CN102459394B - 环氧组合物用的潜硬化剂 - Google Patents

环氧组合物用的潜硬化剂 Download PDF

Info

Publication number
CN102459394B
CN102459394B CN201080025795.1A CN201080025795A CN102459394B CN 102459394 B CN102459394 B CN 102459394B CN 201080025795 A CN201080025795 A CN 201080025795A CN 102459394 B CN102459394 B CN 102459394B
Authority
CN
China
Prior art keywords
epoxy
particles
compound
curing agent
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080025795.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN102459394A (zh
Inventor
应宇蓉
约翰·J·麦克纳马拉
梁静
梁荣昌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trillion Science Inc
Original Assignee
Trillion Science Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/497,040 external-priority patent/US8044154B2/en
Priority claimed from US12/762,892 external-priority patent/US8067484B2/en
Application filed by Trillion Science Inc filed Critical Trillion Science Inc
Priority claimed from PCT/US2010/035905 external-priority patent/WO2010144236A1/en
Publication of CN102459394A publication Critical patent/CN102459394A/zh
Application granted granted Critical
Publication of CN102459394B publication Critical patent/CN102459394B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Analytical Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Adhesive Tapes (AREA)
CN201080025795.1A 2009-06-12 2010-05-24 环氧组合物用的潜硬化剂 Expired - Fee Related CN102459394B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US18654709P 2009-06-12 2009-06-12
US61/186,547 2009-06-12
US12/497,040 US8044154B2 (en) 2009-06-12 2009-07-02 Latent hardener for epoxy compositions
US12/497,040 2009-07-02
US31319910P 2010-03-12 2010-03-12
US61/313,199 2010-03-12
US12/762,892 US8067484B2 (en) 2010-03-12 2010-04-19 Latent hardener with improved barrier properties and compatibility
US12/762,892 2010-04-19
PCT/US2010/035905 WO2010144236A1 (en) 2009-06-12 2010-05-24 Latent hardener for epoxy compositions

Publications (2)

Publication Number Publication Date
CN102459394A CN102459394A (zh) 2012-05-16
CN102459394B true CN102459394B (zh) 2015-01-21

Family

ID=45045033

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080025795.1A Expired - Fee Related CN102459394B (zh) 2009-06-12 2010-05-24 环氧组合物用的潜硬化剂

Country Status (4)

Country Link
JP (1) JP2012529555A (enExample)
KR (1) KR101385077B1 (enExample)
CN (1) CN102459394B (enExample)
TW (1) TWI425023B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111247207B (zh) * 2017-10-18 2022-11-08 三键有限公司 导热性树脂组合物、固化物以及散热方法
TWI715978B (zh) * 2019-05-15 2021-01-11 洽興營造有限公司 環保全聚脲核廢料桶
EP3998299A4 (en) 2019-07-12 2023-07-26 Samyang Corporation Anhydrous alcohol-alkylene glycol composition, anhydrous alcohol-based urethane-modified polyol composition, and uses of same for expoxy resin composition
CN117362590B (zh) * 2023-11-01 2024-05-07 湖北泊瑞高分子材料有限公司 一种超支化、柔性水性环氧树脂固化剂及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649780A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Resin molded bondable article
JPS62273224A (ja) * 1986-05-21 1987-11-27 Asahi Denka Kogyo Kk エポキシ樹脂硬化性組成物
DE19845607A1 (de) * 1998-10-06 2000-04-20 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
CN101128502B (zh) * 2005-02-23 2010-12-01 旭化成电子材料株式会社 环氧树脂用潜在性固化剂和环氧树脂组合物
US20070095475A1 (en) * 2005-11-01 2007-05-03 L&L Products, Inc. Adhesive material and method of using same
US20070270515A1 (en) * 2006-05-19 2007-11-22 Zephyros, Inc. Toughened polymeric material and method of forming and using same
JP5430059B2 (ja) * 2007-11-08 2014-02-26 株式会社Ａｄｅｋａ 粉末状エポキシ樹脂用潜在性硬化剤の製造方法、その方法によって得られた粉末状エポキシ樹脂用潜在性硬化剤、及びそれを用いた硬化性エポキシ樹脂用組成物
JP2008115400A (ja) * 2007-12-10 2008-05-22 Hitachi Chem Co Ltd 回路部材接続用接着剤
JP4492692B2 (ja) * 2007-12-17 2010-06-30 日立化成工業株式会社 回路部材接続用接着フィルム
JP2010150362A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd フィルム状接着剤及び異方導電性接着剤

Also Published As

Publication number Publication date
JP2012529555A (ja) 2012-11-22
TWI425023B (zh) 2014-02-01
TW201120085A (en) 2011-06-16
CN102459394A (zh) 2012-05-16
KR101385077B1 (ko) 2014-04-24
KR20120046158A (ko) 2012-05-09

Similar Documents

Publication Publication Date Title
US8481612B2 (en) Latent hardener with improved barrier properties and compatibility
CN101128502B (zh) 环氧树脂用潜在性固化剂和环氧树脂组合物
JP5558118B2 (ja) マイクロカプセル型エポキシ樹脂用硬化剤、及びそれを含むマスターバッチ型エポキシ樹脂用硬化剤組成物
CN101595152B (zh) 潜固化剂
US10450407B2 (en) Coated particles
EP3127933B1 (en) Heat-curable epoxy resin composition
US8044154B2 (en) Latent hardener for epoxy compositions
KR100527990B1 (ko) 회로 접속용 페이스트, 이방성 도전 페이스트 및 이들의사용방법
JP5158088B2 (ja) エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、並びに一液性エポキシ樹脂組成物及びその硬化物
JPWO1998015597A1 (ja) 相分離構造物、該構造物を含む樹脂組成物、電子部品封止用成形材料および電子部品装置
JP2010053353A (ja) エポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、一液性エポキシ樹脂組成物、エポキシ樹脂硬化物、接着剤、接合用フィルム、導電性材料並びに異方導電性材料
CN100584872C (zh) 潜固化剂和组合物
CN102459394B (zh) 环氧组合物用的潜硬化剂
JP5045896B2 (ja) エポキシ樹脂用潜在性硬化剤及びその製造方法
TW200908166A (en) Adhesive for electronic component, semiconductor chip stacking method, and semiconductor device
US8333910B2 (en) Microencapsulated silane coupling agent
JP4001493B2 (ja) 実装基板の製造方法
JP3270774B2 (ja) 球状のエポキシ樹脂用潜在性硬化剤及びその製造方法
JP2003168323A (ja) 異方性導電ペーストおよびその使用方法
JP4947305B2 (ja) エポキシ樹脂用潜在性硬化剤の製造方法
JP2013053228A (ja) エポキシ樹脂用硬化剤及びマイクロカプセル型エポキシ樹脂用硬化剤
WO2010144236A1 (en) Latent hardener for epoxy compositions
JP2013053230A (ja) エポキシ樹脂組成物、及びこれを用いたペースト状組成物、フィルム状組成物
TW201839024A (zh) 熱硬化性樹脂組合物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150121

Termination date: 20180524

CF01 Termination of patent right due to non-payment of annual fee