light emitting direction (−Z direction)), the portions of the substrate 110 with a thin film to be laser-processed are all transparent areas of the window glass 222 and the cover glass 225. The sizes and shapes of the window glass 222 and the cover glass 225 and their horizontal planes (in the XY plane) so that the areas (i.e., the parts other than the peripheral edge where each glass is held) fall within the overlapping range. The relative position is set.

In a device (for example, a vacuum vapor deposition device) at a stage preceding the thin film patterning device 200, the substrate 110 with a thin film on which a thin film to be processed is formed is transferred to a substrate transfer robot 231 at a substrate loading port 230 (in FIG. Is placed at a predetermined position on the table 223 in the vacuum chamber 221.
Then, the inside of the vacuum chamber 221 is depressurized by the vacuum pump 240 to be in a vacuum state. In the present embodiment, in order to prevent the characteristics of the organic EL display panel 10 from deteriorating, it is desirable that the high vacuum is set to, for example, 10 ⁻³ to 10 ⁻⁵ Pa.

  The control unit (not shown) of the laser processing device 210 moves the laser head unit 211 to a reference position (home position), and then outputs a laser output and a scanning speed that can selectively remove only a thin film to be processed. Then, based on a program (pattern data) stored in an internal storage memory in advance, patterning is performed by irradiating the substrate 110 with a thin film with a laser beam.

The components of the thin film are sublimated by the irradiation of the laser beam, and the debris D is scattered. Adhere to.
(A) Since the cover glass 225 is separated from the upper surface of the thin film-attached substrate 110, the scattered debris jumps out of the space between the openings of the substrate 11 between the partition walls 14, and the prior art shown in FIG. As described above, the debris D is not filled in the very small space S and does not adhere again to the lower auxiliary electrode 731.

(B) Since the cover glass 225 is located closer to the thin-film-attached substrate 110 than the window glass 222, a part of the scattered debris D reaches the window glass 821 as shown in FIG. It is also possible to prevent a situation in which the liquid drops down and re-adheres to the substrate without being caused.
In order to sufficiently exhibit the effects (a) and (b), the distance between the cover glass 225 and the substrate 110 with a thin film is preferably 1 mm or more and 500 mm or less.

If it is 1 mm or less, there is a limit to the space in which it scatters, and there is a possibility that debris that cannot be protruded from the opening of the substrate 110 with a thin film may remain. If the distance exceeds 500 mm, it cannot reach the cover glass 225 and falls, This is because it cannot be said that there is a possibility that debris re-adhering to the attached substrate 110 is completely generated.
In order to more effectively prevent the debris D from leaking into the space above the cover glass 225 and attaching to the window glass 222, it is preferable that the area of the cover glass 225 is larger than that of the window glass 222. Furthermore, it is desirable that the space below the cover glass 225 and the space above the cover glass 225 are almost completely separated by the cover glass 225 and the holding plate 224.

  After the patterning, the substrate 110 with thin film and the cover glass 225 are taken out of the vacuum chamber 221 by the substrate transfer robot 231. The substrate 110 with thin film is transported to the next processing device, and the cover glass 225 is placed in a collection place. To be washed and reused or discarded. Then, when the next substrate 110 with a thin film is transferred into the vacuum chamber 221, a new cover glass 225 is also installed.

  Note that the cover glass 225 may be replaced every time one thin-film-attached substrate 110 is patterned, or may be replaced periodically after patterning N (N is an integer of 2 or more) thin-film substrates 110. You may do so. In the latter case, the value of N is an appropriate value before the debris adheres to the cover glass 225 and the transmittance of the laser beam deteriorates beyond an allowable range, and is determined in advance by experiments or the like. It is good.

2. FIG. 3 is a block diagram showing the overall configuration of the organic EL display device 100 incorporating the organic EL display panel 10 formed by the organic EL display panel manufacturing apparatus including the thin film patterning device 200 described above. It is.
The organic EL display device 100 is a display device used for, for example, a television, a personal computer, a portable terminal, a business display (electronic signboard, a large screen for commercial facilities), and the like.

The organic EL display device 1 includes an organic EL display panel 10 and a drive control unit 400 electrically connected thereto.
In the present embodiment, the organic EL display panel 10 is a top emission type display panel in which the upper surface is a rectangular image display surface. In the organic EL display panel 10, a plurality of organic EL elements (not shown) are arranged along the image display surface, and an image is displayed by combining the light emission of each organic EL element. The organic EL display panel 10 employs, for example, an active matrix system.

  The drive control section 400 includes a drive circuit 410 connected to the organic EL display panel 10 and a control circuit 420 connected to an external device such as a computer or a receiving device such as an antenna. The drive circuit 410 includes a power supply circuit for supplying power to each organic EL element, a signal circuit for applying a voltage signal for controlling the power supplied to each organic EL element, and a scan for switching a location for applying a voltage signal at regular intervals. It has a circuit and the like.

