TWI393206B - 具有分離間隙閥門密封隔間的負載鎖定室 - Google Patents

具有分離間隙閥門密封隔間的負載鎖定室 Download PDF

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Publication number
TWI393206B
TWI393206B TW096128754A TW96128754A TWI393206B TW I393206 B TWI393206 B TW I393206B TW 096128754 A TW096128754 A TW 096128754A TW 96128754 A TW96128754 A TW 96128754A TW I393206 B TWI393206 B TW I393206B
Authority
TW
Taiwan
Prior art keywords
assembly
gap valve
substrate
compartment
load lock
Prior art date
Application number
TW096128754A
Other languages
English (en)
Chinese (zh)
Other versions
TW200816355A (en
Inventor
Jae-Chull Lee
Shinichi Kurita
Suhail Anwar
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200816355A publication Critical patent/TW200816355A/zh
Application granted granted Critical
Publication of TWI393206B publication Critical patent/TWI393206B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Photovoltaic Devices (AREA)
  • Physical Vapour Deposition (AREA)
TW096128754A 2006-08-04 2007-08-03 具有分離間隙閥門密封隔間的負載鎖定室 TWI393206B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82148706P 2006-08-04 2006-08-04
US11/782,267 US8124907B2 (en) 2006-08-04 2007-07-24 Load lock chamber with decoupled slit valve door seal compartment

Publications (2)

Publication Number Publication Date
TW200816355A TW200816355A (en) 2008-04-01
TWI393206B true TWI393206B (zh) 2013-04-11

Family

ID=39033593

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128754A TWI393206B (zh) 2006-08-04 2007-08-03 具有分離間隙閥門密封隔間的負載鎖定室

Country Status (6)

Country Link
US (1) US8124907B2 (enExample)
JP (1) JP5745764B2 (enExample)
KR (1) KR101323224B1 (enExample)
CN (2) CN101496158B (enExample)
TW (1) TWI393206B (enExample)
WO (1) WO2008019317A2 (enExample)

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US10541157B2 (en) * 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
EP2336611A1 (en) * 2009-12-15 2011-06-22 Applied Materials, Inc. Water cooled valve
JP5658928B2 (ja) * 2010-07-02 2015-01-28 株式会社Ihi 多室型熱処理装置
WO2013143081A1 (en) * 2012-03-28 2013-10-03 Acm Research (Shanghai) Inc. Vacuum chuck
WO2013143079A1 (en) * 2012-03-28 2013-10-03 Acm Research (Shanghai) Inc. Vacuum chuck for electropolishing and/or electroplating
TWM476362U (en) 2012-09-07 2014-04-11 Applied Materials Inc Load lock chamber with slit valve doors
USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
TWI576468B (zh) * 2013-07-31 2017-04-01 盛美半導體設備（上海）有限公司 Suitable for electrolytic polishing and / or electroplating of vacuum fixtures
US9484243B2 (en) 2014-04-17 2016-11-01 Lam Research Corporation Processing chamber with features from side wall
US10115605B2 (en) * 2016-07-06 2018-10-30 Rjr Technologies, Inc. Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates
US10559483B2 (en) * 2016-08-10 2020-02-11 Lam Research Corporation Platform architecture to improve system productivity
KR102400186B1 (ko) 2017-06-19 2022-05-20 삼성전자주식회사 공정 챔버 및 이를 포함하는 기판 처리 장치
US10636629B2 (en) * 2017-10-05 2020-04-28 Applied Materials, Inc. Split slit liner door
US20200194234A1 (en) * 2018-12-17 2020-06-18 Lam Research Corporation Vacuum chamber opening system
JP7280132B2 (ja) * 2019-07-12 2023-05-23 株式会社アルバック 真空チャンバ及び基板処理装置
KR102544775B1 (ko) * 2020-11-05 2023-06-20 주식회사 케이씨텍 기판 처리 장치
CN115910869B (zh) * 2022-12-30 2024-02-02 江苏微导纳米科技股份有限公司 装载腔体及其清洗方法、及半导体设备

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WO2008019317A3 (en) 2008-09-18
CN101496158A (zh) 2009-07-29
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TW200816355A (en) 2008-04-01
CN101496158B (zh) 2011-08-17
JP2010500740A (ja) 2010-01-07
KR101323224B1 (ko) 2013-10-30
US8124907B2 (en) 2012-02-28
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