TWI394626B - 可調節雷射光束線條長度的鐳射加工裝置 - Google Patents

可調節雷射光束線條長度的鐳射加工裝置 Download PDF

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Publication number
TWI394626B
TWI394626B TW099144417A TW99144417A TWI394626B TW I394626 B TWI394626 B TW I394626B TW 099144417 A TW099144417 A TW 099144417A TW 99144417 A TW99144417 A TW 99144417A TW I394626 B TWI394626 B TW I394626B
Authority
TW
Taiwan
Prior art keywords
circuit board
laser
laser beam
support table
processing apparatus
Prior art date
Application number
TW099144417A
Other languages
English (en)
Chinese (zh)
Other versions
TW201121687A (en
Inventor
Hyo Kyoung Yu
Jun Young Seok
Oh Sung Kwon
Jin Young An
Original Assignee
Ap Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ap Systems Inc filed Critical Ap Systems Inc
Publication of TW201121687A publication Critical patent/TW201121687A/zh
Application granted granted Critical
Publication of TWI394626B publication Critical patent/TWI394626B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/06—Surface hardening
    • C21D1/09—Surface hardening by direct application of electrical or wave energy; by particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Recrystallisation Techniques (AREA)
TW099144417A 2009-12-21 2010-12-17 可調節雷射光束線條長度的鐳射加工裝置 TWI394626B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090128204A KR101164524B1 (ko) 2009-12-21 2009-12-21 레이저 빔의 라인 길이 조절이 가능한 레이저 가공 장치

Publications (2)

Publication Number Publication Date
TW201121687A TW201121687A (en) 2011-07-01
TWI394626B true TWI394626B (zh) 2013-05-01

Family

ID=44402665

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099144417A TWI394626B (zh) 2009-12-21 2010-12-17 可調節雷射光束線條長度的鐳射加工裝置

Country Status (3)

Country Link
KR (1) KR101164524B1 (ko)
CN (1) CN102151983B (ko)
TW (1) TWI394626B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101288993B1 (ko) * 2011-12-20 2013-08-16 삼성디스플레이 주식회사 레이저 어닐링 장치
KR101510772B1 (ko) * 2013-12-27 2015-04-10 에이피시스템 주식회사 광 조사 장치
KR102118133B1 (ko) 2018-01-02 2020-06-03 에이피시스템 주식회사 레이저 처리 장치 및 방법
KR102435310B1 (ko) 2020-07-07 2022-08-23 디앤에이 주식회사 레이저 열처리 장치
KR102646732B1 (ko) 2021-04-12 2024-03-12 에이피시스템 주식회사 기판 처리 장치
DE102022111572A1 (de) * 2022-05-10 2023-11-16 Trumpf Laser- Und Systemtechnik Gmbh Messvorrichtung zum Vermessen eines Laserlinienstrahls
CN116117402B (zh) * 2023-04-19 2023-07-04 天津中物绿色新能源科技有限公司 一种用于生产光伏支架的加工装置及其加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050112264A (ko) * 2004-05-25 2005-11-30 삼성전자주식회사 반도체 노광장치의 셔터 조립체
KR20060119331A (ko) * 2005-05-20 2006-11-24 동부일렉트로닉스 주식회사 이온주입장비의 이온빔 추출장치
KR100780291B1 (ko) * 2006-11-06 2007-11-29 코닉시스템 주식회사 레이저 어닐링 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050088654A1 (en) * 2003-10-27 2005-04-28 Excel/Quantronix, Inc. Apparatus for combining multiple lasers and methods of use
US7227098B2 (en) * 2004-08-06 2007-06-05 Electro Scientific Industries, Inc. Method and system for decreasing the effective pulse repetition frequency of a laser
JP2007190566A (ja) * 2006-01-17 2007-08-02 Miyachi Technos Corp ファイバレーザ加工装置
JP5141034B2 (ja) * 2006-06-20 2013-02-13 日産自動車株式会社 レーザ加工装置およびレーザ加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050112264A (ko) * 2004-05-25 2005-11-30 삼성전자주식회사 반도체 노광장치의 셔터 조립체
KR20060119331A (ko) * 2005-05-20 2006-11-24 동부일렉트로닉스 주식회사 이온주입장비의 이온빔 추출장치
KR100780291B1 (ko) * 2006-11-06 2007-11-29 코닉시스템 주식회사 레이저 어닐링 장치

Also Published As

Publication number Publication date
CN102151983A (zh) 2011-08-17
KR101164524B1 (ko) 2012-07-10
CN102151983B (zh) 2013-12-04
TW201121687A (en) 2011-07-01
KR20110071591A (ko) 2011-06-29

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