The control circuit 420 controls the operation of the drive circuit 410 according to data including image information input from an external device or a receiving device.
In FIG. 3, as an example, four drive circuits 410 are arranged around the organic EL display panel 10. However, the configuration of the drive control unit 400 is not limited to this, and the number of drive circuits 410 And the position can be changed as appropriate. For the sake of explanation, as shown in FIG. 3, a direction along the long side of the upper surface of the organic EL display panel 10 is defined as an X direction, and a direction along a short side of the upper surface of the organic EL display panel 10 is defined as a Y direction. .

3. Configuration of Organic EL Display Panel 10 (A) Planar Configuration FIG. 4 is a schematic plan view in which a part of the image display surface of the organic EL display panel 10 is enlarged.
In the organic EL display panel 10, as an example, sub-pixels 100R, 100G, and 100B that emit light of R, G, and B colors are arranged in a matrix. The sub-pixels 100R, 100G, and 100B are alternately arranged in the X direction, and a set of sub-pixels 100R, 100G, and 100B arranged in the X direction constitute one pixel P.

The organic EL elements 2 (see FIG. 5) that emit light of R, G, and B colors are disposed in the sub-pixels 100R, 100G, and 100B, respectively, and the light emission of the sub-pixels 100R, 100G, and 100B whose gradation is controlled is provided. By combining the luminance, a full-color image can be displayed.
In the Y direction, only one of the sub-pixels 100R, 100G, and 100B is arranged to form a sub-pixel column CR, a sub-pixel column CG, and a sub-pixel column CB, respectively. Thereby, the pixels P are arranged in a matrix along the X direction and the Y direction as the whole organic EL display panel 10, and an image is displayed on the image display surface by combining the colors of the pixels P arranged in the matrix. .

The organic EL display panel 10 according to the present embodiment employs a so-called line bank method. That is, a plurality of partitions (banks) 14 that partition the sub-pixel columns CR, CG, and CB for each column are arranged at intervals in the X direction, and in each of the sub-pixel columns CR, CG, and CB, the sub-pixels 100R, 100G, 100B share the organic light emitting layer.
However, in each of the sub-pixel columns CR, CG, and CB, a plurality of pixel regulation layers 141 that insulate the sub-pixels 100R, 100G, and 100B are arranged at intervals in the Y direction. It can emit light independently.

Note that the height of the pixel regulating layer 141 is higher than the height of the surface of the light emitting layer (the distance from the surface of the pixel electrode 13 to the surface of the light emitting layer is 200 nm or less, and the pixel regulating layer is about 500 nm. (The surface height of the ink of the previous light emitting layer is higher than that of the pixel regulating layer and the fluidity is improved, but the finished height after drying and baking is lower than that of the pixel regulating layer.)
In FIG. 4, the partition wall 14 and the pixel regulating layer 141 are represented by dotted lines, but this is because the pixel regulating layer 141 and the partition wall 14 are not exposed on the surface of the image display surface, and are located inside the image display surface. This is because they are arranged.

Here, if an area composed of a set of sub-pixel rows CR, CG, and CB is defined as one light-emitting area 500 (light-emitting section), the area extends between two adjacent light-emitting areas in parallel with each sub-pixel row. There is an auxiliary electrode formation region 600 (non-light emitting column).
No organic EL element is formed in the auxiliary electrode forming region 600, and a long auxiliary electrode 131 extending in the Y direction is formed substantially at the center in the X direction.

(B) Cross-Sectional Configuration of Organic EL Display Panel As described above, in the organic EL display panel 10, one pixel includes three sub-pixels that respectively emit R, G, and B light. Each sub-pixel is composed of an organic EL element 2 that emits a corresponding color.
FIG. 5 is a schematic cross-sectional view of the organic EL display panel 10 taken along line AA of FIG.

As shown in FIG. 1, in the present embodiment, the organic EL display panel 10 includes a substrate 11, an interlayer insulating layer 12, a pixel electrode 13, a partition 14, a light emitting layer 15, an electron transport layer 16, a common electrode 17, The stop layer 18 and the auxiliary electrode 131 are provided.
The substrate 11, the interlayer insulating layer 12, the electron transport layer 16, the common electrode 17, and the sealing layer 18 are not formed for each pixel, but are formed on a plurality of organic EL elements 2 included in the organic EL display panel 10. It is formed in common.

(1) Substrate The substrate 11 includes a base material 111 that is an insulating material, and a TFT (Thin Film Transistor) layer 112. In the TFT layer 112, a driving circuit is formed for each sub-pixel. The substrate 111 is, for example, a glass substrate, a quartz substrate, a silicon substrate, a molybdenum sulfide, a metal substrate such as copper, zinc, aluminum, stainless steel, magnesium, iron, nickel, gold, or silver, a semiconductor substrate such as gallium arsenide, or a plastic substrate. Etc. can be adopted.

(2) Interlayer insulating layer The interlayer insulating layer 12 is formed on the substrate 11. The interlayer insulating layer 12 is made of a resin material and is for flattening a step on the upper surface of the TFT layer 112. Examples of the resin material include a positive photosensitive material. In addition, examples of such a photosensitive material include an acrylic resin, a polyimide resin, a siloxane resin, and a phenol resin. Although not shown in the cross-sectional view of FIG. 3, a contact hole is formed in the interlayer insulating layer 12 for each sub-pixel.

