TWI425101B - Cu-Ni-Si alloy excellent in bending workability - Google Patents

Cu-Ni-Si alloy excellent in bending workability Download PDF

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Publication number
TWI425101B
TWI425101B TW100108504A TW100108504A TWI425101B TW I425101 B TWI425101 B TW I425101B TW 100108504 A TW100108504 A TW 100108504A TW 100108504 A TW100108504 A TW 100108504A TW I425101 B TWI425101 B TW I425101B
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TW
Taiwan
Prior art keywords
surface layer
less
bending
precipitates
thickness
Prior art date
Application number
TW100108504A
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English (en)
Chinese (zh)
Other versions
TW201202445A (en
Inventor
新見壽宏
加藤弘德
Original Assignee
Ｊｘ日鑛日石金屬股份有限公司
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Application filed by Ｊｘ日鑛日石金屬股份有限公司 filed Critical Ｊｘ日鑛日石金屬股份有限公司
Publication of TW201202445A publication Critical patent/TW201202445A/zh
Application granted granted Critical
Publication of TWI425101B publication Critical patent/TWI425101B/zh

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW100108504A 2010-03-31 2011-03-14 Cu-Ni-Si alloy excellent in bending workability TWI425101B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010083736A JP5281031B2 (ja) 2010-03-31 2010-03-31 曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金

Publications (2)

Publication Number Publication Date
TW201202445A TW201202445A (en) 2012-01-16
TWI425101B true TWI425101B (zh) 2014-02-01

Family

ID=44762511

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100108504A TWI425101B (zh) 2010-03-31 2011-03-14 Cu-Ni-Si alloy excellent in bending workability

Country Status (5)

Country Link
JP (1) JP5281031B2 (https=)
KR (1) KR101377391B1 (https=)
CN (1) CN102666891B (https=)
TW (1) TWI425101B (https=)
WO (1) WO2011125558A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5631847B2 (ja) * 2011-11-07 2014-11-26 Jx日鉱日石金属株式会社 圧延銅箔
JP5683432B2 (ja) * 2011-11-07 2015-03-11 Jx日鉱日石金属株式会社 圧延銅箔
CN104011236B (zh) * 2011-12-22 2016-03-16 三菱伸铜株式会社 模具耐磨性及剪切加工性良好的Cu-Ni-Si系铜合金板及其制造方法
JP2013205052A (ja) * 2012-03-27 2013-10-07 Yazaki Corp 気体サンプル室及びガス濃度測定装置
JP6196429B2 (ja) * 2012-08-23 2017-09-13 Ｊｘ金属株式会社 放熱性及び繰り返し曲げ加工性に優れた銅合金板
CN103205600A (zh) * 2013-04-18 2013-07-17 大连理工大学 一种高强导电Cu-Ni-Si-M合金
CN103643080A (zh) * 2013-12-25 2014-03-19 海门市江滨永久铜管有限公司 高强、高延性、高导电的铜镍硅合金棒材及生产方法
JP6317967B2 (ja) * 2014-03-25 2018-04-25 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造方法並びに通電部品
JP5916964B2 (ja) 2014-03-25 2016-05-11 古河電気工業株式会社 銅合金板材、コネクタ、および銅合金板材の製造方法
JP6185870B2 (ja) * 2014-03-27 2017-08-23 株式会社神戸製鋼所 溶接構造部材用アルミニウム合金鍛造材およびその製造方法
WO2016059707A1 (ja) * 2014-10-16 2016-04-21 三菱電機株式会社 Ｃｕ－Ｎｉ－Ｓｉ合金及びその製造方法
CN104388748A (zh) * 2014-11-27 2015-03-04 恒吉集团有限公司 易切削、耐腐蚀、可热锻的锡青铜
DE102015014856A1 (de) * 2015-11-17 2017-05-18 Wieland-Werke Ag Kupfer-Nickel-Zink-Legierung und deren Verwendung
KR101627696B1 (ko) 2015-12-28 2016-06-07 주식회사 풍산 자동차 및 전기전자 부품용 동합금재 및 그의 제조 방법
CN107012357B (zh) * 2017-03-22 2018-11-06 合肥达户电线电缆科技有限公司 一种铜合金线材及其制备方法
JP6670277B2 (ja) * 2017-09-14 2020-03-18 Ｊｘ金属株式会社 金型摩耗性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金
JP6762333B2 (ja) * 2018-03-26 2020-09-30 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金条
JP2020158817A (ja) * 2019-03-26 2020-10-01 Ｊｘ金属株式会社 強度と圧延平行方向および圧延直角方向の曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金条
CN115652136B (zh) * 2022-10-31 2023-12-15 宁波金田铜业(集团)股份有限公司 一种易切削铜镍硅棒材及其制备方法
JP7556997B2 (ja) * 2023-02-24 2024-09-26 株式会社神戸製鋼所 銅合金板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200533768A (en) * 2004-04-14 2005-10-16 Mitsubishi Shindo Kk Copper alloy and method of manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06100984A (ja) * 1992-09-22 1994-04-12 Nippon Steel Corp バネ限界値と形状凍結性に優れたバネ用材料及びその製造方法
JP3977376B2 (ja) * 2004-02-27 2007-09-19 古河電気工業株式会社 銅合金
TWI363099B (zh) * 2005-03-29 2012-05-01 Jx Nippon Mining & Metals Corp Cu-Ni-Si-Zn系合金鍍錫條
JP4810704B2 (ja) * 2006-01-10 2011-11-09 Ｄｏｗａメタルテック株式会社 耐応力腐食割れ性に優れたＣｕ−Ｎｉ−Ｓｉ−Ｚｎ系銅合金の製造法
JP4006468B1 (ja) * 2006-09-22 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金
JP4440313B2 (ja) * 2008-03-31 2010-03-24 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系合金

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200533768A (en) * 2004-04-14 2005-10-16 Mitsubishi Shindo Kk Copper alloy and method of manufacturing the same

Also Published As

Publication number Publication date
KR20120053087A (ko) 2012-05-24
JP2011214087A (ja) 2011-10-27
TW201202445A (en) 2012-01-16
JP5281031B2 (ja) 2013-09-04
CN102666891B (zh) 2014-05-14
WO2011125558A1 (ja) 2011-10-13
KR101377391B1 (ko) 2014-03-25
CN102666891A (zh) 2012-09-12

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