TWI404122B - 增進半-極性(Al,In,Ga,B)N藉由金屬有機化學氣相沈積生長之方法 - Google Patents
增進半-極性(Al,In,Ga,B)N藉由金屬有機化學氣相沈積生長之方法 Download PDFInfo
- Publication number
- TWI404122B TWI404122B TW095133385A TW95133385A TWI404122B TW I404122 B TWI404122 B TW I404122B TW 095133385 A TW095133385 A TW 095133385A TW 95133385 A TW95133385 A TW 95133385A TW I404122 B TWI404122 B TW I404122B
- Authority
- TW
- Taiwan
- Prior art keywords
- semi
- group iii
- iii nitride
- polar group
- polar
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2921—Materials being crystalline insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
- H10P14/3216—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3446—Transition metal elements; Rare earth elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3466—Crystal orientation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
- H10P14/276—Lateral overgrowth
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71549105P | 2005-09-09 | 2005-09-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200723369A TW200723369A (en) | 2007-06-16 |
| TWI404122B true TWI404122B (zh) | 2013-08-01 |
Family
ID=37836513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095133385A TWI404122B (zh) | 2005-09-09 | 2006-09-08 | 增進半-極性(Al,In,Ga,B)N藉由金屬有機化學氣相沈積生長之方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7575947B2 (https=) |
| EP (1) | EP1935014A4 (https=) |
| JP (2) | JP5270348B2 (https=) |
| KR (1) | KR101347848B1 (https=) |
| TW (1) | TWI404122B (https=) |
| WO (1) | WO2007030709A2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7846757B2 (en) * | 2005-06-01 | 2010-12-07 | The Regents Of The University Of California | Technique for the growth and fabrication of semipolar (Ga,A1,In,B)N thin films, heterostructures, and devices |
| US7842527B2 (en) | 2006-12-11 | 2010-11-30 | The Regents Of The University Of California | Metalorganic chemical vapor deposition (MOCVD) growth of high performance non-polar III-nitride optical devices |
| KR101145755B1 (ko) * | 2005-03-10 | 2012-05-16 | 재팬 사이언스 앤드 테크놀로지 에이젼시 | 평면의 반극성 갈륨 질화물의 성장을 위한 기술 |
| EP1984545A4 (en) | 2006-02-17 | 2013-05-15 | Univ California | PROCESS FOR THE GROWTH OF SEMIPOLARS (AL, IN, GA, B) N OPTOELECTRONIC COMPONENTS |
| JP2010512660A (ja) * | 2006-12-11 | 2010-04-22 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 無極性および半極性の発光デバイス |
| US8673074B2 (en) * | 2008-07-16 | 2014-03-18 | Ostendo Technologies, Inc. | Growth of planar non-polar {1 -1 0 0} M-plane and semi-polar {1 1 -2 2} gallium nitride with hydride vapor phase epitaxy (HVPE) |
| KR100990645B1 (ko) | 2008-12-15 | 2010-10-29 | 고려대학교 산학협력단 | 질화물 단결정의 제조 방법 및 이를 이용한 반도체 발광소자의 제조 방법 |
| US8629065B2 (en) * | 2009-11-06 | 2014-01-14 | Ostendo Technologies, Inc. | Growth of planar non-polar {10-10} M-plane gallium nitride with hydride vapor phase epitaxy (HVPE) |
| US9525117B2 (en) | 2009-12-08 | 2016-12-20 | Lehigh University | Thermoelectric materials based on single crystal AlInN—GaN grown by metalorganic vapor phase epitaxy |
| US8772758B2 (en) * | 2011-05-13 | 2014-07-08 | The Regents Of The University Of California | Suppression of inclined defect formation and increase in critical thickness by silicon doping on non-c-plane (Al,Ga,In)N |
| US8698163B2 (en) * | 2011-09-29 | 2014-04-15 | Toshiba Techno Center Inc. | P-type doping layers for use with light emitting devices |
| WO2013157014A1 (en) | 2012-04-20 | 2013-10-24 | Tata Institute Of Fundamental Research | Group iii-nitride semiconducting material and a method of manufacturing the same |
| JP7614602B2 (ja) * | 2019-10-31 | 2025-01-16 | 東ソー株式会社 | 積層膜構造体及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5741724A (en) * | 1996-12-27 | 1998-04-21 | Motorola | Method of growing gallium nitride on a spinel substrate |