(3) Pixel Electrode The pixel electrode 13 is provided for each sub-pixel and is electrically connected to the TFT layer 112 through a contact hole (not shown).
In the present embodiment, the pixel electrode 13 functions as an anode.
In the present embodiment, since the organic EL display panel 10 is a top emission type, the pixel electrode 13 is formed of a metal material having light reflectivity in order to improve luminous efficiency.

Specific examples of such a metal material include Ag (silver), Al (aluminum), aluminum alloy, Mo (molybdenum), APC (alloy of silver, palladium, and copper) and ARA (alloy of silver, rubidium, and gold). , MoCr (an alloy of molybdenum and chromium), MoW (an alloy of molybdenum and tungsten), NiCr (an alloy of nickel and chromium), and the like.
(4) Auxiliary electrode (bus bar)
The auxiliary electrode 131 is formed on the interlayer insulating layer 12 in the same layer as the pixel electrode 13. As will be described later, it is preferable that the auxiliary electrode 131 be formed in the same process as the pixel electrode 13 and use the same material as the pixel electrode 13 from the viewpoint of simplifying the manufacturing process.

(5) Partition / Pixel Control Layer The partition 14 partitions the plurality of pixel electrodes 13 arranged for each sub-pixel above the substrate 11 for each column in the X direction (see FIG. 2). The line bank shape extends in the Y direction between the sub-pixel columns CR, CG, and CB arranged in a row.
The partition 14 is made of an electrically insulating material. As a specific example of the electrically insulating material, for example, an insulating organic material (for example, an acrylic resin, a polyimide resin, a novolak resin, a phenol resin, or the like) is used.

The partition wall 14 functions as a structure for preventing the applied color inks from overflowing and mixing when the light emitting layer 15 is formed by a coating method.
When a resin material is used as the material of the partition wall 14, it is preferable that the partition wall 14 has photosensitivity from the viewpoint of processability. The photosensitivity may be either positive type or negative type, but preferably has resistance to an organic solvent or heat. Further, in order to suppress the outflow of the ink, it is preferable that the surface of the partition wall 14 has a predetermined liquid repellency.

In a portion where the pixel electrode 13 is not formed, the bottom surface of the partition wall 14 is in contact with the upper surface of the interlayer insulating layer 12.
The pixel regulation layer 141 is made of an electrically insulating material, covers an end of the pixel electrode 13 adjacent in the Y direction (FIG. 2) in each subpixel column, and separates the pixel electrodes 13 adjacent in the Y direction. .

  The thickness of the pixel regulation layer 141 is slightly larger than the thickness of the pixel electrode 13, but is set to be lower than the height of the upper surface of the ink-like light emitting layer immediately after printing as described above. Thus, in each of the sub-pixel rows CR, CG, and CB, the flow of ink when forming the light emitting layer 15 is not hindered by the pixel regulating layer 141. Therefore, it is easy to make the thickness of the light emitting layer 15 in each sub-pixel column uniform.

With the above structure, the pixel regulation layer 141 improves the electrical insulation of the pixel electrode 13 adjacent in the Y direction, suppresses the disconnection of the light emitting layer 15 in each of the sub-pixel columns CR, CG, and CB, and is common to the pixel electrode 13. It has a role of improving electric insulation between the electrode 17 and the like.
Specific examples of the electrically insulating material used for the pixel control layer 141 include the resin materials and inorganic materials exemplified as the material of the partition wall 14. Further, when forming the light emitting layer 15 as the upper layer, it is preferable that the surface of the pixel regulating layer 141 has lyophilic property to the ink so that the ink easily spreads.

Note that the pixel regulation layer 141 is not formed in the auxiliary electrode formation region 600.
(6) Light-Emitting Layer The light-emitting layer 15 is formed between the partition walls 14 in the light-emitting region 500 and has a function of emitting light of each color of R, G, and B by recombination of holes and electrons. In particular, when it is necessary to specify and explain a luminescent color, the luminescent colors are referred to as luminescent layers 15 (R), 15 (G), and 15 (B).

  As a material of the light emitting layer 15, a known material can be used. Specifically, for example, oxinoid compounds, perylene compounds, coumarin compounds, azacoumarin compounds, oxazole compounds, oxadiazole compounds, perinone compounds, pyrrolopyrrole compounds, naphthalene compounds, anthracene compounds, fluorene compounds, fluoranthene compounds, tetracene compounds, pyrene Compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone compound, styryl compound, butadiene compound, dicyanomethylene pyran compound, dicyanomethylene Thiopyran compounds, fluorescein compounds, pyrylium compounds, thiapyrylium compounds, selena Lilium compounds, telluropyrylium compounds, aromatic aldadienes, oligophenylene compounds, thioxanthene compounds, cyanine compounds, acridine compounds, metal complexes of 8-hydroxyquinoline compounds, metal complexes of 2-bipyridine compounds, Schiff salts and Group III metals It is preferably formed of a fluorescent substance such as a complex, an oxine metal complex, and a rare earth complex.

