TWI403232B - 立體電路基板之形成裝置及形成方法 - Google Patents

立體電路基板之形成裝置及形成方法 Download PDF

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Publication number
TWI403232B
TWI403232B TW097148882A TW97148882A TWI403232B TW I403232 B TWI403232 B TW I403232B TW 097148882 A TW097148882 A TW 097148882A TW 97148882 A TW97148882 A TW 97148882A TW I403232 B TWI403232 B TW I403232B
Authority
TW
Taiwan
Prior art keywords
film
adhesive film
adhesive
circuit board
release film
Prior art date
Application number
TW097148882A
Other languages
English (en)
Chinese (zh)
Other versions
TW200938024A (en
Inventor
Hiroshi Okada
Tayuru Yoshida
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of TW200938024A publication Critical patent/TW200938024A/zh
Application granted granted Critical
Publication of TWI403232B publication Critical patent/TWI403232B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW097148882A 2008-01-15 2008-12-16 立體電路基板之形成裝置及形成方法 TWI403232B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008005406A JP4428449B2 (ja) 2008-01-15 2008-01-15 立体的回路基板の形成装置および形成方法

Publications (2)

Publication Number Publication Date
TW200938024A TW200938024A (en) 2009-09-01
TWI403232B true TWI403232B (zh) 2013-07-21

Family

ID=40891957

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097148882A TWI403232B (zh) 2008-01-15 2008-12-16 立體電路基板之形成裝置及形成方法

Country Status (4)

Country Link
JP (1) JP4428449B2 (ja)
KR (1) KR100999212B1 (ja)
CN (1) CN101489354B (ja)
TW (1) TWI403232B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4400673B2 (ja) * 2007-12-13 2010-01-20 住友金属鉱山株式会社 立体的回路基板の形成装置および形成方法
JP5131013B2 (ja) * 2008-04-24 2013-01-30 住友金属鉱山株式会社 立体的回路基板の形成方法および形成装置
JP5131251B2 (ja) * 2009-06-25 2013-01-30 住友金属鉱山株式会社 立体的回路基板の製造方法
JP5251803B2 (ja) * 2009-09-17 2013-07-31 住友金属鉱山株式会社 立体的回路基板の製造方法
JP5482641B2 (ja) * 2010-12-13 2014-05-07 住友金属鉱山株式会社 立体回路基板の製造方法および立体回路基板の製造に用いるスキージ
JP5790550B2 (ja) * 2012-03-13 2015-10-07 住友金属鉱山株式会社 立体的回路基板及びその製造方法
JP5794180B2 (ja) * 2012-03-13 2015-10-14 住友金属鉱山株式会社 立体的回路基板、フィルム状回路基板の製造方法及びこれを用いた立体的回路基板の製造方法
CN103997858B (zh) * 2014-05-30 2017-01-18 昆山一邦泰汽车零部件制造有限公司 一种移动式印刷电路薄膜环

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003252318A (ja) * 2002-02-28 2003-09-10 Daiwa Can Co Ltd 缶体へのフィルム貼着方法およびその装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3738518B2 (ja) 1997-02-26 2006-01-25 東洋製罐株式会社 缶体へのラミネート方法
KR100347857B1 (ko) 2000-09-04 2002-08-09 오티에스테크놀러지 주식회사 인쇄회로기판의 라미네이팅 방법 및 그 장치
KR100609871B1 (ko) 2005-01-14 2006-08-08 주식회사 비에이치플렉스 다층형 연성인쇄기판의 커버레이 라미네이팅 방법 및 장치
JP4613847B2 (ja) * 2006-02-02 2011-01-19 パナソニック株式会社 立体配線の製造方法およびその製造方法により作製した立体配線基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003252318A (ja) * 2002-02-28 2003-09-10 Daiwa Can Co Ltd 缶体へのフィルム貼着方法およびその装置

Also Published As

Publication number Publication date
CN101489354A (zh) 2009-07-22
JP2009170578A (ja) 2009-07-30
JP4428449B2 (ja) 2010-03-10
KR20090078730A (ko) 2009-07-20
TW200938024A (en) 2009-09-01
CN101489354B (zh) 2011-03-16
KR100999212B1 (ko) 2010-12-07

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