TWI410604B - 沈積儀器及利用該沈積儀器之沈積方法 - Google Patents

沈積儀器及利用該沈積儀器之沈積方法 Download PDF

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Publication number
TWI410604B
TWI410604B TW98129848A TW98129848A TWI410604B TW I410604 B TWI410604 B TW I410604B TW 98129848 A TW98129848 A TW 98129848A TW 98129848 A TW98129848 A TW 98129848A TW I410604 B TWI410604 B TW I410604B
Authority
TW
Taiwan
Prior art keywords
deposition
thickness
substrate
deposited
mask
Prior art date
Application number
TW98129848A
Other languages
English (en)
Chinese (zh)
Other versions
TW201024656A (en
Inventor
Chang Ho Kang
Hyun Goo Kwon
Sung Tae Namgoong
Sung Kwan Son
Original Assignee
Snu Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snu Precision Co Ltd filed Critical Snu Precision Co Ltd
Publication of TW201024656A publication Critical patent/TW201024656A/zh
Application granted granted Critical
Publication of TWI410604B publication Critical patent/TWI410604B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
TW98129848A 2008-09-05 2009-09-04 沈積儀器及利用該沈積儀器之沈積方法 TWI410604B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080087763A KR101018644B1 (ko) 2008-09-05 2008-09-05 증착장치 및 이를 이용한 증착방법

Publications (2)

Publication Number Publication Date
TW201024656A TW201024656A (en) 2010-07-01
TWI410604B true TWI410604B (zh) 2013-10-01

Family

ID=41797636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98129848A TWI410604B (zh) 2008-09-05 2009-09-04 沈積儀器及利用該沈積儀器之沈積方法

Country Status (5)

Country Link
JP (1) JP5280542B2 (ja)
KR (1) KR101018644B1 (ja)
CN (1) CN102217038B (ja)
TW (1) TWI410604B (ja)
WO (1) WO2010027178A2 (ja)

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EP2508645B1 (en) * 2011-04-06 2015-02-25 Applied Materials, Inc. Evaporation system with measurement unit
EP2518178B1 (en) * 2011-04-29 2014-01-01 Applied Materials, Inc. Tooling carrier for inline coating machine, method of operating thereof and process of coating a substrate
DE102011084996A1 (de) * 2011-10-21 2013-04-25 Robert Bosch Gmbh Anordnung zum Beschichten eines Substrats
KR101394393B1 (ko) * 2012-06-29 2014-05-13 세메스 주식회사 박막 증착 장치 및 방법
KR101876306B1 (ko) * 2012-07-02 2018-07-10 주식회사 원익아이피에스 기판 처리 시스템 및 그 제어 방법
WO2014050319A1 (ja) * 2012-09-25 2014-04-03 株式会社日立ハイテクノロジーズ 成膜装置および成膜方法
KR101435498B1 (ko) * 2012-11-26 2014-08-28 주식회사 선익시스템 인라인(In-line) 증착장비에서의 막 두께 측정장치 및 그 측정방법
KR101478781B1 (ko) * 2012-12-31 2015-01-02 엘아이지에이디피 주식회사 박막증착용 기판 트레이 및 이를 포함하는 박막증착장비
KR20140105670A (ko) * 2013-02-22 2014-09-02 삼성디스플레이 주식회사 유기 박막 두께 측정 유닛 및 이를 구비한 유기 박막 증착 장치
KR102096049B1 (ko) 2013-05-03 2020-04-02 삼성디스플레이 주식회사 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치
JP6270205B2 (ja) * 2014-01-07 2018-01-31 株式会社アルバック 有機ｅｌデバイスの製造装置
CN105980597A (zh) * 2014-02-04 2016-09-28 株式会社爱发科 薄膜制造装置、掩模组、薄膜制造方法
KR101553149B1 (ko) * 2014-03-26 2015-09-14 (주)쎄미시스코 두께 변화 측정 장치
CN105405788B (zh) * 2014-09-16 2021-09-17 北京北方华创微电子装备有限公司 一种反应腔室
KR101737057B1 (ko) 2015-03-23 2017-05-18 에이피시스템 주식회사 막 형성 장치, 유기전자소자용 보호막 형성장치 및 이를 이용한 막 형성 방법
US10233528B2 (en) 2015-06-08 2019-03-19 Applied Materials, Inc. Mask for deposition system and method for using the mask
US9702689B2 (en) * 2015-06-18 2017-07-11 Xerox Corporation Use of a full width array imaging sensor to measure real time film thicknesses on film manufacturing equipment
JP6795337B2 (ja) * 2016-06-29 2020-12-02 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
JP6580105B2 (ja) 2017-10-26 2019-09-25 キヤノントッキ株式会社 測定装置
JP7365878B2 (ja) * 2019-12-06 2023-10-20 東京エレクトロン株式会社 計測装置及び計測方法
TWI759757B (zh) * 2020-06-05 2022-04-01 揚明光學股份有限公司 光學特性檢測裝置及其製造方法
JP7424927B2 (ja) 2020-06-26 2024-01-30 キヤノントッキ株式会社 膜厚測定装置、成膜装置、膜厚測定方法、電子デバイスの製造方法、プログラム及び記憶媒体
KR102595155B1 (ko) * 2021-06-01 2023-10-30 한국생산기술연구원 기판상에 증착된 박막 조성비 실시간 모니터링 방법 및 모니터링 시스템
CN113932721B (zh) * 2021-10-19 2024-01-19 济南邦威仪器有限公司 一种板材铺粉厚度检测设备及其控制方法
CN116180035B (zh) * 2023-04-20 2023-07-28 上海传芯半导体有限公司 Euv空白掩模版制造方法和监控系统、euv空白掩模版制造系统