(7) Electron transport layer The electron transport layer 16 has a function of transporting electrons from the common electrode 17 to the light emitting layer 15. The electron transport layer 16 is made of an organic material having a high electron transport property, and does not include an alkali metal and an alkaline earth metal.
Examples of the organic material used for the electron transport layer 16 include π-electron low molecular weight organic materials such as oxadiazole derivatives (OXD), triazole derivatives (TAZ), and phenanthroline derivatives (BCP, Bphen).

Note that a contact opening 161 is formed in the auxiliary electrode formation region 600 of the electron transport layer 16 (see FIG. 8B).
(8) Common Electrode The common electrode 17 is made of a light-transmitting conductive material and is formed on the electron transport layer 16. The common electrode 17 functions as a cathode.

As a material of the common electrode 17, for example, a metal such as ITO, IZO, silver, a silver alloy, aluminum, or an aluminum alloy is desirably used. When the common electrode 17 is formed of a metal, the common electrode 17 needs to have a light-transmitting property, and thus is formed as a thin film having a thickness of about 20 nm or less.
In the auxiliary electrode formation region 600, the common electrode 17 is formed directly on the auxiliary electrode 131 via the contact opening 161.

(9) Sealing Layer The sealing layer 18 exposes components of the organic EL element, particularly, organic layers such as the light emitting layer 15 and the electron transport layer 16 to water or other liquids, or to air. It is provided in order to prevent deterioration.
In the present embodiment, the sealing layer 18 is a thin film of silicon nitride (SiN) and covers the upper surface of the common electrode 17. In addition to the above-described silicon nitride (SiN), other appropriate inorganic materials (for example, silicon oxynitride (SiON), silicon carbide (SiC), and the like) may be used.

(10) Others Although not shown in FIG. 3, an antiglare polarizing plate or an upper substrate may be bonded on the sealing layer 18 via an adhesive. By bonding these, the constituent elements of the organic EL element 2, particularly the organic layer, are further protected from moisture, air, and the like.
4. Hereinafter, a method of manufacturing the organic EL display panel 10 will be described with reference to the drawings.

FIGS. 6A to 6D, FIGS. 7A to 7C, and FIGS. 8A to 8C are schematic cross-sectional views showing a procedure of an auxiliary electrode forming step in manufacturing the organic EL display panel 10. FIG. 9 is a flowchart showing a manufacturing process of the organic EL display panel 10.
(1) Substrate Preparation Step First, the TFT 11 is formed on the base material 111 to prepare the substrate 11 (FIG. 6A, step S1 in FIG. 9). The TFT layer 112 can be formed by a known method for manufacturing a TFT.

The interlayer insulating layer 12 is formed on the TFT layer 112 (FIG. 6B). Specifically, a photosensitive resin material having a certain fluidity is applied along the upper surface of the substrate 11 by, for example, a die coating method so as to fill the unevenness on the substrate 11 due to the TFT layer 112. Thus, the upper surface of the interlayer insulating layer 12 has a shape that is flattened along the upper surface of the base material 111.
Also, a contact hole (not shown) is formed by performing a dry etching method on a portion of the interlayer insulating layer 12 on, for example, the source electrode of the TFT element. The contact hole is formed by patterning or the like so that the surface of the source electrode is exposed at the bottom.

Next, a connection electrode layer is formed along the inner wall of the contact hole. Part of the upper portion of the connection electrode layer is disposed on the interlayer insulating layer 12. The connection electrode layer can be formed by, for example, a sputtering method. After a metal film is formed, patterning may be performed by using a photolithography method and a wet etching method.
(2) Step of Forming Pixel Electrode / Auxiliary Electrode Next, the pixel electrode 13 and the auxiliary electrode 131 are formed on the interlayer insulating layer 12 (Step S2 in FIG. 9).

  First, a pixel electrode material layer 1300 is formed on the interlayer insulating layer 12 by using, for example, a vacuum evaporation method, a sputtering method, or the like (FIG. 6C). Thereafter, patterning is performed by an etching method to form a plurality of pixel electrodes 13 partitioned for each sub-pixel and an auxiliary electrode 131 extending in the Y-axis direction (FIG. 6D). As described above, the pixel electrode 13 and the auxiliary electrode 131 are made of the same material, but in FIG. 6D, the type of hatching is intentionally changed to distinguish the pixel electrode 13 from the auxiliary electrode 131 (others). The same applies to the figures in FIG.

The pixel electrode and the auxiliary electrode are not necessarily made of the same material. For example, in order to reduce the contact resistance between the auxiliary electrode and the common electrode, a material that is hardly oxidized (for example, Ti ) May be laminated.
(3) Partition / Pixel Control Layer Forming Step Next, the partition 14 and the pixel control layer 141 are formed (Step S3 in FIG. 9).

In the present embodiment, the partition 14 and the pixel control layer 141 are formed simultaneously using a halftone mask as follows.
First, a resin material is applied on the interlayer insulating layer 12 on which the pixel electrodes 13 are formed by the thickness of the partition 14 to form a partition material layer 1400 (FIG. 7A). As a specific application method, for example, a wet method such as a die coating method, a slit coating method, and a spin coating method can be used.

