TWI425023B - 環氧樹脂組成物的潛伏性硬化劑 - Google Patents

環氧樹脂組成物的潛伏性硬化劑 Download PDF

Info

Publication number
TWI425023B
TWI425023B TW099118990A TW99118990A TWI425023B TW I425023 B TWI425023 B TW I425023B TW 099118990 A TW099118990 A TW 099118990A TW 99118990 A TW99118990 A TW 99118990A TW I425023 B TWI425023 B TW I425023B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
composition
adduct
curing agent
particles
Prior art date
Application number
TW099118990A
Other languages
English (en)
Chinese (zh)
Other versions
TW201120085A (en
Inventor
Yurong Ying
John J Mcnamara
Jing Liang
Rong-Chang Liang
Original Assignee
Trillion Science Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/497,040 external-priority patent/US8044154B2/en
Priority claimed from US12/762,892 external-priority patent/US8067484B2/en
Application filed by Trillion Science Inc filed Critical Trillion Science Inc
Publication of TW201120085A publication Critical patent/TW201120085A/zh
Application granted granted Critical
Publication of TWI425023B publication Critical patent/TWI425023B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/24Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/17Amines; Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/10Encapsulated ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Analytical Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Adhesive Tapes (AREA)
TW099118990A 2009-06-12 2010-06-11 環氧樹脂組成物的潛伏性硬化劑 TWI425023B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US18654709P 2009-06-12 2009-06-12
US12/497,040 US8044154B2 (en) 2009-06-12 2009-07-02 Latent hardener for epoxy compositions
US31319910P 2010-03-12 2010-03-12
US12/762,892 US8067484B2 (en) 2010-03-12 2010-04-19 Latent hardener with improved barrier properties and compatibility

Publications (2)

Publication Number Publication Date
TW201120085A TW201120085A (en) 2011-06-16
TWI425023B true TWI425023B (zh) 2014-02-01

Family

ID=45045033

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099118990A TWI425023B (zh) 2009-06-12 2010-06-11 環氧樹脂組成物的潛伏性硬化劑

Country Status (4)

Country Link
JP (1) JP2012529555A (enExample)
KR (1) KR101385077B1 (enExample)
CN (1) CN102459394B (enExample)
TW (1) TWI425023B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111247207B (zh) * 2017-10-18 2022-11-08 三键有限公司 导热性树脂组合物、固化物以及散热方法
TWI715978B (zh) * 2019-05-15 2021-01-11 洽興營造有限公司 環保全聚脲核廢料桶
EP3998299A4 (en) 2019-07-12 2023-07-26 Samyang Corporation Anhydrous alcohol-alkylene glycol composition, anhydrous alcohol-based urethane-modified polyol composition, and uses of same for expoxy resin composition
CN117362590B (zh) * 2023-11-01 2024-05-07 湖北泊瑞高分子材料有限公司 一种超支化、柔性水性环氧树脂固化剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200640978A (en) * 2005-02-23 2006-12-01 Asahi Kasei Chemicals Corp Latent hardener for epoxy resin and epoxy resin composition
US20070270515A1 (en) * 2006-05-19 2007-11-22 Zephyros, Inc. Toughened polymeric material and method of forming and using same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649780A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Resin molded bondable article
JPS62273224A (ja) * 1986-05-21 1987-11-27 Asahi Denka Kogyo Kk エポキシ樹脂硬化性組成物
DE19845607A1 (de) * 1998-10-06 2000-04-20 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
US20070095475A1 (en) * 2005-11-01 2007-05-03 L&L Products, Inc. Adhesive material and method of using same
JP5430059B2 (ja) * 2007-11-08 2014-02-26 株式会社Adeka 粉末状エポキシ樹脂用潜在性硬化剤の製造方法、その方法によって得られた粉末状エポキシ樹脂用潜在性硬化剤、及びそれを用いた硬化性エポキシ樹脂用組成物
JP2008115400A (ja) * 2007-12-10 2008-05-22 Hitachi Chem Co Ltd 回路部材接続用接着剤
JP4492692B2 (ja) * 2007-12-17 2010-06-30 日立化成工業株式会社 回路部材接続用接着フィルム
JP2010150362A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd フィルム状接着剤及び異方導電性接着剤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200640978A (en) * 2005-02-23 2006-12-01 Asahi Kasei Chemicals Corp Latent hardener for epoxy resin and epoxy resin composition
US20070270515A1 (en) * 2006-05-19 2007-11-22 Zephyros, Inc. Toughened polymeric material and method of forming and using same

Also Published As

Publication number Publication date
JP2012529555A (ja) 2012-11-22
TW201120085A (en) 2011-06-16
CN102459394A (zh) 2012-05-16
CN102459394B (zh) 2015-01-21
KR101385077B1 (ko) 2014-04-24
KR20120046158A (ko) 2012-05-09

Similar Documents

Publication Publication Date Title
US8481612B2 (en) Latent hardener with improved barrier properties and compatibility
CN101128502B (zh) 环氧树脂用潜在性固化剂和环氧树脂组合物
JP5558118B2 (ja) マイクロカプセル型エポキシ樹脂用硬化剤、及びそれを含むマスターバッチ型エポキシ樹脂用硬化剤組成物
CN101595152B (zh) 潜固化剂
JP5158088B2 (ja) エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物
US6916538B2 (en) Thermosetting resin composition and semiconductor device obtained with the same
KR101082630B1 (ko) 잠재성 경화제
CN106010321A (zh) 一种导电性粘结胶膜
US8044154B2 (en) Latent hardener for epoxy compositions
CN102414241A (zh) 含咪唑化合物的微囊化组合物、使用其的固化性组合物及母料型固化剂
JP2010053353A (ja) エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、一液性エポキシ樹脂組成物、エポキシ樹脂硬化物、接着剤、接合用フィルム、導電性材料並びに異方導電性材料
TWI425023B (zh) 環氧樹脂組成物的潛伏性硬化劑
TW200908166A (en) Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device
US8333910B2 (en) Microencapsulated silane coupling agent
JP4001493B2 (ja) 実装基板の製造方法
JP2003168323A (ja) 異方性導電ペーストおよびその使用方法
JP2013053228A (ja) エポキシ樹脂用硬化剤及びマイクロカプセル型エポキシ樹脂用硬化剤
JP2000129238A (ja) シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
JP2003165825A (ja) 異方性導電ペーストおよびその使用方法
JP2013053230A (ja) エポキシ樹脂組成物、及びこれを用いたペースト状組成物、フィルム状組成物
WO2010144236A1 (en) Latent hardener for epoxy compositions
TW200306992A (en) Thermosetting resin composition and semiconductor device obtained with the same
JP4718824B2 (ja) エポキシ系硬化性組成物及び電子部品の製造方法
JP2006316259A (ja) 接着剤の製造方法
JP5416653B2 (ja) 電子部品

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees