TWI422644B - 聚伸芳基醚組合物、方法及物件 - Google Patents

聚伸芳基醚組合物、方法及物件 Download PDF

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Publication number
TWI422644B
TWI422644B TW96131713A TW96131713A TWI422644B TW I422644 B TWI422644 B TW I422644B TW 96131713 A TW96131713 A TW 96131713A TW 96131713 A TW96131713 A TW 96131713A TW I422644 B TWI422644 B TW I422644B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
poly
composition
group
ether
Prior art date
Application number
TW96131713A
Other languages
English (en)
Chinese (zh)
Other versions
TW200821355A (en
Inventor
Hua Guo
Edward N Peters
Erik R Delsman
Original Assignee
Sabic Innovative Plastics Ip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/532,146 external-priority patent/US20080071036A1/en
Priority claimed from US11/532,135 external-priority patent/US20080071035A1/en
Application filed by Sabic Innovative Plastics Ip filed Critical Sabic Innovative Plastics Ip
Publication of TW200821355A publication Critical patent/TW200821355A/zh
Application granted granted Critical
Publication of TWI422644B publication Critical patent/TWI422644B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW96131713A 2006-09-15 2007-08-27 聚伸芳基醚組合物、方法及物件 TWI422644B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/532,146 US20080071036A1 (en) 2006-09-15 2006-09-15 Cured poly(arylene ether) composition, method, and article
US11/532,135 US20080071035A1 (en) 2006-09-15 2006-09-15 Curable poly(arylene ether) composition and method

Publications (2)

Publication Number Publication Date
TW200821355A TW200821355A (en) 2008-05-16
TWI422644B true TWI422644B (zh) 2014-01-11

Family

ID=38792033

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96131713A TWI422644B (zh) 2006-09-15 2007-08-27 聚伸芳基醚組合物、方法及物件

Country Status (5)

Country Link
EP (1) EP2061836A1 (ja)
JP (1) JP5599612B2 (ja)
CN (1) CN102702680A (ja)
TW (1) TWI422644B (ja)
WO (1) WO2008033611A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638566B2 (en) * 2006-10-30 2009-12-29 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) compositions
JP2011074123A (ja) * 2009-09-29 2011-04-14 Panasonic Electric Works Co Ltd 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
US9528026B2 (en) 2011-07-19 2016-12-27 Panasonic Intellectual Property Management Co., Ltd. Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
US8598281B2 (en) * 2011-09-01 2013-12-03 Sabic Innovative Plastics Ip B.V. Epoxybenzyl-terminated poly(arylene ether)s, method for preparation thereof, and curable compositions comprising same
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
EP2861644A1 (en) * 2012-06-15 2015-04-22 Dow Global Technologies LLC Latent catalytic curing agents
US9296916B2 (en) * 2013-08-09 2016-03-29 Sabic Global Technologies B.V. Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same
CN108290386B (zh) * 2015-11-17 2021-05-14 沙特基础工业全球技术有限公司 形成固化环氧材料的方法、由其形成的固化环氧材料及结合固化环氧材料的复合材料核
CN112111057B (zh) * 2019-06-20 2023-07-14 南通星辰合成材料有限公司 聚苯醚及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200416243A (en) * 2003-01-21 2004-09-01 Mitsubishi Gas Chemical Co Epoxy resin curing agent, curable epoxy resin composition and cured product

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4842454B1 (ja) * 1970-12-28 1973-12-12
US4912172A (en) * 1987-09-03 1990-03-27 General Electric Company Compositions comprising polyphenylene ethers, polyepoxides and aluminum or zinc diketone salt
JPH0737567B2 (ja) * 1991-01-11 1995-04-26 旭化成工業株式会社 硬化性樹脂組成物並びにこれを用いた複合材料および積層体
US5596048A (en) * 1995-10-16 1997-01-21 General Electric Company Method for making copolymers of polyarylene ethers and siloxanes
JPH09202850A (ja) * 1995-11-20 1997-08-05 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物、それを用いた半導体装置、及びその封止用エポキシ樹脂組成物の製造方法
US5834565A (en) * 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
JP4736254B2 (ja) * 2001-06-28 2011-07-27 三菱瓦斯化学株式会社 ２官能性フェニレンエーテルのオリゴマー体とその製造法
US6835785B2 (en) * 2002-01-28 2004-12-28 Mitsubishi Gas Chemical Company, Inc. Polyphenylene ether oligomer compound, derivatives thereof and use thereof
JP4196164B2 (ja) * 2002-09-25 2008-12-17 三菱瓦斯化学株式会社 ２官能性フェニレンエーテルオリゴマー体の製造法
JP2004231728A (ja) * 2003-01-29 2004-08-19 Mitsubishi Gas Chem Co Inc エポキシ樹脂硬化剤および硬化性エポキシ樹脂組成物および硬化物
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200416243A (en) * 2003-01-21 2004-09-01 Mitsubishi Gas Chemical Co Epoxy resin curing agent, curable epoxy resin composition and cured product

Also Published As

Publication number Publication date
WO2008033611A1 (en) 2008-03-20
TW200821355A (en) 2008-05-16
JP5599612B2 (ja) 2014-10-01
JP2010503753A (ja) 2010-02-04
CN102702680A (zh) 2012-10-03
EP2061836A1 (en) 2009-05-27

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