After the application, unnecessary solvent is removed by, for example, vacuum drying and low-temperature heating drying (prebaking) at about 60 ° C. to 120 ° C., and the partition wall material layer is exposed through a photomask (not shown).
For example, when the partition material layer has positive photosensitivity, a portion where the partition material layer 1400 is left is shielded from light, and a portion to be removed is exposed.

In the case of this example, since the pixel regulation layer 141 has a smaller film thickness than the partition wall 14, it is necessary to partially expose the partition wall material layer 1400 to the pixel regulation layer 141.
Therefore, the photomask used in this exposure step includes a light-shielding portion disposed at a position corresponding to the partition wall 14 to completely block light, a translucent portion disposed at a position corresponding to the pixel control layer 141, A pixel having an exposed portion of the pixel electrode 13 and a light transmitting portion disposed at a position corresponding to the auxiliary electrode 131 is used.

The translucency of the translucent portion is set such that when exposed for a predetermined time, the partition material layer on the pixel electrode 13 and the auxiliary electrode 131 is fully exposed, and the pixel regulation layer 141 is left unexposed by its height. It is determined.
Next, by performing development and removing the exposed region of the partition wall material layer 1400, the partition wall 14 and the pixel regulating layer 141 having a smaller thickness than the partition wall 14 can be formed. As a specific developing method, for example, after immersing the entire substrate 11 in a developing solution such as an organic solvent or an alkaline solution that dissolves a portion exposed by exposure of the partition wall material layer 1400, the substrate 11 is rinsed with pure water or the like. 11 may be washed.

Thereby, the partition wall 14 extending in the Y direction and the pixel regulating layer 141 extending in the X direction can be formed on the interlayer insulating layer 12 (FIG. 7B).
(4) Light Emitting Layer Forming Step Next, the light emitting layer 15 is formed above the pixel electrode 13 (Step S4 in FIG. 9).
Specifically, ink containing a luminescent material of a corresponding luminescent color is sequentially discharged from a nozzle 3011 of a coating head 301 of a printing apparatus into an opening sandwiched between each pair of the partition walls 14, and the pixel electrode 13 in the opening is discharged. Apply on top. At this time, the ink is applied continuously above the pixel regulating layer 141. This allows the ink to flow along the Y direction, thereby reducing ink application unevenness and making the thickness of the light emitting layer 15 in the same sub-pixel column uniform.

Then, the substrate 11 on which the ink has been applied is carried into a vacuum drying chamber and heated in a vacuum environment to evaporate the organic solvent in the ink. Thereby, the light emitting layer 15 can be formed (FIG. 7C).
(5) Electron Transport Layer Forming Step Next, a common electron transport layer 16 is formed on the light emitting layer 15, the partition 14, the pixel regulation layer 141, and the auxiliary electrode 131 (FIG. 8A, step S5 in FIG. 9). . The electron transport layer 16 is formed, for example, by depositing an organic material having an electron transporting property on the light emitting region 500 and the auxiliary electrode forming region 600 in common by an evaporation method.

(6) Contact opening forming step (laser patterning step)
Next, by using the above-described thin film patterning apparatus 200 (FIG. 1), the electron transport layer 16 on the auxiliary electrode 131 is removed to form a contact opening 161 (Step S6 in FIG. 9).
The substrate 110 with a thin film, which is an intermediate product of the organic EL display panel 10 having the electron transport layer 16 formed thereon over the substrate 11 (the state shown in FIG. 8A), is moved by the substrate transport robot 231 in the substrate loading port 230. Then, the vacuum chamber 221 of the thin film patterning apparatus 200 is positioned and mounted at a predetermined position on the table 223 in the vacuum chamber 221, and the vacuum pump 240 is operated to reduce the pressure in the vacuum chamber 221 to a high vacuum state as described above. .

Then, the laser processing device 210 is operated to scan with the laser beam LB to remove the electron transport layer 16 on all the auxiliary electrodes 131 on the substrate 11 to form the contact opening 161 (FIG. 8 ( b)).
(7) Common Electrode Forming Step Next, the common electrode 17 is formed on the electron transport layer 16 (Step S7 in FIG. 9). In this embodiment, the common electrode 17 is formed by forming a film of silver, aluminum, or the like by a sputtering method or a vacuum evaporation method.

At this time, since the contact opening 161 is formed on the auxiliary electrode 131, the common electrode 17 is formed directly on the auxiliary electrode 131, and the electrical connection between them can be improved. Since the auxiliary electrode 131 is made of a metal, the auxiliary electrode 131 has excellent conductivity, and thus, there is almost no potential difference between the peripheral portion and the central portion of the common electrode 17, and unevenness in luminance does not occur.
(8) Sealing Layer Forming Step Next, the sealing layer 18 is formed on the common electrode 17 (Step S8 in FIG. 9).