| US20040251471A1 (en) * | 2001-10-26 | 2004-12-16 | Robert Dwilinski | Light emitting element structure using nitride bulk single crystal layer |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62119196A (ja) * | 1985-11-18 | 1987-05-30 | Univ Nagoya | 化合物半導体の成長方法 |
| JP2704181B2 (ja) * | 1989-02-13 | 1998-01-26 | 日本電信電話株式会社 | 化合物半導体単結晶薄膜の成長方法 |
| CN1159750C (zh) * | 1997-04-11 | 2004-07-28 | 日亚化学工业株式会社 | 氮化物半导体的生长方法 |
| JP3119200B2 (ja) * | 1997-06-09 | 2000-12-18 | 日本電気株式会社 | 窒化物系化合物半導体の結晶成長方法および窒化ガリウム系発光素子 |
| US6849472B2 (en) * | 1997-09-30 | 2005-02-01 | Lumileds Lighting U.S., Llc | Nitride semiconductor device with reduced polarization fields |
| US6218280B1 (en) * | 1998-06-18 | 2001-04-17 | University Of Florida | Method and apparatus for producing group-III nitrides |
| JP3592553B2 (ja) * | 1998-10-15 | 2004-11-24 | 株式会社東芝 | 窒化ガリウム系半導体装置 |
| WO2000033388A1 (en) * | 1998-11-24 | 2000-06-08 | Massachusetts Institute Of Technology | METHOD OF PRODUCING DEVICE QUALITY (Al)InGaP ALLOYS ON LATTICE-MISMATCHED SUBSTRATES |
| KR100506077B1 (ko) * | 2000-04-15 | 2005-08-04 | 삼성전기주식회사 | 유기금속기상화학증착법에 의한 고품위 ⅲ-족 질화물 박막성장 방법 |
| US6599362B2 (en) * | 2001-01-03 | 2003-07-29 | Sandia Corporation | Cantilever epitaxial process |
| US7501023B2 (en) * | 2001-07-06 | 2009-03-10 | Technologies And Devices, International, Inc. | Method and apparatus for fabricating crack-free Group III nitride semiconductor materials |
| US7105865B2 (en) * | 2001-09-19 | 2006-09-12 | Sumitomo Electric Industries, Ltd. | AlxInyGa1−x−yN mixture crystal substrate |
| JP3768943B2 (ja) * | 2001-09-28 | 2006-04-19 | 日本碍子株式会社 | Iii族窒化物エピタキシャル基板、iii族窒化物素子用エピタキシャル基板及びiii族窒化物素子 |
| JP4031628B2 (ja) * | 2001-10-03 | 2008-01-09 | 松下電器産業株式会社 | 半導体多層膜結晶、およびそれを用いた発光素子、ならびに当該半導体多層膜結晶の成長方法 |
| US6847057B1 (en) * | 2003-08-01 | 2005-01-25 | Lumileds Lighting U.S., Llc | Semiconductor light emitting devices |
| US7846757B2 (en) * | 2005-06-01 | 2010-12-07 | The Regents Of The University Of California | Technique for the growth and fabrication of semipolar (Ga,A1,In,B)N thin films, heterostructures, and devices |
| US7432142B2 (en) * | 2004-05-20 | 2008-10-07 | Cree, Inc. | Methods of fabricating nitride-based transistors having regrown ohmic contact regions |
| KR101145755B1 (ko) * | 2005-03-10 | 2012-05-16 | 재팬 사이언스 앤드 테크놀로지 에이젼시 | 평면의 반극성 갈륨 질화물의 성장을 위한 기술 |
| TWI390633B (zh) * | 2005-07-13 | 2013-03-21 | 獨立行政法人科學技術振興機構 | 半極性氮化物膜缺陷減少之側向成長方法 |
-
2006
- 2006-09-08 KR KR1020087008498A patent/KR101347848B1/ko active Active
- 2006-09-08 WO PCT/US2006/035012 patent/WO2007030709A2/en not_active Ceased
- 2006-09-08 EP EP06790201A patent/EP1935014A4/en not_active Withdrawn
- 2006-09-08 TW TW095133385A patent/TWI404122B/zh active
- 2006-09-08 US US11/517,797 patent/US7575947B2/en active Active
- 2006-09-08 JP JP2008530223A patent/JP5270348B2/ja not_active Expired - Fee Related
-
2012
- 2012-07-17 JP JP2012158240A patent/JP5645887B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5741724A (en) * | 1996-12-27 | 1998-04-21 | Motorola | Method of growing gallium nitride on a spinel substrate |
| US20040251471A1 (en) * | 2001-10-26 | 2004-12-16 | Robert Dwilinski | Light emitting element structure using nitride bulk single crystal layer |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1935014A2 (en) | 2008-06-25 |
| KR20080063766A (ko) | 2008-07-07 |
| JP2009508336A (ja) | 2009-02-26 |
| JP2012209586A (ja) | 2012-10-25 |
| EP1935014A4 (en) | 2010-09-08 |
| US20090184342A1 (en) | 2009-07-23 |
| US7575947B2 (en) | 2009-08-18 |
| JP5645887B2 (ja) | 2014-12-24 |
| WO2007030709A2 (en) | 2007-03-15 |
| JP5270348B2 (ja) | 2013-08-21 |
| TW200723369A (en) | 2007-06-16 |
| WO2007030709A3 (en) | 2009-04-23 |
| KR101347848B1 (ko) | 2014-01-06 |
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