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TW200530418A (en) * 2004-03-03 2005-09-16 Sanyo Electric Co Method and apparatus for measuring the thickness of deposited film, method and apparatus for forming material layer
US20050208698A1 (en) * 2004-03-18 2005-09-22 Eastman Kodak Company Monitoring the deposition properties of an oled
TW200734476A (en) * 2006-03-13 2007-09-16 Au Optronics Corp Mask body with isolating layer and processing device thereof
JP2007273363A (ja) * 2006-03-31 2007-10-18 Horiba Ltd 有機ｅｌ素子の製造方法及び製造装置

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JPH0665724A (ja) * 1992-05-20 1994-03-08 Yoichi Murayama インラインプラズマ蒸着装置
JPH07331421A (ja) * 1994-06-03 1995-12-19 Toshiba Glass Co Ltd 真空蒸着装置
KR100408161B1 (ko) * 2001-03-09 2003-12-01 정광호 양산용 다층 박막 제작장치
TWI242602B (en) * 2001-11-02 2005-11-01 Ulvac Inc Thin film forming apparatus and method
KR20060021210A (ko) * 2004-09-02 2006-03-07 삼성에스디아이 주식회사 레이저 전사용 도너 기판의 제조 장치와 도너 기판의 제조방법 및 그를 이용한 유기 전계 발광 소자의 제조 방법
KR100752681B1 (ko) * 2004-11-02 2007-08-29 두산메카텍 주식회사 증착되는 유기박막의 두께를 실시간으로 측정가능한유기박막 증착장치 및 유기박막 증착방법
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TW200530418A (en) * 2004-03-03 2005-09-16 Sanyo Electric Co Method and apparatus for measuring the thickness of deposited film, method and apparatus for forming material layer
US20050208698A1 (en) * 2004-03-18 2005-09-22 Eastman Kodak Company Monitoring the deposition properties of an oled
TW200734476A (en) * 2006-03-13 2007-09-16 Au Optronics Corp Mask body with isolating layer and processing device thereof
JP2007273363A (ja) * 2006-03-31 2007-10-18 Horiba Ltd 有機ｅｌ素子の製造方法及び製造装置

Also Published As

Publication number Publication date
CN102217038A (zh) 2011-10-12
TW201024656A (en) 2010-07-01
WO2010027178A3 (en) 2010-06-17
WO2010027178A2 (en) 2010-03-11
KR101018644B1 (ko) 2011-03-03
JP5280542B2 (ja) 2013-09-04
JP2012502177A (ja) 2012-01-26
KR20100028836A (ko) 2010-03-15
CN102217038B (zh) 2013-07-31

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