TWI410360B - 具有可調整內徑之晶圓容器 - Google Patents

具有可調整內徑之晶圓容器 Download PDF

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Publication number
TWI410360B
TWI410360B TW099127150A TW99127150A TWI410360B TW I410360 B TWI410360 B TW I410360B TW 099127150 A TW099127150 A TW 099127150A TW 99127150 A TW99127150 A TW 99127150A TW I410360 B TWI410360 B TW I410360B
Authority
TW
Taiwan
Prior art keywords
rib
case
wafer
base
wafer container
Prior art date
Application number
TW099127150A
Other languages
English (en)
Chinese (zh)
Other versions
TW201132564A (en
Inventor
詹姆士 彼蘭特
艾倫 偉柏
克里斯托夫 馬克
Original Assignee
德建科技產品有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德建科技產品有限公司 filed Critical 德建科技產品有限公司
Publication of TW201132564A publication Critical patent/TW201132564A/zh
Application granted granted Critical
Publication of TWI410360B publication Critical patent/TWI410360B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
    • B65D53/04—Discs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/16—Container closures formed after filling by collapsing and twisting mouth portion
    • B65D77/18—Container closures formed after filling by collapsing and twisting mouth portion and securing by a deformable clip or binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099127150A 2010-03-29 2010-08-13 具有可調整內徑之晶圓容器 TWI410360B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/749,448 US8556079B2 (en) 2009-08-26 2010-03-29 Wafer container with adjustable inside diameter

Publications (2)

Publication Number Publication Date
TW201132564A TW201132564A (en) 2011-10-01
TWI410360B true TWI410360B (zh) 2013-10-01

Family

ID=44712425

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099127150A TWI410360B (zh) 2010-03-29 2010-08-13 具有可調整內徑之晶圓容器

Country Status (8)

Country Link
US (1) US8556079B2 (cg-RX-API-DMAC10.html)
EP (1) EP2470456A4 (cg-RX-API-DMAC10.html)
JP (1) JP5914457B2 (cg-RX-API-DMAC10.html)
KR (1) KR20130014047A (cg-RX-API-DMAC10.html)
CN (2) CN104787502A (cg-RX-API-DMAC10.html)
MY (1) MY160279A (cg-RX-API-DMAC10.html)
TW (1) TWI410360B (cg-RX-API-DMAC10.html)
WO (1) WO2011122928A1 (cg-RX-API-DMAC10.html)

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KR20170076179A (ko) * 2015-12-24 2017-07-04 삼성전자주식회사 웨이퍼 수납 용기
CN105501635B (zh) * 2016-01-07 2017-07-07 安庆市兴龙印业有限责任公司 一种易碎品防护式安全包装盒
US11538703B2 (en) 2017-02-06 2022-12-27 Achilles Corporation Substrate housing container
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11658059B2 (en) 2018-02-28 2023-05-23 Ii-Vi Delaware, Inc. Thin material handling carrier
EP3806138B1 (en) * 2019-10-09 2022-11-30 Infineon Technologies AG Transport system
KR102595523B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
KR102595526B1 (ko) 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
CN114023676B (zh) * 2021-10-13 2022-09-16 广东万维半导体技术有限公司 一种移动式晶圆载盘承载装置
US12159799B2 (en) * 2022-03-30 2024-12-03 Achilles Corporation Container for transporting semiconductor wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050269241A1 (en) * 2003-06-06 2005-12-08 Brooks Ray G Integrated circuit wafer packaging system and method
US6988621B2 (en) * 2003-06-17 2006-01-24 Illinois Tool Works Inc. Reduced movement wafer box

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US5207324A (en) * 1991-03-08 1993-05-04 Fluoroware, Inc. Wafer cushion for shippers
US5501351A (en) * 1992-07-17 1996-03-26 Minnesota Mining And Manufacturing Company Reusable, multiple-piece storage container
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FR2735754B1 (fr) 1995-06-20 1998-07-17 Astra Plastique Pot, notamment pour le conditionnement de produits alimentaires
JPH09129719A (ja) * 1995-08-30 1997-05-16 Achilles Corp 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法
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Publication number Priority date Publication date Assignee Title
US20050269241A1 (en) * 2003-06-06 2005-12-08 Brooks Ray G Integrated circuit wafer packaging system and method
US6988621B2 (en) * 2003-06-17 2006-01-24 Illinois Tool Works Inc. Reduced movement wafer box
US7565980B2 (en) * 2003-06-17 2009-07-28 Illinois Tool Works Inc. Wafer box with radially pivoting latch elements

Also Published As

Publication number Publication date
WO2011122928A1 (en) 2011-10-06
MY160279A (en) 2017-02-28
JP5914457B2 (ja) 2016-05-11
US20100236977A1 (en) 2010-09-23
TW201132564A (en) 2011-10-01
US8556079B2 (en) 2013-10-15
EP2470456A4 (en) 2016-10-26
CN102666315A (zh) 2012-09-12
CN104787502A (zh) 2015-07-22
JP2013526011A (ja) 2013-06-20
CN102666315B (zh) 2015-03-25
KR20130014047A (ko) 2013-02-06
EP2470456A1 (en) 2012-07-04

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