In this method, a sealing layer 18 made of SiN is formed by, for example, a plasma CVD method. Thereby, the organic EL display panel 10 having a laminated structure as shown in FIG. 5 can be obtained.
4. Summary of Effects According to the aspect of the above disclosure, the following effects can be obtained.
(1) In a display panel including an organic thin film, in particular, an organic EL element panel, since the organic thin film dislikes oxygen and moisture, it is necessary to perform laser processing in a closed chamber under a vacuum atmosphere. Since the laser processing device is relatively large, the laser processing device is arranged outside the chamber, and the thin film formed on the internal substrate is irradiated and processed through the window glass that transmits laser light. However, the debris melted and sublimated by the laser light scatters in the chamber, and comes into contact with the above-mentioned window glass, solidifies and adheres, so that the laser light does not sufficiently pass through the window glass. Processing becomes impossible. Therefore, the window glass must be cleaned or replaced frequently.However, in order to withstand the decompression, it is necessary to use a thick and firm window glass as well as a sealing material to maintain the hermeticity of the chamber. Since the device is mounted relatively firmly through the device, the time and cost required for maintenance of the device cannot be ignored.

However, according to the aspect of the present disclosure, since the cover glass is disposed closer to the substrate than the window glass, most of the debris once scattered upward adhere to the cover glass, and the thin film of the substrate The probability of re-adhering to the top is dramatically reduced, and the quality of the organic EL display panel can be prevented from deteriorating.
The cover glass is entirely inside the vacuum chamber and does not receive external pressure from the outside like a window glass for processing, so its rigidity is not as high as that of a window glass. In addition, a relatively inexpensive one can be used, and since it is simply placed on a holding plate inside the vacuum chamber, it can be replaced freely. If the substrate and the cover glass 225 are simultaneously transferred by the substrate transfer robot 231 of FIG. 1, there is no need to stop the production line for a long time for maintenance of the thin film patterning apparatus 200, and the productivity is excellent.

Further, the cover glass 225 is taken out of the vacuum chamber for each processing of one substrate with a thin film or for each processing of several substrates, and for example, a special cleaning machine is separately prepared, and the cover glass is cleaned and reused. Is economical.
As described above, according to the embodiment of the present disclosure, by performing patterning of a thin film by laser processing, the number of steps can be significantly reduced as compared with a conventional patterning method using a photolithography method or an etching method, and the adverse effect of generated debris can be reduced. It is possible to manufacture a high-quality organic EL display panel which is easy to maintain and has high quality.

Further, various patterns can be formed immediately by simply changing a program (pattern data) to be installed in the control unit of the laser processing apparatus 210. Therefore, a mask is required for each design change as in the case of the conventional etching method. There is no need to rework or cost, and it is excellent on demand.
≪Modified example≫
As an embodiment of the present invention, an embodiment of a manufacturing apparatus and a manufacturing method of an organic EL display panel has been described. However, the present invention is not limited to the above description except for its essential characteristic components. is not. Hereinafter, a modified example that is another example of the present invention will be described.

(1) Regarding Wavelength Range of Laser Light Source in Thin Film Patterning Apparatus In the above embodiment, the electron transport layer 16 made of resin on the auxiliary electrode 131 was patterned. Even when a plurality of thin films, such as a hole transport layer, are formed on the auxiliary electrode 131, the laser processing device that generates a laser beam of a common wavelength band that is absorbed by the materials of the thin films can be used for contact at once. It is also possible to form the opening 161 to expose the auxiliary electrode 131.

In the embodiment, a YAG laser which is a solid-state laser is used as a laser light source. The YAG laser is capable of stable fine processing, and the laser power and scanning speed can be controlled to fine-tune the digging depth. Can be removed (half-cut processing).
However, in order to more stably and surely leave only the auxiliary electrode 131 and remove the thin film on the upper layer, the absorption rate of the thin film laser light with respect to the laser light in a specific wavelength range constitutes the auxiliary electrode 131. It is desirable to select those materials and the wavelength range of the laser light so that the absorption rate of the metal is as large as possible.

As an example, the wavelength of the YAG laser is set to 355 MHz of the third harmonic, and the auxiliary electrode 131 is formed of aluminum or an aluminum alloy to selectively remove only the electron transport layer 16 (resin thin film) thereabove. It is possible to do.
(2) Thin Film to be Patterned In the above-described embodiment, the case where the contact opening 161 is formed in the electron transport layer 16 on the auxiliary electrode 131 has been described. It is possible to pattern the thin film.

  For example, the present invention can also be used when the auxiliary electrode 131 is not formed by providing the auxiliary electrode forming region 600 in parallel with the light emitting region 500 but is formed above the top of the partition wall 14. In this case, the organic layer, the sealing layer, and the like formed on the common electrode 17 are partially removed by the thin film patterning device 200 on the top of the partition 14 to form a contact opening. A metal film may be formed thereon by an evaporation method or the like, and may be etched to leave a metal only in the contact opening and use the metal as an auxiliary electrode.

