TWI418443B - 化學機械研磨墊 - Google Patents
化學機械研磨墊 Download PDFInfo
- Publication number
- TWI418443B TWI418443B TW96115814A TW96115814A TWI418443B TW I418443 B TWI418443 B TW I418443B TW 96115814 A TW96115814 A TW 96115814A TW 96115814 A TW96115814 A TW 96115814A TW I418443 B TWI418443 B TW I418443B
- Authority
- TW
- Taiwan
- Prior art keywords
- polymer
- abrasive
- polishing pad
- phase
- matrix
- Prior art date
Links
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- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 17
- 150000002513 isocyanates Chemical class 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 14
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
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- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- JBDBCPSTGPKRCV-UHFFFAOYSA-N 2-pentylbenzene-1,3-diamine Chemical compound CCCCCC1=C(N)C=CC=C1N JBDBCPSTGPKRCV-UHFFFAOYSA-N 0.000 description 1
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- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 description 1
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 description 1
- HLDUVPFXLWEZOG-UHFFFAOYSA-N 4-tert-butyl-6-methylbenzene-1,3-diamine Chemical compound CC1=CC(C(C)(C)C)=C(N)C=C1N HLDUVPFXLWEZOG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920006309 Invista Polymers 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
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- BCZWPKDRLPGFFZ-UHFFFAOYSA-N azanylidynecerium Chemical compound [Ce]#N BCZWPKDRLPGFFZ-UHFFFAOYSA-N 0.000 description 1
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- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 150000002291 germanium compounds Chemical class 0.000 description 1
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- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
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- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
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- 229920002647 polyamide Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
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- 238000010079 rubber tapping Methods 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/442,077 US7445847B2 (en) | 2006-05-25 | 2006-05-25 | Chemical mechanical polishing pad |
Publications (2)
| Publication Number | Publication Date |
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| TW200806431A TW200806431A (en) | 2008-02-01 |
| TWI418443B true TWI418443B (zh) | 2013-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW96115814A TWI418443B (zh) | 2006-05-25 | 2007-05-04 | 化學機械研磨墊 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7445847B2 (OSRAM) |
| JP (1) | JP5346446B2 (OSRAM) |
| KR (1) | KR101360622B1 (OSRAM) |
| CN (1) | CN100540225C (OSRAM) |
| DE (1) | DE102007024459A1 (OSRAM) |
| FR (1) | FR2901499B1 (OSRAM) |
| TW (1) | TWI418443B (OSRAM) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| US20230390970A1 (en) * | 2022-06-02 | 2023-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making low specific gravity polishing pads |
| CN117020933B (zh) * | 2023-08-10 | 2025-10-31 | 安徽禾臣新材料有限公司 | 一种半导体抛光用白垫及其生产工艺 |
| CN119458143B (zh) * | 2024-10-11 | 2025-11-14 | 广东粤港澳大湾区黄埔材料研究院 | 一种用于SiC晶圆的粗抛垫及其制备方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3577386A (en) * | 1968-10-07 | 1971-05-04 | Minnesota Mining & Mfg | Product and process |
| JP2002151447A (ja) * | 2000-11-13 | 2002-05-24 | Asahi Kasei Corp | 研磨パッド |
| TW491755B (en) * | 2000-09-19 | 2002-06-21 | Rodel Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| US6648733B2 (en) * | 1997-04-04 | 2003-11-18 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
| US6682402B1 (en) * | 1997-04-04 | 2004-01-27 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
| CN1738845A (zh) * | 2002-11-18 | 2006-02-22 | 东省A&T株式会社 | 具有微孔的聚氨酯泡沫的制备方法和由此获得的抛光垫 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63283857A (ja) * | 1987-05-15 | 1988-11-21 | Asahi Chem Ind Co Ltd | 研磨布 |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5814409A (en) | 1994-05-10 | 1998-09-29 | Asahi Kasei Kogyo Kabushiki Kaisha | Expanded fluorine type resin products and a preparation process thereof |
| JP2001518852A (ja) * | 1997-04-04 | 2001-10-16 | ローデル ホールディングス インコーポレイテッド | 改良研磨パッド及びこれに関連する方法 |
| US6022268A (en) | 1998-04-03 | 2000-02-08 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| US7718102B2 (en) | 1998-06-02 | 2010-05-18 | Praxair S.T. Technology, Inc. | Froth and method of producing froth |
| US6514301B1 (en) | 1998-06-02 | 2003-02-04 | Peripheral Products Inc. | Foam semiconductor polishing belts and pads |
| US6022903A (en) | 1998-07-09 | 2000-02-08 | Arco Chemical Technology L.P. | Permanent gas blown microcellular polyurethane elastomers |
| US6095902A (en) * | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
| US6267644B1 (en) | 1998-11-06 | 2001-07-31 | Beaver Creek Concepts Inc | Fixed abrasive finishing element having aids finishing method |
| US6454634B1 (en) | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
| US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
| US6736709B1 (en) | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
| JP2004303280A (ja) | 2003-03-28 | 2004-10-28 | Hoya Corp | 情報記録媒体用ガラス基板の製造方法 |
| SG111222A1 (en) * | 2003-10-09 | 2005-05-30 | Rohm & Haas Elect Mat | Polishing pad |
| US7074115B2 (en) | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
| US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| JP4783553B2 (ja) * | 2004-02-18 | 2011-09-28 | 三井化学ポリウレタン株式会社 | ポリウレタン水性分散系の製造方法 |
| US7169030B1 (en) * | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
-
2006
- 2006-05-25 US US11/442,077 patent/US7445847B2/en active Active
-
2007
- 2007-05-04 TW TW96115814A patent/TWI418443B/zh active
- 2007-05-23 KR KR1020070050490A patent/KR101360622B1/ko active Active
- 2007-05-25 FR FR0755268A patent/FR2901499B1/fr not_active Expired - Fee Related
- 2007-05-25 DE DE200710024459 patent/DE102007024459A1/de not_active Ceased
- 2007-05-25 JP JP2007138566A patent/JP5346446B2/ja active Active
- 2007-05-25 CN CNB2007101092532A patent/CN100540225C/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3577386A (en) * | 1968-10-07 | 1971-05-04 | Minnesota Mining & Mfg | Product and process |
| US6648733B2 (en) * | 1997-04-04 | 2003-11-18 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
| US6682402B1 (en) * | 1997-04-04 | 2004-01-27 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
| TW491755B (en) * | 2000-09-19 | 2002-06-21 | Rodel Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| JP2002151447A (ja) * | 2000-11-13 | 2002-05-24 | Asahi Kasei Corp | 研磨パッド |
| CN1738845A (zh) * | 2002-11-18 | 2006-02-22 | 东省A&T株式会社 | 具有微孔的聚氨酯泡沫的制备方法和由此获得的抛光垫 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100540225C (zh) | 2009-09-16 |
| US20070275226A1 (en) | 2007-11-29 |
| JP2007313641A (ja) | 2007-12-06 |
| JP5346446B2 (ja) | 2013-11-20 |
| FR2901499B1 (fr) | 2010-09-03 |
| DE102007024459A1 (de) | 2007-11-29 |
| KR20070114019A (ko) | 2007-11-29 |
| TW200806431A (en) | 2008-02-01 |
| CN101077570A (zh) | 2007-11-28 |
| KR101360622B1 (ko) | 2014-02-07 |
| US7445847B2 (en) | 2008-11-04 |
| FR2901499A1 (fr) | 2007-11-30 |
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