In addition, the thin film patterning apparatus according to the present embodiment is particularly effective because a thin film which needs patterning, particularly a pattern whose removal area is not so large, generates little debris.
(3) Materials such as Window Glass In the above-described embodiment, quartz glass having good transmittance and excellent durability over a wide wavelength range is used as the material of the window glass 222 and the cover glass 225. Depending on the wavelength range of the laser light used, soda glass or a transparent resin plate such as an acrylic plate may be used. In particular, in the case where the used cover glass is discarded without reuse, the merit of using soda glass or a transparent resin plate, which is less expensive than quartz glass, is great.

  (4) In the above embodiment, in order to avoid deterioration of the organic functional film including the light emitting layer in the organic EL display panel 10 in particular, the air in the vacuum chamber 221 is evacuated by the vacuum pump 240 to reduce the pressure. The intermediate product (substrate with thin film) of the organic EL display panel was patterned, but after evacuating with a vacuum pump 240, an inert gas such as nitrogen gas or argon containing no moisture (nitrogen gas in terms of cost) was used. Is preferably introduced from a cylinder or an inert gas is introduced into the vacuum chamber 221 without using the vacuum pump 240 to replace the air therein, thereby forming an atmosphere of the inert gas. You may.

In the present invention, as an upper concept of the process of setting the atmosphere in the vacuum chamber 221 to a vacuum or an atmosphere of an inert gas, an atmosphere adjusting process is called. Further, an apparatus for performing the process can be referred to as an atmosphere adjusting apparatus.
It should be noted that, although exceptional, a display panel made of a thin film that is not (or hardly) affected by oxygen or moisture may not require the above-described atmosphere adjustment. However, in the case where the generated debris may harm the environment, it is necessary to perform patterning in a closed space such as a chamber, and the cover glass is disposed in the chamber as in the embodiment. Is useful.

(5) In the above embodiment, the cover glass 225 is held by the holding plate 224 provided on the inner surface of the vacuum chamber 221. However, the cover glass 225 may be placed on the table 223 via a spacer.
Further, the substrate 110 with a thin film may be carried into the vacuum chamber 221 together with the table 223.

  (6) In the above embodiment, in order to form the full-color organic EL display panel 10, the light-emitting layers 15 (R), 15 () containing the light-emitting materials that emit the colors corresponding to the R, G, and B sub-pixels respectively. G) and 15 (B) were formed, but all were unified into a light emitting layer that emits white light, and a known color filter substrate having R, G, and B filters disposed above the sealing layer 18 was transparently bonded. You may comprise so that it may stick through an agent etc.

(7) In the above embodiment, a method using a wet process was described as a method for forming a light emitting layer, but the present invention is not limited to this. For example, a dry process such as a vacuum evaporation method, an electron beam evaporation method, a sputtering method, a reactive sputtering method, an ion plating method, and a vapor phase growth method can be used.
(8) In the above embodiment, each organic EL element is configured to include the pixel electrode, the light emitting layer, the electron transport layer, and the common electrode. For example, holes are injected between the pixel electrode and the light emitting layer. It may have a configuration including a layer or a hole transport layer, or may have a configuration including an electron injection layer between the electron transport layer and the common electrode. It should be noted that the organic functional layer can be generically referred to as a superordinate concept of an organic film having functions such as a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

(9) In the above embodiment, the partition walls 14 and the pixel regulating layers 141 having different heights are formed simultaneously in one step by using a halftone mask. However, the partition walls 14 and the pixel regulating layers 141 are formed in separate steps. You may do it.
For example, first, the pixel regulation layer 141 for partitioning the pixel electrode row in the Y direction is formed.

  As a specific method for forming the pixel regulation layer 141, a resin material is applied to the upper surface of the substrate 11 on which the pixel electrodes 13 are formed, for example, by a die coating method. Then, by using a photolithography method, a resin material is patterned to form the pixel regulating layer 141 between the pixel electrodes 13 adjacent in the Y direction, and then fired, whereby the pixel regulating layer 141 can be formed. .

Next, a partition wall resin, which is a material of the partition walls 14, is uniformly applied by, for example, a die coating method to form a partition wall material layer, patterned into a partition wall material layer by a photolithography method, and then baked. The partition 14 is formed.
(10) In the above-described embodiment, a line bank type organic EL display panel has been described. However, in the light emitting region 500, a so-called pixel bank type organic EL is provided in which four sub-pixels are surrounded by partition walls on each side. It may be a display panel.

  (11) In the organic EL display panel 10 according to the above-described embodiment, the sub-pixels 100R, 100G, and 100B that emit light of R, G, and B colors are arranged, but the light emission color of the sub-pixel is not limited to this. For example, four colors of yellow (Y) in addition to R, G, and B may be used. Further, in one pixel P, the number of sub-pixels is not limited to one per color, and a plurality of sub-pixels may be arranged. The arrangement of the sub-pixels in the pixel P is not limited to the order of R, G, and B as shown in FIG. 2, but may be the order in which these are replaced.

(12) In the organic EL display panel 10 according to the above-described embodiment, the pixel electrode 13 is an anode and the common electrode 17 is a cathode. However, the present invention is not limited to this, and the pixel electrode 13 is a cathode and the common electrode 17 is an anode. It may be a structure. The stacking order of the hole injection layer, the hole transport layer, the electron transport layer, the electron injection layer, and the like is also appropriately modified depending on the positions of the cathode and the anode.
(13) In the above embodiment, the contact opening 161 is formed in a groove shape in the direction (column direction) parallel to the partition wall 14. Instead, however, a plurality of contact holes (through holes) may be appropriately formed. It is also possible to provide them in a row at an appropriate pitch.

(14) Although the organic EL display panel 10 according to the above embodiment employs the active matrix system, the present invention is not limited to this, and the organic EL display panel 10 may employ a passive matrix system.
Further, the present invention is applicable to the manufacture of a bottom emission type organic EL display panel, and is further applicable to the manufacture of a general display panel in which a thin film needs to be patterned in a substantially closed space.

≪Supplement≫
As described above, the display panel manufacturing apparatus and the manufacturing method according to the present disclosure have been described based on the embodiments and the modifications, but the present invention is not limited to the above embodiments and the modifications. A form obtained by applying various modifications conceived by those skilled in the art to the above-described embodiments and modifications, and a configuration in which components and functions in the embodiments and modifications are arbitrarily combined without departing from the spirit of the present invention. Embodiments realized are also included in the present invention.

  The display panel manufacturing apparatus and method according to the present invention are suitable for manufacturing a display panel used for a television device, a personal computer, a mobile phone, and the like.

Reference Signs List 1 organic EL display device 2 organic EL element 10 organic EL display panel 11 substrate 12 interlayer insulating layer 13 pixel electrode 14 partition wall 15 light emitting layer 16 electron transport layer 17 common electrode 18 sealing layer 100 organic EL display device 110 substrate with thin film 100B 100G, 100R Subpixel 111 Substrate 112 TFT layer 131 Auxiliary electrode 141 Pixel regulating layer 161 Contact opening 200 Thin film patterning device 210 Laser processing device 220 Chamber 221 Chamber 222 Window glass 225 Cover glass 230 Substrate carrying port 240 Vacuum pump

Claims (9)

A display panel manufacturing apparatus for manufacturing a display panel in which a plurality of thin films including an organic film are stacked on a substrate,
A chamber that has a transparent window equipped with a first transparent plate that transmits a laser beam and that houses a substrate with a thin film on which at least one thin film is formed;
In the chamber, between the transparent window and the substrate with a thin film, disposed at a position separated from the substrate with a thin film, a second transparent plate that transmits the laser light,
A laser which is disposed outside the chamber and injects the laser beam toward the substrate with a thin film through the first transparent plate and the second transparent plate to partially remove the at least one thin film; A display panel manufacturing apparatus, comprising: an irradiation unit.   The display panel manufacturing apparatus according to claim 1, further comprising: an atmosphere adjusting unit that adjusts an atmosphere in the chamber to a vacuum or an atmosphere of an inert gas. The display panel manufacturing apparatus according to claim 1, wherein the second transparent plate is arranged to be exchangeable. When viewed in a plan view, the first transparent plate and the first transparent plate are arranged so that all portions of the substrate with a thin film to be laser-processed are included in a range where the transparent regions of the first transparent plate and the second transparent plate overlap each other. The display panel manufacturing apparatus according to any one of claims 1 to 3, wherein a size, a shape, and a positional relationship of the second transparent plate are set. The first transparent plate and the second transparent plate are both parallel to the main surface of the substrate with a thin film, and the laser beam is incident perpendicularly to the main surface of the first transparent plate. The display panel manufacturing apparatus according to any one of claims 1 to 4, wherein:   The distance between the second transparent plate and the substrate with the thin film is such that the material of the thin film sublimated and scattered by the irradiation of the laser light contacts the second transparent plate, solidifies and adheres, The display panel manufacturing apparatus according to any one of claims 1 to 5, wherein the distance is set within a range that does not re-adhere. The thin film formed above the substrate is an organic film laminated on an auxiliary electrode made of a metal, and the laser irradiation unit scans the laser light in a predetermined pattern on the auxiliary electrode. The display panel manufacturing apparatus according to any one of claims 1 to 6, wherein the organic film is removed. The display panel manufacturing apparatus according to any one of claims 1 to 7, wherein at least the first transparent plate of the first transparent plate and the second transparent plate is made of quartz glass. A method for manufacturing a display panel in which a plurality of thin films including an organic film are stacked on a substrate,
In a chamber having a transparent window provided with a first transparent plate that transmits laser light, a substrate with a thin film on which at least one layer of thin film is formed is placed on a main surface on the side on which the thin film is formed by the transparent window. A substrate storage step of storing in a state facing the
An atmosphere adjusting step of adjusting the atmosphere in the chamber to an atmosphere of a vacuum or an inert gas,
From the outside of the chamber, through the transparent window, emit laser light toward the processing surface of the substrate with a thin film, a thin film removing step of partially removing the thin film,
Including
A second transparent plate that transmits the laser light is disposed in the chamber between the transparent window and the substrate with a thin film and at a position separated from the substrate with a thin film. Display panel manufacturing method.

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